Semiconductor etching and drying device

Abstract

The utility model discloses a semiconductor etching and drying device, which relates to the technical field of semiconductor processing and comprises a device main body and a drying mechanism, the device main body is provided with a drying cavity and a waiting cavity; the drying cavity is provided with a first communicating opening communicating with the exterior of the device body and allowing workpieces to pass through. The drying mechanism is installed in the drying cavity and used for drying the workpieces located in the drying cavity. The waiting cavity is provided with a second communication part which communicates with the outside of the device body and allows the workpiece to pass through. By integrating the waiting cavity, when the drying cavity is occupied, the etched workpiece can enter the waiting cavity for temporary storage through the second communication port. Due to the existence of the waiting cavity, the etching groove can carry out the next round of etching operation in time after the workpiece is etched, the etching groove is prevented from being idle due to the fact that the waiting drying cavity is idle, the utilization rate of the etching groove is greatly improved, and the etching efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and in particular to a semiconductor etching and drying apparatus. Background Technology

[0002] In wet etching processes, the application of automated equipment significantly improves the efficiency and consistency of wafer processing. A typical automated wet etching machine uses a robotic arm to pick up wafers or baskets and immerse them in an etching tank containing etching solution for cleaning and etching. After that, they are transferred to a drying tank for drying. For example, Chinese patent application CN120341141A discloses a wafer slicing etching equipment and method.

[0003] As shown in the above-disclosed patent, the existing drying tank is a single drying chamber design. When one drying chamber corresponds to multiple etching tanks, if the workpiece in the drying chamber is not dried completely, but a new workpiece is etched in the etching tank, the etched workpiece needs to be left in the etching tank, making it impossible for the etching tank to perform subsequent etching operations; or an empty etching tank needs to be occupied for temporary storage. Both of these methods will limit the utilization rate of the etching tank and reduce the etching efficiency.

[0004] Specifically, because the drying chamber is occupied, the etched workpieces cannot be immediately transferred to the drying chamber for the next stage of processing. In this situation, operators typically have two options: one is to leave the etched workpieces in the original etching tank while waiting for the drying chamber to become available, but this will prevent the etching tank from starting new etching operations in a timely manner; the other is to temporarily move the etched workpieces to an empty etching tank for storage, but this method not only occupies other etching tank resources but also increases unnecessary handling operations.

[0005] Therefore, there is an urgent need to provide a new solution to address the technical problems caused by the limited utilization of etching tanks and reduced etching efficiency due to the single drying chamber design of existing drying tanks. Utility Model Content

[0006] In view of this, the purpose of this application is to provide a semiconductor etching and drying apparatus to solve the technical problems of limited utilization of etching tank and reduced etching efficiency caused by the single drying chamber design of existing drying tanks.

[0007] To achieve the above-mentioned technical objectives, this application provides a semiconductor etching and drying apparatus, including an apparatus body and a drying mechanism;

[0008] The main body of the device is provided with a drying chamber and a waiting chamber;

[0009] The drying chamber has a first communication port that connects to the outside of the main body of the device and allows the workpiece to pass through;

[0010] The drying mechanism is installed in the drying chamber for drying the workpiece located in the drying chamber;

[0011] The waiting cavity has a second communication port that connects to the outside of the device body and allows the workpiece to pass through.

[0012] Furthermore, a sealing cap is installed on the first communication port;

[0013] A switch cover mechanism is installed on the main body of the device;

[0014] The switch cover mechanism is connected to the sealing cover and is used to control the opening or closing movement of the sealing cover.

[0015] Furthermore, it also includes a conveying mechanism;

[0016] The main body of the device is also provided with a third communication port connecting the waiting chamber and the drying chamber;

[0017] The conveying mechanism is installed on the main body of the device and spans the waiting chamber, the third connecting port and the drying chamber, and is used to convey the workpiece in the waiting chamber to the drying chamber through the third connecting port.

[0018] Furthermore, there are multiple waiting chambers arranged sequentially;

[0019] The adjacent waiting chambers are connected by a fourth communication port;

[0020] The waiting chamber closest to the drying chamber is connected to the drying chamber through the third communication port;

[0021] The conveying mechanism spans the drying chamber, the third connecting port, each of the waiting chambers, and the fourth connecting port, and is capable of sequentially transporting the workpieces in the waiting chambers to the drying chamber.

[0022] Furthermore, a shielding component is installed on the third connecting port;

[0023] The blocking member is a normally closed blocking member that can be opened by pushing the workpiece.

