Jig for chip mounting

Abstract

The utility model discloses a jig for chip mounting, and relates to the technical field of semiconductor manufacturing, the jig comprises a substrate, a mounting hole and at least two positioning blocks, the substrate is provided with a first surface and a second surface which are oppositely arranged along a third direction; the mounting hole is used for being matched with a chip so as to position the chip; the mounting hole is formed in the substrate and penetrates through the first surface and the second surface along the third direction; and the positioning block is arranged on the second surface and extends along the third direction so as to protrude out of the second surface, and the positioning block is used for being connected onto a printed circuit board in a penetrating manner so as to enable the substrate to be connected with the printed circuit board and fix the substrate. According to the jig, the mounting hole is formed, and the periphery of the chip slot or the chip socket of the printed circuit board is sleeved with the mounting hole, so that the position of the chip placed in the mounting hole can be calibrated, and the alignment precision of the chip and the printed circuit board can be ensured through the jig.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a fixture for chip mounting. Background Technology

[0002] With the development of technologies such as AI, 5G communication, and big data, the industry's demand for high-performance CPUs (Central Processing Units), GPUs (Graphics Processing Units), and FPGAs (Field-Programmable Gate Arrays) has surged. The explosive growth in CPU and GPU computing power has also led to a significant increase in their package sizes. Currently, large-size package structures with dimensions greater than 70mm × 70mm have appeared on the market. These types of package structures not only have larger dimensions but also significantly increased weight, placing higher demands on the soldering and rework processes of SMT (Surface Mount Technology) production lines.

[0003] In traditional SMT machines, chips are picked up by the placement head during reflow soldering and placed in the corresponding positions under certain trajectory control. However, when mounting large-size package structures, traditional SMT machines are prone to chip picking failure due to insufficient suction force of the placement head, which can cause chip wobbling and affect subsequent mounting accuracy or lead to soldering failure. This forces some manufacturers to upgrade their SMT machines, increasing production costs.

[0004] Furthermore, when chips are being reworked, the process cannot be carried out in the reflow oven. At this time, chips with large-size packaging structures cannot be picked up by the placement head and need to be placed manually, which greatly reduces the alignment accuracy of the chips and seriously affects the rework yield. Utility Model Content

[0005] The purpose of this invention is to provide a fixture for chip mounting. By calibrating the fixture, the chip can maintain good alignment accuracy with the printed circuit board, thereby solving the problem of mounting accuracy of large-size chips in the present invention.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A fixture for chip mounting, having a first direction, a second direction, and a third direction that are mutually perpendicular, includes:

[0008] The substrate has a first surface and a second surface arranged opposite to each other along the third direction;

[0009] Mounting holes are used to mate with chips to position the chips; the mounting holes are formed on the substrate and penetrate the first surface and the second surface along the third direction;

[0010] At least two positioning blocks are disposed on the second surface and extend along the third direction to protrude from the second surface, and the positioning blocks are used to pass through the printed circuit board to connect the substrate to the printed circuit board and fix the substrate.

[0011] The above technical solution has the following advantages: by setting a positioning block and using the positioning block to pass through the printed circuit board, the position of the fixture and the printed circuit board is relatively fixed. Furthermore, by setting a mounting hole and using the mounting hole to fit onto the printed circuit board, the fixture defines a mounting space on the printed circuit board using the mounting hole. This mounting space cooperates with the chip, and the position of the chip placed in the mounting hole can be calibrated.

[0012] In some embodiments, the mounting hole has a square cross-sectional profile, and at least one corner of the mounting hole is recessed outward to form a first clearance channel, which penetrates the first surface and the second surface along the third direction.

[0013] The above technical solution has the following advantages: by setting a first clearance channel, at least one corner of the mounting hole can avoid the chip, so that when the chip is placed into the mounting hole, at least one corner of the chip is not likely to interfere with the mounting hole. The space provided by the first clearance channel allows the chip to enter the mounting hole smoothly.

[0014] In some embodiments, the inner wall of the mounting hole is recessed toward the outer side of the mounting hole to form a plurality of second clearance channels that penetrate the first surface and the second surface in a third direction.

[0015] The above technical solution has the following advantages: By setting a second clearance channel, when the chip enters the mounting hole, even if the chip is not parallel to the printed circuit board, the first clearance channel and the second clearance channel set in the mounting hole cooperate with each other to prevent the chip from hitting the inner wall of the mounting hole and causing the chip to get stuck in the mounting hole.

