Compression-resistant chip capacitor

Abstract

The utility model belongs to the technical field of chip capacitors, and discloses a compression-resistant chip capacitor which comprises a chip capacitor body, pins are arranged on two sides of the chip capacitor body, a base plate is connected to the bottom of the chip capacitor body, openings are formed in two sides of the base plate, a compression-resistant assembly is arranged on the top of the base plate, and the compression-resistant assembly is connected with the chip capacitor body. The pressure-resistant assembly comprises supporting plates, the two supporting plates are symmetrically connected to the top of the base plate, and the tops of the two supporting plates are connected with a concave plate. According to the pressure-resistant assembly structure, when the upper portion of the chip capacitor body is pressed, grooves in the two sides of the bottom of the concave plate can press the supporting plates, so that the chip capacitor body is prevented from being damaged, and the service life of the chip capacitor body is prolonged; the concave plate and the supporting plate compress the rubber air cushion, so that the concave plate protects the chip capacitor body, the internal structure of the chip capacitor body is prevented from being damaged when the chip capacitor body is pressed, normal use of the chip capacitor body is facilitated, and the practicability of the chip capacitor body is improved.

Description

Technical Field

[0001] This utility model belongs to the field of surface mount capacitor technology, specifically relating to a voltage-resistant surface mount capacitor. Background Technology

[0002] Surface mount capacitors are made by stacking ceramic dielectric films with printed electrodes in a staggered manner, forming a ceramic chip through a one-time high-temperature sintering process, and then sealing the two ends of the chip with metal layers to form a monolithic structure.

[0003] Currently, surface mount capacitors lack protective measures due to their simple structure, making them susceptible to internal damage under pressure. This affects their normal operation and reduces their practicality. Furthermore, after prolonged use on the motherboard, the internal temperature of existing surface mount capacitors increases significantly, and it is difficult to dissipate the heat generated by them quickly, accelerating their aging and reducing their lifespan. Utility Model Content

[0004] The purpose of this invention is to provide a pressure-resistant surface mount capacitor to solve the problems of damage to the internal structure of existing surface mount capacitors under pressure and difficulty in quickly dissipating the heat generated by the surface mount capacitor.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a pressure-resistant surface mount capacitor, comprising: a surface mount capacitor body, pins on both sides of the surface mount capacitor body, a pad connected to the bottom of the surface mount capacitor body, openings on both sides of the pad, and a pressure-resistant component on the top of the pad, the pressure-resistant component comprising support plates, two support plates symmetrically connected to the top of the pad, the outer walls of the pins penetrating through the support plates, concave plates connected to the top of the two support plates, grooves on both sides of the bottom of the concave plates, one end of the support plate extending into the interior of the groove, and a rubber air cushion connected between one end of the support plate and one side of the inner wall of the groove.

[0006] Preferably, a heat dissipation assembly is provided on the top of the surface mount capacitor body. The heat dissipation assembly includes a heat-conducting plate, which is disposed on the top of the surface mount capacitor body. A plurality of heat-conducting aluminum sheets are uniformly connected to the top of the heat-conducting plate. A metal shell is provided on the top of the heat-conducting plate, and one end of each of the plurality of heat-conducting aluminum sheets is connected to one side of the inner wall of the metal shell.

[0007] Preferably, the bottom of the pad is provided with a rubber pad, and the bottom of the rubber pad is provided with raised texture.

[0008] Preferably, a through groove is provided in the center of the top of the concave plate, and a protective net is provided inside the through groove.

[0009] Preferably, the top of the metal casing has multiple heat dissipation holes.

[0010] Preferably, thermal grease is provided between the heat-conducting plate and the chip capacitor body.

[0011] Compared with the prior art, this utility model has the following advantages:

[0012] (1) By setting up an anti-pressure component, when the top of the chip capacitor body is subjected to pressure, the grooves on both sides of the bottom of the concave plate will press the support plate, so that the concave plate and the support plate compress the rubber air cushion, thereby protecting the chip capacitor body from damage to its internal structure when subjected to pressure. This is beneficial to the normal use of the chip capacitor body and improves its practicality.

[0013] (2) By setting up a heat dissipation component, when it is necessary to dissipate heat from the surface mount capacitor body, the heat is absorbed by the heat-conducting plate, and then the heat is conducted to the heat-conducting aluminum sheet. Then, the high-temperature gas can be quickly discharged through the gap between the metal shell and the heat-conducting aluminum sheet, thereby realizing the rapid heat dissipation of the surface mount capacitor, reducing the aging speed of the surface mount capacitor, and increasing the service life of the surface mount capacitor. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model;

[0015] Figure 2 This is a top view of the present invention;

[0016] Figure 3 This is the left view of the present invention;

