Calibration circuit board for chip detection jig

Abstract

The utility model relates to the field of chip detection equipment, and discloses a calibration circuit board for a chip detection jig, which comprises a calibration substrate, a first detection resistor, a second detection resistor and a third detection resistor, the quasi substrate is provided with a plurality of first tin balls which are mutually conducted and a plurality of second tin balls which are mutually conducted, wherein the first tin balls and the second tin balls are respectively used for being correspondingly conducted and butted with a grounding conduction butt joint point, a core power supply conduction butt joint point, an auxiliary power supply conduction butt joint point and a main power supply conduction butt joint point on a detection circuit board in the chip detection jig. One ends of the first detection resistor, the second detection resistor and the third detection resistor are connected and conducted with the first tin ball, and the other ends of the first detection resistor, the second detection resistor and the third detection resistor are respectively connected and conducted with the second tin ball, the third tin ball and the fourth tin ball. The detection accuracy of the chip can be effectively improved, and error detection caused by errors of electronic devices on a detection circuit board in the detection jig is reduced.

Description

Technical Field

[0001] This utility model relates to chip testing equipment, and in particular to a calibration circuit board for a chip testing fixture. Background Technology

[0002] During chip manufacturing, packaged chips typically require performance testing. Based on the chip performance testing needs, the manufacturing and testing company requests the corresponding batch of test fixtures for testing equipment, including test circuit boards. After the test fixture secures and limits the chips, the test circuit board connects to the test points on the chip for conductivity testing, and the results are analyzed using appropriate current and voltage monitoring modules.

[0003] For example, when testing LPDDR4X (fourth generation low-power double data rate synchronous dynamic random access memory), the corresponding test circuit board provides VDD1, VDD2, VDDQ, and VSS to the corresponding solder ball pins on the LPDDR4X. (VDD1 is the core power supply inside the chip, used to control the logic circuits in the memory; VDD2 is the auxiliary power supply for the internal circuits, mainly used for generating internal clock, address, and control signals; VDDQ is the main power supply for storing data, supplying external data for writing and reading; VSS is the ground point.) The test circuit board also has adjustable voltage source modules that output each voltage domain (VDD1, VDD2, VDDQ) and ADC current detection modules for analyzing and acquiring electrical signals respectively.

[0004] Because test circuit boards are mass-produced, the errors caused by cost factors in individual components on the circuit board are significant when these errors are accumulated across a large number of components. Consequently, the resistances in the test circuits of mass-produced test circuit boards have slight differences. For chips that require precise testing, maintaining the same output voltage will result in different input currents to the chip, which in turn will affect the accuracy of the test. Therefore, a chip testing fixture is needed to calibrate the output current on the test circuit board using a calibration circuit board, thereby improving the accuracy of chip testing and reducing false readings caused by errors in the electronic components on the test circuit board in the testing fixture. Utility Model Content

[0005] This utility model provides a calibration circuit board for chip testing fixtures, which solves the technical problem that when batch-customized testing circuit boards in test fixtures of chip testing equipment are made, the resistances on the testing circuits of batch-customized testing circuit boards are slightly different, and fixing the same output voltage will cause different input currents to the chip, thus affecting the accuracy of testing.

[0006] The technical solution adopted by this utility model to solve its technical problem is: a calibration circuit board for a chip testing fixture, including a calibration substrate, a first detection resistor, a second detection resistor, and a third detection resistor. The calibration substrate is provided with multiple first solder balls, multiple second solder balls, multiple third solder balls, and multiple fourth solder balls, each for corresponding conductive connections with grounding, core power supply, auxiliary power supply, and main power supply points on the testing circuit board in the chip testing fixture. The multiple first solder balls are interconnected, the multiple second solder balls are interconnected, the multiple third solder balls are interconnected, and the multiple fourth solder balls are interconnected. One end of each of the first, second, and third detection resistors is connected to a first solder ball, and the other end is connected to a second, third, and fourth solder ball, respectively. This effectively improves the accuracy of chip testing and reduces false detections caused by errors in electronic components on the testing circuit board in the testing fixture.

[0007] Furthermore, the calibration substrate includes a mating trace layer and a back trace layer. The mating trace layer includes multiple independent first conductive metal portions, and the back trace layer includes multiple independent second conductive metal portions. Communication between the same contact pins is achieved through these two circuit boards.