[0024] Furthermore, a shielding component is installed on the third connecting port;

[0025] A stopper drive mechanism is installed on the main body of the device;

[0026] The stop drive mechanism is connected to the stop and is used to drive the stop to open or close.

[0027] Furthermore, the drying mechanism includes a drying head;

[0028] The drying head has an air inlet and an air outlet;

[0029] The air inlet is connected to a heat source via an air inlet pipe.

[0030] Furthermore, the drying mechanism also includes a linkage mechanism and a linkage driver;

[0031] The drying head is rotatably mounted on the side wall of the drying chamber;

[0032] The linkage driver is connected to the drying head via the linkage mechanism, and is used to drive the drying head to swing through the linkage mechanism.

[0033] Furthermore, the drying mechanism also includes a linkage mechanism;

[0034] The drying head is rotatably mounted on the side wall of the drying chamber;

[0035] The linkage mechanism is connected between the drying head and the conveying mechanism, and can follow the movement of the conveying mechanism when it is running, and drive the drying head to swing.

[0036] Furthermore, the conveying mechanism includes a conveyor belt body and a conveyor motor;

[0037] The output shaft of the conveyor motor is connected to the drive shaft in the conveyor belt body.

[0038] Furthermore, the linkage mechanism includes a first fixing member, a second fixing member, and a connecting rod;

[0039] The first fixing member is fixed to the rotating connection end of the drying head;

[0040] The second fixing member is fixed to one end of the drive shaft or driven shaft of the conveyor belt body;

[0041] The first end of the connecting rod is hinged to the first fixing member at a position a first distance from the rotation center line of the rotating connection end;

[0042] The second end of the connecting rod is hinged to the second fixing member at a position a second distance from the rotation center line of the driving shaft or the driven shaft;

[0043] The connecting rod is used to convert the rotation of the second fixed member into the swing of the first fixed member.

[0044] Furthermore, the conveying mechanism also includes a limiting frame;

[0045] The limiting frame is mounted on the conveying surface of the conveyor belt body and is provided with a limiting groove along the conveying direction of the conveyor belt body;

[0046] The workpiece contacts the conveying surface via the limiting groove;

[0047] The limiting groove is used to limit the displacement of the workpiece in a direction perpendicular to the conveying direction.

[0048] Furthermore, a stop mechanism is installed in the waiting cavity;

[0049] The stop mechanism has a stop part that can switch between a stop position and a release position;

[0050] When the stop portion is in the stop position, it can contact and abut against the workpiece to stop the workpiece from moving towards the drying chamber.

[0051] As can be seen from the above technical solutions, the semiconductor etching and drying apparatus designed in this application has the following beneficial effects:

[0052] By integrating a waiting chamber, when the drying chamber is occupied, etched workpieces can be temporarily stored in the waiting chamber through the second connection port. The existence of the waiting chamber allows the etching tank to promptly perform the next round of etching operations after the workpiece etching is completed, avoiding the etching tank from being idle due to the drying chamber being unavailable, greatly improving the utilization rate of the etching tank and increasing etching efficiency. Attached Figure Description

[0053] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0054] Figure 1 This is a perspective view of a semiconductor etching and drying apparatus provided in this application;

[0055] Figure 2 This is a top view of a semiconductor etching and drying apparatus provided in this application;

[0056] Figure 3 This is a cross-sectional view of a semiconductor etching and drying apparatus provided in this application;

[0057] Figure 4 A first perspective view of a semiconductor etching and drying apparatus provided in this application, without the apparatus body;

[0058] Figure 5 A second perspective view of a semiconductor etching and drying apparatus provided in this application, without the apparatus body;

[0059] Figure 6 This is a perspective view of the conveying mechanism of a semiconductor etching and drying apparatus provided in this application;

[0060] Figure 7 This is a schematic diagram showing the application state of the linkage mechanism of a semiconductor etching and drying apparatus provided in this application.

[0061] Figure 8 A three-dimensional view of the workpiece carrying a wafer provided in this application;

[0062] In the diagram: 1. Main body of the device; 11. Drying chamber; 111. First connecting port; 12. Waiting chamber; 121. Second connecting port; 13. Sealing cover; 14. Partition; 15. Third connecting port; 16. Fourth connecting port; 17. Shielding component; 18. Protective cover; 2. Drying mechanism; 21. Drying head; 211. Air inlet; 212. Air outlet; 22. Linkage mechanism; 221. First fixing component; 222. Linkage component; 2 23. Second fixing component; 3. Conveying mechanism; 31. Conveying motor; 321. Conveying frame; 322. Drive shaft; 323. Driven shaft; 324. Transmission belt; 325. Sprocket; 33. Limiting frame; 331. Limiting groove; 4. Carrier; 41. Side frame; 42. Base frame; 421. First slot; 43. Limiting post; 431. Second slot; 44. Clamping block; 5. Wafer; 6. Stopping mechanism; 61. Stopping part. Detailed Implementation

[0063] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the embodiments of this application.

