MOS tube fixing structure
By using a fixing seat and a stacking design of multiple compression springs in the MOS tube fixing structure, the problem of loose fixing of the MOS tube is solved, and better heat conduction and heat dissipation effects are achieved.
Patent Information
- Application Number
- CN202422973200.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-02
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2034-12-02
AI Technical Summary
In existing technologies, the MOSFET is not securely fixed, leading to unreliable heat conduction and excessively high temperatures.
The structure adopts a fixed base and multiple clamping springs. The clamping springs include a fixing part and a clamping part. The fixing part is fixed to the fixed base by screws, and the clamping part is used to clamp the MOSFET. The fixing parts of adjacent clamping springs are stacked to enhance the fixing strength and increase the clamping force.
This improves the contact stability between the MOSFET and the mounting base, enhances heat conduction, and ensures better heat dissipation for the MOSFET.
Smart Images
Figure CN223487044U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of MOSFET technology, and in particular to a MOSFET fixed structure. Background Technology
[0002] Metal-oxide-semiconductor field-effect transistor (MOSFET) is a type of field-effect transistor that can be widely used in analog and digital circuits.
[0003] Currently, MOSFETs are integrated onto PCBs in fields such as new energy and industrial control to control circuit switching. MOSFETs consume power and generate significant heat during operation. To ensure effective heat dissipation and normal operation, a heat sink is installed on the controller, and a clamping device is needed to firmly press the MOSFET against the heat sink for heat conduction.
[0004] Current technology often uses clamping springs to fix MOSFETs. One end of the clamping spring is fixed to the PCB board with screws, and the other end of the clamping spring clamps the MOSFET. However, this structure has the problem of insufficient clamping force, which can easily lead to the MOSFET not being firmly fixed, unreliable heat conduction of the MOSFET, and thus causing excessive temperature. Utility Model Content
[0005] Therefore, it is necessary to provide a MOSFET fixing structure to solve the technical problem of unstable MOSFET fixing in the prior art.
[0006] To achieve the above objectives, this application provides a MOSFET fixing structure, which includes:
[0007] Fixed base;
[0008] Multiple clamping springs, each clamping spring including a fixing part and a clamping part connected together, the fixing part being fixed to a mounting base by screws, and the clamping part being used to clamp the MOSFET onto the mounting base, wherein in any two adjacent clamping springs, a portion of the fixing part of one clamping spring is stacked on the fixing part of the other clamping spring.
[0009] Optionally, multiple clamping springs are disposed on the same surface of the fixing base; or
[0010] Multiple clamping springs are disposed on multiple surfaces of the fixed base.
[0011] Optionally, multiple clamping springs are disposed on the top surface of the fixing base, the fixing part and the clamping part are arranged along the first horizontal direction, the fixing part of the multiple clamping springs is arranged along the second horizontal direction, and the first horizontal direction and the second horizontal direction are perpendicular.
[0012] Optionally, multiple clamping springs are arranged from the first end to the last end along a second horizontal direction. The clamping spring at the last end is the first spring, and the remaining multiple clamping springs are the second springs. In any two adjacent second springs, the fixing part of the second spring in the first end direction is stacked on the fixing part of the second spring in the last end direction. In adjacent first springs and second springs, the fixing part of the second spring is stacked on the fixing part of the first spring.
[0013] Optionally, the fixing part of the second spring has a Z-shaped structure.
[0014] Optionally, the clamping part has a V-shaped structure, and the edge of the clamping part away from the fixing part presses against the MOSFET.
[0015] Optionally, the edge of the clamping part that presses against the MOSFET is arc-shaped.
[0016] Optionally, the clamping spring is formed by integral bending and stamping of a metal sheet.
[0017] Optionally, each fixing part is fixed to the fixing base by multiple screws.
[0018] Optionally, the mounting base is a heat sink.
