Probe assembly and probe seat

Abstract

The utility model provides a probe assembly and a probe seat. The probe assembly comprises a probe, a clamp, a wire, a first heat insulation piece, a first temperature-resistant fastening assembly and a second temperature-resistant fastening assembly. The probe comprises a detection part and a fixing part which are arranged back to back, and the detection part is used for testing a tested sample; the clamp accommodates the fixing part and is fixedly connected with the fixing part in a pressing manner; the wire comprises a conductive connecting part and a conductive body part, the conductive connecting part is connected with the fixing part and is fixed on the clamp in a pressing manner, and the conductive body part is connected with the conductive connecting part; the first heat insulation piece is located on the peripheral side of the part, close to the conductive connecting part, of the conductive body and accommodates the part, close to the conductive connecting part, of the conductive body. The first temperature-resistant fastening assembly is used for pressing and fixing the fixing part to the clamp; and the second temperature-resistant fastening assembly is used for pressing and fixing the conductive connecting part to the clamp. The probe assembly provided by the utility model is more stable and not easy to damage when being applied to a test in a high-temperature and large-current environment.

Description

Technical Field

[0001] This application relates to the field of semiconductor testing technology, and in particular to a probe assembly and a probe holder. Background Technology

[0002] Integrated circuit elements on semiconductor devices require electrical characterization and measurement before packaging to determine if they meet standards. Probe socket testing equipment is widely used in the semiconductor testing field due to its advantages such as low cost, wide applicability, ease of operation, and stable and objective test results. In some cases, it is necessary to test the performance parameters of the sample under test in extreme environments, such as high-current and high-temperature environments, to further understand the sample's performance under extreme conditions. However, current probe socket testing equipment is prone to overheating of the lead wires when testing the parameters of samples under high-temperature or high-current environments. This can damage the lead wires, interfering with the test results and affecting the lifespan of the probe socket testing equipment. Utility Model Content

[0003] The technical problem to be solved by the embodiments of this application is that when existing probe components are used to test the parameters of the sample under test in high current or high temperature environments, the temperature of the lead wires is easily too high. This application provides a probe component and a probe holder that enables the testing of the parameters of the sample under test in high current and high temperature environments.

[0004] In a first aspect, this application provides a probe assembly, the probe assembly comprising:

[0005] A probe, comprising a detection part and a fixing part arranged opposite to each other, wherein the detection part is used to test the sample to be tested;

[0006] A clamp that receives the fixing part and is pressed and fixed to the fixing part;

[0007] A wire, comprising a conductive connecting portion and a conductive body, wherein the conductive connecting portion is connected to the fixing portion and crimped and fixed to the clamp, and the conductive body is connected to the conductive connecting portion;

[0008] A first heat insulation member is located on the outer periphery of the portion of the conductive body near the conductive connection portion, and accommodates the portion of the conductive body near the conductive connection portion.

[0009] A first high-temperature resistant fastening assembly, wherein the first high-temperature resistant fastening assembly is used to press and fix the fixing part to the clamp; and

[0010] The second temperature-resistant fastening assembly is used to press and fix the conductive connection to the clamp.

[0011] The probe assembly provided in this application includes a probe, a clamp, a lead wire, a first heat insulation component, a first high-temperature resistant fastening component, and a second high-temperature resistant fastening component. The probe has a detection portion and a fixing portion disposed opposite to each other. The detection portion is used to test the sample. The clamp houses the fixing portion to fix the probe; the clamp presses and fixes the conductive connection portion of the lead wire to connect the lead wire and the clamp. The conductive connection portion of the lead wire is connected to the fixing portion to achieve electrical signal exchange between the probe and the lead wire. The first heat insulation component is located on the outer periphery of the portion of the conductive body near the conductive connection portion and houses the portion of the conductive body near the conductive connection portion, thereby reducing heat transfer between the portion of the conductive body near the conductive connection portion and the test environment, thus preventing the lead wire from overheating and being damaged when the probe assembly is used to test the sample parameters under high-temperature conditions. The first high-temperature resistant fastening component is used to press and fix the fixing portion to the clamp, and the second high-temperature resistant fastening component is used to press and fix the conductive connection portion to the clamp. The first and second high-temperature resistant fastening components and the pressing and fixing method make the probe assembly more stable and less prone to damage when applied to high-temperature testing environments.

[0012] In some embodiments, the probe assembly further includes:

[0013] A support rod, one end of which is spaced apart from the clamp, and the other end of which is used to connect to the displacement stage in the probe holder;

[0014] A transition piece, wherein the transition piece is located between the support rod and the clamp, and one end of the transition piece is connected to one end of the support rod;

[0015] The second heat insulation component has one end pressed and fixed to the clamp, and the other end connected to the other end of the transition component.

[0016] The probe assembly provided in this application further includes a support rod, a second heat insulation component, and a transition component. The support rod connects the clamp and the displacement stage in the probe holder to provide support for the clamp. The transition component connects the support rod and the clamp. The second heat insulation component reduces heat transfer between the clamp and the support rod, minimizing heat loss and preventing heat transfer to external components that could cause overheating.

[0017] In some embodiments, the probe assembly includes a plurality of probes, and the fixture includes:

[0018] A base having a first surface having a plurality of probe grooves; and

[0019] A first fixing member has a second surface that abuts against the first surface, and the second surface and the probe groove define a probe cavity for receiving the fixing part.

[0020] The probe assembly provided in this application includes multiple probes, which prevent damage to the probes when the probe assembly is applied to a high-current testing environment. The fixture includes a base and a first fixing member. The base has a first surface with multiple probe slots, and the first fixing member has a second surface that abuts against the first surface. The second surface and the probe slots define a probe cavity. The probe cavity accommodates and fixes the fixing member. When the multiple probes and the fixture are assembled, the probe slots allow for accurate determination of the probe's mounting position.

[0021] In some embodiments, the base includes a base sub-part and a first mating sub-part, and the first fastener includes a base sub-part and a second mating sub-part, wherein the second mating sub-part engages with the first mating sub-part to fix the base sub-part and the base sub-part, wherein the first mating sub-part is one of a protrusion and a groove, and the second mating sub-part is the other of a protrusion and a groove.

[0022] The probe assembly provided in this application includes a base comprising a base sub-part and a first mating sub-part, and a first fixing member comprising a base sub-part and a second mating sub-part. The first mating sub-part is one of a protrusion and a groove, and the second mating sub-part is the other of a protrusion and a groove. The second mating sub-part engages with the first mating sub-part to fix the base sub-part to the base sub-part, thereby further achieving accurate determination of the installation position of the base and the first fixing member.

[0023] In some embodiments, the base further comprises:

[0024] A first connecting hole, the first connecting hole corresponding to the base sub-part and the first mating sub-part;

[0025] The first fastener also has:

[0026] The second connecting hole corresponds to the base sub-part and the second mating sub-part, and the second connecting hole is provided corresponding to the first connecting hole;

[0027] The first heat-resistant fastening component is disposed in the first connecting hole and the second connecting hole, and presses and fixes the first fastener to the base.

[0028] The probe assembly provided in this application includes a base with a first connecting hole corresponding to the base sub-part and the first mating sub-part, and a first fixing member with a second connecting hole corresponding to the base sub-part and the second mating sub-part. The first and second connecting holes cooperate with the first high-temperature resistant fastening assembly to achieve press-fit fixing of the first fixing member and the base, thereby achieving press-fit fixing of the probe and the clamp, making the probe assembly more stable and less prone to damage when tested in high-temperature environments.

[0029] In some embodiments, the base further includes:

[0030] A first fixing sub-part, the first fixing sub-part having a first receiving groove for receiving the conductive connection part;

[0031] The clamp also includes:

[0032] The second fixing member cooperates with the first fixing part to fix the conductive connection part.