[0008] Furthermore, the plurality of first solder balls, second solder balls, third solder balls, and fourth solder balls are each soldered to corresponding positions on a plurality of different first conductive metal portions. Each of the plurality of first conductive metal portions has a first metal conductive post extending vertically to the corresponding second conductive metal portion at the position corresponding to the plurality of first solder balls, second solder balls, third solder balls, and fourth solder balls. With each conductive solder ball position on the mating trace layer and the back trace layer having a connected first metal conductive post, the resistance is lower and the calibration accuracy is higher.

[0009] Furthermore, a plurality of vertically connected second metal posts located outside the positions of the first metal post are provided between the first conductive metal part and the corresponding second conductive metal part. This fixed conductive arrangement, located between the first and second conductive metal parts which have a relatively large area or long length, reduces the resistance between the corresponding first and second conductive metal parts.

[0010] Furthermore, the calibration substrate has two positioning solder balls independent of the multiple first solder balls, multiple second solder balls, multiple third solder balls, and multiple fourth solder balls. These two positioning solder balls are not connected to the first and second conductive metal portions. Fifty-eight first solder balls, together with the two positioning solder balls, form a total of sixty solder balls, symmetrically distributed on the calibration substrate. Eight second solder balls, twenty-four third solder balls, and twenty fourth solder balls are symmetrically arranged on the calibration substrate. This symmetrical ball-point structure on the calibration circuit board provides better stability for the fixed connection.

[0011] Furthermore, the first, second, and third detection resistors are all surface-mount resistors with a precision of one-thousandth. This ensures high calibration accuracy. Attached Figure Description

[0012] Figure 1 This is a block diagram illustrating the connection between the detection circuit board and the calibration circuit board during the calibration process of this utility model.

[0013] Figure 2 A front view schematic diagram of the conductive connection structure on the calibration circuit board;

[0014] Figure 3 A top view schematic diagram of the conductive connection structure on the docking routing layer;

[0015] Figure 4 This is a top view diagram showing the orientation of the back wiring layer;

[0016] The following are labeled in the figure: First metal conductive post 101, Second metal conductive post 102, First solder ball 110, Second solder ball 120, Third solder ball 130, Fourth solder ball 140, Positioning solder ball 150, First detection resistor 200, Second detection resistor 300, and Third detection resistor 400. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0018] like Figure 1The calibration circuit board for a chip testing fixture shown includes a calibration substrate, a first detection resistor 200, a second detection resistor 300, and a third detection resistor 400. The calibration substrate is provided with a plurality of first solder balls 110, a plurality of second solder balls 120, a plurality of third solder balls 130, and a plurality of fourth solder balls 140, which are respectively used for conductive connection with the grounding connection point, core power connection point, auxiliary power connection point, and main power connection point on the testing circuit board in the chip testing fixture. The plurality of first solder balls 110 are interconnected, the plurality of second solder balls 120 are interconnected, the plurality of third solder balls 130 are interconnected, and the plurality of fourth solder balls 140 are interconnected. One end of the first detection resistor 200, the second detection resistor 300, and the third detection resistor 400 is connected to the first solder ball 110 and conductive, and the other end is connected to the second solder ball 120, the third solder ball 130, and the fourth solder ball 140, respectively.

[0019] In this specific embodiment, the calibration circuit board is used to calibrate the detection current of the LPDDR4X (4th Generation Low Power Double Data Rate Synchronous Dynamic Random Access Memory) testing fixture. During the LPDDR4X testing process, the testing circuit board in the testing fixture provides corresponding voltage domains and grounding to the corresponding solder ball pins on the LPDDR4X. VDD1 is the core power supply inside the chip, used to control the logic circuits in the memory; VDD2 is the auxiliary power supply for the internal circuitry, mainly used for generating internal clock, address, and control signals; VDDQ is the main power supply for storing data, supplying external data for writing and reading; and VSS is the grounding point. When calibrating the testing fixture, the calibration circuit board is placed at the LPDDR4X testing position. Multiple first solder balls 110, multiple second solder balls 120, multiple third solder balls 130, and multiple fourth solder balls 140 on the calibration substrate correspond to the solder ball pins of VSS, VDD1, VDD2, and VDDQ on the LPDDR4X, respectively.

