Chip heat dissipation structure, controller, industrial control equipment and electronic product
By setting multiple through holes and adjustment parts on the heat sink, and combining the different distances of screw holes with the chip center, the spring compression is adjusted, which solves the problem of heat sink tilt caused by the asymmetrical placement of the CPU and achieves a uniform heat conduction effect.
Patent Information
- Application Number
- CN202520089743.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-22
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2033-12-22
AI Technical Summary
In small or layout-constrained consumer electronics products, the CPU cannot be placed symmetrically relative to screw holes and mounting holes, which may cause the heat sink to tilt, resulting in poor heat conduction.
By setting multiple through holes and adjustment parts on the heat sink, and combining the different settings of screw holes at different distances from the chip center, the installation space of the spring is limited by the adjustment parts, and the compression of the spring is adjusted, so that the torque and pressure at each connection point are balanced, preventing the heat sink from tilting.
It achieves effective contact between the chip and the heat dissipation area even in asymmetrical placement, avoiding heat sink tilt and ensuring uniform heat conduction.
Smart Images
Figure CN223501864U_ABST
Abstract
Description
[0001] This application is a divisional application of application number 202323541495.2, filed on December 22, 2023, entitled "Chip Heat Dissipation Structure, Controller, Industrial Control Equipment and Electronic Product". Technical Field
[0002] This utility model relates to the field of chip heat dissipation technology, and in particular to chip heat dissipation structures, controllers, industrial control equipment and electronic products. Background Technology
[0003] In consumer electronics products, such as computers, which are relatively large, the multiple mounting holes of the heatsink are usually designed to be centered relative to the CPU. The multiple screw holes on the PCBA board and the multiple mounting holes of the heatsink are flexibly connected together by multiple spring screws. The CPU is sandwiched between the PCBA board and the heatsink. This allows the heatsink to fully dissipate heat from the CPU that is in close contact with it. Because the multiple spring screws are equidistant from the CPU, the pressure applied to the CPU is relatively even, and the heatsink can fully contact the CPU for heat dissipation.
[0004] When the product is small or the layout is limited, the CPU cannot be placed symmetrically with respect to the screw holes and mounting holes. As a result, the pressure on the CPU cannot be balanced, and the heatsink may tilt, leading to poor heat conduction. Utility Model Content
[0005] The main purpose of this invention is to propose a chip heat dissipation structure, controller, and electronic product, which aims to solve the problem that when the CPU cannot be placed symmetrically with respect to the screw holes and mounting holes, the heat sink may tilt, resulting in poor heat conduction.
[0006] To achieve the above objectives, this utility model proposes a chip heat dissipation structure, wherein the chip heat dissipation structure includes:
[0007] A heat sink has an upper side and a lower side that are arranged opposite each other in the vertical direction. A heat dissipation area is formed in the middle of the upper side of the heat sink. The heat sink has a plurality of through holes in the vertical direction. The plurality of through holes are arranged at intervals around the periphery of the heat dissipation area in the circumferential direction of the heat sink.
[0008] A substrate and a chip are disposed above the heat sink. The chip is sandwiched between the heat sink and the substrate and is positioned corresponding to the heat dissipation area. The substrate has a plurality of screw holes, each corresponding to one of the plurality of through holes. The plurality of screw holes includes at least one first screw hole. The distance between the first screw hole and the center of the chip is different from the distances between the other screw holes and the center of the chip.
[0009] The connection structure includes multiple connecting bolts and multiple springs respectively sleeved on the corresponding connecting bolts, with each connecting bolt passing through the corresponding through hole and screw hole for fixation;
[0010] The chip heat dissipation structure further includes an adjustment structure, which includes at least one adjustment portion formed on the lower side of the heat sink. The plurality of through holes includes a first through hole that extends vertically through the adjustment portion and the heat sink. The adjustment portion and the corresponding screw head of the connecting bolt define an installation space for mounting the spring.
[0011] Optionally, the distance between the first screw hole and the center of the chip is greater than the distance between the other screw holes and the center of the chip;
[0012] The adjustment part includes a first groove recessed on the lower side of the heat sink, and the bottom of the first groove is provided with the first through hole.
[0013] Optionally, the distance between the first screw hole and the center of the chip is smaller than the distance between the other screw holes and the center of the chip;
[0014] The adjustment part includes a first protrusion protruding from the lower side of the heat sink, and the first through hole is provided on the first protrusion.