[0033] The probe assembly provided in this application includes a base comprising a first fixing sub-part with a first receiving groove for accommodating the conductive connection portion. The clamp includes a second fixing member. The second fixing member cooperates with the first fixing sub-part to fix the conductive connection portion to the clamp.

[0034] In some embodiments, the first fixing sub-part further comprises:

[0035] At least one third connecting hole is provided in the first fixing sub-part;

[0036] The second fastener also has:

[0037] At least one fourth connecting hole, the fourth connecting hole penetrating the second fixing member, and the fourth connecting hole being provided corresponding to the third connecting hole;

[0038] The second heat-resistant fastening component is disposed in the third connecting hole and the fourth connecting hole to fix the second fastener to the first fastening part.

[0039] The probe assembly provided in this application includes a first fixing sub-part having at least one third connecting hole, and a second fixing member having at least one fourth connecting hole. The third and fourth connecting holes cooperate with the second temperature-resistant fastening assembly to achieve crimping and fixing of the second fixing member and the base, thereby achieving crimping and fixing of the wire and the clamp, making the probe assembly more stable and less prone to damage when applied to high-temperature testing environments.

[0040] In some embodiments, the clamp further includes:

[0041] The third fixing member receives one end of the second heat insulation member facing the clamp, and the third fixing member has at least one fifth connecting hole, the fifth connecting hole penetrates the third fixing member, and the fifth connecting hole is provided corresponding to the third connecting hole;

[0042] The second temperature-resistant fastening component is also disposed in the fifth connecting hole to press and fix the third fastener to the first fastening part.

[0043] The probe assembly provided in this application includes a clamp that further comprises a third fixing member. The third fixing member accommodates the second heat insulation member near one end of the clamp and secures the connection between the second heat insulation member and the clamp. The third fixing member has at least one fifth connecting hole, which cooperates with the second temperature-resistant fastening assembly to press-fit the third fixing member and the base, thereby achieving press-fitting of the second heat insulation member and the clamp. This makes the probe assembly more stable and less prone to damage when tested in high-temperature environments.

[0044] In some embodiments, the third fastener includes:

[0045] A first sub-connecting portion, the first sub-connecting portion having a third surface, the third surface having a second receiving groove; and

[0046] The second sub-connector has a fourth surface that abuts against the third surface and has a third receiving groove. The third receiving groove and the second receiving groove together define a receiving cavity that receives the portion of the second heat insulation member facing the probe.

[0047] The probe assembly provided in this application includes a third fixing member comprising a first connecting sub-part and a second connecting sub-part. The first connecting sub-part has a second receiving groove; the second connecting sub-part has a third receiving groove. The third receiving groove and the second receiving groove together define a receiving cavity, which allows the portion of the second heat insulation member facing the probe to be received within the third fixing member, thereby achieving the connection between the second heat insulation member and the clamp.

[0048] Secondly, this application provides a probe holder, the probe holder comprising:

[0049] At least one probe assembly, wherein the probe in the probe assembly is used to test the parameters of the sample under test in a preset environment; and a detection stage, wherein the detection stage is used to hold the sample under test and the detection stage provides the preset environment for the sample under test.

[0050] A displacement stage is connected to the side of the probe assembly opposite to the detection stage, and the displacement stage is used to move in different directions to adjust the position of the probe; and

[0051] A current device is electrically connected to one end of the conductive body away from the conductive connection portion, and is used to provide current to the probe.

[0052] The probe holder provided in this application includes at least one probe assembly, a detection stage, a displacement stage, and a current device. The probe holder enables testing of a sample under test in a testing environment. The probes in the probe assembly are used to test the working state of the sample under test in that environment. The components of the probe assembly are fixedly connected by a heat-resistant fastening assembly, making the probe assembly more stable and less prone to damage when applied to high-temperature testing environments. The detection stage provides the testing environment for the sample under test and supports the sample during testing. The displacement stage is connected to the side of the probe assembly opposite to the detection stage to achieve displacement of the probes in the probe assembly. The current device is electrically connected to the wires to provide current to the probes in the probe assembly, thereby further realizing the exchange of electrical signals between the probe holder and the sample under test. Attached Figure Description

[0053] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0054] Figure 1 This is a top view of the probe holder according to one embodiment of this application;

[0055] Figure 2 This is a three-dimensional structural diagram of the probe assembly, displacement stage, and current device combined according to an embodiment of this application.

[0056] Figure 3 yes Figure 1 The diagram shows a cross-sectional structure of the probe holder along line AA.

[0057] Figure 4This is a three-dimensional structural schematic diagram of a probe assembly according to an embodiment of this application;

[0058] Figure 5 yes Figure 4 The diagram shows a cross-sectional view of the probe assembly along line BB.

[0059] Figure 6 This is a three-dimensional structural diagram of the probe assembly in the separated state according to an embodiment of this application;

[0060] Figure 7 This is a three-dimensional structural schematic diagram of a probe assembly according to another embodiment of this application;

[0061] Figure 8 yes Figure 5 A partially enlarged schematic diagram of probe assembly I shown;

[0062] Figure 9 yes Figure 7 A partially enlarged schematic diagram of probe assembly II shown;

[0063] Figure 10 This is a three-dimensional structural diagram of the base according to one embodiment of this application;

[0064] Figure 11 This is a three-dimensional structural diagram of the clamp in the separated state according to an embodiment of this application;

[0065] Figure 12 This is a three-dimensional structural schematic diagram of a clamp according to an embodiment of this application;

[0066] Figure 13 yes Figure 12 A schematic diagram of the cross-sectional structure of the fixture along line CC;

[0067] Figure 14 yes Figure 12 A schematic diagram of the cross-sectional structure of the fixture along line DD;

[0068] Figure 15 This is a three-dimensional structural diagram of the third fastener according to an embodiment of this application.

[0069] Explanation of reference numerals in the attached figures:

[0070] Probe holder 1, probe assembly 10, detection stage 20, displacement stage 30, first mechanism 31, second mechanism 32, third mechanism 33, current device 40, probe 110, detection part 111, fixing part 112, clamp 120, base 121, first fixing member 122, second fixing member 123, third fixing member 124, wire 130, conductive connection part 131, conductive body part 132, first heat insulation member 140, first high-temperature resistant fastening assembly 150, second high-temperature resistant fastening assembly 160, support rod 170, transition member 180, second heat insulation member 190, base sub-part 1211, first mating sub-part 1212, first fixing sub-part 1213, base sub-part 1221, second mating part 1222, first sub-connecting part 1241, second sub-connecting part 1242, probe cavity 120a, first surface 121a, probe groove 121b, first connecting hole 121c, second surface 122a, second connecting hole 122b, fourth connecting hole 123a, fifth connecting hole 124a, receiving cavity 124b, first sub-surface 1212a, first side surface 1212b, first receiving groove 1213a, third connecting hole 1213b, second sub-surface 1222a, second side surface 1222b, third surface 1241a, second receiving groove 1241b, fourth surface 1242a, third receiving groove 1242b. Detailed Implementation

[0071] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0072] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0073] In this document, the reference to "embodiment" or "implementation" means that a specific feature, structure, or characteristic described in connection with or in connection with an implementation may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same implementation, nor is it a separate or alternative implementation mutually exclusive with other implementations. It will be explicitly and implicitly understood by those skilled in the art that the implementations described herein can be combined with other implementations.