[0016] In some embodiments, there are multiple first clearance channels, with one first clearance channel corresponding to one corner of the mounting hole; and...

[0017] The second clearance lane is arranged at intervals from the first clearance lane, and at least one second clearance lane is arranged between two adjacent first clearance lanes.

[0018] The above technical solution has the following advantages: the second clearance channel is arranged at an interval from the first clearance channel, which can avoid the second clearance channel and the first clearance channel being connected, resulting in too much hollow area on the inner wall of the mounting hole, making it impossible to calibrate the position of the chip.

[0019] In some embodiments, a connecting portion is provided on the second surface, the connecting portion extending along the third direction to protrude from the second surface, and the length L1 of the connecting portion in the first direction is less than the length L2 of the second surface in the first direction, and...

[0020] The end face of the connecting portion away from the second surface has a third surface, which is used to adhere to the surface of the printed circuit board.

[0021] The positioning block is disposed on the third surface, and the mounting hole penetrates through the first surface and the third surface along the third direction.

[0022] The above technical solution has the following advantages: by setting a connecting part with a smaller external size on the second side, the fixture can more easily fit with the printed circuit board. Moreover, by setting the connecting part, a stepped structure will be formed between the third side and the second side, so that the area of ​​the second side that is not connected to the connecting part is suspended above the printed circuit board, thereby allowing the operator to observe the fit between the third side and the printed circuit board and ensuring that the fixture is properly installed.

[0023] In some embodiments, along the third direction, the vertical distance from the third surface to the second surface is H, and the vertical distance from the first surface to the third surface is D. Then the parameters H and D satisfy: H = 0.3D ~ 0.5D.

[0024] The above technical solution has the following advantages: by limiting the relative ratio between the vertical distance H from the third surface to the second surface and the vertical distance D from the first surface to the third surface, it can be ensured that the operator can directly observe the fit between the third surface and the printed circuit board at a normal operating height.

[0025] In some embodiments, the substrate is provided with connection holes, which are located between any one of the positioning blocks and the outer edge of the substrate; and,

[0026] The fixture also includes a connecting rod, one end of which passes through the first surface into the connecting hole and is fixedly connected to the connecting hole, while the other end of the connecting rod is located outside the connecting hole for gripping.

[0027] The above technical solution has the following advantages: By setting a connecting rod, when the operator removes the substrate, the connecting rod can act as an extension arm of the fixture, making it easier for the substrate to detach from the printed circuit board, avoiding the substrate from accidentally touching the chip, causing the chip to deviate from its current position and affecting subsequent operations.

[0028] In some embodiments, the number of connecting holes is at least two, with one connecting hole correspondingly disposed between one of the positioning blocks and the outer edge of the substrate, and the two connecting holes are symmetrically arranged relative to the mounting holes; and...

[0029] The number of connecting rods is at least two, and one end of the connecting rod passes through the first surface into the connecting hole and is fixedly connected to the corresponding connecting hole.

[0030] The above technical solution has the following advantages: by limiting the number of connecting holes and connecting rods, it can be ensured that the substrate is subjected to relatively balanced force when the operator applies force to the substrate using the connecting rods, thus avoiding the substrate from deviating from its position when it is removed from the printed circuit board and accidentally touching the chip.

[0031] In some embodiments, the edge of the mounting hole is provided with a chamfered portion inclined to the first surface, one end of the chamfered portion is connected to the first surface, and the other end extends toward the interior of the mounting hole, and...

[0032] Along the third direction, the mounting hole has a positioning space located below the chamfered portion to position the chip.

[0033] The above technical solution has the following advantages: by setting the guide part, the chip can smoothly enter the mounting hole, and by limiting the positioning space below the chamfer, it can be ensured that the chamfer will not extend to the third surface, and there is always a positioning space for positioning the chip below the chamfer.

[0034] In some embodiments, the angle between the chamfered portion and the first surface is α, and α satisfies: 50°≤α≤70°.

[0035] The above technical solution has the following advantages: by limiting the range of the angle α between the chamfered part and the first surface, it can be ensured that the tilt angle of the chamfered part is within a suitable range, thus ensuring the guiding function of the chamfered part.

