Chuck pin detection device and single-chip machine

Abstract

The utility model relates to a chuck pin detection device and a single-chip machine table, a first polar plate is in contact with a first surface of a chuck pin, a second polar plate is in contact with a second surface of the chuck pin, and the first surface and the second surface are oppositely arranged, so that an electric signal of the chuck pin can be obtained through the first polar plate and the second polar plate; a detection assembly is arranged, the detection assembly is electrically connected with the first polar plate and the second polar plate, test voltage is provided for the first polar plate and the second polar plate through the detection assembly, and under the action of the test voltage, a defect detection result of the chuck pin is determined according to an electric signal between the first polar plate and the second polar plate; therefore, the abrasion condition of the chuck pin is monitored in real time so that the chuck pin can be replaced in time, the abrasion condition of the chuck pin is obtained according to the electric signal between the first pole plate and the second pole plate, the monitoring accuracy of the chuck pin is improved, meanwhile, shutdown detection is avoided, and the production efficiency of a machine table is guaranteed to the maximum degree.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a chuck pin detection device and a single-chip microcomputer. Background Technology

[0002] In semiconductor manufacturing processes, wafers undergo rotation and translation, requiring components such as chuck pins or locating pins to hold the wafers and define their position.

[0003] However, due to the relative movement between the wafer and the chuck pins, the part of the chuck pins that contacts the wafer is prone to wear. Excessively worn chuck pins will not only break and cause fragments, but will also generate contaminants due to wear, affecting the device performance of the wafer. Utility Model Content

[0004] Therefore, it is necessary to provide a chuck pin detection device and a single-chip machine that can monitor the wear of chuck pins in real time to address the above-mentioned technical problems.

[0005] This application provides a chuck pin detection device. The chuck pin includes a rotating component, a chuck pin body, and a positioning pin protruding from the chuck pin body. Both the rotating component and the positioning pin are connected to the chuck pin body. The rotating component drives the positioning pin to rotate, and the positioning pin clamps a wafer. The detection device includes: a first electrode plate, which is in contact with a first surface of the chuck pin; a second electrode plate, which is in contact with a second surface of the chuck pin and grounded; wherein the first surface and the second surface are opposite to each other; and a detection component, which is electrically connected to the first electrode plate and the second electrode plate respectively, for providing test voltages to the first electrode plate and the second electrode plate respectively, and determining the defect detection result of the chuck pin based on the electrical signal between the first electrode plate and the second electrode plate under the action of the test voltage.

[0006] In one embodiment, the detection component includes: a signal generation circuit connected to both the first electrode plate and the second electrode plate, for providing the test voltage to the first electrode plate and the second electrode plate; and a signal detection circuit connected to the signal generation circuit, for detecting the electrical signal between the first electrode plate and the second electrode plate under the action of the test voltage, and determining the defect detection result based on the electrical signal.

[0007] In one embodiment, the signal generation circuit includes a current detector, a voltage detector, and a variable resistor; wherein, a first terminal of the current detector is connected to a power supply, a second terminal of the current detector is connected to the first electrode and the first terminal of the voltage detector, a third terminal of the current detector is connected to the signal detection circuit, a second terminal of the voltage detector is connected to the second electrode and the first terminal of the variable resistor, and a second terminal of the variable resistor is connected to the power supply.

[0008] In one embodiment, the signal generation circuit includes: a sine wave generator, a comparator, a first capacitor, and a resistor; wherein the output terminal of the sine wave generator is connected to the first plate, the second plate is connected to the inverting input terminal of the comparator, the first terminal of the first capacitor, and the first terminal of the resistor, the non-inverting input terminal of the comparator is connected to a common ground terminal, and the second terminal of the first capacitor is connected to the second terminal of the resistor, the output terminal of the comparator, and the signal detection circuit.

[0009] In one embodiment, the signal generation circuit further includes: a second capacitor, the first end of which is connected to the output terminal of the sine wave generator, and the second end of which is connected to the common ground terminal; and a third capacitor, the first end of which is connected to the inverting input terminal of the comparator, and the second end of which is connected to the common ground terminal.