[0074] Please see Figure 1 , Figure 2and Figure 3 , Figure 1 This is a top view of the probe holder according to one embodiment of this application; Figure 2 This is a three-dimensional structural diagram of the probe assembly, displacement stage, and current device combined according to an embodiment of this application. Figure 3 yes Figure 1 The diagram shows a cross-sectional view of the probe holder along line AA. One embodiment of this application provides a probe holder 1, comprising: at least one probe assembly 10, a detection stage 20, a displacement stage 30, and a current device 40. The probe 110 in the probe assembly 10 is used to test parameters of a sample under test in a preset environment. The detection stage 20 is used to hold the sample under test and provides the preset environment for the sample. The displacement stage 30 is connected to the side of the probe assembly 10 opposite to the detection stage 20; the displacement stage 30 is used to move in different directions to adjust the position of the probe 110. The current device 40 is electrically connected to the end of the conductive body 132 opposite to the conductive connection portion 131, and is used to provide current to the probe 110.

[0075] The probe holder 1 provided in this application is a process testing instrument used in the fields of information science and systems science. The probe holder 1 is used to test the performance parameters of a sample under test in a test environment. The sample under test can be, but is not limited to, wafers, diodes, power devices, circuit boards, liquid crystal panels, and solar cells. The test environment can be, but is not limited to, temperature environments, pressure environments, and current environments. It is understood that the probe holder 1 can be used for radio frequency testing of wafers, high-temperature environment testing of diodes, low-current testing of power devices, high-voltage and high-current testing of circuit boards, radiation environment testing of solar cells, and resistivity testing of material surfaces. The above are examples of application scenarios for the probe holder 1 provided in this application and should not be construed as limiting the application scenarios of the probe holder 1 provided in this application.

[0076] The probe holder 1 includes at least one probe assembly 10 and a detection stage 20. Optionally, the at least one probe assembly 10 is located around the detection stage 20, and the probes 110 in the probe assembly 10 are arranged facing the detection stage 20. When the probe holder 1 tests the sample under test, the detection portion 111 of the probe 110 contacts the sample under test to perform the test. The probe holder 1 includes a displacement stage 30 and a current device 40. Optionally, the displacement stage 30 is correspondingly disposed to the probe assembly 10, and the displacement stage 30 is located at the end of the probe assembly 10 opposite to the probe 110, and the displacement stage 30 is connected to the end of the probe assembly 10 opposite to the probe 110. It is understood that the current device 40 is correspondingly disposed to the probe assembly 10 and is electrically connected to the wire 130 in the probe assembly 10 to provide current to the sample under test.

[0077] The probe 110 in the probe assembly 10 is used to test the working state of the sample under test in the test environment. The detection stage 20 carries the sample under test and provides the test environment for the sample. The detection stage 20 may have a test cavity. When the probe holder 1 is used to test the sample under test, the detection part 111 of the probe 110 in the probe assembly 10 extends into the test cavity and contacts the sample to test its parameters. The detection stage 20 may include a sample stage housed in the test cavity. When the probe holder 1 is used to test the sample under test, the sample stage carries the sample. The detection stage 20 may, but is not limited to, include a cooling component, a heating component, a pressure component, an electromagnetic component, etc. Understandably, the cooling component and the heating component can regulate the temperature of the test environment within the test cavity; the pressure component can regulate the pressure of the test environment within the test cavity; and the electromagnetic component can regulate the magnetic field of the test environment within the test cavity.

[0078] The displacement stage 30 is connected to the side of the probe assembly 10 opposite to the detection stage 20. The displacement stage 30 is used to move in different directions to adjust the position of the probe 110. The displacement stage 30 may include, but is not limited to, a first mechanism 31, a second mechanism 32, and a third mechanism 33. The first mechanism 31 is used to move the probe assembly 10 in a first direction, the second mechanism 32 is used to move the probe assembly 10 in a second direction, and the third mechanism 33 is used to move the probe assembly 10 in a third direction. The first direction is perpendicular to the second direction, the first direction is perpendicular to the third direction, and the second direction is perpendicular to the third direction. The first mechanism 31, the second mechanism 32, and the third mechanism 33 cause the displacement stage 30 to move in different directions, thereby further adjusting the position of the probe 110. It is understood that the displacement stage 30 may also be a displacement device including a translation stage and a rotation stage. The above is an example of the structure of the displacement stage 30 provided in this application and should not be construed as limiting the structure of the displacement stage 30 provided in the embodiments of this application.

[0079] To clearly illustrate the beneficial effects of the technical solution of this application, related technologies are introduced here. In related technologies, the current device 40 in the probe holder 1 typically provides a current I to the sample under test that satisfies the condition 0A < I < 1A, in order to test the parameters of the sample under test when current flows through it. When the current I satisfies 0A < I < 1A, it is also called a small current; when the current I satisfies 1A ≤ I, it is also called a large current. Typically, a large current is a current I that satisfies 1A ≤ I ≤ 50A. However, in some cases, the sample under test needs to operate in a high-current environment, in which case the probe holder 1 is needed to test the characteristic parameters of the sample under test when a large current flows through it. The probe holder 1 provided in this application includes a current device 40, which is electrically connected to one end of the conductive body 132 away from the conductive connection portion 131, for providing a current I that satisfies I ≤ 50A to the probe 110. The current device 40 in the probe holder 1 provided in this application can realize the testing of the parameters of the sample under test when a large current flows through it.

[0080] The current device 40 is electrically connected to the wire 130 of the probe assembly 10 for exchanging electrical signals with the probe 110. Understandably, the current device 40 can conduct current to the probe 110 of the probe assembly 10 through the wire 130, thereby providing current to the sample under test when the probe holder 1 is being tested, to test the parameters of the sample under test when current flows through it. The current device 40 may, but is not limited to, be connected to the displacement stage 30 and move in different directions with the displacement stage 30 during testing.

[0081] In summary, the probe holder 1 provided in this application includes at least one probe assembly 10, a detection stage 20, a displacement stage 30, and a current device 40. The probe holder 1 enables testing of the sample under test in a testing environment. The probe 110 in the probe assembly 10 is used to test the working state of the sample under test in the testing environment. The components of the probe assembly 10 are fixedly connected by a heat-resistant fastening assembly, making the probe assembly 10 more stable and less prone to damage when tested in a high-temperature testing environment. The detection stage 20 provides the testing environment for the sample under test and carries the sample during testing. The displacement stage 30 is connected to the side of the probe assembly 10 away from the detection stage 20 to achieve displacement of the probe 110 in the probe assembly 10. The current device 40 is electrically connected to the wire 130 to provide current to the probe 110 in the probe assembly 10, thereby further realizing the electrical signal exchange between the probe holder 1 and the sample under test.

[0082] Please see Figure 4 and Figure 5 , Figure 4 This is a three-dimensional structural schematic diagram of a probe assembly according to an embodiment of this application; Figure 5 yes Figure 4 The diagram shows a cross-sectional view of the probe assembly along line BB. One embodiment of this application provides a probe assembly 10, which includes a probe 110, a clamp 120, a wire 130, a first heat insulation member 140, a first temperature-resistant fastening assembly 150, and a second temperature-resistant fastening assembly 160. The probe 110 includes a detection portion 111 and a fixing portion 112 disposed opposite to each other. The detection portion 111 is used to test the sample. The clamp 120 houses the fixing portion 112 and is press-fitted to it. The wire 130 includes a conductive connection portion 131 and a conductive body portion 132. The conductive connection portion 131 connects to the fixing portion 112 and is press-fitted to the clamp 120. The conductive body portion 132 connects to the conductive connection portion 131. The first heat insulation member 140 is located on the outer periphery of the portion of the conductive body portion 132 near the conductive connection portion 131 and houses the portion of the conductive body portion 132 near the conductive connection portion 131. The first heat-resistant fastening assembly 150 is used to press and fix the fixing part 112 to the clamp 120. The second heat-resistant fastening assembly 160 is used to press and fix the conductive connection part 131 to the clamp 120.