[0036] Compared with the prior art, the advantages of the jig for chip mounting provided by this utility model embodiment are as follows:

[0037] This fixture, by incorporating positioning blocks, allows it to be mounted onto a printed circuit board (PCB), ensuring a relatively fixed position between the fixture and the PCB. Furthermore, by providing mounting holes that fit around the chip slots or sockets on the PCB, the fixture defines a mounting space on the PCB. This mounting space, in conjunction with the chip, allows for precise positioning of the chip placed within the mounting holes. By applying this fixture to SMT machines or rework stations, even when the pick-and-place head's suction is insufficient for stable chip pickup or when manual chip placement is required, the fixture ensures accurate chip alignment with the PCB, reducing the cost of modifying existing chip production lines to produce large-size packaged chips.

[0038] Furthermore, by providing connecting holes and corresponding connecting rods on the substrate, this fixture forms an extension structure of a certain length outside the substrate. By using the connecting rods to remove the fixture from the printed circuit board, the risk of affecting the alignment accuracy between the chip and the printed circuit board due to contact with the chip during the removal of the fixture can be reduced.

[0039] Furthermore, by providing chamfered portions on the substrate, this fixture allows the chip to smoothly enter the positioning space of the mounting hole. Even if the suction force of the chip pick-up head is insufficient to stably pick up the chip or if the chip needs to be placed manually, the chamfered portions of this fixture can correct the alignment position of the chip and the printed circuit board, ensuring the alignment accuracy of the chip and the printed circuit board. Attached Figure Description

[0040] Figure 1 This is a schematic diagram of the fixture in an embodiment of this utility model;

[0041] Figure 2 This is another schematic diagram of the fixture in an embodiment of this utility model;

[0042] Figure 3 This is a schematic diagram of the fit between the fixture and the printed circuit board in an embodiment of this utility model;

[0043] Figure 4 yes Figure 3 A magnified view of A in the middle.

[0044] In the diagram, 100 represents the fixture; X represents the first direction; Y represents the second direction; and Z represents the third direction.

[0045] 1. Substrate; 1a. First side; 1b. Second side; 1c. Connecting part; 1d. Third side; 2. Mounting hole; 2a. Chamfered part; 3. Positioning block; 4. First clearance channel; 5. Second clearance channel; 6. Connecting hole; 7. Connecting rod; 8. Printed circuit board; 9. Positioning space. Detailed Implementation

[0046] The following embodiments are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0047] In the description of this utility model, it should be understood that when an element is referred to as "fixed to" or "set on" another element, it can be directly on or indirectly on the other element. When an element is referred to as "connected to" another element, it can be directly connected to or indirectly connected to the other element. The terms "mounted," "connected," and "attached" should be interpreted broadly, for example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two elements or the interaction between two elements. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0048] In the description of this utility model, it should be understood that the terms "height," "upper," "lower," "vertical," "horizontal," "top," "bottom," "inner," and "outer" used to indicate the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0049] In the description of this utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature.

[0050] Example

[0051] This utility model provides a fixture 100 for chip mounting, which has a first direction X, a second direction Y and a third direction Z that are perpendicular to each other. The first direction X is defined as the length direction of the fixture 100, the second direction Y is defined as the width direction of the fixture 100, and the third direction Z is defined as the vertical direction of the fixture 100. The upper and lower sides are distinguished by the upper and lower sides of the fixture 100 when it is in normal use.

[0052] refer to Figure 1-4The fixture 100 of this embodiment includes a substrate 1, mounting holes 2, and four positioning blocks 3. The substrate 1 has a first surface 1a and a second surface 1b arranged opposite each other along a third direction Z. The mounting holes 2 are used to cooperate with a chip to position the chip. The mounting holes 2 are formed on the substrate 1 and extend through the first surface 1a and the second surface 1b along the third direction Z. The four positioning blocks 3 are disposed on the second surface 1b and extend along the third direction Z to protrude from the second surface 1b. The four positioning blocks 3 are arranged around the mounting holes 2 and are used to be connected to the printed circuit board 8 so that the substrate 1 is connected to the printed circuit board 8 and the substrate 1 is fixed.