[0010] In one embodiment, the detection device further includes: a housing having a receiving cavity, the detection component being disposed in the receiving cavity; wherein the housing is spaced apart from the chuck pin, and a first groove for receiving the first electrode plate is formed between the housing and a first surface of the chuck pin, and a second groove for receiving the second electrode plate is formed between the housing and a second end of the chuck pin.

[0011] In one embodiment, the detection device further includes: at least one first elastic member, a first end of which is connected to the first electrode plate and a second end of which is connected to the housing; and at least one second elastic member, a first end of which is connected to the second electrode plate and a second end of which is connected to the housing.

[0012] In one embodiment, the detection component further includes a first connection port, a second connection port, a power supply port, and an electrical signal input / output port; wherein the first connection port is connected to the first electrode plate, the second connection port is connected to the second electrode plate, the power supply port is connected to an external power supply, and the electrical signal input / output port is connected to a machine tool controller; wherein the machine tool controller is used to input control signals to the detection component to control the detection component to start working and to receive the defect detection results.

[0013] In one embodiment, the chuck pin includes a conductive chuck pin or an insulating chuck pin; wherein, when the chuck pin is a conductive chuck pin, the test voltage is a fixed voltage signal, and the detection component is used to determine that the chuck pin is defective when the electrical signal is less than a first preset electrical signal; when the chuck pin is an insulating chuck pin, the test voltage is an AC voltage signal, and the detection component is used to determine that the chuck pin is defective when the electrical signal is less than a second preset electrical signal.

[0014] This application also provides a single-chip microcomputer, including the chuck pin detection device described in any one of the embodiments of this application.

[0015] The aforementioned chuck pin detection device and single-chip microcomputer have the following unexpected and beneficial effects:

[0016] The chuck pin detection device and single-piece machine tool of this application, by setting a first electrode plate in contact with the first surface of the chuck pin and a second electrode plate in contact with the second surface of the chuck pin, with the first and second surfaces arranged opposite each other, can acquire the electrical signal of the chuck pin through the first and second electrode plates. Then, by setting a detection component, the detection component is electrically connected to both the first and second electrode plates. The detection component provides a test voltage to the first and second electrode plates, and under the action of the test voltage, the defect detection result of the chuck pin is determined based on the electrical signal between the first and second electrode plates. This enables real-time monitoring of the wear condition of the chuck pin, so as to replace the chuck pin in a timely manner. Furthermore, this application improves the accuracy of chuck pin monitoring by acquiring the wear condition of the chuck pin based on the electrical signal between the first and second electrode plates, while avoiding downtime for inspection and maximizing the production efficiency of the machine tool. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1a This is a schematic diagram of the structure of an unworn chuck pin in one embodiment;

[0019] Figure 1b This is a schematic diagram of the structure of a worn chuck pin in one embodiment;

[0020] Figure 2 This is a schematic diagram of the chuck pin detection device in one embodiment;

[0021] Figure 3 This is a schematic diagram of the chuck pin detection device in another embodiment;

[0022] Figure 4a This is a side view of the housing structure in one embodiment;

[0023] Figure 4b This is a top view of the housing structure in one embodiment;

[0024] Figure 5 This is a schematic diagram of the signal generation circuit in one embodiment;

[0025] Figure 6 This is a schematic diagram of the signal generation circuit in another embodiment;

[0026] Figure 7 This is a schematic diagram of the chuck pin detection device in another embodiment;

[0027] Figure 8 This is a schematic diagram of the chuck and chuck pin in one embodiment.

[0028] Explanation of reference numerals in the attached figures:

[0029] 10. Chuck pin; 101. Rotating component; 102. Chuck pin body; 103. Positioning pin; 20. First electrode plate; 30. Second electrode plate; 40. Detection assembly; 401. Current detector; 402. Voltage detector; 403. Variable resistor; 404. Operating power supply; 406. Sine wave generator; 407. Comparator; 50. Housing; 501. First groove; 502. Second groove; 510. Groove; 601. First elastic element; 602. Second elastic element; 701. Grounding pin; 702. Signal input pin; 703. Signal output pin; 704. Positive power supply pin; 705. Negative power supply pin; 80. Chuck; 90. Detection device. Detailed Implementation

[0030] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0032] It is understood that the terms “first,” “second,” etc., used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another.