[0064] In the description of the embodiments of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0065] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a replaceable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.

[0066] This application discloses a semiconductor etching and drying apparatus.

[0067] Please see Figures 1 to 3 One embodiment of a semiconductor etching and drying apparatus provided in this application includes:

[0068] The main body of the device 1 and the drying mechanism 2.

[0069] The main body of the device 1 is provided with a drying chamber 11 and a waiting chamber 12.

[0070] The main body 1 of the device is provided with a drying chamber 11. The drying chamber 11 has a first connecting port 111 that connects to the outside of the main body 1 and allows the workpiece to pass through. The first connecting port 111 can be located at the top position. The drying mechanism 2 is installed in the drying chamber 11 to dry the workpiece located in the drying chamber 11.

[0071] The workpiece in this application may refer directly to the wafer 5, or it may refer to the carrier 4 (flower basket frame) that carries the wafer 5.

[0072] like Figure 8 As shown, taking the carrier 4 carrying the wafer 5 as an example, the specific design can include a side frame 41 and a base frame 42; the base frame 42 is vertically connected to the bottom of the first side of the side frame 41 and is provided with a first slot 421 for the bottom edge of the wafer 5 to be inserted; the first side of the side frame 41 is fixed with limiting posts 43 on both sides above the base frame 42; the limiting posts 43 and the base frame 42 form a receiving area for accommodating the wafer 5; the limiting posts 43 are provided with a second slot 431 for the side edge of the wafer 5 to pass through.

[0073] Through the above design, at least one side of wafer 5 can be maximized to be exposed to the drying environment, which facilitates the hot air to blow fully and evenly onto the surface of wafer 5, thereby significantly improving the drying effect. In addition, the slot-type edge limiting design allows wafer 5 to be suspended, so that there is also a sufficient gap between it and the side holder 41, allowing the heat flow to pass through the other side of wafer 5, realizing the smooth flow of heat around wafer 5 and removing surface moisture.

[0074] The slotted edge-limiting design also makes wafer 5 more stable during conveying and drying. Even if the conveyor belt vibrates during operation, the slots of the limiting post 43 and the base frame 42 can firmly fix wafer 5, preventing it from shifting or shaking, and ensuring the positional accuracy of wafer 5 during the drying process. At the same time, the slot design will not cause excessive compression or damage to wafer 5, ensuring the integrity and quality of wafer 5.

[0075] Furthermore, a clamping block 44 is fixed on the top of the second side opposite to the first side on the side frame 41 for the material transfer robot (a multi-axis manipulator used in wet processing machines to grip wafers or basket racks) to grip.

[0076] The design of the clamping block 44 facilitates the precise gripping and movement of the carrier 4 containing the wafer 5 by the transfer robot. The transfer robot can cooperate with the clamping block 44 through a specific gripping mechanism to achieve stable gripping and transport of the carrier 4. This design makes the entire automated production process smoother, reduces the possibility of manual intervention, and improves production efficiency and product quality.

[0077] To ensure that the transfer robot can accurately grasp the clamping block 44, the surface of the clamping block 44 can also be specially treated, such as adding anti-slip textures or using special materials to enhance the friction between the robot's gripping mechanism and the clamping block 44.

[0078] This application can provide a drain outlet at the bottom of the drying chamber 11. When the moisture on the surface of the workpiece is dried, some condensed water droplets will flow to the bottom of the drying chamber 11. The drain outlet can drain this moisture in time to avoid water accumulation causing secondary pollution to the workpiece.

[0079] The waiting cavity 12 has a second communication port 121 outside the main body 1 of the communication device and for the workpiece to pass through.

[0080] The semiconductor etching and drying apparatus designed in this application has the following beneficial effects:

[0081] With the waiting chamber 12 set up, when the drying chamber 11 is occupied, the etched workpiece can be temporarily stored in the waiting chamber 12 through the second connecting port 121. The existence of the waiting chamber 12 allows the etching tank to promptly carry out the next round of etching operations after the workpiece etching is completed, avoiding the etching tank from being idle due to the drying chamber 11 being unavailable, greatly improving the utilization rate of the etching tank and increasing etching efficiency.

