Limiting device for CCGA device welding column grinding

Abstract

The utility model discloses a limiting device for grinding a welding column of a CCGA device. The limiting device comprises a base and a limiting frame, bosses are symmetrically arranged at the bottoms of the two sides of the limiting frame respectively, mounting grooves are formed in the sides, close to the base, of the bosses, rolling wheels are rotationally connected into the mounting grooves, and the outer edges of the bottoms of the rolling wheels extend out of the bottom face of the base. A plurality of limiting through holes corresponding to and matched with welding columns of the CCGA device are formed in the middle of the base. The position of the welding column can be limited through the limiting through hole in the base, and the situation that the welding column inclines when a CCGA device is polished is avoided; the boss is arranged at the bottom of the limiting frame, the rolling wheel is rotationally connected into the mounting groove in the boss, the rolling wheel makes contact with the surface of abrasive paper, friction is reduced, the limiting device is pushed to enable the rolling wheel to roll back and forth on the abrasive paper, and therefore polishing of the welding column is achieved, the polishing smoothness is improved, and the polishing speed is increased; and the skill requirements on operators are low.

Description

Technical Field

[0001] This utility model relates to the field of CCGA device technology, and specifically to a limiting device for grinding CCGA device solder pillars. Background Technology

[0002] After CCGA (ceramic column grid array) devices are packaged, the end faces of the free ends of the solder pillars are typically curved or spherical, not flat. Furthermore, the uneven surface of the ceramic substrate of the CCGA device also contributes to the overall irregularity and poor flatness of the free ends of the solder pillars. If the solder pillars on the ceramic substrate are directly soldered onto the printed circuit board, the poor overall contact quality between the solder pillars and the printed circuit board results in poor soldering quality, and some solder pillars may even fail to solder effectively, directly affecting the functionality of the CCGA.

[0003] Because CCGA devices use tin-lead alloy pins, their leads are long and flexible. Uneven horizontal force applied during polishing can easily deform the pins, causing them to skew. The current method involves placing the device flat on metallographic sandpaper and having the operator repeatedly push the device body horizontally by hand to polish it.

[0004] Although this method can meet the welding requirements, it has two problems:

[0005] (1) The grinding speed is slow, which is not conducive to rapid production of products;

[0006] (2) The skill level requirements for operators are high, and only personnel with professional qualifications are required to operate the equipment. Utility Model Content

[0007] The purpose of this invention is to provide a limiting device for grinding the solder pillars of CCGA devices, so as to solve the problems mentioned in the background art.

[0008] The technical solution of this utility model to solve the above-mentioned technical problems is as follows:

[0009] A limiting device for grinding the solder pillars of a CCGA device includes: a base and a limiting frame disposed on the top of the base, wherein the size of the limiting cavity inside the limiting frame matches the size of the ceramic substrate of the CCGA device.

[0010] The bottom of each side of the limiting frame is symmetrically provided with protrusions. The side of the protrusion closest to the base has an installation groove, and a roller is rotatably connected in the installation groove. The base has a through groove that corresponds to and matches the protrusion. The protrusion extends into the corresponding through groove, and the bottom outer edge of the roller extends out from the bottom surface of the base.

[0011] The base has several limiting through holes in the middle that correspond to and match the solder posts of the CCGA device. The CCGA device is placed into the limiting frame and the solder posts of the CCGA device pass through the limiting through holes.

[0012] Furthermore, the outer side of the aforementioned limiting frame is flush with the side of the base.

[0013] Furthermore, both the base and the limiting frame mentioned above have a rectangular structure.

[0014] Furthermore, the width of the aforementioned boss is equal to the width of the side of the limiting frame, and the through slots are symmetrically opened on both sides of the base and correspond one-to-one with the bosses.

[0015] Furthermore, at least two sets of the aforementioned protrusions are provided.

[0016] Furthermore, the height of the aforementioned base is less than the height of the solder pillars on the CCGA device.

[0017] Furthermore, the aforementioned base is connected and locked to the limiting frame by multiple screws.