[0020] During the testing process, the resistance of the circuit corresponding to the voltage domain provided by the detection circuit board in the testing fixture is determined by the basic principle that voltage equals the product of resistance and current. That is, by providing different voltages to the circuits with a first detection resistor 200, a second detection resistor 300, and a third detection resistor 400 connected in series with fixed high-precision resistance values, and detecting the current in the corresponding circuits, the resistance of the circuit corresponding to the voltage domain provided by the detection circuit board in the testing fixture can be determined. Then, in subsequent testing, the output current can be accurately output by adjusting the voltage, thus completing the output current calibration. When testing LPDDR4X, the detection circuit board in the testing fixture has an adjustable voltage source module for outputting each voltage domain and an ADC current detection module.

[0021] During calibration, when the calibration circuit board is positioned and pressed into the chip detection position in the chip detection fixture, one end of the first detection resistor 200 on the calibration circuit board is connected to the VDD1 (core power) terminal on the detection circuit board through multiple interconnected second solder balls 120, and the other end is connected to the VSS (ground) terminal on the detection circuit board through multiple interconnected first solder balls 110; one end of the second detection resistor 300 is connected to the VDD2 (auxiliary power) terminal on the detection circuit board through multiple interconnected third solder balls 130, and the other end is connected to the VSS (ground) terminal on the detection circuit board through multiple interconnected first solder balls 110; one end of the third detection resistor 400 is connected to the VDDQ (main power) terminal on the detection circuit board through multiple interconnected fourth solder balls 140, and the other end is connected to the VSS (ground) terminal on the detection circuit board through multiple interconnected first solder balls 110; the adjustable voltage source module and ADC current detection module of the detection circuit board can simply complete the output current calibration on the detection circuit board by outputting different voltages and detecting the corresponding current.

[0022] It can effectively improve the accuracy of chip detection and reduce false detections caused by errors in electronic components on the circuit board in the testing fixture.

[0023] Based on the above, such as Figures 2 to 4 As shown, the calibration substrate includes a mating trace layer and a back trace layer. The mating trace layer includes multiple independent first conductive metal portions, and the back trace layer includes multiple independent second conductive metal portions. Communication between the same contact pins is achieved through these two circuit boards.

[0024] Based on the above, such as Figures 2 to 4As shown, the plurality of first solder balls 110, the plurality of second solder balls 120, the plurality of third solder balls 130, and the plurality of fourth solder balls 140 are respectively soldered to corresponding positions on a plurality of different first conductive metal portions. A first metal conductive post 101 extending vertically to the corresponding second conductive metal portion is provided on the plurality of first conductive metal portions at positions corresponding to the plurality of first solder balls 110, the plurality of second solder balls 120, the plurality of third solder balls 130, and the plurality of fourth solder balls 140. In this specific embodiment, the plurality of first conductive metal portions include a plurality of independent first mating conductive metal portions corresponding to the soldering of the plurality of first solder balls 110, a plurality of independent second mating conductive metal portions corresponding to the soldering of the plurality of second solder balls 120, a plurality of independent third mating conductive metal portions corresponding to the soldering of the plurality of third solder balls 130, and a plurality of independent fourth mating conductive metal portions corresponding to the soldering of the plurality of fourth solder balls 140. The first three conductive metal sections are each connected to multiple first solder balls 110; the second three conductive metal sections are each connected to multiple second solder balls 120; the third sixteen conductive metal sections are each connected to a third solder ball 130, and five of them are connected to multiple third solder balls 130; the fourth seven conductive metal sections are each connected to a fourth solder ball 140, and three of them are connected to multiple fourth solder balls 140. Each conductive solder ball position on the mating trace layer and the back trace layer is equipped with a connected first metal conductive post, resulting in lower resistance and higher calibration accuracy.

[0025] Based on the above, such as Figure 2 As shown, a plurality of vertically connected second metal conductive posts 102, located outside the positions of the first metal conductive posts 101, are provided between the first conductive metal part and the corresponding second conductive metal part. The fixed conductive arrangement between the first conductive metal part and the corresponding second conductive metal part, which has a relatively large area or a long length, reduces the resistance between the corresponding first conductive metal part and the corresponding second conductive metal part.