[0082] The above is Embodiment 1 of a semiconductor etching and drying apparatus provided in this application. The following is Embodiment 2 of a semiconductor etching and drying apparatus provided in this application. Please refer to the following for details. Figures 1 to 8 .

[0083] Based on the solution of Embodiment 1 above:

[0084] Furthermore, such as Figures 1 to 3 As shown, a sealing cover 13 is installed on the first connecting port 111 to prevent heat loss from the drying chamber 11 and ensure drying efficiency. The sealing cover 13 can be made of a material with good heat insulation properties to further reduce heat loss and improve drying efficiency. At the same time, a sealing strip can also be provided on the edge of the sealing cover 13 to further enhance the sealing effect and prevent hot air leakage.

[0085] There are two ways to control the opening and closing of the sealing cover 13:

[0086] Method 1: A switch cover mechanism (not shown in the figure) is installed on the main body 1 of the device. The switch cover mechanism is connected to the sealing cover 13 and is used to control the opening or closing movement of the sealing cover 13. The design of the switch cover mechanism may include a rotary motor and a connecting block connecting the output shaft of the rotary motor and the sealing cover 13. The rotary motor drives the sealing cover 13 to rotate, thereby realizing the opening and closing.

[0087] Method 2: The sealing cap 13 is directly placed on the first connecting port 111. The transfer robot is also used to grasp the sealing cap 13 to drive the sealing cap 13 to open or close. The first connecting port 111 is opened and sealed by the transfer robot grasping the moving sealing cap 13. A handle can be provided on the sealing cap 13 to facilitate the grasping of the transfer robot.

[0088] The first method uses a rotary motor to drive the opening and closing mechanism. Its advantage lies in independent and automated control, which can precisely control the opening and closing angle and time of the sealing cover 13. It is suitable for scenarios that require frequent opening and closing of the sealing cover 13, and can effectively improve the efficiency of the drying process. However, this method requires the additional installation of components such as a rotary motor and connecting blocks, which increases the cost and complexity of the device, and the subsequent maintenance and repair work is also relatively cumbersome.

[0089] Method two utilizes a transfer robot to grasp the sealing cover 13 for opening and closing. Its advantage lies in fully utilizing existing transfer robot resources, eliminating the need for additional complex opening and closing mechanisms, thus reducing device cost and space requirements. Furthermore, the transfer robot offers high operational flexibility, allowing the sealing cover 13 to be opened and closed at different locations and times according to actual needs. However, this method also has limitations. For example, the grasping accuracy and stability of the transfer robot may be affected by various factors, potentially leading to inaccurate opening and closing of the sealing cover 13, affecting the sealing effect of the drying chamber 11.

[0090] In practical applications, the appropriate opening and closing control method of the sealing cover 13 can be selected according to the specific working scenario and needs. Of course, it is not limited to the two control methods mentioned above. Those skilled in the art can make appropriate changes based on this.

[0091] Furthermore, such as Figures 2 to 4 As shown, it also includes a conveying mechanism 3; the main body 1 of the device is also provided with a third connecting port 15 connecting the waiting chamber 12 and the drying chamber 11; the conveying mechanism 3 is installed on the main body 1 of the device and spans the waiting chamber 12, the third connecting port 15 and the drying chamber 11, and is used to convey the workpiece in the waiting chamber 12 to the drying chamber 11 through the third connecting port 15.

[0092] An independent conveying mechanism 3 is designed to transport workpieces from the waiting chamber 12 to the drying chamber 11. After the transfer robot places the workpiece into the waiting chamber 12, it can directly wait for the conveying mechanism 3 to transport it, without having to grab the workpiece from the waiting chamber 12 and transfer it to the drying chamber 11. The transfer robot only needs to wait for the dried workpiece to be removed from the drying chamber 11. With the conveying mechanism 3 designed, the steps required for the transfer robot to perform are simply sending the workpiece into the waiting chamber 12 and then waiting to remove it from the drying chamber 11, reducing the number of actions the transfer robot needs to take and effectively improving work efficiency.