[0018] This utility model has the following beneficial effects:

[0019] 1. This utility model relates to a limiting device for grinding CCGA device solder pillars. In use, the CCGA device is placed within a limiting frame, and the solder pillars on the CCGA device extend from the limiting through-holes on the base. The extended solder pillars are then placed on sandpaper for grinding. The limiting through-holes on the base restrict the position of the solder pillars and prevent them from becoming skewed during grinding. A boss is provided at the bottom of the limiting frame, and a roller is rotatably connected to the mounting groove on the boss. The outer edge of the roller extends from the bottom surface of the base, thus preventing the base from directly contacting the sandpaper surface. Contact between the roller and the sandpaper surface reduces friction. Pushing the limiting device causes the roller to roll back and forth on the sandpaper, thereby grinding the solder pillars. This improves the smoothness and speed of grinding and requires less skill from the operator.

[0020] 2. The limiting device for grinding CCGA device solder pillars of this utility model can replace different bases according to the specific shape and arrangement of the solder pillars when different CCGA devices need to be ground, making it convenient to use. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of an existing CCGA device;

[0022] Figure 2 A schematic diagram of a limiting device for grinding CCGA device solder pillars;

[0023] Figure 3This is an exploded structural diagram of a limiting device for grinding the solder pillars of CCGA devices.

[0024] In the diagram: 1. Base; 11. Through slot; 12. Limiting through hole; 2. Limiting frame; 21. Limiting cavity; 22. Boss; 23. Mounting slot; 24. Roller; 3. CCGA device; 31. Ceramic substrate; 32. Weld post. Detailed Implementation

[0025] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0026] like Figure 2 and Figure 3 As shown, an embodiment of this utility model provides a limiting device for grinding the solder pillars of a CCGA device, including: a base 1 and a limiting frame 2 disposed on the top of the base 1. The base 1 is connected and locked to the limiting frame 2 by a plurality of screws. By opening a plurality of corresponding screw holes on the base 1 and the limiting frame 2, it is convenient to use screws for connection and disassembly. The size of the limiting cavity 21 on the inner side of the limiting frame 2 matches the size of the ceramic substrate 31 of the CCGA device 3.

[0027] Among them, such as Figure 1 As shown, the CCGA device 3 includes a ceramic substrate 31 and a number of solder posts 32 disposed on the ceramic substrate 31. All solder posts 32 are soldered on the ceramic substrate 31 and are distributed in a matrix.

[0028] Specifically, the bottom of the limiting frame 2 is symmetrically provided with protrusions 22 on both sides. The side of the protrusion 22 near the base 1 is provided with a mounting groove 23, and a roller 24 is rotatably connected in the mounting groove 23. The inner walls of both sides of the mounting groove 23 are provided with shaft holes for mounting the roller 24, and rotation is achieved through the shaft holes. The base 1 is provided with a through groove 11 that corresponds to and matches the protrusion 22. The protrusion 22 extends into the corresponding through groove 11, and the bottom outer edge of the roller 24 extends out from the bottom surface of the base 1. This arrangement ensures that the base 1 does not directly contact the surface of the sandpaper, and the roller 24 contacts the surface of the sandpaper, reducing friction, improving the smoothness of sanding, and also increasing the sanding speed.

[0029] The base 1 has several limiting through holes 12 in the middle that correspond to and match the solder posts 32 of the CCGA device 3. The limiting through holes 12 can restrict the position of the solder posts 32 and prevent the solder posts 32 from becoming skewed when grinding the CCGA device 3. The CCGA device 3 is placed into the limiting frame 2 and the solder posts 32 of the CCGA device 3 pass through the limiting through holes 12. Furthermore, the height of the base 1 is less than the height of the solder posts 32 on the CCGA device 3.

[0030] The height of the welding post 32 is 2.2mm, the height of the base 1 is 1.6mm, and the bottom outer edge of the roller 24 extends 0.5mm beyond the bottom surface of the base 1. Therefore, when grinding the CCGA device 3, the welding post 32 extends about 0.1mm beyond the base 1. The setting of the limiting device facilitates the grinding of the CCGA device 3.

