Rotary lifting silicon wafer eutectic table mechanism

Abstract

The utility model relates to the field of silicon wafer surface mounting, in particular to a rotary lifting silicon wafer eutectic table mechanism, which comprises a mounting platform and a working platform, a lifting mechanism is arranged on the mounting platform, and a rotating mechanism is arranged on one side of the mounting platform; the rotating mechanism comprises a supporting seat and a first driving assembly, and the supporting seat is rotationally arranged on the mounting platform; a detection strip is arranged on the outer wall surface of the supporting seat; a sensor is arranged on the first driving assembly; the loading platform comprises a disc and a lifting bottom plate, the disc is fixed on the supporting seat, and the top of the disc is used for adsorbing a silicon wafer; the lifting bottom plate is arranged on the mounting platform; the lifting mechanism comprises a guide shaft and a second driving assembly, the guide shaft is arranged on the lifting bottom plate and is in sliding fit with the lifting bottom plate, the other end of the guide shaft is fixed to the bottom of the disc, and the second driving assembly is fixed to the side edge of the mounting platform and is in linkage fit with the mounting platform. The utility model has the advantages that the operation steps are simplified, and the production efficiency and the yield are improved.

Description

Technical Field

[0001] This utility model relates to a crystal stage mechanism, and more particularly to a rotating and lifting silicon wafer eutectic stage mechanism. Background Technology

[0002] In the current semiconductor industry, due to the low level of automation in the chip placement mechanism, a large amount of manual labor is still required to manually adjust the chip position and angle during the placement process. This is cumbersome and affects production progress and yield. Utility Model Content

[0003] This utility model provides a rotating and lifting silicon wafer eutectic stage mechanism, which solves the technical problems of cumbersome operation, low production efficiency, and low yield. The following technical solution is provided:

[0004] A rotating and lifting silicon wafer eutectic stage mechanism includes an installation platform and a working platform. The installation platform is provided with a lifting mechanism for driving the working platform to move in the longitudinal direction, and a rotating mechanism for driving the working platform to rotate is provided on one side of the installation platform. The working platform rotates about the axis of the working platform.

[0005] The rotating mechanism includes a support base and a first driving assembly. The support base is rotatably disposed on the top of the mounting platform and is hollow. The first driving assembly is used to drive the support base to rotate. A detection strip is provided on the outer wall surface of the support base, and the detection strip is arranged along the radial direction of the support base. A sensor for detecting the detection strip is provided on the first driving assembly.

[0006] The installation platform includes a disc and a lifting base plate. The disc is fixedly installed on the support base. A first through hole is provided in the center of the disc. The first through hole is connected to an air pipe rotary joint. The other end of the air pipe rotary joint is connected to a high-speed rotary joint. The high-speed rotary joint is located in the hollow part of the support base, so that the top of the disc is used to adsorb silicon wafers. The lifting base plate is ring-shaped and sleeved on the top of the installation platform corresponding to the support base.

[0007] The lifting mechanism includes a guide shaft and a second drive assembly. One end of the guide shaft is disposed on the lifting base plate, and the guide shaft and the lifting base plate are in a sliding engagement. The other end of the guide shaft is fixedly disposed on the bottom of the disc. The second drive assembly is fixedly installed on the side of the installation platform, and the second drive assembly and the lifting base plate are in a linkage engagement.

[0008] By adopting the above technical solution and setting up a rotating mechanism, when it is necessary to adjust the position and angle of chip mounting, there is no need for manual adjustment. Instead, the first driving component drives the support to rotate, and when the support drives the working platform to rotate, the position of the chip can be adjusted, simplifying the operation steps. Furthermore, the rotation angle of the working platform can be determined by a sensor, thereby achieving precise adjustment of the silicon wafer's rotation angle, which accelerates production efficiency and improves the yield of finished products.

