Bernoulli chuck for grabbing wafer

Abstract

The utility model discloses a Bernoulli sucker for wafer grabbing, which comprises a fixed seat, the outer side of the fixed seat is fixedly connected with a plurality of uniformly distributed mounting seats, the lower end of the fixed seat is in contact with a plurality of sucker bodies, the fixed seat is internally provided with a sliding chute, the interior of the sliding chute is slidably connected with a plurality of sliding blocks, and the sliding blocks are arranged in the sliding chute. The outer side of the sliding block is fixedly connected with a sliding base, and the sliding base is slidably connected with the fixing base. According to the wafer grabbing device, by designing the effect of the multiple suction cup bodies, multiple wafers can be grabbed at the same time in the wafer grabbing process, the grabbing efficiency is higher, the relative positions of the sliding base and the fixed base can be fixed through insertion connection of the balls and the grooves, and therefore the wafer grabbing efficiency is improved. When the suction cup body is pushed to move in the horizontal direction, the balls can be matched with the grooves in different positions in an inserted mode, then the relative positions of the suction cup body and the fixing base can be adjusted and fixed, and the using position of the suction cup body can be adjusted conveniently and flexibly.

Description

Technical Field

[0001] This utility model relates to the field of Bernoulli chuck technology, specifically a Bernoulli chuck for wafer gripping. Background Technology

[0002] Wafers are essential materials in semiconductor manufacturing, typically circular sheets made of single-crystal materials such as silicon. They play a crucial role in integrated circuits, optoelectronic devices, and are one of the fundamental materials for manufacturing chips and devices. During wafer fabrication, Bernoulli chucks are commonly used to grip the wafers. A Bernoulli chuck is a device that uses Bernoulli's principle to generate negative pressure, used to pick up thin objects on flat surfaces, such as paper and plastic films.

[0003] Utility model patent CN221102044U discloses a Bernoulli chuck assembly, including a mounting base, two Bernoulli chucks disposed at the bottom of both ends of the mounting base, and two limiting cylinders. The Bernoulli chucks are correspondingly disposed inside the limiting cylinders, and each limiting cylinder has a first limiting surface on its inner side. This utility model provides a Bernoulli chuck assembly that can stably limit the movement of semiconductor wafers laterally and upwards, preventing damage to the semiconductor wafers during the adsorption process by the Bernoulli chucks, improving the finished product quality of the semiconductor wafers, and reducing the defect rate.

[0004] In existing technologies, the use of Bernoulli suction cups is inconvenient in practical applications, as it makes it difficult to adjust the position of the suction cups and to combine any number of them in a single operation. Therefore, improvements are needed. Utility Model Content

[0005] The purpose of this invention is to provide a Bernoulli chuck for wafer gripping, which solves the problem of inconvenience in adjusting the position of the Bernoulli chuck, and also solves the problem of inconvenience in combining any number of Bernoulli chucks.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a Bernoulli chuck for wafer gripping, comprising a fixed base, a plurality of uniformly distributed mounting seats fixedly connected to the outer side of the fixed base, a plurality of chuck bodies contacting the lower end of the fixed base, a sliding groove provided inside the fixed base, a plurality of sliders slidably connected inside the sliding groove, a sliding seat fixedly connected to the outer side of the sliders, the sliding seat slidably connected to the fixed base, a hinge seat fixedly connected to the top of the fixed base, a hinge rod hinged inside the hinge seat, a blocking block fixedly connected to the outer side of the hinge rod, the blocking block contacting the fixed base, an adjustment mechanism provided on the sliding seat, and a sealing mechanism provided on the blocking block.

[0007] Preferably, the adjusting mechanism includes a groove, the fixed base has a groove inside, a ball is movably sleeved inside the groove, the ball is movably connected to the slide, a support block is movably sleeved outside the ball, the support block is slidably connected to the slide, two symmetrically distributed guide rods are slidably sleeved inside the support block, the guide rods are fixedly connected to the slide, and a first spring is provided on the outside of the guide rods. This adjusting mechanism facilitates the adjustment of the slide position.

[0008] Preferably, there are multiple grooves, which are evenly distributed inside the fixing seat. By designing multiple grooves, the ball can roll into the grooves at different positions.

[0009] Preferably, one end of the first spring is fixedly connected to the support block, and the other end of the first spring is fixedly connected to the slide. The first spring is designed so that its force can act on the support block.

[0010] Preferably, the sealing mechanism includes a connecting rod and a fixed rod. The connecting rod is slidably connected inside the blocking block, and a pull block is fixedly connected to the outside of the connecting rod, with the pull block contacting the blocking block. A connecting strip is slidably sleeved inside the connecting rod. The fixed rod is fixedly connected to the blocking block, and a second spring is provided on the outside of the fixed rod. An insert block is fixedly connected to the end of the connecting strip away from the connecting rod, and the insert block is slidably connected to both the blocking block and the fixed seat. By designing the sealing mechanism, both ends of the fixed seat can be sealed.