[0093] The cross-span installation arrangement of conveyor mechanism 3 can be as follows:

[0094] like Figure 3 As shown, the main body 1 of the device has a large inner cavity, and a conveying mechanism 3 is installed at the bottom of the inner cavity. The inner cavity is located above the conveying mechanism 3, and at least one partition 14 is provided along the conveying direction to divide the area above the conveying mechanism 3 into the required drying chamber 11 and at least one waiting chamber 12. A third connecting port 15 is opened on the partition 14 between the drying chamber 11 and the waiting chamber 12, so the conveying mechanism 3 is arranged across the waiting chamber 12, the third connecting port 15, and the drying chamber 11.

[0095] Furthermore, such as Figure 3 as well as Figure 4 As shown, taking multiple waiting chambers 12 arranged sequentially as an example, adjacent waiting chambers 12 are connected through a fourth connecting port 16 (the fourth connecting port 16 is located on the partition 14 between adjacent waiting chambers 12); the waiting chamber 12 closest to the drying chamber 11 is connected to the drying chamber 11 through a third connecting port 15; the conveying mechanism 3 spans the drying chamber 11, the third connecting port 15, each waiting chamber 12 and the fourth connecting port 16, and can sequentially transport the workpieces in the waiting chambers 12 to the drying chamber 11.

[0096] The above design makes the entire drying device more flexible and efficient when processing multiple workpieces. When multiple etching tanks have workpieces that have been etched and need to be dried, these workpieces can be temporarily stored in different waiting chambers 12 in sequence. The conveying mechanism 3 will transport the workpieces in the waiting chambers 12 one by one through the third connecting port 15 to the drying chamber 11 for drying in a certain order.

[0097] Furthermore, such as Figure 3 as well as Figure 4 As shown, a shield 17 is installed on the third connecting port 15. The design of the shield 17 is consistent with the function of the sealing cover 13, which is to prevent heat loss from the inside of the drying chamber 11 and ensure drying efficiency. It can also be made of a material with good heat insulation performance, and its edges can also be provided with sealing strips to enhance the sealing effect and prevent hot air from leaking from the third connecting port 15.

[0098] There are also several ways to control the opening and closing of the shielding component 17:

[0099] Method 1: The shield 17 is a normally closed shield that can be opened by pushing the workpiece. The design principle is similar to that of a common air conditioner door curtain. When a person passes by, the door curtain can be pushed open and entered. After entering, the door curtain will automatically close to reduce the loss of cold air.

[0100] When the conveying mechanism 3 drives the workpiece through the third connecting port 15, it pushes the blocking member 17 to open it. After passing through, the blocking member 17 closes itself to close the third connecting port 15. The blocking member 17 can be a double-opening curtain structure or an open curtain structure, and there are no restrictions on the specific structure.

[0101] Method 2: A dedicated control mechanism for the blocking component 17 (not shown in the figure) can be installed on the main body 1 of the device. This mechanism is connected to the blocking component 17 and is used to control its opening or closing movement. This control mechanism can be designed to include a linear motor and a push rod connecting the output shaft of the linear motor and the blocking component 17. The linear motion of the linear motor drives the blocking component 17 to translate, thereby realizing the opening and closing of the third communication port 15.

[0102] In practical applications, the appropriate opening and closing control method of the shielding component 17 can be selected according to the specific working scenario and needs. Of course, it is not limited to the two control methods mentioned above. Those skilled in the art can make appropriate changes based on this.

[0103] Furthermore, such as Figure 5 As shown, the design of the drying mechanism 2 includes a drying head 21, which has an air inlet 211 and an air outlet 212. The air inlet 211 is connected to a heat source through an air inlet pipe.

[0104] The drying head 21 can be an air knife head structure, capable of evenly blowing hot air onto the workpiece surface, causing the moisture on the workpiece surface to evaporate quickly. The air outlet 212 of the air knife head structure is usually designed as a narrow slit, which can form a high-speed and uniform airflow, enhancing the drying effect. During the drying process, the hot air entering from the air inlet 211 is converted into a high-speed airflow through the special structure of the air knife head and blown out from the air outlet 212, covering the workpiece surface and accelerating the vaporization process of moisture.

[0105] For the design of the air inlet pipe, a layer of heat insulation material, such as rock wool or fiberglass, can be wrapped around the outside of the air inlet pipe. These materials can effectively block the heat dissipation and ensure that the temperature of the hot air reaching the drying head 21 meets the drying requirements.

[0106] For the heat source, nitrogen gas at a certain temperature is used. Nitrogen is an inert gas with stable chemical properties, and it does not easily react chemically with the workpiece, thus avoiding adverse effects such as oxidation during the drying process and ensuring the quality of the workpiece. Furthermore, nitrogen has a large heat capacity, capable of carrying a significant amount of heat, which helps improve drying efficiency. The nitrogen gas can be heated to a suitable temperature by a heating device before being supplied to the drying head 21. The heating device can employ electric heating or gas heating, and the specific heating method can be selected based on the actual production environment and cost requirements.