[0015] Optionally, the adjustment structure further includes a first washer disposed between the head of the connecting bolt for screwing into the first screw hole and the spring.
[0016] Optionally, the adjustment structure further includes a second shim, which is disposed between the spring and the lower side of the heat sink that are configured to correspond to the first through hole.
[0017] This utility model proposes a chip heat dissipation structure, which includes:
[0018] A heat sink has an upper side and a lower side that are arranged opposite each other in the vertical direction. A heat dissipation area is formed in the middle of the upper side of the heat sink. The heat sink has a plurality of through holes in the vertical direction. The plurality of through holes are arranged at intervals around the periphery of the heat dissipation area in the circumferential direction of the heat sink.
[0019] An adjusting plate is provided with through holes corresponding to the heat dissipation area, and the adjusting plate is provided with a plurality of internal threaded holes that correspond one-to-one with the plurality of through holes;
[0020] A substrate and a chip are disposed above the adjustment plate. The chip is sandwiched between the heat sink and the substrate and is positioned corresponding to the heat dissipation area. The substrate is fixedly connected to the adjustment plate.
[0021] The connection structure includes multiple connecting bolts and multiple springs. Each connecting bolt passes through the corresponding through hole and is fixed to the internal thread hole. Each spring is sleeved around the thread of the corresponding connecting bolt and is located on the side of the through hole away from the adjusting plate.
[0022] The distance between each of the internal threaded holes and the center of the chip is the same.
[0023] Optionally, the substrate is provided with a plurality of screw holes, and the adjustment plate is provided with a plurality of connection holes that correspond one-to-one with the plurality of screw holes;
[0024] The chip heat dissipation structure also includes multiple fixing bolts, each of which is threaded through the corresponding connecting hole and the corresponding screw hole.
[0025] This utility model also provides a controller, which includes the chip heat dissipation structure described above.
[0026] This utility model proposes an industrial control device, which includes the controller described above.
[0027] This utility model also provides an electronic product, which includes the above-mentioned industrial control equipment.
[0028] In the technical solution provided by this utility model, the heat sink is provided with multiple through holes for connecting bolts to pass through. The corresponding substrate is also provided with multiple screw holes, each corresponding to one of the through holes. After the connecting bolt is fitted with a spring, it passes through the through holes and is screwed into the screw holes for fixation. The chip is positioned between the heat sink and the substrate, corresponding to the heat dissipation area. The multiple through holes are spaced apart along the circumference of the heat sink around the heat dissipation area, thus facilitating pressure application to the periphery of the chip sandwiched between the substrate and the heat sink. The multiple screw holes include at least one first screw hole. The distance between the first screw hole and the center of the chip differs from the distances of the other screw holes to the center of the chip. Correspondingly, the distance between the through holes corresponding to the first screw hole and the center of the chip is also different. Because the deformation generated after the spring is compressed affects the magnitude of the pressure acting on the substrate, at least one adjustment part is provided on the lower side of the heat sink. The first through hole corresponding to the first screw hole penetrates the adjustment part and the heat sink in the vertical direction, thus defining the size of the installation space for the spring between the adjustment part and the screw head of the corresponding connecting bolt. This allows for adjustments based on actual needs. To adjust the mounting space, when the distance from the first screw hole to the center of the chip is greater than that of the other screw holes, the adjustment mechanism can be used to increase the defined mounting space. When multiple connecting bolts are tightened to the same depth, the compression of the spring at the first through hole decreases, thus reducing the force exerted by the spring on the substrate. This allows the torque at that location relative to the chip center to be adjusted to be approximately equal to the torque at the other connecting bolt locations relative to the chip center, resulting in approximately equal pressure acting on the chip. When the distance from the first screw hole to the center of the chip is less than that of the other screw holes, the adjustment mechanism can be used to increase the defined mounting space. As the gap decreases, when multiple connecting bolts are tightened to the same depth, the compression of the spring at the first through hole increases. This increases the force exerted by the spring on the substrate, ultimately adjusting the torque at that point relative to the chip center to be approximately equal to the torque at other connecting bolts relative to the chip center. Consequently, the pressure exerted on the chip is also approximately equal, and there is no relative tilt between the substrate and the heat sink. The chip can fit well with the heat sink area, solving the problem that when the CPU cannot be placed symmetrically relative to the screw holes and mounting holes, the heat sink may tilt, leading to poor heat conduction. Attached Figure Description
[0029] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0030] Figure 1This is a top view of a chip heat dissipation structure in the prior art;
[0031] Figure 2 A partial three-dimensional cross-sectional view of an embodiment of the chip heat dissipation structure provided by this utility model;
[0032] Figure 3 for Figure 2 A planar schematic diagram of the heat sink, chip, and connection structure in the chip;
[0033] Figure 4 for Figure 2 A side view of the chip's heat dissipation structure;
[0034] Figure 5 for Figure 4 Enlarged view of point A in the middle;
[0035] Figure 6 for Figure 2 A schematic diagram of a second specific embodiment of the chip heat dissipation structure;
[0036] Figure 7 for Figure 2 A schematic diagram of a third specific embodiment of the chip heat dissipation structure;
[0037] Figure 8 for Figure 2 A schematic diagram of the fourth specific embodiment of the chip heat dissipation structure;
[0038] Figure 9 A partial cross-sectional perspective view of another embodiment of the chip heat dissipation structure provided by this utility model.