[0083] The probe assembly 10 provided in this application can be applied to the probe holder 1 provided in this application. The probe assembly 10 provided in this application is a process testing device in the fields of information science and systems science. The probe assembly 10 is used to test the performance parameters of a sample under test in a test environment. The sample under test can be, but is not limited to, wafers, diodes, power devices, circuit boards, liquid crystal panels, and solar cells. The test environment can be, but is not limited to, temperature environments, pressure environments, and current environments. It is understood that the probe assembly 10 can be used for radio frequency testing of wafers, high-temperature environment testing of diodes, low-current testing of power devices, high-voltage and high-current testing of circuit boards, radiation environment testing of solar cells, and resistivity testing of material surfaces. The above are examples of application scenarios for the probe assembly 10 provided in this application and should not be construed as limiting the application scenarios of the probe assembly 10 provided in this application.

[0084] The probe 110 has a detection part 111 and a fixing part 112 disposed opposite to each other. The detection part 111 and the fixing part 112 can be integrally formed to reduce production costs. The detection part 111 is used to test the sample under test. When the probe assembly 10 is used to test the parameters of the sample under test, the detection part 111 of the probe 110 contacts the sample under test to perform the test. Understandably, the detection part 111 can transmit the electrical signal from the sample under test to the electrode device, thereby acquiring and analyzing the electrical signal to test the parameters of the sample under test. Understandably, the detection part 111 can conduct the current from the electrode device to the sample under test to test the parameters of the sample under test when receiving current. The detection part 111 can be an oxidation-resistant detection part 111; optionally, the oxidation-resistant detection part 111 is a tungsten detection part 111. When the probe assembly 10 is used to test the parameters of the sample under test in a high-temperature test environment, the detection unit 111 needs to be in a high-temperature test environment. The oxidation-resistant detection unit 111 can prevent the detection unit 111 from oxidizing and failing in a high-temperature test environment, thereby increasing the service life of the probe 110.

[0085] The probe assembly 10 further includes a clamp 120, which houses and presses against the fixing part 112; the conductive connection part 131 is also press-fitted to the clamp 120. The clamp 120 houses and fixes the fixing part 112 of the probe 110, and also houses and fixes the conductive connection part 131 of the wire 130. Understandably, the fixing part 112 is connected to the clamp 120 by pressing, and the conductive connection part 131 is also connected to the clamp 120 by pressing. Understandably, the clamp 120 fixes the positions of the fixing part 112 and the conductive connection part 131, thereby ensuring stable electrical signal exchange between the fixing part 112 and the conductive connection part 131 during testing.

[0086] The probe assembly 10 also includes a wire 130. When the probe assembly 10 is used to test the parameters of the sample under test using the probe holder 1, the probe 110 is electrically connected to the current device 40 on the probe holder 1 via the wire 130, thereby realizing the exchange of electrical signals between the probe 110 and the current device 40. Understandably, the detection unit 111 conducts current to the sample under test via the wire 130 to test the parameters of the sample under test when receiving current. Understandably, the sample under test conducts electrical signals to the current device 40 via the wire 130 to achieve the acquisition and analysis of the electrical signals from the sample under test. The wire 130 includes a conductive connection part 131, which is electrically connected to the fixing part 112 to realize the electrical connection between the wire 130 and the probe 110.

[0087] To clearly illustrate the beneficial effects of the technical solution of this application, related technologies are introduced here. The probe assembly 10 in the related technologies operates in a test environment with a temperature between -269°C and 200°C. When the temperature of the test environment exceeds 200°C, the heat from the test environment will be conducted to the lead wire 130, causing the lead wire 130 to overheat and be damaged, interfering with the test results of the probe assembly 10 on the sample being tested. This also affects the service life of the lead wire 130 and the probe assembly 10.

[0088] The probe assembly 10 provided in this application includes a first heat insulation member 140. The first heat insulation member 140 is located on the outer periphery of the portion of the conductive body 132 near the conductive connection portion 131, and accommodates the portion of the conductive body 132 near the conductive connection portion 131. It is understood that the first heat insulation member 140 may be, but is not limited to, a tubular structure, sleeved on the outer periphery of the portion of the conductive body 132 near the conductive connection portion 131. When the probe assembly 10 is used to test the parameters of the sample under test in a high-temperature testing environment (e.g., 200℃~500℃), the first heat insulation member 140 can achieve thermal isolation between the conductive body 132 and the high-temperature testing environment, thereby preventing the conductive body 132 from overheating and being damaged, and increasing the service life of the wire 130 and the probe assembly 10. The first heat insulation member 140 may be an insulating first heat insulation member; optionally, the insulating first heat insulation member may be a ceramic first heat insulation member.

[0089] To clearly illustrate the beneficial effects of the technical solution of this application, the relevant technologies are described again here. In the relevant technologies, the electrical connection between the components of the probe assembly 10 is usually achieved by soldering during manufacturing. However, the solder in the soldering process is unstable at high temperatures. When the probe assembly 10 is continuously used to test the sample in a test environment of 200℃~500℃, the solder in the soldering process of the relevant technologies is prone to melting, causing damage to the probe assembly 10. The first high-temperature resistant fastening component 150 and the second high-temperature resistant fastening component 160 in the probe assembly 10 provided in this application have the characteristic of not easily melting at high temperatures, so that the probe assembly 10 can be used to test the sample in a test environment of 200℃~500℃. It can be understood that the probe assembly 10 provided in this embodiment has a wide temperature application range and can also be used in low temperature environment, normal temperature environment and high temperature environment. The temperature environment t of the probe assembly 10 provided in this embodiment satisfies: -269℃ <t≤500℃。

[0090] The first high-temperature resistant fastening assembly 150 is used to press-fit and fix the fixing part 112 to the clamp 120. It is understood that the first high-temperature resistant fastening assembly 150 may be, but is not limited to, a combination of a high-temperature resistant screw, a high-temperature resistant bolt, a combination of a high-temperature resistant screw and a high-temperature resistant nut, or a combination of a high-temperature resistant bolt and a high-temperature resistant nut. Optionally, the first high-temperature resistant fastening assembly 150 is correspondingly disposed with respect to the portion of the clamp 120 near the fixing part 112, and penetrates the clamp 120 to achieve the press-fit fixation between the clamp 120 and the fixing part 112. The electrical connection method of the first high-temperature resistant fastening assembly 150 and the press-fit fixation can avoid the melting of solder in the soldering process used in related technologies, thereby making the probe assembly 10 more stable and less prone to damage when tested in high-temperature testing environments.

[0091] The second high-temperature resistant fastening assembly 160 is used to press-fit and fix the conductive connection portion 131 to the clamp 120. It is understood that the second high-temperature resistant fastening assembly 160 can be, but is not limited to, a combination of a high-temperature resistant screw, a high-temperature resistant bolt, a combination of a high-temperature resistant screw and a high-temperature resistant nut, or a combination of a high-temperature resistant bolt and a high-temperature resistant nut. Optionally, the second high-temperature resistant fastening assembly 160 is correspondingly disposed to the portion of the clamp 120 opposite to the fixing portion 112, and penetrates the clamp 120 to achieve the press-fit fixation of the clamp 120 and the conductive connection portion 131. The electrical connection method of the second high-temperature resistant fastening assembly 160 and the press-fit fixation can avoid the melting of solder in the soldering process used in related technologies, thereby making the probe assembly 10 more stable and less prone to damage when tested in high-temperature testing environments.