[0107] Furthermore, such as Figure 7 As shown, the drying mechanism 2 also includes a linkage mechanism 22 and a linkage driver (not shown in the figure); the drying head 21 is rotatably mounted on the side wall of the drying chamber 11 (specifically, the drying head 21 has rotating shafts at both ends, which are fixed by bearing assemblies to realize the rotating installation of the drying head 21, which will not be described in detail); the linkage driver is connected to the drying head 21 through the linkage mechanism 22 and is used to drive the drying head 21 to swing through the linkage mechanism 22.

[0108] By driving the linkage mechanism 22 through the linkage driver, the drying head 21 can swing within the drying chamber 11. This expands the coverage area of ​​the hot air blown out by the drying head 21, allowing all parts of the workpiece to be more evenly exposed to the hot air. For example, for larger workpieces, the swinging of the drying head 21 ensures that moisture on every part of its surface is quickly dried, avoiding any drying dead spots.

[0109] The linkage mechanism 22 can be designed in various forms, such as a crank-rocker mechanism. Taking the crank-rocker mechanism as an example, the linkage driver can be a motor, which drives the crank to rotate, and the crank then drives the rocker to swing. The rocker is connected to the drying head 21, thereby realizing the swing of the drying head 21. This design can precisely control the swing angle and frequency of the drying head 21, and can be adjusted according to the drying requirements of different workpieces.

[0110] Furthermore, such as Figure 7 As shown, besides using an independent linkage driver to drive the linkage mechanism 22 to cause the drying head 21 to swing, the linkage mechanism 22 can be connected between the drying head 21 and the conveying mechanism 3. It can then follow the movement of the conveying mechanism 3 during operation and cause the drying head 21 to swing. This design cleverly utilizes the power of the conveying mechanism 3, eliminating the need for an additional power source to drive the drying head 21 to swing, further simplifying the device structure and reducing costs. When the conveying mechanism 3 operates, transporting the workpiece from the waiting chamber 12 to the drying chamber 11, the linkage mechanism 22 moves with the movement of the conveying mechanism 3, thereby causing the drying head 21 to swing.

[0111] This linkage not only improves energy efficiency but also makes the entire drying process more compact and efficient. The coordinated action of the conveyor mechanism 3 and the drying head 21 reduces equipment operating time and energy consumption, thereby increasing production efficiency. At the same time, the reduction of independent drive components lowers the equipment failure rate and maintenance costs.

[0112] Furthermore, such as Figure 6 As shown, the design of the conveyor mechanism 3 includes a conveyor belt body and a conveyor motor 31. The conveyor belt body is an existing conveyor belt mechanism, including a conveyor frame 321, a drive shaft 322, a driven shaft 323, and a transmission belt 324. The transmission belt 324 can be a chain. Taking a chain as an example, sprockets 325 that mesh with the chain are installed on the drive shaft 322 and the driven shaft 323. The transmission belt 324 can also be a belt. Taking a belt as an example, movement can be achieved through frictional contact with the drive shaft 322 and the driven shaft 323. Those skilled in the art can modify the design according to actual needs without limitation.

[0113] The conveyor motor 31 is an existing rotary motor such as a servo motor. Its output shaft is connected to the drive shaft 322 in the conveyor belt body. By driving the drive shaft 322, it drives the transmission belt 324, which in turn drives the workpiece located on the transmission belt 324. The conveyor motor 31 is installed outside the main body 1 of the device and is connected via a method such as... Figure 2 The protective cover 18 shown is installed in a sealed manner.

[0114] Furthermore, such as Figure 7 As shown, in order to achieve linkage between the linkage mechanism 22 and the conveying mechanism 3, the linkage mechanism 22 can be designed to include a first fixing member 221, a second fixing member 223 and a connecting member 222.

[0115] The first fixing member 221 is fixed to the rotating connection end of the drying head 21; the second fixing member 223 is fixed to one end of the drive shaft 322 or driven shaft 323 of the conveyor belt body; the first end of the connecting rod 222 is hinged to the first fixing member 221 at a position a first distance from the rotation center line of the rotating connection end; the second end of the connecting rod 222 is hinged to the second fixing member 223 at a position a second distance from the rotation center line of the drive shaft 322 or driven shaft 323; the connecting rod 222 is used to convert the rotation of the second fixing member 223 into the swing of the first fixing member 221.

