Aging conversion seat for converting SMD (Surface Mount Device) packaging into TO-220 packaging

Abstract

The utility model provides an aging conversion seat for converting SMD packaging into TO-220 packaging, and belongs to the technical field of conversion seats. Comprising a conversion seat body; a component loading groove; the adapter is arranged on the adapter body. The pins are stably mounted on the conversion seat main body, and the pins are positioned in the element loading grooves; the SMD packaging main body is stably mounted in the element loading groove, and the SMD packaging main body is electrically connected with the pins; and the TO aging seat is detachably connected with the pins, and the TO aging seat is used for being externally connected with TO-220 packaging aging equipment so as to carry out an aging test on SMD packaging. According to the utility model, through the cooperation of the conversion seat main body, the element loading groove, the pins and the TO aging seat, the purpose of connecting an SMD packaging product with TO aging equipment is realized; meanwhile, through the cooperation of the conversion seat main body, the fixing plate, the fixing column and the element loading groove, the purpose of firmly installing and fixing the SMD packaging main body is achieved.

Description

Technical Field

[0001] This utility model relates to the field of conversion socket technology, and in particular to an aging conversion socket for SMD package to TO-220 package. Background Technology

[0002] With the continuous development of electronic technology, the packaging forms of various electronic components are becoming increasingly diversified. Different packaging forms play an important role in different application scenarios. Among them, SMD packaging and TO-220 packaging are relatively common packaging types. With the widespread application of electronic products, the requirements for the quality and reliability of electronic components are also getting higher and higher. As an important testing method, aging test can effectively evaluate the performance stability of electronic components during long-term use.

[0003] However, in actual aging tests, the sockets of existing TO aging equipment are usually designed for TO-220 packages, which is not convenient for aging tests on SMD packaged products. This is because SMD packaged products and TO-220 packages have significant differences in size, pin structure, etc. Directly inserting SMD packaged products into the sockets of TO aging equipment for aging tests is often not feasible. It may not only lead to poor contact, but also damage electronic components, affecting the accuracy and reliability of the aging test. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide an aging conversion socket for SMD package to TO-220 package, so as to solve the technical problems that the existing TO aging equipment sockets are not convenient for aging tests on SMD packaged products and are not convenient for installing and fixing SMD packages.

[0005] Technical Solution: To achieve the above objectives, this utility model provides the following technical solution: an SMD to TO-220 package aging conversion socket, comprising: a conversion socket body; a component loading slot; pins stably mounted on the conversion socket body and located within the component loading slot; an SMD package body stably mounted within the component loading slot, the SMD package body being electrically connected to the pins; and a TO aging socket detachably connected to the pins. The TO aging socket is used to connect an external TO-220 package aging device to perform aging tests on the SMD package. The conversion socket body can be made of a high-temperature resistant material with good insulation properties. The pin material should have good conductivity and stability to ensure reliable signal transmission.

[0006] In a further embodiment, a heat sink is stably installed inside the adapter body. The heat sink is used for heat dissipation of the SMD package body. The heat sink can be made of a material with high thermal conductivity, such as copper or aluminum. The installation method of the heat sink should ensure good thermal contact between it and the adapter body to improve heat dissipation efficiency. Thermally conductive materials such as thermal grease can be added to the contact area between the heat sink and the SMD package body to further enhance the heat dissipation effect.

[0007] In a further embodiment, a fixing plate is detachably connected to the conversion base body. The fixing plate is used to fix the SMD package body, and the fixing plate can be made of a material with a certain strength and toughness, such as plastic or metal.

[0008] In a further embodiment, two fixing posts are provided, which are located on the main body of the conversion seat. The threaded ends of the two fixing posts pass through both ends of the fixing plate and are threadedly connected to the main body of the conversion seat. The fixing posts are used to fix the fixing plate. The material of the fixing posts should have sufficient strength and stability to ensure that the fixing plate can be firmly fixed. The thread specification of the fixing posts should match the threaded hole of the conversion seat body to ensure the reliability of the connection.

[0009] In a further embodiment, a through slot is formed on the main body of the adapter. The through slot is used to connect the heat sink mounting position and the component loading slot. The through slot is used to provide contact space between the SMD package body and the heat sink. The size of the through slot should be designed according to the size of the SMD package body and the heat sink to ensure that there is sufficient contact area between the two to improve heat dissipation efficiency. The position of the through slot should be reasonably set to avoid affecting the structural strength of the adapter body.

[0010] In a further embodiment, one end of the fixing plate has an opening, the size of which is adapted to the threaded end of the fixing post. The size of the opening should be slightly larger than the diameter of the threaded end of the fixing post to ensure that the fixing post can pass through the opening smoothly. The shape of the opening can be designed according to the shape of the fixing post, such as circular, square, etc.

[0011] In a further embodiment, the size of the through slot is adapted to the SMD package body, and the depth of the component loading slot is adapted to the thickness of the SMD package body. The length and width of the through slot should be slightly larger than the corresponding dimensions of the SMD package body to ensure that the SMD package body can smoothly pass through the through slot and contact the heat sink. The depth of the component loading slot should be equal to or slightly smaller than the thickness of the SMD package body to ensure that the SMD package body can be firmly installed in the component loading slot without causing excessive compression.