[0026] Based on the above, such as Figures 2 to 4As shown, the calibration substrate has two positioning solder balls 150, independent of the plurality of first solder balls 110, the plurality of second solder balls 120, the plurality of third solder balls 130, and the plurality of fourth solder balls 140. These two positioning solder balls 150 are not connected to the first and second conductive metal portions. Fifty-eight of the first solder balls 110, together with the two positioning solder balls 150, form a total of sixty solder balls, which are centrally symmetrically distributed on the calibration substrate. Eight of the second solder balls 120, twenty-four of the third solder balls 130, and twenty of the fourth solder balls 140 are centrally symmetrically distributed on the calibration substrate. In specific implementations, the two positioning solder balls 150 serve a positioning function and provide symmetrical support after the calibration substrate is pressed. In specific implementations, the number and position of the positioning solder balls 150 that are not connected to the first and second conductive metal portions can be determined according to actual conditions to achieve an overall symmetrical structure. The symmetrical ball-point structure on the calibration circuit board provides better stability for the fixed connection.

[0027] Based on the above, such as Figure 2 and Figure 3 As shown, the first detection resistor 200, the second detection resistor 300, and the third detection resistor 400 are all surface-mount resistors with a precision of one-thousandth. This ensures high calibration accuracy.

[0028] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above description is only a specific embodiment of this utility model and is not intended to limit this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A calibration circuit board for a chip testing fixture, characterized in that: The device includes a calibration substrate, a first detection resistor (200), a second detection resistor (300), and a third detection resistor (400). The calibration substrate is provided with a plurality of first solder balls (110), a plurality of second solder balls (120), a plurality of third solder balls (130), and a plurality of fourth solder balls (140) for corresponding conductive connections with the grounding connection point, core power connection point, auxiliary power connection point, and main power connection point on the detection circuit board in the chip testing fixture. The plurality of first solder balls (110) are interconnected, the plurality of second solder balls (120) are interconnected, the plurality of third solder balls (130) are interconnected, and the plurality of fourth solder balls (140) are interconnected. One end of the first detection resistor (200), the second detection resistor (300), and the third detection resistor (400) is connected to the first solder ball (110) and the other end is connected to the second solder ball (120), the third solder ball (130), and the fourth solder ball (140), respectively.

2. The calibration circuit board for a chip testing fixture according to claim 1, characterized in that: The calibration substrate includes a mating trace layer and a back trace layer. The mating trace layer includes multiple independent first conductive metal portions, and the back trace layer includes multiple independent second conductive metal portions.

3. The calibration circuit board for a chip testing fixture according to claim 2, characterized in that: The plurality of first solder balls (110), the plurality of second solder balls (120), the plurality of third solder balls (130) and the plurality of fourth solder balls (140) are respectively soldered to the corresponding positions on the plurality of different first conductive metal parts. The plurality of first conductive metal parts are provided with first metal conductive posts (101) that extend vertically to the corresponding second conductive metal parts at the corresponding positions of the plurality of first solder balls (110), the plurality of second solder balls (120), the plurality of third solder balls (130) and the plurality of fourth solder balls (140).

4. The calibration circuit board for a chip testing fixture according to claim 3, characterized in that: A plurality of vertically connected second metal conduction posts (102) located outside the position of the first metal conduction post (101) are provided between the first conductive metal part and the corresponding second conductive metal part.

5. The calibration circuit board for a chip testing fixture according to claim 4, characterized in that: The calibration substrate has two positioning solder balls (150) that are independent of the plurality of first solder balls (110), the plurality of second solder balls (120), the plurality of third solder balls (130), and the plurality of fourth solder balls (140). The two positioning solder balls (150) are not connected to the first conductive metal part and the second conductive metal part. Fifty-eight of the first solder balls (110) are provided, and together with the two positioning solder balls (150), a total of sixty solder balls are centrally symmetrically distributed on the calibration substrate. Eight of the second solder balls (120) are centrally symmetrically arranged on the calibration substrate. Twenty-four of the third solder balls (130) are centrally symmetrically arranged on the calibration substrate. Twenty of the fourth solder balls (140) are centrally symmetrically arranged on the calibration substrate.

6. The calibration circuit board for a chip testing fixture according to claim 1, characterized in that: The first detection resistor (200), the second detection resistor (300), and the third detection resistor (400) are all surface mount resistors with a precision of one-thousandth.

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