[0092] In summary, the probe assembly 10 provided in this application includes a probe 110, a clamp 120, a wire 130, a first heat insulation member 140, a first temperature-resistant fastening assembly 150, and a second temperature-resistant fastening assembly 160. The probe 110 has a detection portion 111 and a fixing portion 112 disposed opposite to each other. The detection portion 111 is used to test the sample. The clamp 120 houses the fixing portion 112 to fix the probe 110; the clamp 120 presses and fixes the conductive connection portion 131 of the wire 130 to connect the wire 130 and the clamp 120. The conductive connection portion 131 of the wire 130 is connected to the fixing portion 112 to realize electrical signal exchange between the probe 110 and the wire 130. The first heat insulation element 140 is located on the outer periphery of the portion of the conductive body 132 near the conductive connection portion 131, and accommodates the portion of the conductive body 132 near the conductive connection portion 131, thereby reducing heat transfer between the portion of the conductive body 132 near the conductive connection portion 131 and the test environment, thus preventing the wire 130 from overheating and being damaged when the probe assembly 10 is used to test the parameters of the sample under high temperature conditions. The first high-temperature resistant fastening assembly 150 is used to press and fix the fixing portion 112 to the clamp 120, and the second high-temperature resistant fastening assembly 160 is used to press and fix the conductive connection portion 131 to the clamp 120. The first high-temperature resistant fastening assembly 150 and the second high-temperature resistant fastening assembly 160 and the pressing and fixing method make the probe assembly 10 more stable and less prone to damage when tested in high-temperature test environments.

[0093] Please refer to it again. Figure 4 and Figure 5 And please see Figure 6 and Figure 7 , Figure 6 This is a three-dimensional structural diagram of the probe assembly in the separated state according to an embodiment of this application; Figure 7 This is a three-dimensional structural schematic diagram of a probe assembly according to another embodiment of this application. Further, in one embodiment, the probe assembly 10 further includes a support rod 170, a transition member 180, and a second heat insulation member 190. One end of the support rod 170 is spaced apart from the clamp 120, and the other end is connected to the displacement stage 30 in the probe holder 1. The transition member 180 is located between the support rod 170 and the clamp 120, and one end of the transition member 180 is connected to the aforementioned end of the support rod 170. One end of the second heat insulation member 190 is press-fitted and fixed to the clamp 120, and the other end is connected to the other end of the transition member 180.

[0094] The probe assembly 10 also includes a support rod 170. Understandably, when the probe assembly 10 is used to test the parameters of the sample in the probe holder 1, the first heat insulation member 140 is sleeved on the outer periphery of the conductive body 132 near the conductive connection portion 131, and is not fixedly connected to other components in the probe holder 1. The wire 130 connects the clamp 120 and the current device 40 in the probe holder 1, but cannot fix the position of the probe assembly 10 and the current device 40. One end of the support rod 170 is spaced apart from the clamp 120, and the other end is used to connect to the displacement stage 30 in the probe holder 1. This allows for the fixation of the position of the probe assembly 10 and the displacement stage 30, providing support for the probe assembly 10.

[0095] The probe assembly 10 further includes a second heat insulation element 190. One end of the second heat insulation element 190 is pressed and fixed to the clamp 120, and the other end is connected to the other end of the transition element 180. Optionally, the second heat insulation element 190 is a ceramic tube heat insulation element. The second heat insulation element can reduce the heat transfer from the test environment to the support rod 170, and at the same time, it can also serve as insulation to prevent the current in the wire 130 from being conducted to the support rod 170 and damaging the probe assembly 10 when the probe assembly is used to test the characteristic parameters of the sample under test when a large current passes through it.

[0096] The probe assembly 10 further includes a transition member 180, which is located between the support rod 170 and the clamp 120, with one end of the transition member 180 connected to that end of the support rod 170. Understandably, the transition member 180 simultaneously accommodates the end of the support rod 170 facing the clamp 120 and the end of the second heat insulation member 190 facing away from the clamp 120. Optionally, the transition member 180 includes a first transition portion and a second transition portion. The first transition portion is fixedly connected to the support rod 170, and the second transition portion is fixedly connected to the second heat insulation member 190, thereby achieving a fixed connection between the support rod 170 and the second heat insulation member 190.

[0097] In summary, the probe assembly 10 provided in this application further includes a support rod 170, a second heat insulation member 190, and a transition member 180. The support rod 170 connects the clamp 120 and the displacement stage 30 in the probe holder 1, thereby providing support for the clamp 120. The transition member 180 connects the support rod 170 and the clamp 120. The second heat insulation member 190 reduces heat transfer between the clamp 120 and the support rod 170, minimizing heat loss and preventing heat transfer to external components that could cause overheating.

[0098] Please refer to it again. Figure 5 , Figure 6 and Figure 7 And please see Figure 8 , Figure 9 and Figure 10 , Figure 8 yes Figure 5 A partially enlarged schematic diagram of probe assembly I shown; Figure 9 yes Figure 7 A partially enlarged schematic diagram of probe assembly II shown; Figure 10 This is a three-dimensional structural schematic diagram of the base according to one embodiment of this application. Further, in one embodiment, the probe assembly 10 includes a plurality of probes 110. The clamp 120 includes a base 121 and a first fixing member 122. The base 121 has a first surface 121a, which has a plurality of probe grooves 121b. The first fixing member 122 has a second surface 122a, which abuts against the first surface 121a, and the second surface 122a and the probe grooves 121b define a probe cavity 120a for receiving the fixing part 112.

[0099] Before introducing the technical solution of this application, let's reiterate the technical problems in related technologies. In related technologies, when a large current passes through the probe 110 in the probe assembly 10, the detection part 111 of the probe 110 is prone to overheating and damage. However, in some cases, the sample under test needs to operate in a high-current environment, and in this case, the probe assembly 10 is needed to test the characteristic parameters of the sample under test when a large current passes through it. In view of this, to solve the above problems, the probe assembly 10 provided in the embodiments of this application includes a plurality of probes 110. The plurality of probes 110 can be arranged in parallel to disperse the current passing through the probes 110, wherein each probe 110 can carry a current of 0A to 5A. In one embodiment, the probe assembly 10 includes ten probes 110, and the ten probes 110 enable the probe assembly 10 to carry a current of 0A to 50A.

[0100] The first surface 121a of the base has a plurality of probe slots 121b, which, together with the second surface 122a of the first fixing member 122, define a probe cavity 120a for receiving the fixing part 112. The portion of the second surface 122a facing the probe slot 121b can abut against the surface of the fixing part 112 facing the first fixing member 122, allowing the probe 110 to be stably fixed to the clamp 120. The detection portion 111 of the probe 110 extends from the probe slot 121b for testing the sample. Understandably, the base 121 and the first fixing member 122 cooperate to receive and fix the fixing part 112 of the probe 110. When the plurality of probes 110 and the clamp 120 are assembled, the probe slots 121b can further accurately determine the installation position of the probe 110.

[0101] In summary, the probe assembly 10 provided in this application includes a plurality of probes 110, which makes the probes 110 less prone to damage when the probe assembly 10 is applied to a high-current testing environment. The fixture 120 includes a base 121 and a first fixing member 122. The base 121 has a first surface 121a with a plurality of probe grooves 121b. The first fixing member 122 has a second surface 122a that abuts against the first surface 121a. The second surface 122a and the probe grooves 121b define a probe cavity 120a. The probe cavity 120a accommodates and fixes the fixing part 112. When the plurality of probes 110 and the fixture 120 are assembled, the probe grooves 121b can accurately determine the installation position of the probes 110.