[0019] The beneficial effects of the MOSFET fixing structure provided in this application are as follows: Compared with the prior art, the MOSFET fixing structure of this application includes a fixing base and multiple clamping springs. Each clamping spring includes a fixing part and a clamping part connected together. The fixing part is fixed to the fixing base by screws, and the clamping part is used to clamp the MOSFET onto the fixing base. In any two adjacent clamping springs, part of the fixing part of one clamping spring is stacked on the fixing part of the other clamping spring, which plays an auxiliary pressing role on the fixing part below, enhances the strength of the fixing part, reduces the possibility of deformation and bending of the fixing part, and makes the overall installation of the clamping springs reliable and stable. It also increases the clamping force of the clamping part that contacts the MOSFET, allowing the MOSFET to contact the fixing base better, thereby better conducting the heat generated by the MOSFET away as quickly as possible, resulting in better heat dissipation. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This is a three-dimensional structural diagram of the MOS transistor fixing structure provided in the embodiments of this application;
[0022] Figure 2 A schematic diagram showing the mounting positions of the first and second spring contacts of the MOS transistor fixing structure provided in this application embodiment;
[0023] Figure 3 A three-dimensional structural diagram of the first spring contact of the MOS transistor fixing structure provided in the embodiments of this application;
[0024] Figure 4 A three-dimensional structural diagram of the second spring of the MOS transistor fixing structure provided in the embodiments of this application.
[0025] Explanation of reference numerals in the attached figures:
[0026] 1. Fixing base; 2. Clamping spring; 210. Fixing part; 220. Clamping part; 230. First spring; 240. Second spring; 3. Screw; 4. MOSFET. Detailed Implementation
[0027] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0028] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.
[0030] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0031] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0032] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0033] The embodiments of this application provide a MOS transistor fixing structure, please refer to them as well. Figures 1 to 4 The MOSFET fixing structure includes a fixing base 1 and multiple clamping springs 2. Each clamping spring 2 includes a fixing part 210 and a clamping part 220 connected together. The fixing part 210 is fixed to the fixing base 1 by screws 3. The clamping part 220 is used to clamp the MOSFET 4 onto the fixing base 1. In any two adjacent clamping springs 2, part of the fixing part 210 of one clamping spring 2 is stacked on the fixing part 210 of the other clamping spring 2.
[0034] In this embodiment, the MOSFET fixing structure includes a fixing base 1 and multiple clamping springs 2. Each clamping spring 2 includes a fixing part 210 and a clamping part 220 connected together. The fixing part 210 is fixed to the fixing base 1 by screws 3. The clamping part 220 is used to clamp the MOSFET 4 onto the fixing base 1. In any two adjacent clamping springs 2, part of the fixing part 210 of one clamping spring 2 is stacked on the fixing part 210 of the other clamping spring 2, which plays an auxiliary pressing role on the fixing part 210 below, enhances the strength of the fixing part 210, reduces the possibility of deformation and bending of the fixing part 210, and makes the overall installation of the clamping spring 2 reliable and stable. It increases the clamping force of the clamping part 220 that contacts the MOSFET 4, so that the MOSFET 4 can better contact the fixing base 1, thereby better conducting the heat generated by the MOSFET 4 away as soon as possible, and the heat dissipation effect is better.
[0035] In one embodiment, multiple clamping springs 2 are disposed on the same surface of the fixing base 1, and the fixing part 210 at the top is generally in the shape of a straight plate; or multiple clamping springs 2 are disposed on multiple surfaces of the fixing base 1, and the fixing part 210 at the top is generally in the shape of a right-angled plate.
[0036] In one embodiment, see Figure 1 Multiple clamping springs 2 are disposed on the top surface of the fixing base 1. The fixing part 210 and the clamping part 220 are arranged along the first horizontal direction, and the fixing part 210 of the multiple clamping springs 2 is arranged along the second horizontal direction. The first horizontal direction and the second horizontal direction are perpendicular.
[0037] In one embodiment, see Figure 1 Multiple clamping springs 2 are arranged from the first end to the last end along the second horizontal direction. The clamping spring 2 at the last end is the first spring 230, and the remaining multiple clamping springs 2 are the second springs 240. In any two adjacent second springs 240, the fixing part 210 of the second spring 240 in the first end direction is stacked on the fixing part 210 of the second spring 240 in the last end direction. In adjacent first springs 230 and second springs 240, the fixing part 210 of the second spring 240 is stacked on the fixing part 210 of the first spring 230.