[0033] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, the element or feature described as “below,” “under,” or “below” will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.

[0034] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0035] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that terms such as “comprising / including” or “having” specify the presence of the stated features, wholes, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, components, parts, or combinations thereof. Meanwhile, the term “and / or” as used in this specification includes any and all combinations of the associated listed items.

[0036] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0037] Please refer to Figure 1a The chuck pin 10 generally includes a rotating component 101, a chuck pin 10 body 102, and a positioning pin 103 protruding from the chuck pin 10 body 102. Both the rotating component 101 and the positioning pin 103 are connected to the chuck pin 10 body 102. The rotating component 101 drives the positioning pin 103 to rotate around the center of the chuck when the chuck rotates. To reduce the relative displacement between the chuck pin 10 and the chuck, the rotating component 101 may include a gear that engages with a pin hole on the chuck. The chuck pin 10 body 102 may include a tubular structure. The bottom of the positioning pin 103 is a column corresponding to the tubular structure. The bottom column of the positioning pin 103 engages with the chuck pin 10 body 102. When the chuck rotates, because the positioning pin 103 and the chuck pin 10 body 102 are movably connected, the positioning pin 103 can rotate around the center of the chuck while simultaneously rotating on its own axis, thereby achieving the function of fixing the wafer.

[0038] Please refer to Figure 1bAs described in the background section, due to the relative movement between the wafer and the locating pin 103, the clamping components in contact with the wafer are prone to wear. Excessively worn locating pins 103 can not only break, causing fragments, but also generate contaminants due to wear, affecting the device performance of the wafer. However, different processes and wafer types result in different degrees of wear on the locating pin 103. Furthermore, a particular machine may perform different processes or process different wafers within a certain period. Therefore, it is difficult to determine the wear condition of the locating pin 103 based on machine operating time or the number of wafers processed, and thus determine whether the chuck pin needs to be replaced. Typically, the wear condition of the chuck pin can only be determined by stopping the machine for inspection, making real-time and accurate monitoring impossible.

[0039] For the reasons mentioned above, please refer to Figure 2 This application provides a chuck pin detection device, which includes a first electrode plate 20, a second electrode plate 30, and a detection component 40; wherein the detection component 40 is electrically connected to the first electrode plate 20 and the second electrode plate 30 respectively.

[0040] The first electrode plate 20 is configured to contact the first surface of the chuck pin.

[0041] The second electrode plate 30 is configured to contact the second surface of the chuck pin and is grounded.

[0042] The first surface and the second surface are disposed opposite to each other. As an example, the first surface may include the top surface of the positioning pin 103, and the second surface may include the bottom surface of the rotating member 101; or the first surface is the top surface of the positioning pin 103, and the second surface is the bottom surface of the positioning pin 103.

[0043] As an example, the materials of the first electrode plate 20 and the second electrode plate 30 include, but are not limited to, graphite materials, metallic materials, and graphite-based composite materials or metal-based composite materials.

[0044] The detection component 40 is used to provide test voltages to the first electrode plate 20 and the second electrode plate 30 respectively, and to determine the defect detection result of the chuck pin based on the electrical signal between the first electrode plate 20 and the second electrode plate 30 under the action of the test voltage.

[0045] As an example, the electrical signal may include a current signal or a voltage signal. The defect detection result is the wear condition of the chuck pin. For example, when the chuck pin is made of a conductive material, the wear condition of the chuck pin can be determined by applying a certain test voltage to both ends of the chuck pin and obtaining the current signal between the first electrode 20 and the second electrode 30, based on the current signal.