[0102] Please refer to it again. Figure 10 And please see Figure 11 , Figure 11 This is a three-dimensional structural diagram of the clamp in its separated state according to one embodiment of this application. Further, in one embodiment, the base 121 includes a base sub-part 1211 and a first mating sub-part 1212, and the first fixing member 122 includes a base sub-part 1221 and a second mating sub-part 1222. The second mating sub-part 1222 engages with the first mating sub-part 1212 to fix the base sub-part 1211 and the base sub-part 1221. The first mating sub-part 1212 is one of a protrusion and a groove, and the second mating sub-part 1222 is the other of a protrusion and a groove.

[0103] Understandably, the first mating portion 1212 has a first sub-surface 1212a facing the second mating portion 1222, and at least one first side surface 1212b. In one embodiment, the first mating portion 1212 is a protrusion, defined by the first sub-surface 1212a and at least one first side surface 1212b. In one embodiment, the first mating portion 1212 is a groove, defined by the first sub-surface 1212a and at least one first side surface 1212b.

[0104] Understandably, the second mating portion has a second sub-surface 1222a facing the first mating portion 1212, and at least one second side surface 1222b. In one embodiment, the second mating portion is a protrusion, defined by the second sub-surface 1222a and at least one second side surface 1222b. In one embodiment, the second mating portion is a groove, defined by the second sub-surface 1222a and at least one second side surface 1222b.

[0105] When the base 121 and the first fixing member 122 are assembled, the first sub-surface 1212a of the first mating sub-part 1212 abuts against the second sub-surface 1222a of the second mating sub-part, and the first side surface 1212b of the first mating sub-part 1212 abuts against the second side surface 1222b of the second mating sub-part, thereby fixing the base sub-part 1211 to the base sub-part 1221, and further accurately determining the installation position of the base 121 and the first fixing member 122.

[0106] In summary, the probe assembly 10 provided in this application includes a base 121 comprising a base sub-part 1211 and a first mating sub-part 1212, and a first fixing member 122 comprising a base sub-part 1221 and a second mating sub-part 1222. The first mating sub-part 1212 is one of a protrusion and a groove, and the second mating sub-part 1222 is the other of a protrusion and a groove. The second mating sub-part 1222 engages with the first mating sub-part 1212 to fix the base sub-part 1211 to the base sub-part 1221, thereby further achieving accurate determination of the installation position of the base 121 and the first fixing member 122.

[0107] Please refer to it again. Figure 8 and Figure 11 And please see Figure 12 and Figure 13 , Figure 12 This is a three-dimensional structural schematic diagram of a clamp according to an embodiment of this application; Figure 13 yes Figure 12 The diagram shows a cross-sectional view of the clamp along line CC. Further, in one embodiment, the base 121 also has a first connecting hole 121c, and the first fixing member 122 also has a second connecting hole 122b. The first connecting hole 121c corresponds to the base sub-part 1211 and the first mating sub-part 1212. The second connecting hole 122b corresponds to the base sub-part 1221 and the second mating sub-part 1222, and is disposed corresponding to the first connecting hole 121c. The first temperature-resistant fastening assembly 150 is disposed in the first connecting hole 121c and the second connecting hole 122b, pressing and fixing the first fixing member 122 to the base 121.

[0108] Understandably, in one embodiment, the first mating part 1212 is a protrusion, and the second mating part is a groove. Optionally, the first connecting hole 121c is a through hole penetrating the base part 1211 and the first mating part 1212, and the second connecting hole 122b is a through hole penetrating the portion of the base part 1221 corresponding to the second mating part 1222. Optionally, the first connecting hole 121c is a blind hole provided in the base part 1211 and the first mating part 1212, the opening of the blind hole facing the first fixing member 122; the second connecting hole 122b is a through hole penetrating the portion of the base part 1221 corresponding to the second mating part 1222. When the first temperature-resistant fastening assembly 150 is assembled with the clamp 120, the first temperature-resistant fastening assembly 150 enters the second connecting hole 122b from the side of the second connecting hole 122b away from the second mating part 1222, and extends into the first connecting hole 121c. Optionally, the first connecting hole 121c is a through hole penetrating the base sub-part 1211 and the first mating sub-part 1212; the second connecting hole 122b is a blind hole disposed on the portion of the base sub-part 1221 corresponding to the second mating sub-part 1222, the opening of the blind hole facing the base 121. When the first temperature-resistant fastening assembly 150 is assembled with the clamp 120, the first temperature-resistant fastening assembly 150 passes through the first connecting hole 121c from the side of the first connecting hole 121c away from the first mating sub-part 1212 and extends into the second connecting hole 122b.

[0109] Understandably, in one embodiment, the second mating portion 1222 is a protrusion, and the first mating portion 1212 is a groove. Optionally, the second connecting hole 122b is a through hole penetrating the base portion 1221 and the second mating portion 1222, and the first connecting hole 121c is a through hole penetrating the portion of the base portion 1211 corresponding to the first mating portion 1212. Optionally, the second connecting hole 122b is a blind hole provided in the base portion 1221 and the second mating portion 1222, the opening of the blind hole facing the base 121; the first connecting hole 121c is a through hole penetrating the portion of the base portion 1211 corresponding to the first mating portion 1212. When the first temperature-resistant fastening assembly 150 is assembled with the clamp 120, the first temperature-resistant fastening assembly 150 passes through the first connecting hole 121c from the side opposite to the first mating part 1212 and extends into the second connecting hole 122b. Optionally, the second connecting hole 122b is a through hole penetrating the base part 1221 and the second mating part 1222; the first connecting hole 121c is a blind hole provided in the portion of the base part 1211 corresponding to the first mating part 1212, and the opening of the blind hole faces the first fixing member 122. When the first temperature-resistant fastening assembly 150 is assembled with the clamp 120, the first temperature-resistant fastening assembly 150 passes through the second connecting hole 122b from the side opposite to the second mating part 1222 and extends into the first connecting hole 121c.

[0110] The first high-temperature resistant fastening component 150 is disposed within the first connecting hole 121c and the second connecting hole 122b to press-fit and fix the first fixing member 122 to the base 121. The first high-temperature resistant fastening component 150, in conjunction with the first connecting hole 121c and the second connecting hole 122b, achieves the press-fit fixation of the first fixing member 122 and the base 121, thereby achieving the press-fit fixation of the probe 110 and the clamp 120. The electrical connection method of the first high-temperature resistant fastening component 150 and the press-fit fixation avoids the problem of solder melting easily and instability in testing environments of 200–500°C, which is common in related technologies using solder fixing methods. This makes the probe assembly 10 more stable and less prone to damage when applied to high-temperature testing environments. The maximum testing temperature of the probe assembly 10 is increased to 500°C.

[0111] In summary, the probe assembly 10 provided in this application embodiment has a base 121 with a first connecting hole 121c corresponding to the base sub-part 1211 and the first mating sub-part 1212, and a second connecting hole 122b corresponding to the base sub-part 1221 and the second mating sub-part 1222. The first connecting hole 121c and the second connecting hole 122b cooperate with the first high-temperature resistant fastening assembly 150 to achieve the crimping and fixing of the first fastener 122 and the base 121, thereby achieving the crimping and fixing of the probe 110 and the clamp 120, making the probe assembly 10 more stable and less prone to damage when tested in high-temperature testing environments.

[0112] Please refer to it again. Figure 9 , Figure 11 and Figure 12 And please see Figure 14 , Figure 14 yes Figure 12 The diagram shows a cross-sectional view of the clamp along line DD. Further, in one embodiment, the base 121 includes a first fixing sub-part 1213, and the clamp 120 includes a second fixing member 123. The first fixing sub-part 1213 has a first receiving groove 1213a for receiving the conductive connection part 131. The second fixing member 123 cooperates with the first fixing sub-part 1213 to fix the conductive connection part 131.