[0053] This fixture 100 is used to mount on a printed circuit board 8 and cooperate with the printed circuit board 8 to calibrate the relative position of the printed circuit board 8 and the chip (CPU, GPU). By inserting the positioning block 3 into the positioning hole of the printed circuit board 8, the fixture 100 can be connected and fixed to the printed circuit board 8. Furthermore, the mounting hole 2 is fitted outside the chip mounting position of the printed circuit board 8. In this way, when the chip is mounted to the chip mounting position, since the mounting hole 2 penetrates the first surface 1a and the second surface 1b of the substrate 1 in the third direction Z, the chip enters the mounting hole 2 and can reach the chip mounting position of the printed circuit board 8 through the mounting hole 2. During this process, under the constraint of the mounting hole 2, the chip will cooperate with the mounting hole 2. Based on the positioning calibration of the mounting hole 2, the relative position between the chip and the printed circuit board 8 is determined.

[0054] The dimensions of mounting hole 2 can be configured according to the dimensions of the chip to ensure proper fit. For example, with a 58.5mm × 75.4mm chip, the cross-sectional profile of mounting hole 2 is also square to match the outer contour of the chip. The length of mounting hole 2 in the first direction X and the second direction Y is set according to the chip's dimensions. For instance, mounting hole 2 can be 58.6mm × 75.5mm with a tolerance of 0 to +0.03mm, ensuring the chip can be smoothly placed within mounting hole 2, connected to the chip mounting position on the printed circuit board 8, and properly positioned by mounting hole 2.

[0055] In this embodiment, the substrate 1 has a planar plate structure, with the first surface 1a and the second surface 1b being two parallel planes. This facilitates the substrate 1's attachment to the printed circuit board 8, ensuring the fit between the mounting holes 2 and the printed circuit board 8. Of course, the first surface 1a and the second surface 1b can also be two non-parallel surfaces, but it is preferable that the substrate 1 is attached to the printed circuit board 8 to ensure the relative positional accuracy between the fixture 100 and the printed circuit board 8.

[0056] It should be noted that the number of positioning blocks 3 can be adjusted. For example, the number of positioning blocks 3 can be two, three, four, five, or more. Two or more positioning blocks 3 can determine the relative position between the substrate 1 and the printed circuit board 8, preventing the substrate 1 from moving relative to the printed circuit board 8.

[0057] When the dimensional fit between the mounting hole 2 and the chip is relatively tight, a certain placement accuracy is required for the chip to be smoothly placed into the mounting hole 2. However, since this fixture 100 is mainly designed for chips with package sizes greater than 70mm × 70mm, existing placement heads are difficult to meet the placement accuracy requirements of large-sized chips. To address this, the fixture 100 can be equipped with a cutout structure to improve the smoothness of chip entry into the mounting hole 2.

[0058] refer to Figure 1-2 As an example of this embodiment, the four corners of the mounting hole 2 are recessed towards the outside of the mounting hole 2 to form a first clearance channel 4. A first clearance channel 4 is correspondingly provided at one corner of the mounting hole 2, and the first clearance channel 4 penetrates the first surface 1a and the second surface 1b along the third direction Z.

[0059] By setting the first avoidance channel 4, the mounting hole 2 will avoid the chip at the four corner positions, so that when the chip is placed into the mounting hole 2, the corner of the chip is less likely to interfere with the corner position of the mounting hole 2, thus allowing the chip to enter the mounting hole 2 smoothly.

[0060] Of course, the first clearance channel 4 is not necessarily set at all four angles of the mounting hole 2. Depending on the fitting accuracy between the mounting hole 2 and the chip and the chip's outline, in other examples, the mounting hole 2 may also have the first clearance channel 4 set at only one angle. In this case, there is also a certain clearance space between the mounting hole 2 and the chip, which can also prevent the chip from bumping into the mounting hole 2 when it is placed in the mounting hole 2, causing the chip to tilt.

[0061] Other perforated structures can also be provided on the inner walls of the four sides of the mounting hole 2. For example, as an example of this embodiment, the inner wall of the mounting hole 2 is recessed towards the outside of the mounting hole 2 to form four second clearance channels 5, which penetrate the first surface 1a and the second surface 1b along the third direction Z.