[0046] In the above embodiments, by setting the first electrode plate 20 to contact the first surface of the chuck pin and the second electrode plate 30 to contact the second surface of the chuck pin, with the first and second surfaces facing each other, the electrical signal of the chuck pin can be obtained through the first electrode plate 20 and the second electrode plate 30. Then, by setting the detection component 40, the detection component 40 is electrically connected to both the first electrode plate 20 and the second electrode plate 30. The detection component 40 provides a test voltage to the first electrode plate 20 and the second electrode plate 30, and under the action of the test voltage, the defect detection result of the chuck pin is determined based on the electrical signal between the first electrode plate 20 and the second electrode plate 30. This achieves real-time monitoring of the wear condition of the chuck pin, so as to replace the chuck pin in a timely manner. Furthermore, this application obtains the wear condition of the chuck pin based on the electrical signal between the first electrode plate 20 and the second electrode plate 30, and the value of the electrical signal corresponds to the wear condition of the chuck pin, improving the accuracy of chuck pin monitoring. At the same time, it avoids downtime for inspection and maximizes the production efficiency of the machine.

[0047] In one embodiment, please refer to Figure 3 The detection device also includes a housing 50; wherein the housing 50 is spaced apart from the chuck pin.

[0048] As an example, a first groove 501 for accommodating the first electrode plate 20 is formed between the housing 50 and the first surface of the chuck pin, and a second groove 502 for accommodating the second electrode plate 30 is formed between the housing 50 and the second end of the chuck pin. Furthermore, the housing 50 has a receiving cavity in which the detection assembly 40 is disposed.

[0049] As an example, when a detection device is needed to detect the chuck pin, the first surface and the second end of the chuck pin can be placed into the first groove 501 and the second groove 502 respectively. The first groove 501 and the second groove 502 are engaged with the first surface and the second end of the chuck pin, as well as the first electrode plate 20 and the second electrode plate 30, thereby reducing the relative movement between the housing, the first electrode plate 20, the second electrode plate 30, and the chuck pin, and avoiding wear on the detection device.

[0050] As an example, the materials of the casing include, but are not limited to, wear-resistant and corrosion-resistant materials such as stainless steel, aluminum alloy, and engineering plastics.

[0051] For example, please refer to Figure 4a and Figure 4b When the first surface and second end of the chuck pin are circular, the shape of the groove 510 is also circular. This application does not impose specific limitations on the shape of the housing 50, and it can be designed according to actual needs.

[0052] In one embodiment, please refer to... Figure 3 The detection device also includes at least one first elastic element 601 and at least one second elastic element 602.

[0053] The first end of the first elastic member 601 is connected to the first electrode plate 20, and the second end of the first elastic member 601 is connected to the housing 50; the first end of the second elastic member 602 is connected to the second electrode plate 30, and the second end of the second elastic member 602 is connected to the housing 50.

[0054] As an example, the first elastic element 601 and the second elastic element 602 include, but are not limited to, leaf springs, torsion bar springs, gas springs, rubber springs, column springs, leaf springs, rubber pads, elastic supports, etc.

[0055] In the above embodiment, by providing a first elastic element 601 and a second elastic element 602, and connecting the elastic elements to the first electrode plate 20, the second electrode plate 30, and the housing 50 respectively, the first electrode plate 20 and the second electrode plate 30 are fixed. At the same time, when the chuck pin is engaged with the groove, the first elastic element 601 and the second elastic element 602 are in a compressed state, and the chuck pin is fixed due to the supporting force, further reducing the relative displacement between the chuck pin and the housing 50.

[0056] In one embodiment, the detection component includes a signal generation circuit and a signal detection circuit; wherein the signal generation circuit is connected to the first electrode plate, the second electrode plate, and the signal detection circuit.

[0057] The signal generation circuit is used to provide test voltage to the first and second plates.

[0058] The signal detection circuit is used to detect the electrical signal between the first and second plates under the action of the test voltage, and to determine the defect detection result based on the electrical signal.

[0059] For example, please refer to Figure 5 The signal generation circuit may include a current detector 401, a voltage detector 402, and a variable resistor 403. The first terminal of the current detector 401 is connected to the operating power supply 404; the second terminal of the current detector 401 is connected to both the first electrode 20 and the first terminal of the voltage detector 402; the third terminal of the current detector 401 is connected to the signal detection circuit; the second terminal of the voltage detector 402 is connected to both the second electrode 30 and the first terminal of the variable resistor 403; and the second terminal of the variable resistor 403 is connected to the operating power supply 404. Alternatively, the third terminal of the voltage detector 402 may also be connected to the signal detection circuit.

