Shielding cover for enhancing heat dissipation of chip

Abstract

The utility model discloses a shielding case for enhancing heat dissipation of a chip, which comprises a case body, a box body is fixedly arranged at a position close to the middle of the front surface of the case body, a cavity is arranged in the box body, a heat dissipation groove is arranged on the front surface of the case body, and a micro fan is fixedly arranged on a position close to the rear surface in the box body. An air outlet formed in the front end of the micro fan is communicated with an air outlet pipe, flow guide pipes are fixedly arranged at the positions, close to the four corners, of the front surface of the cover body, a connecting pipe is arranged on the outer surface of the air outlet pipe in a surrounding mode, and a flow dividing pipe is arranged in the cover body. According to the shielding case for enhancing heat dissipation of the chip, by arranging a micro fan, a flow guide pipe, a connecting pipe and a flow dividing pipe, when the shielding case is used, heat dissipation can be conducted on the interior of the case body through wind power, so that the heat discharging speed is increased, the overall heat dissipation performance is improved, convenience is brought to a user, and the practicability of the shielding case is improved; and the use requirements of users are met.

Description

Technical Field

[0001] This utility model relates to the field of circuit board heat dissipation technology, specifically a shielding cover to enhance chip heat dissipation. Background Technology

[0002] Electronic components mounted on a circuit board generate electromagnetic radiation and interfere with each other during operation. In addition, external electromagnetic interference can also affect the normal operation of electronic components. To avoid the effects of electromagnetic radiation, a common practice is to place a shielding cover around the electronic components.

[0003] The prior art document, "Shielding Cover for Enhancing Chip Heat Dissipation," patent number (CN220830642U), describes a shielding cover with heat dissipation protrusions. The bottom of the protrusions contacts the chip, allowing the heat generated by the chip during operation to be directly transferred to the shielding cover. This reduces the amount of heat dissipation material used, lowers production costs, and improves the self-heating function of electronic components, giving the shielding cover excellent heat dissipation performance. By setting heat dissipation holes that do not exceed the radio frequency wavelength, the shielding cover not only improves the self-heating function of electronic components but also ensures good signal shielding. Thus, the shielding cover fulfills the dual functions of heat dissipation and signal shielding.

[0004] However, the aforementioned devices only use physical heat dissipation, resulting in low heat dissipation efficiency and inconvenience to users, and can no longer meet their needs. Utility Model Content

[0005] The purpose of this utility model is to provide a shielding cover that enhances chip heat dissipation, so as to solve the problem mentioned in the background art that the above-mentioned mechanism only uses physical heat dissipation when in use, resulting in low heat dissipation efficiency, causing inconvenience to users, and no longer meeting the needs of users.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a shielding cover for enhancing chip heat dissipation, comprising a cover body, a box body fixedly disposed at the middle position of the front surface of the cover body, a cavity opened inside the box body, a heat dissipation groove opened on the front surface of the cover body, a micro fan fixedly disposed on the rear surface of the box body, an air outlet of the micro fan located at the front end connected to an air outlet pipe, guide pipes fixedly disposed at the four corners of the front surface of the cover body, a connecting pipe surrounding the outer surface of the air outlet pipe, a diversion pipe disposed inside the cover body, an exhaust groove opened on the rear surface of the diversion pipe, and the side of the diversion pipe near the inner wall of the cover body connected to the guide pipe.

[0007] Furthermore, the number of heat dissipation slots is several, and the heat dissipation slots and the cover are integrated into one design.

[0008] Furthermore, mounting ears are fixedly provided on both sides of the cover at the top and bottom positions.

[0009] Furthermore, the rear end of the guide tube penetrates the cover and extends into its interior.

[0010] Furthermore, the two connecting pipes on opposite sides both penetrate the box and are connected to the guide pipe, and the connecting pipes are connected to the air outlet pipe.

[0011] Furthermore, the front surface of the box body is provided with a ventilation groove, and the ventilation groove is integrated with the box body.

[0012] Furthermore, the number of exhaust slots is several, and the exhaust slots and the diversion pipes are integrated into one design. Both ends of the diversion pipes are fixedly connected to the inner wall of the cover.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] This enhanced chip heat dissipation shield, by incorporating a micro-fan, guide pipe, connecting pipe, and distribution pipe, enables the device to utilize airflow to dissipate heat within the shield during use. This accelerates heat dissipation, improves overall heat dissipation performance, provides convenience for users, enhances the device's practicality, and meets user needs. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a front sectional view of the structure of this utility model;

[0017] Figure 3 This is a rear sectional view of the structure of this utility model;

[0018] Figure 4 for Figure 3 A magnified view of part A in the diagram.

[0019] In the diagram: 1. Cover; 2. Box; 3. Heat dissipation slot; 4. Micro fan; 5. Air outlet duct; 6. Guide duct; 7. Connecting pipe; 8. Diverter duct; 9. Exhaust slot; 10. Mounting lug; 11. Ventilation slot. Detailed Implementation

[0020] The utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. The following embodiments are only descriptive and are not intended to limit the scope of protection of this utility model.