[0116] When the conveyor motor 31 drives the drive shaft 322 to rotate, the second fixing member 223 will rotate together with the drive shaft 322. Since the two ends of the connecting rod 222 are respectively hinged to the eccentric positions of the first fixing member 221 and the second fixing member 223, the rotation of the second fixing member 223 will be transmitted to the first fixing member 221 through the connecting rod 222, so that the first fixing member 221 swings, thereby driving the drying head 21 to swing.

[0117] Furthermore, such as Figure 5 as well as Figure 6 As shown, the conveying mechanism 3 also includes a limiting frame 33; the limiting frame 33 is mounted on the conveying surface of the conveyor belt body and is provided with a limiting groove 331 arranged along the conveying direction of the conveyor belt body; the workpiece contacts the conveying surface through the limiting groove 331; the limiting groove 331 is used to limit the displacement of the workpiece in the horizontal direction perpendicular to the conveying direction.

[0118] The limiting frame 33 effectively ensures the stability of the workpiece during the conveying process. When the conveyor belt moves the workpiece, the limiting groove 331 prevents the workpiece from shifting or swaying in the direction perpendicular to the conveying direction due to various factors, such as vibration and inertia during the conveying process. This is crucial for ensuring that the workpiece is accurately conveyed from the waiting chamber 12 to the drying chamber 11, avoiding poor conveying or collision with other components due to workpiece position deviation.

[0119] By installing the limit frame 33, the stability and reliability of workpiece transportation can be improved, thereby further enhancing the working efficiency and operational quality of the entire drying device.

[0120] Furthermore, such as Figure 5 as well as Figure 6As shown, a stop mechanism 6 is installed in the waiting chamber 12. The stop mechanism 6 has a stop part 61 that can switch between a stop position and a release position. When the stop part 61 is in the stop position, it can contact and abut against the workpiece to prevent the workpiece from moving towards the drying chamber 11. The stop mechanism 6 can be a telescopic device, with its telescopic rod forming the stop part 61. When the telescopic rod extends a certain distance, it is in the stop position, where it can contact and abut against the workpiece to prevent the workpiece from moving towards the drying chamber 11. When the telescopic rod retracts, the stop part 61 is in the release position, and the workpiece can be smoothly conveyed towards the drying chamber 11.

[0121] The stop mechanism 6 stabilizes the interval between adjacent workpieces, ensuring that the conveying mechanism 3 accurately delivers the workpiece to the drying chamber 11 each time it makes a certain displacement. Furthermore, when the drying chamber 11 is drying a workpiece, subsequent workpieces waiting to be dried can be stopped by the stop mechanism 6 at a suitable position in the waiting chamber 12, preventing workpieces from entering the drying chamber 11 before it is ready, thus avoiding disruption to the drying process.

[0122] Meanwhile, the stop mechanism 6 also serves a protective function. During the operation of the conveying mechanism 3, if any unexpected situations occur, such as abnormal conveying speed, the stop mechanism 6 can stop the workpieces in time to prevent them from colliding with each other.

[0123] Of course, additional detectors (such as laser detection probes, etc., are also possible) to detect whether a workpiece is accurately positioned at the stop 61.

[0124] The stop mechanism 6 can be set on one side of the limit frame 33 and the limit groove 331. When its stop part 61 extends into the upper position of the limit groove 331, it can stop the workpiece. When it retracts, it can allow the workpiece to pass smoothly.

[0125] The semiconductor etching and drying apparatus provided in this application has been described in detail above. For those skilled in the art, there will be changes in the specific implementation and application scope based on the ideas of the embodiments of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A semiconductor etching and drying apparatus, characterized in that, Includes the main body of the device (1) and the drying mechanism (2); The main body (1) of the device is provided with a drying chamber (11) and a waiting chamber (12); The drying chamber (11) has a first communication port (111) that connects to the outside of the main body (1) of the device and allows the workpiece to pass through. The drying mechanism (2) is installed in the drying chamber (11) for drying the workpiece located in the drying chamber (11); The waiting cavity (12) has a second communication port (121) that connects to the outside of the device body (1) and allows the workpiece to pass through.

2. The semiconductor etching and drying apparatus according to claim 1, characterized in that, A sealing cap (13) is installed on the first communication port (111); A switch cover mechanism is installed on the main body (1) of the device; The switch cover mechanism is connected to the sealing cover (13) and is used to control the opening or closing movement of the sealing cover (13).