[0062] Four second clearance channels 5 are distributed on the four sides of the mounting hole 2. In this way, when the chip enters the mounting hole 2, even if the chip is not parallel to the printed circuit board 8, the first clearance channels 4 at the four corners of the mounting hole 2 and the second clearance channels 5 on the four sides of the mounting hole 2 can prevent the chip from hitting the inner wall of the mounting hole 2 and causing the chip to get stuck in the mounting hole 2.

[0063] It is important to note that the number of the first clearance channel 4 and the second clearance channel 5 can be adjusted. Generally, the second clearance channel 5 is arranged alternately with the first clearance channel 4 to avoid the second clearance channel 5 and the first clearance channel 4 being connected in the first direction X or the second direction Y, which would result in too much open area on the inner wall of the mounting hole 2, making it impossible to calibrate the chip position. When there are multiple first clearance channels 4, at least one second clearance channel 5 is arranged between two adjacent first clearance channels 4, thus ensuring that the cutout structure of the mounting hole 2 can cooperate with each other.

[0064] Printed circuit boards 8 typically house numerous electrical components. Since the fixture 100 is attached to the printed circuit board 8, it is prone to interference with these components, affecting the assembly of the fixture 100. Therefore, the fixture 100 can reduce its contact area with the printed circuit board 8 to minimize the possibility of interference with the electrical components. (Reference) Figure 1-2 As an example of this embodiment, a connecting portion 1c is provided on the second surface 1b. The connecting portion 1c extends along the third direction Z to protrude from the second surface 1b, and the length L1 of the connecting portion 1c in the first direction X is less than the length L2 of the second surface 1b in the first direction X. Furthermore, a third surface 1d is formed on the end face of the connecting portion 1c away from the second surface 1b, and the third surface 1d is used to adhere to the surface of the printed circuit board 8. A positioning block 3 is provided on the third surface 1d, and the mounting hole 2 penetrates through the first surface 1a and the third surface 1d along the third direction Z.

[0065] By providing a smaller connecting part 1c below the second surface 1b, this fixture can more easily mate with the printed circuit board 8. Furthermore, when the positioning block 3 is inserted into the printed circuit board 8, the operator cannot easily observe the mating of the positioning block 3 and the printed circuit board 8 due to the obstruction of the substrate 1 itself, making it difficult to determine whether the second surface 1b is in contact with the upper surface of the printed circuit board 8. By providing the connecting part 1c, a stepped structure is formed between the third surface 1d and the second surface 1b, causing the area of ​​the second surface 1b not in contact with the connecting part 1c to be suspended above the printed circuit board 8, thus creating a certain visual space. This allows the operator to use this visual space to observe the mating of the third surface 1d with the printed circuit board 8, ensuring proper installation of the fixture 100.

[0066] To ensure that the operator can directly observe the fit between the third surface 1d and the printed circuit board 8 from a normal operating height, a certain level of viewing space is required. For this, refer to... Figure 1-4 As an example of this embodiment, along the third direction Z, the vertical distance from the third surface 1d to the second surface 1b is H, and the vertical distance from the first surface 1a to the third surface 1d is D. Then the parameters H and D satisfy: H = 0.3D ~ 0.5D.

[0067] To facilitate chip entry into the mounting hole 2, the edge of the mounting hole 2 may also be provided with a chamfered portion 2a inclined to the first surface 1a. One end of the chamfered portion 2a is connected to the first surface 1a, and the other end extends into the interior of the mounting hole 2. Furthermore, along the third direction Z, the mounting hole 2 has a positioning space 9 located below the chamfered portion 2a to position the chip.

[0068] Using the chamfered portion 2a, the chip can slide into the mounting hole 2 under the guidance of the chamfered portion 2a. In order to ensure the guiding function of the chamfered portion 2a, the tilt angle of the chamfered portion 2a needs to be limited to a certain suitable range. For example, as an example of this embodiment, the included angle between the chamfered portion 2a and the first surface 1a is α, and α satisfies: 50°≤α≤70°. For example, α can be 50°, 60° or 70°, etc.

[0069] With the cooperation of the first clearance channel 4 and the second clearance channel 5, the chip can be smoothly inserted into the mounting hole 2. Of course, the chamfered portion 2a cannot extend to the second surface 1b, or, if the connecting portion 1c is provided, the chamfered portion 2a cannot extend to the third surface 1d, to ensure that there is always a positioning space 9 for positioning the chip below the chamfered portion 2a. Furthermore, to ensure the effective cooperation between the positioning space 9 and the chip, the height of the positioning space 9 in the third direction Z can be configured according to the height of the chip, so that when the chip is connected to the printed circuit board 8, the chip can be surrounded by the positioning space 9.