[0113] The base 121 further includes a first fixing sub-part 1213, which has a first receiving groove 1213a for receiving the conductive connection part 131. Understandably, the first receiving groove 1213a can accommodate the conductive connection part 131. Optionally, the inner wall surface of the first receiving groove 1213a abuts against the outer peripheral surface of the conductive connection part 131, so that the first receiving groove 1213a cooperates with the second fixing member 123 to stably fix the conductive connection part 131 to the clamp, thereby further ensuring stable electrical signal exchange between the fixing part 112 and the conductive connection part 131 during the test.

[0114] The clamp 120 further includes a second fixing member 123, which cooperates with the first fixing sub-part 1213 to fix the conductive connection part 131. Understandably, the second fixing member 123 can cooperate with the first receiving groove 1213a to fix the conductive connection part 131. Optionally, the surface of the second fixing member 123 facing the base 121 can abut against the conductive connection part 131, so that the second fixing member 123 cooperates with the first fixing sub-part 1213 to stably fix the conductive connection part 131 to the clamp, thereby further ensuring stable electrical signal exchange between the fixing part 112 and the conductive connection part 131 during the testing process.

[0115] In summary, the probe assembly 10 provided in this application includes a base 121 comprising a first fixing sub-part 1213, which has a first receiving groove 1213a for receiving the conductive connection part 131. The clamp 120 includes a second fixing member 123. The second fixing member 123 cooperates with the first fixing sub-part 1213 to fix the conductive connection part 131 to the clamp 120.

[0116] Please refer to it again. Figure 9 , Figure 11 , Figure 12 and Figure 14 Furthermore, in one embodiment, the first fixing sub-part 1213 further has at least one third connecting hole 1213b, and the second fixing member 123 further has at least one fourth connecting hole 123a. The third connecting hole 1213b is disposed in the first fixing sub-part 1213, and the fourth connecting hole 123a penetrates the second fixing member 123, and the fourth connecting hole 123a is disposed corresponding to the third connecting hole 1213b. The second temperature-resistant fastening assembly 160 is disposed in the third connecting hole 1213b and the fourth connecting hole 123a to fix the second fixing member 123 to the first fixing sub-part 1213.

[0117] The first fixing sub-part 1213 further has at least one third connecting hole 1213b, and the second fixing member 123 further has at least one fourth connecting hole 123a, wherein the fourth connecting hole 123a is disposed corresponding to the third connecting hole 1213b. In one possible embodiment, the first fixing sub-part 1213 has two third connecting holes 1213b, which are respectively disposed on both sides of the first receiving groove 1213a, and the fourth connecting hole 123a is disposed corresponding to the third connecting hole 1213b. It can be understood that the first fixing sub-part 1213 may also have one or more third connecting holes 1213b, and the second fixing member 123 may also have one or more fourth connecting holes 123a. The above are examples of the structure of the first fixing sub-part 1213 provided in this application, and should not be construed as limiting the structure of the first fixing sub-part 1213 provided in the embodiments of this application.

[0118] The third connecting hole 1213b is disposed in the first fixing sub-part 1213, and the fourth connecting hole 123a penetrates the second fixing member 123. It can be understood that the fourth connecting hole 123a is a through hole penetrating the second fixing member 123, and the third connecting hole 1213b can be either a through hole penetrating the first fixing sub-part 1213 or a blind hole disposed in the first fixing sub-part 1213, with the opening of the blind hole facing the second fixing member 123. When the second temperature-resistant fastening assembly 160 is assembled with the clamp 120, the second temperature-resistant fastening assembly 160 enters the fourth connecting hole 123a from the side of the fourth connecting hole 123a away from the first fixing sub-part 1213 and extends into the third connecting hole 1213b.

[0119] The second high-temperature resistant fastening assembly 160 is disposed in the third connecting hole 1213b and the fourth connecting hole 123a to fix the second fixing member 123 to the first fixing sub-part 1213. The second high-temperature resistant fastening assembly 160, in conjunction with the third connecting hole 1213b and the fourth connecting hole 123a, achieves the crimping fixation of the second fixing member 123 and the base 121, thereby achieving the crimping fixation of the probe 110 and the clamp 120. The electrical connection method of the second high-temperature resistant fastening assembly 160 and the crimping fixation avoids the problem of solder melting and instability in testing environments of 200–500°C, which is common in related technologies using soldering methods. This makes the probe assembly 10 more stable and less prone to damage when tested in high-temperature environments, increasing the maximum testing temperature of the probe assembly 10 to 500°C.

[0120] In summary, the probe assembly 10 provided in this application embodiment has at least one third connecting hole 1213b for the first fixing sub-part 1213 and at least one fourth connecting hole 123a for the second fixing member 123. The third connecting hole 1213b and the fourth connecting hole 123a cooperate with the second temperature-resistant fastening assembly 160 to achieve crimping and fixing of the second fixing member 123 and the base 121, thereby achieving crimping and fixing of the wire 130 and the clamp 120. This makes the probe assembly 10 more stable and less prone to damage when tested in high-temperature environments.

[0121] Please refer to it again. Figure 9 , Figure 11 , Figure 12 and Figure 14 And please see Figure 15 , Figure 15 This is a three-dimensional structural schematic diagram of the third fixing member according to one embodiment of this application. Further, in one embodiment, the clamp 120 further includes a third fixing member 124, which receives one end of the second heat insulation member 190 facing the clamp 120, and has at least one fifth connecting hole 124a. The fifth connecting hole 124a penetrates the third fixing member 124 and is disposed corresponding to the third connecting hole 1213b. The second heat-resistant fastening assembly 160 is also disposed in the fifth connecting hole 124a, pressing and fixing the third fixing member 124 to the first fixing sub-part 1213.

[0122] The clamp 120 further includes a third fixing member 124, which receives one end of the second heat insulation member 190 facing the clamp 120. Understandably, the third fixing member 124 has a cavity for receiving the second heat insulation member 190 near one end of the clamp 120. Optionally, the inner wall surface of the cavity abuts against the outer peripheral surface of the second heat insulation member 190 near the end of the clamp 120, thereby connecting the third fixing member 124 and the second heat insulation member 190.

[0123] The third fixing member 124 has at least one fifth connecting hole 124a, which corresponds to the third connecting hole 1213b. The second heat-resistant fastening component 160 is also disposed in the fifth connecting hole 124a, thereby pressing and fixing the third fixing member 124 to the first fixing sub-part 1213. In this embodiment, the third connecting hole 1213b is a through hole penetrating the first fixing sub-part 1213. The fifth connecting hole 124a can cooperate with the third connecting hole 1213b and the second heat-resistant fastening component 160 to achieve the pressing and fixing of the third fixing member 124 and the base 121, thereby achieving the pressing and fixing of the second heat insulation member 190 and the clamp 120.

[0124] The fifth connecting hole 124a is provided corresponding to the third connecting hole 1213b. The second heat-resistant fastening assembly 160 is disposed in the third connecting hole 1213b, the fourth connecting hole 123a, and the fifth connecting hole 124a, fixing the second fixing member 123, the conductive base 121, and the third fixing member 124. In this embodiment, the fifth connecting hole 124a allows the three components to be crimped and fixed using only one set of heat-resistant fastening assemblies, eliminating the need for a connecting hole on the base 121 to mate with the third fixing member 124, thus saving manufacturing costs for the probe assembly 10.

[0125] In summary, the probe assembly 10 provided in this application includes a clamp 120 further comprising a third fixing member 124. The third fixing member 124 accommodates the second heat insulation member 190 near one end of the clamp 120 and secures the connection between the second heat insulation member 190 and the clamp 120. The third fixing member 124 has at least one fifth connecting hole 124a, which cooperates with the second temperature-resistant fastening assembly 160 to press-fit the third fixing member 124 and the base 121, thereby achieving the press-fit fixation between the second heat insulation member 190 and the clamp 120. This makes the probe assembly 10 more stable and less prone to damage when tested in high-temperature environments.