[0011] Preferably, one end of the second spring is fixedly connected to the connecting strip, and the other end of the second spring is fixedly connected to the block. By designing the second spring, its force can be applied to the connecting strip.

[0012] Preferably, the mounting base has a slot inside, and a plug is slidably connected inside the slot. The slot is designed so that the plug can slide inside the slot.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] 1. This utility model, through the design of multiple suction cup bodies, can simultaneously perform the gripping of multiple wafers during the wafer gripping process, resulting in higher gripping efficiency. By interlocking the ball bearings with the grooves, the relative positions of the slide and the fixed base can be fixed. When the suction cup body is pushed to move in the horizontal direction, the ball bearings can be interlocked with the grooves at different positions, thereby adjusting and fixing the relative positions of the suction cup body and the fixed base, making it convenient and flexible to adjust the usage position of the suction cup body.

[0015] 2. This utility model uses a blocking block to seal both ends of the fixed base. By pulling the block, the insert can be moved and separated from the slot. The blocking block can then be rotated to open, allowing the slide to be slid out of the fixed base or other slides to be inserted. This facilitates the combination of any number of suction cup bodies as needed, improving the performance. Attached Figure Description

[0016] Figure 1 This is a three-dimensional view of the overall structure of this utility model;

[0017] Figure 2 This utility model Figure 1 A three-dimensional sectional view of a partial structure of the fixing seat;

[0018] Figure 3 This utility model Figure 2 Enlarged view of point A;

[0019] Figure 4 This utility model Figure 2 The front sectional view of the block.

[0020] In the diagram: 1. Fixed base; 2. Mounting base; 3. Suction cup body; 4. Slide groove; 5. Slider; 6. Slide seat; 7. Hinge base; 8. Adjustment mechanism; 9. Sealing mechanism; 10. Hinge rod; 11. Block; 81. Groove; 82. Ball bearing; 83. Support block; 84. Guide rod; 85. First spring; 91. Connecting rod; 92. Pull block; 93. Connecting strip; 94. Fixed rod; 95. Second spring; 96. Insert block; 97. Slot. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1 , Figure 2 , Figure 3A Bernoulli chuck for wafer gripping includes a base 1, with multiple evenly distributed mounting seats 2 fixedly connected to the outer side of the base 1. Multiple chuck bodies 3 are in contact with the lower end of the base 1. A sliding groove 4 is provided inside the base 1, and multiple sliders 5 are slidably connected inside the sliding groove 4. A slide block 6 is fixedly connected to the outer side of the slider 5 and is slidably connected to the base 1. A hinge seat 7 is fixedly connected to the top of the base 1. A hinge rod 10 is hinged inside the hinge seat 7, and a block 11 is fixedly connected to the outer side of the hinge rod 10 and is in contact with the base 1. An adjustment mechanism 8 is provided on the slide block 6, and a sealing mechanism 9 is provided on the block 11.

[0023] Please see Figure 1 , Figure 2 , Figure 3 The adjusting mechanism 8 includes a groove 81. The fixed base 1 has a groove 81 inside, and a ball bearing 82 is movably sleeved inside the groove 81. There are multiple grooves 81, which are evenly distributed inside the fixed base 1. By designing multiple grooves 81, the ball bearing 82 can roll into the grooves 81 at different positions. The ball bearing 82 is movably connected to the slide block 6. A support block 83 is movably sleeved on the outside of the ball bearing 82. The support block 83 is slidably connected to the slide block 6. Two symmetrically distributed guide rods 84 are slidably sleeved inside the support block 83. The guide rods 84 are fixedly connected to the slide block 6. A first spring 85 is provided on the outside of the guide rods 84. One end of the first spring 85 is fixedly connected to the support block 83, and the other end of the first spring 85 is fixedly connected to the slide block 6. By designing the first spring 85, the force of the first spring 85 can act on the support block 83. By designing the adjusting mechanism 8, the position of the slide block 6 can be easily adjusted.

[0024] Please see Figure 1 , Figure 2 , Figure 4 The sealing mechanism 9 includes a connecting rod 91 and a fixed rod 94. The connecting rod 91 is slidably connected inside the blocking block 11, and a pull block 92 is fixedly connected to the outside of the connecting rod 91. The pull block 92 contacts the blocking block 11. A connecting strip 93 is slidably sleeved inside the connecting rod 91. The fixed rod 94 is fixedly connected to the blocking block 11. A second spring 95 is provided on the outside of the fixed rod 94. One end of the second spring 95 is fixedly connected to the connecting strip 93, and the other end of the second spring 95 is fixedly connected to the blocking block 11. By designing the second spring 95, the force of the second spring 95 can act on the connecting strip 93. An insert block 96 is fixedly connected to the end of the connecting strip 93 away from the connecting rod 91. The insert block 96 is slidably connected to the blocking block 11 and the fixed seat 1 respectively. A slot 97 is opened inside the fixed seat 1. The insert block 96 is slidably connected inside the slot 97. By designing the slot 97, the insert block 96 can slide inside the slot 97. By designing the sealing mechanism 9, both ends of the fixed seat 1 can be sealed.