[0039] Explanation of icon numbers:
[0040]
[0041]
[0042] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0043] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0044] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.
[0045] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.
[0046] In consumer electronics products, such as computers, which are relatively large, the multiple mounting holes of the heatsink are typically designed to be centered relative to the CPU. Please refer to [link / reference needed]. Figure 1 The PCBA board has multiple screw holes, and the heatsink has multiple mounting holes, all flexibly connected by multiple spring screws. The CPU is sandwiched between the PCBA board and the heatsink, allowing the heatsink to effectively dissipate heat from the CPU. Because the multiple spring screws are equidistant from the CPU, the pressure applied to the CPU is relatively even, ensuring the heatsink can effectively contact the CPU for heat dissipation. However, when the product is small or the layout is limited, the CPU cannot be placed perfectly symmetrically relative to the screw holes and mounting holes. In this case, the pressure on the CPU becomes unbalanced, and the heatsink may tilt, leading to poor heat conduction.
[0047] To solve the above problems, this utility model provides a heat dissipation structure for chip 3. Figure 1 This is a top view of the heat dissipation structure of chip 3 in the prior art; Figure 2 A partial three-dimensional cross-sectional view of an embodiment of the heat dissipation structure for chip 3 provided by this utility model; Figure 3 for Figure 2 A planar schematic diagram of the heat sink, chip 3, and connection structure in the diagram; Figure 4 for Figure 2 A side view of the heat dissipation structure of chip 3 in the diagram; Figure 5 for Figure 4 Enlarged view of point A in the middle; Figure 6 for Figure 2 A schematic diagram of a second specific embodiment of the heat dissipation structure for chip 3; Figure 7 for Figure 2 A schematic diagram of a third specific embodiment of the heat dissipation structure for chip 3; Figure 8 for Figure 2 A schematic diagram of the fourth specific embodiment of the heat dissipation structure of chip 3 in the diagram; Figure 9 A partial three-dimensional cross-sectional view of another embodiment of the heat dissipation structure for chip 3 provided by this utility model.
[0048] In the first embodiment, please refer to Figures 2 to 5 The chip heat dissipation structure 100 includes a heat sink 1, a substrate 2, a chip 3, and a connection structure 4. The heat sink 1 has an upper side and a lower side that are arranged opposite each other in the vertical direction. A heat dissipation area 1a is formed in the middle of the upper side of the heat sink 1. The heat sink 1 has a plurality of through holes in the vertical direction, and the plurality of through holes are arranged at intervals around the periphery of the heat dissipation area 1a along the circumference of the heat sink 1. The substrate 2 and the chip 3 are disposed above the heat sink 1. The chip 3 is sandwiched between the heat sink 1 and the substrate 2 and is disposed corresponding to the heat dissipation area 1a. The substrate 2 has a plurality of screw holes that are respectively arranged one-to-one with the plurality of through holes. The plurality of screw holes include at least one first screw hole 2a1. The distance between the screw hole 2a1 and the center of the chip 3 is set differently from the distance between the other screw holes and the center of the chip 3; the connection structure 4 includes a plurality of connecting bolts 41 and a plurality of springs 42 respectively sleeved on the corresponding connecting bolts 41, and each connecting bolt 41 passes through the corresponding through hole and is fixed to the screw hole; the chip heat dissipation structure 100 also includes an adjustment structure, the adjustment structure includes at least one adjustment part 5 formed on the lower side of the heat sink 1, the plurality of through holes includes a first through hole 1b1 that passes through the adjustment part 5 and the heat sink 1 in the vertical direction, and the adjustment part 5 and the screw head of the corresponding connecting bolt 41 define an installation space for the spring 42 to be installed.