[0021] Please see Figure 1-4This utility model provides a technical solution: a shielding cover for enhancing chip heat dissipation, including a cover body 1, which serves as a shield. A box body 2 is fixedly installed at the middle position of the front surface of the cover body 1. The box body 2 is used to house corresponding components. A cavity is opened inside the box body 2. A heat dissipation groove 3 is opened on the front surface of the cover body 1, which serves as a heat dissipation groove. A micro fan 4 is fixedly installed on the rear surface inside the box body 2. The micro fan 4 can generate wind. An air outlet at the front end of the micro fan 4 is connected to an air outlet pipe 5, which serves as an air outlet. A guide pipe 6 is fixedly installed at each of the four corners of the front surface of the cover body 1, which serves as a guide pipe. A connecting pipe 7 is arranged around the outer surface of the air outlet pipe 5, which serves as a connecting pipe. A diversion pipe 8 is arranged inside the cover body 1, which serves as a diversion pipe. An exhaust groove 9 is opened on the rear surface of the diversion pipe 8, which serves as an exhaust groove. The side of the diversion pipe 8 near the inner wall of the cover body 1 is connected to the guide pipe 6.

[0022] Furthermore, the number of heat dissipation slots 3 is several, and the heat dissipation slots 3 and the cover 1 are integrated into one design. The heat dissipation slots 3 play a role in heat dissipation.

[0023] Furthermore, mounting ears 10 are fixedly provided on the top and bottom sides of both sides of the cover 1, which facilitates the user's installation of the device.

[0024] Furthermore, the rear end of the guide tube 6 penetrates the cover 1 and extends into its interior, whereby the guide tube 6 serves to guide the flow.

[0025] Furthermore, the two connecting pipes 7 are both connected to the box body 2 on opposite sides and are connected to the guide pipe 6. The connecting pipes 7 are connected to the air outlet pipe 5. The connecting pipes 7 serve to connect the two pipes.

[0026] Furthermore, the front surface of the box 2 is provided with a ventilation groove 11, which is integrated with the box 2. The ventilation groove 11 serves to allow air to pass through.

[0027] Furthermore, there are several exhaust slots 9, and the exhaust slots 9 and the diversion pipes 8 are integrated into one design. Both ends of the diversion pipes 8 are fixedly connected to the inner wall of the cover 1, whereby the diversion pipes 8 serve to divert the flow.

[0028] Working principle: When using this device, the user starts the micro fan 4 to generate wind, which is then delivered to the connecting pipe 7 through the air outlet duct 5. The connecting pipe 7 then delivers the wind to the guide pipe 6, which in turn delivers the wind to the diversion pipe 8. The diversion pipe 8 then exhausts the wind outward through the exhaust slot 9, thereby dissipating heat from the inside of the cover 1.

[0029] Based on the above work process, we can conclude that:

[0030] The shielding cover that enhances chip heat dissipation, by incorporating a micro fan 4, a guide pipe 6, a connecting pipe 7, and a branch pipe 8, enables the device to utilize airflow to dissipate heat within the cover 1 during use, thereby accelerating heat dissipation, improving overall heat dissipation performance, providing convenience for users, enhancing the practicality of the device, and meeting user needs.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A shielding cover for enhancing chip heat dissipation, comprising a cover body (1), characterized in that: A box (2) is fixedly installed at the middle position of the front surface of the cover (1). The box (2) has a cavity inside. The front surface of the cover (1) has a heat dissipation groove (3). A micro fan (4) is fixedly installed on the rear surface of the box (2). The air outlet of the micro fan (4) at the front end is connected to an air outlet pipe (5). A guide pipe (6) is fixedly installed at each of the four corners of the front surface of the cover (1). A connecting pipe (7) is arranged around the outer surface of the air outlet pipe (5). A diversion pipe (8) is installed inside the cover (1). An exhaust groove (9) is opened on the rear surface of the diversion pipe (8). The side of the diversion pipe (8) near the inner wall of the cover (1) is connected to the guide pipe (6).

2. The shielding cover for enhancing chip heat dissipation according to claim 1, characterized in that: The number of heat dissipation slots (3) is several, and the heat dissipation slots (3) and the cover (1) are integrated into one design.

3. The shielding cover for enhancing chip heat dissipation according to claim 1, characterized in that: Mounting ear blocks (10) are fixedly installed on both sides of the cover (1) at the top and bottom positions.

4. The shielding cover for enhancing chip heat dissipation according to claim 1, characterized in that: The rear end of the guide tube (6) penetrates the cover (1) and extends into its interior.

5. A shielding cover for enhancing chip heat dissipation according to claim 1, characterized in that: The two connecting pipes (7) are connected to the box body (2) on opposite sides and are connected to the guide pipe (6). The connecting pipes (7) are connected to the air outlet pipe (5).

6. The shielding cover for enhancing chip heat dissipation according to claim 1, characterized in that: The front surface of the box (2) is provided with a ventilation groove (11), and the ventilation groove (11) and the box (2) are integrated into one piece.

7. A shielding cover for enhancing chip heat dissipation according to claim 1, characterized in that: The number of exhaust grooves (9) is several. The exhaust grooves (9) and the diversion pipes (8) are integrated. Both ends of the diversion pipes (8) are fixedly connected to the inner wall of the cover (1).

Images