[0060] As an example, current detector 401 may include a current sensor, voltage detector 402 may include a voltage sensor, and variable resistor 403 may include a sliding resistor. This application does not impose specific limitations on the resistance value of the sliding resistor, as long as it enables current detector 401 and voltage detector 402 to monitor changes in the electrical signal.

[0061] As an example, in the case where the chuck pins include conductive chuck pins, according to the law of resistance:

[0062] R = ρL / S;

[0063] Where R is the resistance of the chuck pin, ρ is the resistivity of the material used to make the chuck pin, L is the length of the wire wound to make the chuck pin, and S is the cross-sectional area of ​​the wire wound to make the chuck pin.

[0064] When the chuck pin is worn, the cross-sectional area S of the conductor decreases, while the resistivity ρ and the conductor length L remain unchanged, and the resistance R of the chuck pin increases.

[0065] A fixed voltage signal is applied across the chuck pins as the test voltage U, and then Ohm's law is applied:

[0066] I=U / R;

[0067] Where U is the test voltage and I is the current flowing through the chuck pin;

[0068] When the chuck pin is worn, its resistance R increases, the test voltage U remains unchanged, and the current I decreases. If the detected current I is less than the first preset electrical signal, a defect in the chuck pin is determined, and the machine can be stopped to replace the chuck pin. The first preset electrical signal is a current value. This application does not impose specific limitations on the value of the first preset electrical signal; it can be set based on the resistance of the variable resistor 403, the resistance of the chuck pin when it is not worn, the resistance of the chuck pin when it is worn to the point of needing replacement, and the test voltage.

[0069] For example, please refer to Figure 6 The signal generation circuit may include: a sine wave generator 406, a comparator 407, a first capacitor C1, and a resistor R; wherein, the sine wave generator 406 is used to output a sine wave voltage signal, the output terminal of the sine wave generator 406 is connected to the first plate 20, the second plate 20 is connected to the inverting input terminal of the comparator 407, the first terminal of the first capacitor C1, and the first terminal of the resistor R respectively, the non-inverting input terminal of the comparator 407 is connected to the common ground terminal, and the second terminal of the first capacitor C1 is connected to the second terminal of the resistor R, the output terminal of the comparator 407, and the signal detection circuit respectively.

[0070] As an example, the signal generation circuit also includes: a second capacitor C2 and a third capacitor C3; wherein, the first end of the second capacitor C2 is connected to the output terminal of the sine wave generator 406, and the second end of the second capacitor C2 is connected to the common ground terminal; the first end of the third capacitor C3 is connected to the inverting input terminal of the comparator 407, and the second end of the third capacitor C3 is connected to the common ground terminal.

[0071] As an example, when the chuck pin is an insulated chuck pin, according to the capacitance calculation formula:

[0072] C = εS / d;

[0073] Where ε is the dielectric constant of the medium between the first and second plates, S is the area of ​​the first and second plates facing each other, d is the distance between the first and second plates, and C is the capacitance.

[0074] When the chuck pin is worn, air will get stuck in the middle of the worn chuck pin. The air reduces the dielectric constant ε between the first and second plates. The area S and the distance d remain unchanged, and the capacitance C decreases.

[0075] A sinusoidal voltage signal is applied across the two ends of the chuck pin as the test voltage U. i Based on the circuit structure of the signal generation circuit, the capacitance C between the first and second plates can be calculated as follows:

[0076] ;

[0077] Where C1 is the capacitance of the first capacitor C1, U o The voltage value at the output terminal of comparator 407. For U o rate of change For U i The rate of change;

[0078] When the chuck pins wear down, the capacitance C decreases, while the capacitance C1 of the first capacitor remains unchanged. i The rate of change remains constant, and the voltage U output by comparator 407 remains constant. o The rate of change decreases. When the voltage U output by comparator 407 is monitored... o When the rate of change is less than a preset rate of change, it can be determined that the voltage change delay between the first electrode 20 and the second electrode 30 is less than the second preset electrical signal, thus determining that the chuck pin has a defect. The second preset electrical signal is the voltage change rate. This application does not impose specific restrictions on the value of the second preset electrical signal; it can be set based on the capacitance value when the chuck pin is not worn, the capacitance value when the chuck pin is worn to the point of needing replacement, and the value of the test voltage.

