Vibration device for PCB electroplating

Abstract

The utility model discloses a vibration device for PCB (Printed Circuit Board) electroplating, and relates to the technical field of PCB processing. The vibration device comprises a vertically-arranged stand column, a temporary storage mechanism, a vibration element and a lifting mechanism. The temporary storage mechanism is used for bearing and placing a hanging frame, and the hanging frame is used for clamping and fixing the PCB; the temporary storage mechanism is connected to the stand column in a sliding mode. The vibration element is mounted on the temporary storage mechanism and is used for driving the hanging rack placed on the temporary storage mechanism to vibrate; the driving end of the lifting mechanism is connected with the temporary storage mechanism, and the lifting mechanism is used for driving the temporary storage mechanism to ascend and descend along the stand column. According to the technical scheme provided by the utility model, gas bubbles attached to the surface of the PCB can be eliminated, so that the electroplating precision control degree of the PCB is improved, and the electroplating uniformity is prevented from deviating.

Description

Technical Field

[0001] This utility model relates to the field of PCB board processing technology, and in particular to a vibration device for PCB board electroplating. Background Technology

[0002] In PCB electroplating, the PCB is usually clamped by a hanger and then lowered into an electroplating tank filled with electroplating solution for electroplating. During the process of lowering the PCB into the electroplating tank, gas bubbles can easily adhere to the surface of the PCB. These gas bubbles can make it difficult to control the electroplating precision, resulting in deviations in the uniformity of electroplating.

[0003] It should be noted that the above content is only used to help understand the technical solution of this utility model, and does not represent an admission that the above content is prior art. Utility Model Content

[0004] The main purpose of this invention is to provide a vibration device for PCB board electroplating, which aims to remove gas bubbles attached to the surface of the PCB board, thereby improving the control of the electroplating precision and avoiding deviations in electroplating uniformity.

[0005] To achieve the above objectives, this utility model proposes a vibration device for PCB board electroplating. Specifically, the vibration device includes:

[0006] Vertically installed columns;

[0007] A temporary storage mechanism is provided for supporting and placing a hanging rack, wherein the hanging rack is used to clamp and fix the PCB board; the temporary storage mechanism is slidably connected to the column.

[0008] A vibration element is mounted on the temporary storage mechanism and is used to drive the hanger placed on the temporary storage mechanism to vibrate.

[0009] A lifting mechanism is provided, the drive end of which is connected to the temporary storage mechanism. The lifting mechanism is used to drive the temporary storage mechanism to move up and down along the column.

[0010] In one embodiment, the vibration device includes two symmetrically arranged columns, each column being slidably connected to a temporary storage mechanism, and a bracket supporting the two temporary storage mechanisms; the two temporary storage mechanisms are fixedly connected by a connecting plate; a lifting mechanism is installed between the two columns, and the driving end of the lifting mechanism is connected to the connecting plate to drive the two temporary storage mechanisms to rise and fall synchronously.

[0011] In one embodiment, the drive end of the lifting mechanism is in contact with the connecting plate, and an anti-collision buffer layer is provided on the side of the drive end of the lifting mechanism that is in contact with the connecting plate.

[0012] In one embodiment, the lifting mechanism includes a mounting plate and a lifting cylinder. The opposite sides of the mounting plate are respectively mounted on the two columns, and the lifting cylinder is mounted in the middle of the mounting plate. The lifting cylinder drives the temporary storage mechanism to move up and down along the columns.

[0013] In one embodiment, the temporary storage mechanism includes a lifting frame and a support frame connected together. The lifting frame is a frame-shaped structure fitted onto the outside of the column. The support frame is used to support and place the hanging bracket, and the vibration element is installed on the support frame.

[0014] In one embodiment, the support frame is provided with a guide rail section, through which the hanger can slide from other processing steps onto the support frame.

[0015] In one embodiment, the support frame is provided with a powder receiving box, which is located below the conductive block of the hanger.

[0016] In one embodiment, a guide wheel is rotatably connected inside the lifting frame, and the guide wheel is in close contact with the column; so that when the lifting frame moves up and down, the guide wheel rotates relative to the column.

[0017] In one embodiment, the lifting frame includes a plurality of guide wheels, which are respectively disposed on each side of the column along its length.

[0018] In one embodiment, each side of the column along its length is provided with at least two guide wheels, and the at least two guide wheels are located on the same vertical line.