[0038] In one embodiment, please refer to [the relevant documentation / reference]. Figure 1 and Figure 4 The fixing part 210 of the second spring 240 has a Z-shaped structure so that the two fixing parts 210 stacked together can fit together better.
[0039] In one embodiment, please refer to [the relevant documentation / reference]. Figures 1 to 4The clamping part 220 has a V-shaped structure. The edge of the clamping part 220 away from the fixing part 210 presses against the MOS tube 4. Compared with the straight plate, the V-shaped structure has greater elasticity when deformed.
[0040] In one embodiment, please refer to [the relevant documentation / reference]. Figures 1 to 4 The edge of the clamping part 220 that presses against the MOSFET 4 is arc-shaped, which reduces the wear of the clamping part 220 on the MOSFET 4.
[0041] In one embodiment, the clamping spring 2 is integrally bent and stamped from a metal sheet. The integral structure has better strength and reduces the possibility of deformation and failure of the clamping spring 2.
[0042] In one embodiment, see Figure 1 Each fixing part 210 is fixed to the fixing base 1 by multiple screws 3, and the clamping spring 2 can be fixed more stably. Compared with fixing by screws 3, multiple screws 3 can prevent the clamping spring 2 from rotating around the screws 3.
[0043] For example, please refer to Figure 1 Each fixing part 210 is fixed to the fixing base 1 by two screws 3.
[0044] Optionally, depending on the actual heat dissipation requirements of the MOSFET 4, the mounting base 1 can be a heat sink or a metal material with a high thermal conductivity.
[0045] Prior to this, the mounting base 1 serves as a heat sink, further improving the heat dissipation effect of the MOSFET 4.
[0046] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0047] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.
Claims
1. A MOS transistor fixing structure, characterized in that, include: Fixed base; Multiple clamping springs, each clamping spring including a fixing part and a clamping part connected together, the fixing part being fixed to the fixing base by screws, and the clamping part being used to clamp the MOS transistor to the fixing base. In any two adjacent clamping springs, a portion of the fixing part of one clamping spring is stacked on the fixing part of the other clamping spring.
2. The MOS transistor fixing structure according to claim 1, characterized in that, Multiple clamping springs are disposed on the same surface of the fixing base; or Multiple clamping springs are disposed on different surfaces of the fixing base.
3. The MOS transistor fixing structure according to claim 2, characterized in that, Multiple clamping springs are disposed on the top surface of the fixing base. The fixing part and the clamping part are arranged along a first horizontal direction, and the fixing part of the multiple clamping springs is arranged along a second horizontal direction. The first horizontal direction and the second horizontal direction are perpendicular.
4. The MOS transistor fixing structure according to claim 3, characterized in that, The plurality of clamping springs are arranged from the first end to the last end along a second horizontal direction. The clamping spring at the last end is the first spring, and the remaining plurality of clamping springs are the second springs. In any two adjacent second springs, a portion of the fixing part of the second spring in the first end direction is stacked on the fixing part of the second spring in the last end direction. In adjacent first springs and second springs, a portion of the fixing part of the second spring is stacked on the fixing part of the first spring.
5. The MOS transistor fixing structure according to claim 4, characterized in that, The fixing part of the second spring has a Z-shaped structure.
6. The MOS transistor fixing structure according to any one of claims 1-5, characterized in that, The clamping part has a V-shaped structure, and the edge of the clamping part away from the fixing part presses against the MOS transistor.
7. The MOS transistor fixing structure according to claim 6, characterized in that, The pressing part abuts against the edge of the MOS transistor in an arc shape.
8. The MOS transistor fixing structure according to any one of claims 1-5, characterized in that, The clamping spring is formed by integral bending and stamping of a metal sheet.
9. The MOS transistor fixing structure according to any one of claims 1-5, characterized in that, Each of the fixing parts is secured to the fixing base by a plurality of the screws.
10. The MOS transistor fixing structure according to any one of claims 1-5, characterized in that, The mounting base is a heat sink.