[0025] The specific implementation process of this utility model is as follows: In use, through the action of multiple suction cup bodies 3, multiple wafers can be gripped simultaneously during the wafer gripping process, resulting in higher gripping efficiency. When it is necessary to adjust the position of the suction cup body 3, simply push the suction cup body 3. The suction cup body 3 drives the slide 6 to move, and the slide 6 drives the ball bearing 82 to move. The ball bearing 82 can roll along the arc surface of the groove 81. The ball bearing 82 will be squeezed and pushed into the slide 6. The ball bearing 82 will drive the support block 83 to move downward. The support block 83 will slide along the guide rod 84 and squeeze the first spring 85, which can separate the ball bearing 82 from the groove 81. As the slide 6 moves in the horizontal direction, under the elastic action of the first spring 85, the ball bearing 82 can be pushed into the groove 81 at another position. At this time, the position of the slide 6 can be adjusted and fixed, and then the relative position of the suction cup body 3 and the fixed seat 1 can be adjusted and fixed, making it convenient and flexible to adjust the position of the suction cup body 3.

[0026] When it is necessary to open the block 11, simply pull the pull block 92 horizontally. The pull block 92 drives the connecting rod 91 to move, and the connecting rod 91 drives the connecting bar 93 to move. The connecting bar 93 will slide along the fixed rod 94 and squeeze the second spring 95. At the same time, the connecting bar 93 drives the insert block 96 to move, causing the insert block 96 to separate from the slot 97. Then the block 11 can be rotated to open. Then the slide block 6 can be slid out from the fixed base 1 or other slide blocks 6 can be inserted. This allows for the combination and use of any number of suction cup bodies 3 as needed, improving the usage effect.

[0027] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A Bernoulli chuck for wafer gripping, comprising a mounting base (1), characterized in that: The fixed base (1) is fixedly connected to a plurality of uniformly distributed mounting seats (2). The lower end of the fixed base (1) is in contact with a plurality of suction cup bodies (3). The fixed base (1) has a sliding groove (4) inside. A plurality of sliders (5) are slidably connected inside the sliding groove (4). A sliding block (6) is fixedly connected to the outside of the slider (5). The sliding block (6) is slidably connected to the fixed base (1). A hinge seat (7) is fixedly connected to the top of the fixed base (1). A hinge rod (10) is hinged inside the hinge seat (7). A block (11) is fixedly connected to the outside of the hinge rod (10). The block (11) is in contact with the fixed base (1). An adjustment mechanism (8) is provided on the sliding block (6). A sealing mechanism (9) is provided on the block (11).

2. The Bernoulli chuck for wafer gripping according to claim 1, characterized in that: The adjusting mechanism (8) includes a groove (81). The groove (81) is provided inside the fixed seat (1). A ball (82) is movably sleeved inside the groove (81). The ball (82) is movably connected to the slide (6). A support block (83) is movably sleeved outside the ball (82). The support block (83) is slidably connected to the slide (6). Two symmetrically distributed guide rods (84) are slidably sleeved inside the support block (83). The guide rods (84) are fixedly connected to the slide (6). A first spring (85) is provided on the outside of the guide rods (84).

3. A Bernoulli chuck for wafer gripping according to claim 2, characterized in that: The number of grooves (81) is multiple, and the multiple grooves (81) are evenly distributed inside the fixing seat (1).

4. A Bernoulli chuck for wafer gripping according to claim 2, characterized in that: One end of the first spring (85) is fixedly connected to the support block (83), and the other end of the first spring (85) is fixedly connected to the slide (6).

5. A Bernoulli chuck for wafer gripping according to claim 1, characterized in that: The sealing mechanism (9) includes a connecting rod (91) and a fixed rod (94). The connecting rod (91) is slidably connected inside the blocking block (11). A pull block (92) is fixedly connected to the outside of the connecting rod (91). The pull block (92) contacts the blocking block (11). A connecting strip (93) is slidably sleeved inside the connecting rod (91). The fixed rod (94) is fixedly connected to the blocking block (11). A second spring (95) is provided on the outside of the fixed rod (94). An insert block (96) is fixedly connected to the end of the connecting strip (93) away from the connecting rod (91). The insert block (96) is slidably connected to the blocking block (11) and the fixed seat (1) respectively.

6. A Bernoulli chuck for wafer gripping according to claim 5, characterized in that: One end of the second spring (95) is fixedly connected to the connecting bar (93), and the other end of the second spring (95) is fixedly connected to the block (11).

7. A Bernoulli chuck for wafer gripping according to claim 1, characterized in that: The fixed base (1) has a slot (97) inside, and a plug (96) is slidably connected inside the slot (97).

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