[0019] The technical solution of this utility model, on the one hand, applies vibration to the hanger through a vibration element installed on the temporary storage mechanism, and on the other hand, drives the temporary storage mechanism to move up and down along the column through a lifting mechanism. This allows the PCB board to undergo both vibration and lifting movements simultaneously during the electroplating process. The combination of these two movements separates the gas bubbles attached to the PCB board from each other, thereby achieving the purpose of eliminating gas bubbles and improving the degree of control over the electroplating precision of the PCB board, thus avoiding deviations in the uniformity of electroplating. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 A schematic diagram of the overall structure of an embodiment of the vibration device provided by this utility model;

[0022] Figure 2 A second schematic diagram of the overall structure of an embodiment of the vibration device provided by this utility model;

[0023] Figure 3 A schematic diagram of the structure of an embodiment of the vibration device provided by this utility model;

[0024] Figure 4 A schematic diagram of the lifting frame in one embodiment of the vibration device provided by this utility model;

[0025] Figure 5 A schematic diagram of the internal structure of the lifting frame in one embodiment of the vibration device provided by this utility model.

[0026] Explanation of reference numerals in the attached figures:

[0027] 100. Column; 200. Temporary storage mechanism; 210. Connecting plate; 220. Lifting frame; 221. Guide wheel; 230. Support frame; 231. Guide rail section; 300. Lifting mechanism; 310. Mounting plate; 320. Lifting cylinder; 400. Hanger; 500. PCB board; 600. Electroplating tank;

[0028] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0029] The technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, what is described is only a part of the embodiments of this utility model, and not all of the embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.

[0030] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0031] Furthermore, it should be noted that the descriptions involving "first," "second," etc., in this utility model are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0032] In PCB electroplating, the PCB is usually clamped by a hanger and then lowered into an electroplating tank filled with electroplating solution for electroplating. During the process of lowering the PCB into the electroplating tank, gas bubbles can easily adhere to the surface of the PCB. These gas bubbles can make it difficult to control the electroplating precision, resulting in deviations in the uniformity of electroplating.

[0033] To solve the above-mentioned technical problems, this utility model proposes a vibration device for PCB board electroplating.

[0034] Please see Figure 1-2 In one embodiment of this utility model, the vibration device for PCB board electroplating includes a vertically arranged column 100, a temporary storage mechanism 200, a vibration element (not shown in the figure), and a lifting mechanism 300. The temporary storage mechanism 200 is used to support and place the hanger 400, wherein the hanger 400 is used to clamp and fix the PCB board 500. Since the hanger 400 is prior art, the specific structure of the hanger 400 will not be described in detail in this application. The temporary storage mechanism 200 is slidably connected to the column 100. The vibration element is installed on the temporary storage mechanism 200 and is used to drive the hanger 400 placed on the temporary storage mechanism 200 to vibrate. The driving end of the lifting mechanism 300 is connected to the temporary storage mechanism 200 and is used to drive the temporary storage mechanism 200 to move up and down along the column 100.

[0035] The technical solution of this utility model, on the one hand, applies vibration to the hanger 400 through a vibration element installed on the temporary storage mechanism 200, and on the other hand, drives the temporary storage mechanism 200 to move up and down along the column 100 through the lifting mechanism 300. This allows the PCB board 500 to undergo both vibration and lifting movements simultaneously during the electroplating process. The combination of these two movements separates the gas bubbles attached to the PCB board 500 from each other, thereby achieving the purpose of eliminating gas bubbles and improving the degree of control over the electroplating precision of the PCB board 500, thus avoiding deviations in the uniformity of electroplating.

[0036] Specifically, the vibration device is set between two electroplating tanks 600, and PCB boards 500 are clamped on both sides of the bracket 400. After the bracket 400 moves to support the temporary storage mechanism 200, the lifting mechanism 300 drives the temporary storage mechanism 200 to move downward along the column 100. This process can also be understood as lowering the PCB board 500 into the electroplating tank 600 for electroplating.

[0037] Among them, the above-mentioned vibration element can be a miniature vibration motor, which is a DC brushed motor. There is an eccentric wheel on the motor shaft. When the motor rotates, the center of the eccentric wheel is not on the center of rotation of the motor, causing the motor to be in a state of constant imbalance. Due to inertia, vibration is caused, thereby achieving the purpose of generating vibration on the hanger 400.