[0070] It is worth noting that, to ensure the positioning accuracy of this fixture 100, the fixture 100 and the chip are fitted together quite tightly. After the chip is installed on the printed circuit board 8, if the operator removes this fixture 100, there is a possibility of accidentally touching the chip, causing the chip to deviate from its current positioning position and affecting subsequent operations. For this purpose, please refer to... Figure 1-2 As an example of this embodiment, the substrate 1 is provided with a connection hole 6, which is located between any one of the positioning blocks 3 and the outer edge of the substrate 1; and the fixture 100 also includes a connecting rod 7, one end of which passes through the first surface 1a into the connection hole 6 and is fixedly connected to the connection hole 6, and the other end of which is located outside the connection hole 6 for gripping.

[0071] A connecting hole 6 is provided between the positioning block 3 and the outer edge of the substrate 1, and extends through the first surface 1a and the third surface 1d in the third direction Z. In this way, the connecting rod 7 connected to the connecting hole 6 can abut against the upper surface of the printed circuit board 8 and be connected and fixed to the substrate 1. When the operator removes the substrate 1, the connecting rod 7 can act as an extension arm of the fixture 100, making it easier for the substrate 1 to detach from the printed circuit board 8.

[0072] It should be noted that the connecting hole 6 is not required to penetrate both the first surface 1a and the third surface 1d. In other examples, the connecting hole 6 may also extend a certain length along the third direction Z within the substrate 1, thereby forming a blind hole structure. In this case, the connecting rod 7 can also be inserted into the connecting hole 6 and connected and fixed thereto.

[0073] The number of connection holes 6 can be adjusted according to the external dimensions of the substrate 1. When there are two or more connection holes 6, one connection hole 6 is correspondingly set between a positioning block 3 and the outer edge of the substrate 1. The two connection holes 6 are symmetrically arranged relative to the mounting holes 2. In addition, the number of connection rods 7 is also selected as two or more. One end of a connection rod 7 passes through the first surface 1a into the connection hole 6 and is fixedly connected to the corresponding connection hole 6. This ensures that when the operator applies force to the substrate 1 using the connection rod 7, the force on the substrate 1 is relatively balanced, and avoids the substrate 1 from deviating from its position and accidentally touching the chip when it is removed from the printed circuit board 8.

[0074] In summary, the fixture 100 provided in this embodiment can be applied to existing SMT production lines or rework stations to facilitate automated chip packaging or manual repair. By setting the positioning block 3, the fixture 100 can be inserted onto the printed circuit board 8, fixing the position of the fixture 100 relative to the printed circuit board 8. Furthermore, by setting the mounting hole 2 and fitting it around the chip slot or chip socket of the printed circuit board 8, the fixture 100 defines a mounting space on the printed circuit board 8 using the mounting hole 2. This mounting space, in conjunction with the chip, can calibrate the position of the chip placed in the mounting hole 2. Thus, by applying the fixture 100 to an SMT machine or rework station, even when the pick-and-place head suction is insufficient to stably pick up the chip or when manual chip placement is required, the chip can still be aligned with the printed circuit board 8 with high accuracy using the fixture 100, reducing the cost of modifying existing chip production lines to produce large-size packaged chips.

[0075] Furthermore, by providing connection holes 6 and corresponding connecting rods 7 on the substrate, the fixture 100 of this embodiment forms an extension structure with a certain length outside the substrate. By using the connecting rods 7 to remove the fixture 100 from the printed circuit, the risk of affecting the alignment accuracy between the chip and the printed circuit board 8 due to touching the chip during the removal of the fixture 100 can be reduced.

[0076] Furthermore, the fixture 100 of this embodiment provides a chamfered portion 2a on the substrate, which enables the chip to smoothly enter the positioning space of the mounting hole 2. Even if the suction force of the chip pick-up head is insufficient to stably pick up the chip or if the chip needs to be placed manually, the fixture 100 of this embodiment can correct the alignment position of the chip and the printed circuit board 8 through the chamfered portion 2a, ensuring the alignment accuracy of the chip and the printed circuit board 8.