[0079] In the above embodiments, by converting the wear condition of the chuck pin into an electrical signal, the degree of wear of the chuck pin can be determined directly based on the value of the electrical signal, thereby enhancing the accuracy of chuck pin detection. At the same time, the signal generation circuit in this application has a simple structure and is easy to repair and replace.

[0080] As an example, the signal detection circuit may include: a comparison unit, a signal amplifier, and an AC / DC converter; wherein the comparison unit is connected to the signal generation circuit and the signal amplifier, and the AC / DC converter is connected to the signal generation circuit.

[0081] The comparison unit is used to output a defect detection result when the electrical signal is less than a first preset electrical signal or a second preset electrical signal; wherein, the defect detection result may include an electrical level signal.

[0082] A signal amplifier is used to amplify the results of defect detection.

[0083] An AC-DC converter is used to convert an external AC power supply into a DC power supply.

[0084] In one embodiment, please refer to Figure 7 The detection component 40 also includes a first connection port, a second connection port, a power supply port, and an electrical signal input / output port; wherein, the first connection port is connected to the first electrode plate 20, the second connection port is connected to the second electrode plate 30, the power supply port is connected to an external power supply (not shown), and the electrical signal input / output port is connected to the machine controller (not shown).

[0085] The machine controller is used to input control signals to the detection component to control the detection component to start working and to receive defect detection results. As an example, the machine controller can control the detection component to start working by controlling the connection or disconnection with the external power supply through control signals.

[0086] In one embodiment, please refer to... Figure 7 and Figure 8 The housing 50 also includes a grounding pin 701, a signal input pin 702, a signal output pin 703, a positive power supply pin 704, and a negative power supply pin 705; wherein the grounding pin 701, the signal input / output pin, and the power supply pin are all located on the contact surface between the housing 50 and the chuck 80, and are connected to the ports in the detection component 40.

[0087] As an example, the chuck 80 includes a groove for accommodating the detection device 90, and the groove includes a slot that matches the pins. The detection device 90 is a detachable detection device, which can be installed by inserting the pins on the housing into the corresponding slots. When there is no need to test the chuck pin 10, the detection device 90 can be pulled out, which improves the flexibility of the test.

[0088] In one embodiment, this application also provides a single-chip microcomputer, including the chuck pin detection device of any one of the embodiments of this application.

[0089] As an example, a single-wafer equipment may include a cleaning equipment, an ion implantation equipment, a deposition equipment, etc. This application does not impose specific limitations on the type of equipment.

[0090] The aforementioned chuck pin detection device and single-chip microcomputer have the following unexpected and beneficial effects:

[0091] The chuck pin detection device and single-piece machine tool of this application, by setting a first electrode plate in contact with the first surface of the chuck pin and a second electrode plate in contact with the second surface of the chuck pin, with the first and second surfaces arranged opposite each other, can acquire the electrical signal of the chuck pin through the first and second electrode plates. Then, by setting a detection component, the detection component is electrically connected to both the first and second electrode plates. The detection component provides a test voltage to the first and second electrode plates, and under the action of the test voltage, the defect detection result of the chuck pin is determined based on the electrical signal between the first and second electrode plates. This enables real-time monitoring of the wear condition of the chuck pin, so as to replace the chuck pin in a timely manner. Furthermore, this application improves the accuracy of chuck pin monitoring by acquiring the wear condition of the chuck pin based on the electrical signal between the first and second electrode plates, while avoiding downtime for inspection and maximizing the production efficiency of the machine tool.