[0009] Furthermore, a plurality of lifting supports are provided between the disc and the lifting base plate, and one end of each lifting support is fixedly mounted on the lifting base plate; a plurality of second through holes are provided on the disc, and the plurality of second through holes are sequentially arranged corresponding to the lifting supports; the other end of each lifting support is slidably disposed in the second through hole; and a suction cup is fixedly provided at the end of each lifting support near the disc.

[0010] With the above technical solution, by setting up the lifting pillar and suction cup, after the silicon wafer is mounted, the second drive mechanism drives the lifting base plate to move upward. During this process, the lifting pillar, which moves upward synchronously, drives the suction cup to move upward. The suction cup inside the disk is pushed out, and the pushed-out suction cup pushes the silicon wafer, causing the silicon wafer to leave the top of the disk. This allows for easy handling of the completed silicon wafer without damaging the chip structure on the silicon wafer, thereby accelerating the production process and improving the yield of finished products.

[0011] Furthermore, a compression spring is sleeved on the guide shaft between the disc and the lifting base plate. When the lifting mechanism drives the mounting platform to move upward, the compression spring is in a compressed state.

[0012] Through the above technical solution, by setting the compression spring, when the second drive component drives the mounting platform to move upward and the silicon wafer is detached from the disk, the compression spring plays a buffering role in the rise of the disk, thereby ensuring the integrity of the silicon wafer and improving the yield of finished products; when the silicon wafer is removed, the spring rebound drives the mounting platform to return to its original position. The structure is simple and can reduce cost input.

[0013] Furthermore, an air pipe connector is provided at one end of the installation platform away from the support base, and the air pipe connector is connected to the high-speed rotary joint through a pipe; the air pipe connector is fixed to the top of the installation platform by a fastener; a first notch is provided on the outer periphery of the air pipe connector; both ends of the fastener are fixedly installed on the top of the installation platform, and the middle part of the fastener is fitted onto the first notch.

[0014] By using the above technical solution and the setting of the first notch, the installation stability of the air pipe connector can be effectively guaranteed when the fastener is fixing the air pipe connector, thereby reducing the frequency of air pipe connector maintenance and thus reducing costs.

[0015] Furthermore, a strip-shaped notch is provided on the mounting platform on one side of the fixing member, and the strip-shaped notch is provided along the length direction of the mounting platform. The other end of the strip-shaped notch extends to the mounting platform corresponding to the hollow part of the support base. Limiting pieces are respectively provided on both sides of the end of the strip-shaped notch away from the fixing member, and each limiting piece extends toward the direction of the disc.

[0016] Through the above technical solution, by setting the strip notch and the limiting piece, the pipe used to connect the air pipe joint and the high-speed rotary joint can be set along the strip notch, and the limiting piece can limit the pipe. This can effectively limit the setting position of the pipe, thereby ensuring the stability of the pipe and reducing maintenance costs.

[0017] Furthermore, the first drive component includes a rotary reducer and a motor that are linked together, and the output shaft of the rotary reducer and the support base are linked together; a second notch is provided at the bottom of one end of the mounting platform near the support base, and the rotary reducer is fixedly installed at the bottom of the mounting platform corresponding to the second notch.

[0018] Furthermore, an installation plate is fixedly installed on the installation platform corresponding to the lower part of the lifting base plate. The second drive component includes a cylinder, which is installed on the side wall of the installation plate away from the installation platform. The output shaft of the cylinder is fixedly provided with a support plate, and the top of the support plate is fixedly installed on the bottom of the lifting base plate.

[0019] In summary, the beneficial effects of this application are as follows:

[0020] 1. By setting up a rotating mechanism, when it is necessary to adjust the position and angle of chip mounting, there is no need to manually adjust it. Instead, the first drive component drives the support to rotate. When the support drives the work platform to rotate, the position of the chip can be adjusted, simplifying the operation steps. Moreover, the rotation angle of the work platform can be determined by the sensor, thereby achieving precise adjustment of the rotation angle of the silicon wafer, thereby accelerating production efficiency and improving the yield of finished products.