[0077] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present utility model, and these improvements and substitutions should also be considered within the protection scope of the present utility model.

Claims

1. A fixture (100) for chip mounting, having a first direction (X), a second direction (Y), and a third direction (Z) that are mutually perpendicular, characterized in that, include: The substrate (1) has a first surface (1a) and a second surface (1b) arranged opposite to each other along the third direction (Z); Mounting holes (2) are used to mate with chips to position the chips; the mounting holes (2) are formed on the substrate (1) and penetrate the first surface (1a) and the second surface (1b) along the third direction (Z); At least two positioning blocks (3) are disposed on the second surface (1b) and extend along the third direction (Z) to protrude from the second surface (1b), and the positioning blocks (3) are used to pass through the printed circuit board (8) so that the substrate (1) is connected to the printed circuit board (8) and the substrate (1) is fixed.

2. The fixture (100) for chip mounting according to claim 1, characterized in that, The mounting hole (2) has a square cross-sectional profile, and at least one corner of the mounting hole (2) is recessed toward the outside of the mounting hole (2) to form a first clearance channel (4), and the first clearance channel (4) penetrates the first surface (1a) and the second surface (1b) along the third direction (Z).

3. The fixture (100) for chip mounting according to claim 2, characterized in that, The inner wall of the mounting hole (2) is recessed toward the outer side of the mounting hole (2) to form a plurality of second clearance channels (5), which penetrate the first surface (1a) and the second surface (1b) along the third direction (Z).

4. The jig (100) for chip mounting according to claim 3, characterized in that, There are multiple first clearance channels (4), and each first clearance channel (4) is correspondingly disposed at one corner of the mounting hole (2); and, The second avoidance channel (5) is arranged at intervals with the first avoidance channel (4), and at least one second avoidance channel (5) is arranged between two adjacent first avoidance channels (4).

5. The fixture (100) for chip mounting according to claim 1, characterized in that, A connecting portion (1c) is provided on the second surface (1b), the connecting portion (1c) extending along the third direction (Z) to protrude from the second surface (1b), and the length L1 of the connecting portion (1c) in the first direction (X) is less than the length L2 of the second surface (1b) in the first direction (X), and... The connecting portion (1c) has a third surface (1d) formed on its end face away from the second surface (1b), the third surface (1d) being used to adhere to the surface of the printed circuit board (8), and, The positioning block (3) is disposed on the third surface (1d), and the mounting hole (2) penetrates the first surface (1a) and the third surface (1d) along the third direction (Z).

6. The fixture (100) for chip mounting according to claim 5, characterized in that, Along the third direction (Z), the vertical distance from the third surface (1d) to the second surface (1b) is H, and the vertical distance from the first surface (1a) to the third surface (1d) is D. Then the parameters H and D satisfy: H = 0.3D ~ 0.5D.

7. The fixture (100) for chip mounting according to claim 1, characterized in that, The substrate (1) is provided with a connection hole (6), which is located between any one of the positioning blocks (3) and the outer edge of the substrate (1); and, The fixture (100) further includes a connecting rod (7), one end of which passes through the first surface (1a) into the connecting hole (6) and is fixedly connected to the connecting hole (6), and the other end of which is located outside the connecting hole (6) for gripping.

8. The fixture (100) for chip mounting according to claim 7, characterized in that, The number of the connecting holes (6) is at least two, with one connecting hole (6) correspondingly disposed between one of the positioning blocks (3) and the outer edge of the substrate (1), and the two connecting holes (6) are symmetrically arranged relative to the mounting holes (2); and, The number of connecting rods (7) is at least two. One end of the connecting rod (7) passes through the first surface (1a) into the connecting hole (6) and is fixedly connected to the corresponding connecting hole (6).

9. The fixture (100) for chip mounting according to claim 1, characterized in that, The mounting hole (2) has a chamfered portion (2a) inclined to the first surface (1a) at its edge. One end of the chamfered portion (2a) is connected to the first surface (1a), and the other end extends into the mounting hole (2). Along the third direction (Z), the mounting hole (2) has a positioning space (9) located below the chamfer (2a) to position the chip.

10. The fixture (100) for chip mounting according to claim 9, characterized in that, The angle between the chamfered portion (2a) and the first surface (1a) is α, and α satisfies: 50°≤α≤70°.

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