[0012] Beneficial effects: 1. By coordinating the adapter body, component loading slot, pins, and TO aging socket, the purpose of connecting SMD packaged products to TO aging equipment is achieved. The adapter body provides stable support for the entire structure, the component loading slot precisely accommodates the SMD package body, and the pins are stably mounted on the adapter body and within the component loading slot, while also being detachably connected to the TO aging socket. This structural design allows SMD packaged products to be connected to the TO aging equipment via the adapter, enabling the TO aging equipment, which was originally inconvenient for aging tests on SMD packaged products, to successfully perform aging tests on them. This greatly expands the applicability of the TO aging equipment, improves the utilization rate of the equipment, and provides convenience for the quality inspection of SMD packaged products.

[0013] 2. Through the cooperation of the adapter body, fixing plate, fixing post, and component loading slot, the SMD package body is firmly installed and fixed. The component loading slot provides the installation position for the SMD package body, and the fixing plate is connected to the adapter body under the action of the fixing post, firmly fixing the SMD package body in the component loading slot. This structural design prevents the SMD package body from loosening or shifting during use, ensuring the connection stability between the SMD package body and the pins, thereby ensuring the reliability of signal transmission during aging tests. At the same time, the opening allows the fixing plate to rotate without the fixing post detaching from the adapter body, thus releasing the fixing plate from fixing the SMD package body. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the structure of this utility model.

[0016] Figure 2 This is a schematic diagram of the adapter.

[0017] Figure 3 This is a schematic diagram of the SMD package body.

[0018] The reference numerals in the figure are as follows: 1. Converter body; 101. Component loading slot; 102. Through slot; 2. Heat sink; 3. Pin; 4. Fixing plate; 5. Fixing post; 6. SMD package body; 7. TO aging socket. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions in this utility model are described clearly and completely. Obviously, the described embodiments are only some, not all, of the embodiments in this utility model. All other embodiments obtained by those skilled in the art based on the embodiments in this utility model without creative effort are within the scope of protection of this utility model.

[0020] This application provides an SMD-to-TO-220 package aging conversion socket, solving the technical problems of existing TO aging equipment sockets being inconvenient for aging tests on SMD packaged products and for installing and securing SMD packages. In practical use, it achieves compatibility between SMD packaged products and TO aging equipment, facilitating aging tests on SMD packaged products while also achieving convenient installation and securing of SMD packages.

[0021] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0022] Reference Figure 1-3 An aging conversion socket for SMD to TO-220 packages includes: a conversion socket body 1; a component loading slot 101; a pin 3 stably mounted on the conversion socket body 1 and located within the component loading slot 101; an SMD package body 6 stably mounted within the component loading slot 101 and electrically connected to the pin 3; and a TO aging socket 7 detachably connected to the pin 3. The TO aging socket 7 is used to connect an external TO-220 package aging device to perform aging tests on the SMD package.

[0023] By cooperating with the converter body 1, component loading slot 101, pin 3 and TO aging socket 7, the SMD package body 6 is installed in the component loading slot 101 of the converter body 1 and detachably connected to the TO aging socket 7 through pin 3, thereby enabling the SMD package to be connected to an external TO-220 package aging equipment for aging tests.

[0024] Heat sink 2 is stably installed inside the conversion base body 1, and the heat sink 2 is used for heat dissipation of the SMD package body 6.

[0025] By cooperating with the heat sink 2 and the conversion base body 1, heat dissipation is achieved for the SMD package body 6, ensuring that the temperature of the SMD package body 6 remains within a reasonable range during the aging test, thereby improving its performance stability and lifespan.

[0026] The fixing plate 4 is detachably connected to the conversion base body 1, and the fixing plate 4 is used to fix the SMD packaging body 6.

[0027] By detachably connecting the fixing plate 4 with the conversion base body 1, the SMD package body 6 is fixed, preventing it from loosening or shifting during the aging test.

[0028] There are two fixing posts 5, which are located on the conversion seat body 1. The threaded ends of the two fixing posts 5 pass through both ends of the fixing plate 4 and are threadedly connected to the conversion seat body 1. The fixing posts 5 are used to fix the fixing plate 4.

[0029] With the cooperation of two fixing posts 5, fixing plate 4 and conversion base body 1, the threaded ends of the two fixing posts 5 pass through both ends of the fixing plate 4 and are threadedly connected to the conversion base body 1, thus achieving the effect of firmly fixing the fixing plate 4, thereby ensuring that the SMD packaging body 6 is stably fixed.

[0030] A through slot 102 is formed on the conversion base body 1. The through slot 102 is used to connect the heat sink 2 mounting position with the component loading slot 101. The through slot 102 is used to provide contact space between the SMD package body 6 and the heat sink 2.