[0021] 2. By setting up the lifting pillar and suction cup, after the silicon wafer is mounted, the second drive mechanism drives the lifting base plate to move upward. During this process, the lifting pillar moves upward synchronously, which drives the suction cup to move upward. The suction cup inside the disk is pushed out, and the pushed-out suction cup pushes the silicon wafer, causing the silicon wafer to leave the top of the disk. This allows for easy handling of the finished silicon wafer without damaging the chip structure on the silicon wafer, thereby speeding up the production process and improving the yield of finished products.

[0022] 3. By using a compression spring, when the second drive assembly drives the mounting platform upward to remove the silicon wafer from the disk, the compression spring acts as a buffer for the disk's ascent, thus ensuring the integrity of the silicon wafer and improving the yield of the finished product. After the silicon wafer is removed, the spring's rebound causes the mounting platform to return to its original position. The structure is simple and can reduce costs.

[0023] 4. By setting the first notch, the installation stability of the air pipe connector can be effectively ensured when the fastener fixes the air pipe connector, thereby reducing the frequency of air pipe connector maintenance and thus reducing costs.

[0024] 5. By using the strip-shaped notch and the limiting piece, the pipe used to connect the air pipe joint and the high-speed rotary joint can be set along the strip-shaped notch, and the limiting piece can limit the pipe. This can effectively limit the setting position of the pipe, thereby ensuring the stability of the pipe and reducing maintenance costs. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of a rotating and lifting silicon wafer eutectic stage mechanism;

[0026] Figure 2 This is a schematic diagram of a rotating and lifting silicon wafer eutectic stage mechanism on which a silicon wafer is adsorbed.

[0027] Figure 3 This is a schematic diagram of the rotating mechanism in a rotating and lifting silicon wafer eutectic stage mechanism.

[0028] Figure 4 This is a schematic diagram of the mounting platform in a rotating and lifting silicon wafer eutectic stage mechanism.

[0029] Figure 5 This is a top view of the mounting platform in a rotating and lifting silicon wafer eutectic stage mechanism.

[0030] Figure 6 for Figure 5 A cross-sectional view from the perspective of the middle BB (Black-White) section;

[0031] Figure 7 An exploded view of the mounting platform and air pipe connector in a rotating and lifting silicon wafer eutectic stage mechanism;

[0032] Figure 8 for Figure 6 A magnified view of part number P in the middle;

[0033] In the diagram: 1. Mounting platform; 2. Support base; 3. First drive assembly; 301. Angle reducer; 302. Motor; 4. Detection strip; 5. Sensor; 6. Disc; 7. Lifting base plate; 8. First through hole; 9. Air pipe rotary joint; 10. High-speed rotary joint; 11. Guide shaft; 12. Second drive assembly; 13. Lifting support column; 14. Second through hole; 15. Suction cup; 16. Compression spring; 17. Air pipe joint; 18. Fixing component; 19. First notch; 20. Strip notch; 21. Limiting piece; 22. Second notch; 23. Mounting plate; 24. Support plate. Detailed Implementation

[0034] The present application will be further described in detail below with reference to the accompanying drawings.

[0035] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0036] In a specific embodiment, refer to Figure 1-8 A rotating lifting silicon wafer eutectic stage mechanism includes a mounting platform 1 and a working platform. The mounting platform 1 is provided with a lifting mechanism for driving the working platform to move in the longitudinal direction. A rotating mechanism for driving the working platform to rotate is provided on one side of the mounting platform 1, and the working platform rotates around the axis of the working platform.

[0037] The rotating mechanism includes a support base 2 and a first drive assembly 3. The support base 2 is rotatably mounted on the top of the mounting platform 1 and is hollow. The first drive assembly 3 is used to drive the support base 2 to rotate. A detection strip 4 is provided on the outer wall of the support base 2. The detection strip 4 is arranged along the radial direction of the support base 2. A sensor 5 for detecting the detection strip 4 is provided on the first drive assembly 3.