[0092] In the description of this specification, references to terms such as "some embodiments," "other embodiments," and "ideal embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0093] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0094] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A chuck pin detection device, characterized in that, The chuck pin includes a rotating component, a chuck pin body, and a positioning pin protruding from the chuck pin body. Both the rotating component and the positioning pin are connected to the chuck pin body. The rotating component drives the positioning pin to rotate, and the positioning pin clamps the wafer. The detection device includes: The first electrode plate is disposed in contact with the first surface of the chuck pin; The second electrode plate is disposed in contact with the second surface of the chuck pin and is grounded; wherein the first surface and the second surface are disposed opposite to each other; The detection component is electrically connected to the first electrode plate and the second electrode plate respectively, and is used to provide test voltages to the first electrode plate and the second electrode plate respectively, and to determine the defect detection result of the chuck pin based on the electrical signal between the first electrode plate and the second electrode plate under the action of the test voltage.

2. The chuck pin detection device according to claim 1, characterized in that, The detection component includes: A signal generation circuit is connected to both the first electrode plate and the second electrode plate, and is used to provide the test voltage to the first electrode plate and the second electrode plate; A signal detection circuit, connected to the signal generation circuit, is used to detect the electrical signal between the first electrode plate and the second electrode plate under the action of a test voltage, and to determine the defect detection result based on the electrical signal.

3. The chuck pin detection device according to claim 2, characterized in that, The signal generation circuit includes: a current detector, a voltage detector, and a variable resistor; wherein... The first end of the current detector is connected to the operating power supply, the second end of the current detector is connected to the first plate and the first end of the voltage detector, the third end of the current detector is connected to the signal detection circuit, the second end of the voltage detector is connected to the second plate and the first end of the variable resistor, and the second end of the variable resistor is connected to the operating power supply.

4. The chuck pin detection device according to claim 2, characterized in that, The signal generation circuit includes: a sine wave generator, a comparator, a first capacitor, and a resistor; wherein... The output terminal of the sine wave generator is connected to the first plate, the second plate is connected to the inverting input terminal of the comparator, the first terminal of the first capacitor, and the first terminal of the resistor, the non-inverting input terminal of the comparator is connected to the common ground terminal, and the second terminal of the first capacitor is connected to the second terminal of the resistor, the output terminal of the comparator, and the signal detection circuit.

5. The chuck pin detection device according to claim 4, characterized in that, The signal generation circuit further includes: The second capacitor has its first terminal connected to the output terminal of the sine wave generator and its second terminal connected to the common ground terminal. The third capacitor has its first terminal connected to the inverting input terminal of the comparator and its second terminal connected to the common ground terminal.

6. The chuck pin detection device according to claim 1, characterized in that, The detection device further includes: The housing has a receiving cavity in which the detection component is disposed; wherein the housing is spaced apart from the chuck pin, and a first groove for receiving the first electrode plate is formed between the housing and a first surface of the chuck pin, and a second groove for receiving the second electrode plate is formed between the housing and a second end of the chuck pin.

7. The chuck pin detection device according to claim 6, characterized in that, The detection device further includes: At least one first elastic element, a first end of the first elastic element being connected to the first electrode plate, and a second end of the first elastic element being connected to the housing; At least one second elastic element, the first end of the second elastic element being connected to the second electrode plate, and the second end of the second elastic element being connected to the housing.

8. The chuck pin detection device according to claim 1, characterized in that, The detection component further includes a first connection port, a second connection port, a power supply port, and an electrical signal input / output port; wherein, the first connection port is connected to the first electrode plate, the second connection port is connected to the second electrode plate, the power supply port is connected to an external power supply, and the electrical signal input / output port is connected to the machine tool controller; The machine controller is used to input control signals to the detection component to control the detection component to start working and to receive the defect detection results.

9. The chuck pin detection device according to claim 1, characterized in that, The chuck pin includes a conductive chuck pin or an insulated chuck pin; wherein... When the chuck pin is a conductive chuck pin, the test voltage is a fixed voltage signal, and the detection component is used to determine that the chuck pin is defective when the electrical signal is less than a first preset electrical signal. When the chuck pin is an insulated chuck pin, the test voltage is an AC voltage signal, and the detection component is used to determine that the chuck pin is defective when the electrical signal is less than a second preset electrical signal.

10. A single-chip microcomputer base, characterized in that, The device includes the chuck pin detection device according to any one of claims 1-9.

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