[0031] By cooperating with the conversion base body 1, the heat sink 2 mounting position and the component loading slot 101, the through slot 102 achieves the effect of connecting the heat sink 2 mounting position and the component loading slot 101, providing contact space for the SMD package body 6 and the heat sink 2.

[0032] One end of the fixing plate 4 has an opening, the size of which is adapted to the threaded end of the fixing post 5.

[0033] By engaging the opening at one end of the fixing plate 4 with the threaded end of the fixing post 5, the fixing plate 4 can be rotated without the fixing post 5 disengaging from the conversion base body 1, thereby releasing the fixing plate 4 from fixing the SMD package body 6.

[0034] The size of the through slot 102 is adapted to the SMD package body 6, and the depth of the component loading slot 101 is adapted to the thickness of the SMD package body 6.

[0035] By adapting the size of the through slot 102 to the SMD package body 6 and the depth of the component loading slot 101 to the thickness of the SMD package body 6, the SMD package body 6 can be accurately installed in the component loading slot 101 and make good contact with the heat sink 2, thereby improving the stability and functionality of the device.

[0036] In use, firstly, the SMD package body 6 is installed in the component loading slot 101 of the adapter body 1, so that the SMD package body 6 is electrically connected to the pin 3 in the component loading slot 101. Next, the fixing plate 4 is placed in a suitable position, and the threaded ends of the two fixing posts 5 pass through both ends of the fixing plate 4 and are threadedly connected to the adapter body 1, thereby fixing the SMD package body 6. At the same time, an opening is provided at one end of the fixing plate 4, which allows the fixing plate 4 to rotate without the fixing posts 5 detaching from the adapter body 1, thereby releasing the fixing plate 4 from fixing the SMD package body 6. Then, since the adapter body 1 has a through slot 102, which connects the heat sink 2 mounting position to the component loading slot 101, it provides contact space for the SMD package body 6 and the heat sink 2, and the heat sink 2 can dissipate heat for the SMD package body 6. Finally, the TO aging socket 7 is detachably connected to the pin 3, so that an external TO-220 package aging device can be connected to perform aging tests on the SMD package body 6.

[0037] The insulation protection structure, positioning structure, temperature monitoring structure, protective structure, and marking structure required above are all existing technologies and are not essential technical features in this application. Therefore, they are not described or drawn in the documents and drawings of this application. The graphics in the drawings are illustrative and are intended only to more intuitively show the key structure and connection relationship of the aging conversion socket for SMD package to TO-220 package of this utility model. In practical applications, the appearance and size of the device can be adjusted and optimized according to specific needs.

[0038] This utility model encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this utility model. To provide the public with a thorough understanding of this utility model, specific details have been described in detail in the above preferred embodiments; however, those skilled in the art can fully understand this utility model even without these detailed descriptions. Furthermore, to avoid unnecessary confusion regarding the essence of this utility model, well-known methods, processes, procedures, components, and circuits have not been described in detail.

[0039] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. An aging conversion socket for SMD package to TO-220 package, characterized in that, include: Converter body (1); Component loading slot (101); is provided on the main body (1) of the conversion seat; Pin (3) is stably mounted on the converter body (1), and the pin (3) is located in the component loading slot (101); The SMD package body (6) is stably mounted in the component loading slot (101), and the SMD package body (6) is electrically connected to the pin (3); The TO aging holder (7) is detachably connected to the pin (3). The TO aging holder (7) is used to connect an external TO-220 package aging device to perform aging tests on the SMD package.

2. The aging conversion socket for SMD package to TO-220 package according to claim 1, characterized in that, Also includes: A heat sink (2) is stably installed inside the conversion base body (1), and the heat sink (2) is used to dissipate heat from the SMD package body (6).

3. The aging conversion socket for SMD package to TO-220 package according to claim 1, characterized in that, Also includes: A fixing plate (4) is detachably connected to the conversion base body (1), and the fixing plate (4) is used to fix the SMD packaging body (6).

4. The aging conversion socket for SMD package to TO-220 package according to claim 3, characterized in that, Also includes: There are two fixed posts (5), which are located on the conversion seat body (1). The threaded ends of the two fixed posts (5) pass through both ends of the fixed plate (4) and are threadedly connected to the conversion seat body (1). The fixed posts (5) are used to fix the fixed plate (4).

5. An aging conversion socket for SMD package to TO-220 package according to claim 2, characterized in that, Also includes: A through slot (102) is provided on the conversion base body (1). The through slot (102) is used to connect the mounting position of the heat sink (2) with the component loading slot (101). The through slot (102) is used to provide contact space between the SMD package body (6) and the heat sink (2).

6. The aging conversion socket for SMD package to TO-220 package according to claim 4, characterized in that: One end of the fixing plate (4) has an opening, the size of which is adapted to the threaded end of the fixing post (5).

7. An aging conversion socket for SMD package to TO-220 package according to claim 5, characterized in that: The size of the through slot (102) is adapted to the SMD package body (6), and the depth of the component loading slot (101) is adapted to the thickness of the SMD package body (6).

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