[0038] The mounting platform 1 includes a disc 6 and a lifting base plate 7. The disc 6 is fixedly mounted on the support base 2. The center of the disc 6 is provided with a first through hole 8, which is connected to an air pipe rotary joint 9. The other end of the air pipe rotary joint 9 is connected to a high-speed rotary joint 10. The high-speed rotary joint 10 is located in the hollow part of the support base 2, so that the top of the disc 6 is used to adsorb silicon wafers. The lifting base plate 7 is ring-shaped and sleeved on the top of the mounting platform 1 corresponding to the support base 2.

[0039] The lifting mechanism includes a guide shaft 11 and a second drive assembly 12. One end of the guide shaft 11 is mounted on the lifting base plate 7, and the guide shaft 11 and the lifting base plate 7 are in a sliding engagement. The other end of the guide shaft 11 is fixedly mounted on the bottom of the disc 6. The second drive assembly 12 is fixedly mounted on the side of the mounting platform 1, and the second drive assembly 12 and the lifting base plate 7 are in a linkage engagement.

[0040] When it is necessary to adjust the position and angle of chip mounting, there is no need for manual adjustment. Instead, the first drive component 3 drives the support base 2 to rotate. When the support base 2 drives the work platform to rotate, the position of the chip can be adjusted, simplifying the operation steps. Furthermore, the rotation angle of the work platform can be determined by the sensor 5, thereby achieving precise adjustment of the rotation angle of the silicon wafer, which speeds up production efficiency and improves the yield of finished products.

[0041] like Figure 7 As shown, in this specific embodiment, the installation platform 1 is the installation plate 23, which is installed on the operating platform during use.

[0042] like Figure 4 , Figure 6 and Figure 8 As shown, multiple lifting pillars 13 are arranged between the disc 6 and the lifting base plate 7. One end of each lifting pillar 13 is fixedly installed on the lifting base plate 7. Multiple second through holes 14 are provided on the disc 6, and the multiple second through holes 14 are sequentially arranged corresponding to the lifting pillars 13. The other end of each lifting pillar 13 is slidably arranged in the second through hole 14. A suction cup 15 is fixedly installed at the end of each lifting pillar 13 near the disc 6. After the silicon wafer is mounted, the second drive mechanism drives the lifting base plate 7 to move upward. During this process, the lifting pillars 13 that move upward synchronously drive the suction cups 15 to move upward. The suction cups 15 in the disc 6 are pushed out. The pushed-out suction cups 15 push the silicon wafer, causing the silicon wafer to leave the top of the disc 6. This allows for easy handling of the finished silicon wafer without damaging the chip structure on the silicon wafer, thereby accelerating the production process and improving the yield of finished products.

[0043] like Figure 4 and Figure 6 As shown, a compression spring 16 is sleeved on the guide shaft 11 between the disc 6 and the lifting base plate 7. When the lifting mechanism drives the mounting platform 1 to move upward, the compression spring 16 is in a compressed state. When the second drive assembly 12 drives the mounting platform 1 to move upward, causing the silicon wafer to detach from the disc 6, the compression spring 16 acts as a buffer for the rise of the disc 6, thereby ensuring the integrity of the silicon wafer and improving the yield of the finished product. After the silicon wafer is removed, the spring 16 returns the mounting platform 1 to its original position. The structure is simple and can reduce cost.

[0044] like Figure 4 and Figure 6 As shown, an air pipe connector 17 is provided at one end of the installation platform 1 away from the support base 2. The air pipe connector 17 is connected to the high-speed rotary joint 10 through a pipe. The air pipe connector 17 is fixed to the top of the installation platform 1 by a fastener 18. A first notch 19 is provided on the outer periphery of the air pipe connector 17. Both ends of the fastener 18 are fixedly installed on the top of the installation platform 1, and the middle part of the fastener 18 is fitted onto the first notch 19. When the fastener 18 fixes the air pipe connector 17, the first notch 19 can effectively ensure the installation stability of the air pipe connector 17, thereby reducing the frequency of maintenance of the air pipe connector 17 and thus reducing costs.