[0126] Please refer to it again. Figure 9 , Figure 11 , Figure 12 , Figure 14 and Figure 15Further, in one embodiment, the third fixing member 124 includes a first sub-connecting portion 1241 and a second sub-connecting portion 1242. The first sub-connecting portion 1241 has a third surface 1241a, which has a second receiving groove 1241b. The second sub-connecting portion 1242 has a fourth surface 1242a, which abuts against the third surface 1241a, and the fourth surface 1242a has a third receiving groove 1242b. The third receiving groove 1242b and the second receiving groove 1241b together define a receiving cavity 124b, which receives the portion of the second heat insulation member 190 facing the probe 110.

[0127] The third fixing member 124 includes a first sub-connecting portion 1241 and a second sub-connecting portion 1242. Optionally, the first sub-connecting portion 1241 and the second sub-connecting portion 1242 are detachably connected. When the second heat insulation member 190 and the third fixing member 124 are assembled, the first sub-connecting portion 1241 and the second sub-connecting portion 1242 are in a separated state. The portion of the second heat insulation member 190 facing the probe 110 is disposed in the second receiving groove 1241b or the third receiving groove 1242b. Then, the first sub-connecting portion 1241 and the second sub-connecting portion 1242 are assembled to realize the combined installation of the second heat insulation member 190 and the third fixing member 124.

[0128] The third receiving groove 1242b and the second receiving groove 1241b together define a receiving cavity 124b, which receives the portion of the second heat insulation member 190 facing the probe 110. The receiving cavity 124b allows the portion of the second heat insulation member 190 facing the probe 110 to be received within the third fixing member 124, thereby connecting the second heat insulation member 190 to the clamp 120. Optionally, the inner wall surface of the receiving cavity 124b abuts against the outer surface of the portion of the second heat insulation member 190 facing the probe 110, thereby achieving stable fixation of the second heat insulation member 190 and the third fixing member 124.

[0129] In summary, the probe assembly 10 provided in this application includes a third fixing member 124 comprising a first connecting sub-part and a second connecting sub-part. The first connecting sub-part 1241 has a second receiving groove 1241b; the second connecting sub-part 1242 has a third receiving groove 1242b. The third receiving groove 1242b and the second receiving groove 1241b together define a receiving cavity 124b, which allows the portion of the second heat insulation member 190 facing the probe 110 to be received in the third fixing member 124, thereby achieving the connection between the second heat insulation member 190 and the clamp 120.

[0130] In this utility model, the terms "embodiment" and "implementation" mean that a specific feature, structure, or characteristic described in connection with an implementation can be included in at least one implementation of this application. The appearance of these phrases in various places in the specification does not necessarily refer to the same implementation, nor are they independent or alternative implementations mutually exclusive with other implementations. Those skilled in the art will understand, explicitly and implicitly, that the implementations described in this utility model can be combined with other implementations. Furthermore, it should be understood that the features, structures, or characteristics described in the various implementations of this utility model can be arbitrarily combined to form another implementation that does not depart from the spirit and scope of the technical solution of this utility model, provided there is no contradiction between them.

[0131] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solution of this application should not depart from the spirit and scope of the technical solution of this utility model.

Claims

1. A probe assembly, characterized in that, The probe assembly includes: A probe, comprising a detection part and a fixing part arranged opposite to each other, wherein the detection part is used to test the sample to be tested; A clamp that receives the fixing part and is pressed and fixed to the fixing part; A wire, comprising a conductive connecting portion and a conductive body, wherein the conductive connecting portion is connected to the fixing portion and crimped and fixed to the clamp, and the conductive body is connected to the conductive connecting portion; A first heat insulation member is located on the outer periphery of the portion of the conductive body near the conductive connection portion, and accommodates the portion of the conductive body near the conductive connection portion. A first high-temperature resistant fastening assembly, wherein the first high-temperature resistant fastening assembly is used to press and fix the fixing part to the clamp; and The second temperature-resistant fastening assembly is used to press and fix the conductive connection to the clamp.

2. The probe assembly as claimed in claim 1, characterized in that, The probe assembly also includes: A support rod, one end of which is spaced apart from the clamp, and the other end of which is used to connect to the displacement stage in the probe holder; A transition piece, wherein the transition piece is located between the support rod and the clamp, and one end of the transition piece is connected to one end of the support rod; The second heat insulation component has one end pressed and fixed to the clamp, and the other end connected to the other end of the transition component.

3. The probe assembly as described in claim 2, characterized in that, The probe assembly includes multiple probes, and the fixture includes: A base having a first surface having a plurality of probe grooves; and A first fixing member has a second surface that abuts against the first surface, and the second surface and the probe groove define a probe cavity for receiving the fixing part.

4. The probe assembly as described in claim 3, characterized in that, The base includes a base sub-part and a first mating sub-part. The first fixing member includes a base sub-part and a second mating sub-part. The second mating sub-part cooperates with the first mating sub-part to fix the base sub-part and the base sub-part. The first mating sub-part is one of a protrusion and a groove, and the second mating sub-part is the other of a protrusion and a groove.

5. The probe assembly as described in claim 4, characterized in that, The base also has: A first connecting hole, the first connecting hole corresponding to the base sub-part and the first mating sub-part; The first fastener also has: The second connecting hole corresponds to the base sub-part and the second mating sub-part, and the second connecting hole is provided corresponding to the first connecting hole; The first heat-resistant fastening component is disposed in the first connecting hole and the second connecting hole, and presses and fixes the first fastener to the base.

6. The probe assembly as claimed in claim 4, characterized in that, The base also includes: A first fixing sub-part, the first fixing sub-part having a first receiving groove for receiving the conductive connection part; The clamp also includes: The second fixing member cooperates with the first fixing part to fix the conductive connection part.

7. The probe assembly as claimed in claim 6, characterized in that, The first fixing sub-part also has: At least one third connecting hole is provided in the first fixing sub-part; The second fastener also has: At least one fourth connecting hole, the fourth connecting hole penetrating the second fixing member, and the fourth connecting hole being provided corresponding to the third connecting hole; The second heat-resistant fastening component is disposed in the third connecting hole and the fourth connecting hole to fix the second fastener to the first fastening part.

8. The probe assembly as claimed in claim 7, characterized in that, The clamp also includes: The third fixing member receives one end of the second heat insulation member facing the clamp, and the third fixing member has at least one fifth connecting hole, the fifth connecting hole penetrates the third fixing member, and the fifth connecting hole is provided corresponding to the third connecting hole; The second temperature-resistant fastening component is also disposed in the fifth connecting hole to press and fix the third fastener to the first fastening part.

9. The probe assembly as claimed in claim 8, characterized in that, The third fastener includes: A first sub-connecting portion, the first sub-connecting portion having a third surface, the third surface having a second receiving groove; and The second sub-connector has a fourth surface that abuts against the third surface and has a third receiving groove. The third receiving groove and the second receiving groove together define a receiving cavity that receives the portion of the second heat insulation member facing the probe.

10. A probe holder, characterized in that, The probe holder includes: At least one probe assembly as described in any one of claims 1-9, wherein the probe in the probe assembly is used to test parameters of the sample under test in a preset environment; A testing station, which is used to hold the sample to be tested and provides the preset environment for the sample to be tested; A displacement stage is connected to the side of the probe assembly opposite to the detection stage, and the displacement stage is used to move in different directions to adjust the position of the probe; and A current device is electrically connected to one end of the conductive body away from the conductive connection portion, and is used to provide current to the probe.

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