[0038] As a preferred embodiment of the above embodiments, refer to the appendix. Figure 3 The vibration device includes two symmetrically arranged columns 100, each column 100 being slidably connected to a temporary storage mechanism 200. A hanger 400 is placed on top of the two temporary storage mechanisms 200. The two temporary storage mechanisms 200 are fixedly connected by a connecting plate 210. A lifting mechanism 300 is installed between the two columns 100, and the driving end of the lifting mechanism 300 is connected to the connecting plate 210 to drive the two temporary storage mechanisms 200 to rise and fall synchronously. This arrangement ensures that the hanger 400 is balanced and placed on top of the temporary storage mechanisms 200, with the two temporary storage mechanisms 200 supporting the left and right sides of the hanger 400 respectively. Meanwhile, the two temporary storage mechanisms 200 are connected to each other through a connecting plate 210. The driving end of the lifting mechanism 300 is connected to the connecting plate 210 to ensure that the two temporary storage mechanisms 200 can move up and down synchronously under the driving action of the lifting mechanism 300. This ensures that the hanging bracket 400 supported on the temporary storage mechanism 200 maintains left and right balance and avoids tilting during the up and down movement.

[0039] Furthermore, the drive end of the lifting mechanism 300 is in contact with the connecting plate 210, and an anti-collision buffer layer (not shown in the attached figure) is provided on the side of the drive end of the lifting mechanism 300 that is in contact with the connecting plate 210. With this configuration, after the lifting mechanism 300 raises the temporary storage mechanism 200 to a certain height, the lifting mechanism 300 quickly descends to reset. At this time, the temporary storage mechanism 200 is temporarily separated from the drive end of the lifting mechanism 300. After losing the connection of the lifting mechanism 300, the temporary storage mechanism 200 descends along the column 100 by its own gravity. When it descends to the point of re-contacting the lifting mechanism 300, the reaction force between the two causes a certain degree of vertical inertial vibration between the temporary storage mechanism 200 and the lifting mechanism 300. This inertial vibration can also be used to remove some of the gas bubbles attached to the surface of the PCB board 500. In addition, in order to avoid damage to the lifting mechanism 300 or the temporary storage mechanism 200 due to excessive inertial vibration, this embodiment also provides an anti-collision buffer layer on the side of the driving end of the lifting mechanism 300 that is in contact with the connecting plate 210, so as to buffer its inertial vibration.

[0040] There are many specific forms of the aforementioned lifting mechanism 300. In this embodiment, please refer to the appendix. Figure 3 The lifting mechanism 300 includes a mounting plate 310 and a lifting cylinder 320. The mounting plate 310 is mounted on two columns 100 on opposite sides. The lifting cylinder 320 is mounted in the middle of the mounting plate 310. The lifting cylinder 320 drives the temporary storage mechanism 200 to move up and down along the columns 100. This design utilizes a commercially available lifting cylinder 320 as the power source for the lifting mechanism 300, resulting in a simple structure and strong practicality.

[0041] As a preferred embodiment of the above embodiments, refer to the appendix. Figure 3 The temporary storage mechanism 200 includes a lifting frame 220 and a support frame 230 connected to each other. The lifting frame 220 is a frame-shaped structure fitted onto the outside of the column 100. The support frame 230 is used to support and place the hanging bracket 400, and the vibration element is installed on the support frame 230. With this configuration, the lifting frame 220, with its frame-shaped structure, fitted onto the outside of the column 100, ensures that the temporary storage mechanism 200 will not tilt when it moves up and down along the column 100, thus ensuring that the temporary storage mechanism 200 moves up and down along the vertical line. The structure is simple and highly practical.

[0042] Furthermore, the support frame 230 is provided with a guide rail section 231, through which the hanger 400 can slide from other processing steps onto the support frame 230. This arrangement allows the hanger 400 to slide along the guide rail section 231 from other processing steps onto the support frame 230, improving the smoothness and processing efficiency of the electroplating operation on the PCB board 500.

[0043] Furthermore, the support frame 230 is equipped with a powder receiving box (not shown in the attached diagram), which is located below the conductive block of the hanger 400. This arrangement takes into account that the conductive block is mounted on the hanger 400, serving as the power transmission medium to drive the hanger 400 to slide along the guide rail section 231. Simultaneously, since the conductive block will experience wear and tear during operation, resulting in dust falling from the conductive block, the powder receiving box is located below the support position of the hanger 400 to collect the falling conductive block dust, thus preventing the dust from polluting the environment.