[0045] like Figure 3 As shown, a strip-shaped notch 20 is provided on the mounting platform 1 on one side of the fixing member 18, and the strip-shaped notch 20 is provided along the length direction of the mounting platform 1. The other end of the strip-shaped notch 20 extends to the mounting platform 1 below the hollow part of the support base 2. Limiting pieces 21 are provided on both sides of the end of the strip-shaped notch 20 away from the fixing member 18, and each limiting piece 21 extends towards the disk 6. The pipe used to connect the air pipe connector 17 and the high-speed rotary connector 10 can be set along the strip-shaped notch 20 and the pipe can be limited by the limiting piece 21. This can effectively limit the setting position of the pipe, thereby ensuring the stability of the pipe and reducing maintenance costs. In this specific embodiment, there is a "U"-shaped plate. The two vertical sections of the "U"-shaped plate are limiting pieces 21. There are two third through holes on the mounting platform 1. The two limiting pieces 21 pass through the third through holes and are connected to the horizontal section of the "U"-shaped plate. The horizontal section of the "U"-shaped plate is located at the bottom of the mounting platform 1.

[0046] like Figure 2-3 and Figure 7 As shown, the first drive assembly 3 includes a rotary reducer 301 and a motor 302 that are linked together. The output shaft of the rotary reducer 301 and the support base 2 are linked together. A second notch 22 is provided at the bottom of the end of the mounting platform 1 near the support base 2. The rotary reducer 301 is fixedly installed at the bottom of the mounting platform 1 corresponding to the second notch 22. The rotary reducer 301 is used to change the transmission direction of the motor 302. The specific structure and installation method of the rotary reducer 301 are all existing technologies and will not be described in detail here. It is sufficient to select a model that can turn the horizontal rotation of the motor 302 into vertical rotation.

[0047] like Figure 1-2As shown, an installation plate 23 is fixedly installed on the installation platform 1 corresponding to the lower part of the lifting base plate 7. The second drive assembly 12 includes a cylinder, which is installed on the side wall of the installation plate 23 away from the installation platform 1. The output shaft of the cylinder is fixedly provided with a support plate 24, and the top of the support plate 24 is fixedly installed on the bottom of the lifting base plate 7. In this specific embodiment, two second drive assemblies 12 with identical structures are provided. The two support plates 24 are respectively set on both sides of the installation platform 1 and are set along both ends of the diameter of the disc 6. The end of each support plate 24 away from the lifting base plate 7 is inclined.

[0048] Working principle: The silicon wafer is placed on top of the disc 6, which firmly holds the wafer in place for processing. When the angle of the wafer needs to be adjusted, the cylinder is activated to lower the disc 6. The cylinder stops when it reaches the lowest position it can move the lifting base plate 7. At this lowest position, the disc 6 remains rotatable.

[0049] After the second drive component 12 is started, it drives the support base 2 to rotate. The support base 2 drives the work platform to rotate synchronously. At this time, because the disc 6 is equipped with a high-speed rotary joint 10, the disc 6 will not be affected by the air pipe. At this time, the position of the detection strip 4 can be detected by the sensor 5 to accurately control the angle of the silicon wafer on the disc 6.

[0050] When it is necessary to load or unload silicon wafers, the second drive assembly 12 is in a non-working state, and the disk 6 stops adsorbing silicon wafers. At this time, the control cylinder extends upward to the highest point, thereby causing the disk 6 to move upward. During the upward movement of the disk 6, the lifting column 13 pushes the suction cup 15 to extend out from the second through hole 14 of the disk 6, thereby pushing the silicon wafer out and detaching it from the top of the disk 6. At this time, the silicon wafer can be placed on the disk 6 or removed from the disk 6.

[0051] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0052] The present invention has been described above with reference to specific embodiments. However, those skilled in the art should understand that these descriptions are exemplary and not intended to limit the scope of protection of the present invention. Those skilled in the art can make various modifications and variations to the present invention based on its spirit and principles, and these modifications and variations are also within the scope of the present invention.