3. The semiconductor etching and drying apparatus according to claim 1, characterized in that, It also includes a conveying mechanism (3); The main body (1) of the device is also provided with a third communication port (15) connecting the waiting chamber (12) and the drying chamber (11). The conveying mechanism (3) is installed on the main body (1) of the device and spans the waiting chamber (12), the third connecting port (15) and the drying chamber (11), and is used to convey the workpiece in the waiting chamber (12) to the drying chamber (11) through the third connecting port (15).

4. The semiconductor etching and drying apparatus according to claim 3, characterized in that, The waiting chambers (12) are multiple and arranged sequentially; The adjacent waiting chambers (12) are connected by a fourth connecting port (16); The waiting chamber (12) closest to the drying chamber (11) is connected to the drying chamber (11) through the third communication port (15); The conveying mechanism (3) spans the drying chamber (11), the third connecting port (15), each of the waiting chambers (12) and the fourth connecting port (16), and can sequentially transport the workpieces in the waiting chambers (12) to the drying chamber (11).

5. The semiconductor etching and drying apparatus according to claim 3, characterized in that, A shield (17) is installed on the third connecting port (15); The blocking member (17) is a normally closed blocking member that can be opened by the pushing of the workpiece.

6. The semiconductor etching and drying apparatus according to claim 3, characterized in that, A shield (17) is installed on the third connecting port (15); A stop drive mechanism is installed on the main body (1) of the device; The stop drive mechanism is connected to the blocking member (17) and is used to drive the blocking member (17) to open or close.

7. The semiconductor etching and drying apparatus according to claim 3, characterized in that, The drying mechanism (2) includes a drying head (21); The drying head (21) has an air inlet (211) and an air outlet (212). The air inlet (211) is connected to a heat source via an air inlet pipe.

8. The semiconductor etching and drying apparatus according to claim 7, characterized in that, The drying mechanism (2) also includes a linkage mechanism (22) and a linkage driver; The drying head (21) is rotatably mounted on the side wall of the drying chamber (11); The linkage driver is connected to the drying head (21) via the linkage mechanism (22) and is used to drive the drying head (21) to swing through the linkage mechanism (22).

9. A semiconductor etching and drying apparatus according to claim 7, characterized in that, The drying mechanism (2) also includes a linkage mechanism (22); The drying head (21) is rotatably mounted on the side wall of the drying chamber (11); The linkage mechanism (22) is connected between the drying head (21) and the conveying mechanism (3), and can follow the movement of the conveying mechanism (3) when the conveying mechanism (3) is running, and drive the drying head (21) to swing.

10. A semiconductor etching and drying apparatus according to claim 9, characterized in that, The conveying mechanism (3) includes a conveyor belt body and a conveyor motor (31); The output shaft of the conveyor motor (31) is connected to the drive shaft (322) in the conveyor belt body.

11. A semiconductor etching and drying apparatus according to claim 10, characterized in that, The linkage mechanism (22) includes a first fixing member (221), a second fixing member (223), and a connecting member (222); The first fixing member (221) is fixed to the rotating connection end of the drying head (21); The second fixing member (223) is fixed to one end of the drive shaft (322) or driven shaft (323) of the conveyor belt body; The first end of the connecting rod (222) is hinged to the first fixing member (221) at a position a first distance from the rotation center line of the rotating connection end; The second end of the connecting rod (222) is hinged to the second fixing member (223) at a position a second distance from the rotation center line of the driving shaft (322) or the driven shaft (323); The connecting rod (222) is used to convert the rotation of the second fixing member (223) into the swing of the first fixing member (221).

12. The semiconductor etching and drying apparatus according to claim 10, characterized in that, The conveying mechanism (3) also includes a limiting frame (33); The limiting frame (33) is mounted on the conveying surface of the conveyor belt body and is provided with a limiting groove (331) arranged along the conveying direction of the conveyor belt body. The workpiece contacts the conveying surface via the limiting groove (331); The limiting groove (331) is used to limit the displacement of the workpiece in a direction perpendicular to the conveying direction.

13. The semiconductor etching and drying apparatus according to claim 10, characterized in that, A stop mechanism (6) is installed in the waiting cavity (12); The stop mechanism (6) has a stop part (61) that can switch between the stop position and the release position. When the stop part (61) is in the stop position, it can contact and abut against the workpiece to stop the workpiece from moving toward the drying chamber (11).

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