[0031] In this embodiment, both the base 1 and the limiting frame 2 are rectangular; and the outer side of the limiting frame 2 is flush with the side of the base 1. In other embodiments of this utility model, the base 1 and the limiting frame 2 can be circular, and it is only necessary to ensure that the size of the limiting cavity 21 inside the limiting frame 2 matches the size of the ceramic substrate 31 of the CCGA device 3.

[0032] like Figure 3 As shown, the width of the boss 22 is equal to the width of the side of the limiting frame 2, and the through slots 11 are symmetrically opened on both sides of the base 1 and correspond one-to-one with the bosses 22. Furthermore, in this embodiment, the height of the boss 22 is equal to the height of the base 1. In other embodiments of this utility model, the height of the boss 22 can be less than the height of the base 1, and it is only necessary to ensure that the bottom outer edge of the roller 24 can extend beyond the bottom surface of the base 1. At least two sets of bosses 22 are provided; in this embodiment, four sets of bosses 22 are provided, symmetrically distributed on the bottom of both sides of the limiting frame 2. With four sets of bosses 22, there are four sets of rollers 24, thus increasing the contact points with sandpaper and facilitating sanding.

[0033] In use, the CCGA device 3 is placed into the limiting cavity 21 of the limiting frame 2, and the solder post 32 of the CCGA device 3 is made to pass through the limiting through hole 12 on the base 1. Then, the solder post 32 extending out of the base 1 is placed on sandpaper for grinding. Under the action of the roller 24, the base 1 does not directly contact the surface of the sandpaper. The contact between the roller 24 and the surface of the sandpaper reduces friction. By pushing the limiting device, the roller 24 rolls back and forth on the sandpaper, thereby achieving the grinding of the solder post 32. The operation is simple and convenient, and the grinding quality is consistent and the grinding flatness is accurate. It also requires low skill from the operator. The base 1 can effectively limit and protect the solder post 32 without damaging the CCGA device 3.

[0034] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A limiting device for grinding CCGA device solder pillars, characterized in that, include: The base (1) and the limiting frame (2) disposed on the top of the base (1), wherein the size of the limiting cavity (21) inside the limiting frame (2) matches the size of the ceramic substrate of the CCGA device (3). The bottom of the limiting frame (2) is symmetrically provided with protrusions (22) on both sides. The protrusions (22) are provided with mounting grooves (23) on the side near the base (1), and rollers (24) are rotatably connected in the mounting grooves (23). The base (1) is provided with through grooves (11) that correspond to and match the protrusions (22). The protrusions (22) extend into the corresponding through grooves (11), and the bottom outer edge of the rollers (24) extends out from the bottom surface of the base (1). The base (1) has several limiting through holes (12) in the middle that correspond to and match the solder posts of the CCGA device (3). The CCGA device (3) is placed into the limiting frame (2) and the solder posts of the CCGA device (3) pass through the limiting through holes (12).

2. The limiting device for grinding CCGA device solder pillars according to claim 1, characterized in that, The outer side of the limiting frame (2) is flush with the side of the base (1).

3. The limiting device for grinding CCGA device solder pillars according to claim 2, characterized in that, Both the base (1) and the limiting frame (2) are rectangular structures.

4. The limiting device for grinding CCGA device solder pillars according to claim 3, characterized in that, The width of the boss (22) is equal to the width of the side of the limiting frame (2), and the through groove (11) is symmetrically opened on both sides of the base (1) and corresponds one-to-one with the boss (22).

5. The limiting device for grinding CCGA device solder pillars according to claim 1, characterized in that, The boss (22) is provided in at least two sets.

6. The limiting device for grinding CCGA device solder pillars according to any one of claims 1 to 5, characterized in that, The height of the base (1) is less than the height of the solder post on the CCGA device (3).

7. The limiting device for grinding CCGA device solder pillars according to claim 6, characterized in that, The base (1) is connected and locked to the limiting frame (2) by multiple screws.

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