[0017] In the diagram: 1. Surface mount capacitor body; 2. Leads; 3. Pad; 4. Opening; 5. Support plate; 6. Concave plate; 7. Groove; 8. Rubber air cushion; 9. Through slot; 10. Protective mesh; 11. Rubber pad; 12. Embossing; 13. Heat-conducting plate; 14. Heat-conducting aluminum sheet; 15. Metal casing; 16. Heat dissipation holes; 17. Thermal grease. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Reference Figures 1-3 As shown, this utility model provides the following technical solution: a pressure-resistant surface mount capacitor, comprising: a surface mount capacitor body 1, pins 2 on both sides of the surface mount capacitor body 1, a pad 3 connected to the bottom of the surface mount capacitor body 1, openings 4 on both sides of the pad 3, and a pressure-resistant component on the top of the pad 3, the pressure-resistant component comprising support plates 5, two support plates 5 symmetrically connected to the top of the pad 3, the outer wall of the pins 2 penetrating through the support plates 5, a concave plate 6 connected to the top of the two support plates 5, grooves 7 on both sides of the bottom of the concave plate 6, one end of the support plate 5 extending into the interior of the groove 7, and a rubber air cushion 8 connected between one end of the support plate 5 and one side of the inner wall of the groove 7.

[0020] Through the above technical solution:

[0021] Specifically, when pressure is applied to the top of the chip capacitor body 1, the grooves 7 on both sides of the bottom of the concave plate 6 will press the support plate 5, causing the concave plate 6 and the support plate 5 to compress the rubber air cushion 8, thereby protecting the chip capacitor body 1 from the concave plate 6.

[0022] Further embodiments are provided in this utility model, see below. Figure 1 A heat dissipation assembly is provided on the top of the surface mount capacitor body 1. The heat dissipation assembly includes a heat conduction plate 13. The heat conduction plate 13 is disposed on the top of the surface mount capacitor body 1, and a plurality of heat conduction aluminum sheets 14 are uniformly connected to the top of the heat conduction plate 13. A metal shell 15 is disposed on the top of the heat conduction plate 13, and one end of each of the plurality of heat conduction aluminum sheets 14 is connected to one side of the inner wall of the metal shell 15.

[0023] Through the above technical solution:

[0024] Specifically, when heat dissipation is required for the surface mount capacitor body 1, the heat is absorbed by the heat-conducting plate 13, and then the heat is conducted to the heat-conducting aluminum sheet 14. The high-temperature gas can then be quickly discharged through the gap between the metal casing 15 and the heat-conducting aluminum sheet 14.

[0025] Reference Figures 1-2 The bottom of the pad 3 is provided with a rubber pad 11, the bottom of the rubber pad 11 is provided with a raised texture 12, the top of the concave plate 6 is provided with a through groove 9, the inside of the through groove 9 is provided with a protective mesh 10, the top of the metal shell 15 is provided with multiple heat dissipation holes 16, and thermal grease 17 is provided between the heat conduction plate 13 and the chip capacitor body 1.

[0026] Through the above technical solution:

[0027] Specifically, by setting the ridges 12 on the bottom of the rubber pad 11, the chip capacitor body 1 is prevented from shifting during installation. By setting the protective mesh 19, the airflow speed above the chip capacitor body 1 can be improved. By setting the heat dissipation holes 16, the heat dissipation efficiency of the heat dissipation component is increased. By setting the thermal grease 17, the heat conduction speed of the heat conduction plate 13 is increased.

[0028] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A voltage-resistant surface mount capacitor, characterized in that, include: A surface mount capacitor body (1) is provided with pins (2) on both sides. A pad (3) is connected to the bottom of the surface mount capacitor body (1). An opening (4) is provided on both sides of the pad (3). An anti-pressure component is provided on the top of the pad (3). The anti-pressure component includes a support plate (5). Two support plates (5) are symmetrically connected to the top of the pad (3). The outer wall of the pin (2) passes through the support plate (5). A concave plate (6) is connected to the top of the two support plates (5). A groove (7) is provided on both sides of the bottom of the concave plate (6). One end of the support plate (5) extends into the interior of the groove (7). A rubber air cushion (8) is connected between one end of the support plate (5) and one side of the inner wall of the groove (7).

2. The voltage-resistant surface mount capacitor according to claim 1, characterized in that: The top of the chip capacitor body (1) is provided with a heat dissipation assembly, which includes a heat-conducting plate (13). The heat-conducting plate (13) is disposed on the top of the chip capacitor body (1), and a plurality of heat-conducting aluminum sheets (14) are uniformly connected to the top of the heat-conducting plate (13). A metal shell (15) is disposed on the top of the heat-conducting plate (13), and one end of each of the plurality of heat-conducting aluminum sheets (14) is connected to one side of the inner wall of the metal shell (15).

3. The voltage-resistant surface mount capacitor according to claim 1, characterized in that: The bottom of the pad (3) is provided with a rubber pad (11), and the bottom of the rubber pad (11) is provided with ridges (12).

4. A voltage-resistant surface mount capacitor according to claim 1, characterized in that: The concave plate (6) has a through groove (9) in the center of its top, and a protective net (10) is provided inside the through groove (9).

5. A voltage-resistant surface mount capacitor according to claim 2, characterized in that: The top of the metal casing (15) has multiple heat dissipation holes (16).

6. A voltage-resistant surface mount capacitor according to claim 2, characterized in that: Thermal grease (17) is provided between the heat-conducting plate (13) and the chip capacitor body (1).

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