Claims

1. A rotating and lifting silicon wafer eutectic stage mechanism, comprising a mounting platform and a working platform, characterized in that, The installation platform is provided with a lifting mechanism for driving the working platform to move in the longitudinal direction, and a rotating mechanism is provided on one side of the installation platform for driving the working platform to rotate, and the working platform rotates about the axis of the working platform. The rotating mechanism includes a support base and a first driving assembly. The support base is rotatably disposed on the top of the mounting platform and is hollow. The first driving assembly is used to drive the support base to rotate. A detection strip is provided on the outer wall surface of the support base, and the detection strip is arranged along the radial direction of the support base. A sensor for detecting the detection strip is provided on the first driving assembly. The installation platform includes a disc and a lifting base plate. The disc is fixedly installed on the support base. A first through hole is provided in the center of the disc. The first through hole is connected to an air pipe rotary joint. The other end of the air pipe rotary joint is connected to a high-speed rotary joint. The high-speed rotary joint is located in the hollow part of the support base, so that the top of the disc is used to adsorb silicon wafers. The lifting base plate is ring-shaped and sleeved on the top of the installation platform corresponding to the support base. The lifting mechanism includes a guide shaft and a second drive assembly. One end of the guide shaft is disposed on the lifting base plate, and the guide shaft and the lifting base plate are in a sliding engagement. The other end of the guide shaft is fixedly disposed on the bottom of the disc. The second drive assembly is fixedly installed on the side of the installation platform, and the second drive assembly and the lifting base plate are in a linkage engagement.

2. The rotating and lifting silicon wafer eutectic stage mechanism according to claim 1, characterized in that, Multiple lifting supports are provided between the disc and the lifting base plate, and one end of each lifting support is fixedly installed on the lifting base plate; multiple second through holes are provided on the disc, and the multiple second through holes are sequentially arranged corresponding to the lifting supports; the other end of each lifting support is slidably arranged in the second through hole; and a suction cup is fixedly provided at the end of each lifting support near the disc.

3. The rotating and lifting silicon wafer eutectic stage mechanism according to claim 1, characterized in that, A compression spring is fitted on the guide shaft between the disc and the lifting base plate. When the lifting mechanism drives the installation platform to move upward, the compression spring is in a compressed state.

4. The rotating and lifting silicon wafer eutectic stage mechanism according to claim 1, characterized in that, An air pipe connector is provided at one end of the installation platform away from the support base. The air pipe connector is connected to the high-speed rotary joint through a pipe. The air pipe connector is fixed to the top of the installation platform by a fastener. A first notch is provided on the outer periphery of the air pipe connector. Both ends of the fastener are fixedly installed on the top of the installation platform, and the middle part of the fastener is fitted onto the first notch.

5. The rotating and lifting silicon wafer eutectic stage mechanism according to claim 4, characterized in that, A strip-shaped notch is provided on the mounting platform on one side of the fastener, and the strip-shaped notch is provided along the length direction of the mounting platform. The other end of the strip-shaped notch extends to the mounting platform corresponding to the hollow part of the support base. Limiting pieces are provided on both sides of the end of the strip-shaped notch away from the fastener, and each limiting piece extends toward the disk.

6. The rotating and lifting silicon wafer eutectic stage mechanism according to claim 1, characterized in that, The first drive assembly includes a rotary reducer and a motor that are linked together. The output shaft of the rotary reducer and the support base are linked together. A second notch is provided at the bottom of one end of the mounting platform near the support base. The rotary reducer is fixedly installed at the bottom of the mounting platform corresponding to the second notch.

7. The rotating and lifting silicon wafer eutectic stage mechanism according to claim 1, characterized in that, An installation plate is fixedly installed on the installation platform corresponding to the lower part of the lifting base plate. The second drive component includes a cylinder, which is installed on the side wall of the installation plate away from the installation platform. The output shaft of the cylinder is fixedly provided with a support plate, and the top of the support plate is fixedly installed on the bottom of the lifting base plate.

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