[0044] Further, see Appendix Figure 4-5 The lifting frame 220 is internally connected to a guide wheel 221, which is in close contact with the column 100. This ensures that the guide wheel 221 rotates relative to the column 100 during the lifting motion of the lifting frame 220. This design transforms the sliding friction between the lifting frame 220 and the column 100 into rolling friction through the guide wheel 221, thus preventing wear on the contact surfaces of the lifting frame 220 or the column 100 and reducing their service life.

[0045] Furthermore, the lifting frame 220 includes a plurality of guide wheels 221, which are respectively disposed on each side of the column 100 along its length. With this arrangement, since the lifting frame 220 is a frame-shaped structure fitted over the outside of the column 100, meaning that each side of the column 100 along its length is in contact with the lifting frame 220, the placement of the guide wheels 221 on each side of the column 100 along its length ensures that each side of the column 100 along its length experiences rolling friction with the lifting frame 220 via the guide wheels 221. In this embodiment, since the column 100 has a square cross-section, the lifting frame 220 correspondingly has a square frame structure, and the guide wheels 221 are configured to roll in contact with its four sides.

[0046] Furthermore, each side of the column 100 along its length is provided with at least two guide wheels 221, and the at least two guide wheels 221 are located on the same vertical line. This arrangement, with at least two guide wheels 221 on each side, ensures that the lifting frame 220 does not skew during its lifting and lowering movement along the column 100 by using the mutual restraint of these guide wheels 221. In this embodiment, each side of the column 100 along its length is provided with two guide wheels 221. It is understood that those skilled in the art, after understanding the technical solution of this application, may also set the number of guide wheels 221 to three, four, or more, which should also fall within the protection scope of this application.

[0047] It should be noted that the other contents of the vibration device for PCB board electroplating disclosed in this utility model are prior art and will not be described in detail here.

[0048] The above are merely optional embodiments of this utility model and do not limit the patent scope of this utility model. Any application of this utility model directly or indirectly in other related technical fields is included within the patent protection scope of this utility model.

Claims

1. A vibration device for electroplating PCB boards, characterized in that, The vibration device includes: Vertically installed columns; A temporary storage mechanism is provided for supporting and placing a hanging rack, wherein the hanging rack is used to clamp and fix the PCB board; the temporary storage mechanism is slidably connected to the column. A vibration element is mounted on the temporary storage mechanism and is used to drive the hanger placed on the temporary storage mechanism to vibrate. A lifting mechanism is provided, the drive end of which is connected to the temporary storage mechanism. The lifting mechanism is used to drive the temporary storage mechanism to move up and down along the column.

2. The vibration device as described in claim 1, characterized in that: The vibration device includes two symmetrically arranged columns, each of which is slidably connected to a temporary storage mechanism. The bracket supports and places the two temporary storage mechanisms on top of each other. The two temporary storage mechanisms are fixedly connected by a connecting plate. The lifting mechanism is installed between the two columns, and the driving end of the lifting mechanism is connected to the connecting plate to drive the two temporary storage mechanisms to rise and fall synchronously.

3. The vibration device as described in claim 2, characterized in that: The drive end of the lifting mechanism and the connecting plate are detachable contact connections, and the side of the drive end of the lifting mechanism that contacts the connecting plate is provided with an anti-collision buffer layer.

4. The vibration device as described in claim 2, characterized in that: The lifting mechanism includes a mounting plate and a lifting cylinder. The mounting plate is mounted on two columns on opposite sides. The lifting cylinder is mounted in the middle of the mounting plate. The lifting cylinder drives the temporary storage mechanism to move up and down along the columns.

5. The vibration device as described in claim 1, characterized in that: The temporary storage mechanism includes a lifting frame and a support frame connected together. The lifting frame is a frame-shaped structure fitted onto the outside of the column. The support frame is used to support and place the hanging rack, and the vibration element is installed on the support frame.

6. The vibration device as described in claim 5, characterized in that: The support frame is provided with a guide rail section, through which the hanging bracket can slide onto the support frame from other processing steps.

7. The vibration device as described in claim 5, characterized in that: The support frame is equipped with a powder receiving box, which is located below the conductive block of the hanging frame.

8. The vibration device as described in claim 5, characterized in that: The lifting frame is internally connected to a guide wheel, which is in close contact with the column; so that when the lifting frame moves up and down, the guide wheel rotates relative to the column.

9. The vibration device as described in claim 8, characterized in that: The lifting frame includes a plurality of guide wheels, which are respectively disposed on each side of the column along its length.

10. The vibration device as described in claim 9, characterized in that: The column is provided with at least two guide wheels on each side along its length, and the at least two guide wheels are located on the same vertical line.

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