[0049] It should be noted that because chip 3 is sandwiched between the substrate and the heat sink, the pressure on chip 3 comes from the elastic force of the spring fitted on the connecting bolt. However, when the distance between different springs and the center of chip 3 is not equal, it will cause the heat sink and the substrate to tend to tilt and rotate. According to M=FL, when the distance L is longer and F is constant, M is larger. That is, the torque generated at the spring that is farther away from the center of chip 3 is larger. In order to avoid tilting between the heat sink and the substrate, F needs to be reduced. The magnitude of the spring's reaction force depends on the spring's elastic coefficient and compression deformation. During assembly, for convenience, the same material is generally used. However, since the springs look similar, it is not conducive to manufacturing and there may be a situation of mixed materials.
[0050] Understandably, the heat sink 1 is provided with multiple through holes for the connecting bolts 41 to pass through, and the corresponding substrate 2 is also provided with multiple screw holes that correspond one-to-one with the multiple through holes. After the connecting bolts 41 are fitted with springs 42, they pass through the through holes and are screwed into the screw holes for fixation. The chip 3 is disposed between the heat sink 1 and the substrate 2 and is disposed corresponding to the heat dissipation area 1a. The multiple through holes are arranged at intervals along the circumference of the heat sink 1 on the periphery of the heat dissipation area 1a, so that pressure can be applied to the periphery of the chip 3 sandwiched between the substrate 2 and the heat sink. The multiple screw holes include at least one first screw hole 2a1. The distance between the first screw hole 2a1 and the center of the chip 3 is different from the distance between the other screw holes and the center of the chip 3. Correspondingly, the distance between the through hole corresponding to the first screw hole 2a1 and the center of the chip 3 is also different. The magnitude of the deformation generated after the spring 42 is squeezed affects the magnitude of the pressure acting on the substrate 2.
[0051] In the technical solution provided by this utility model, at least one adjustment part 5 is provided on the lower side of the heat sink 1. The first through hole 1b1 corresponding to the first screw hole 2a1 passes through the adjustment part 5 and the heat sink 1 in the vertical direction, so that the size of the installation space for the spring 42 is defined between the adjustment part 5 and the screw head of the corresponding connecting bolt 41. It can be adjusted according to actual needs. When the distance between the first screw hole 2a1 and the center of the chip 3 is greater than that of other screw holes, the installation space defined by the adjustment part 5 can be increased. When multiple connecting bolts 41 are tightened to the same depth, the compression of the spring 42 corresponding to the first through hole 1b1 is reduced. Then the force of the spring 42 acting on the substrate 2 will be reduced, and finally the torque at that point relative to the center of the chip 3 can be adjusted to the torque at other connecting bolts 41 relative to the center of the chip 3. The torques are approximately equal, thus ensuring that the final pressure acting on the chip 3 is also approximately equal. When the distance between the first screw hole 2a1 and the center of the chip 3 is smaller than that of the other screw holes, the installation space at the limiting point can be reduced by adjusting the adjustment part 5. When multiple connecting bolts 41 are tightened to the same depth, the compression of the spring 42 provided at the first through hole 1b1 increases. Then, the force of the spring 42 acting on the substrate 2 increases, ultimately allowing the torque at that point relative to the center of the chip 3 to be adjusted to be approximately equal to the torque at the other connecting bolts 41 relative to the center of the chip 3. This ensures that the final pressure acting on the chip 3 is also approximately equal, and there will be no relative tilt between the substrate 2 and the heat sink 1. The chip 3 can fit well with the heat sink area 1a, solving the problem that when the CPU cannot be placed symmetrically relative to the screw holes and mounting holes, the heat sink may tilt, leading to poor heat conduction.
[0052] Understandably, in existing technologies, four screw holes are typically provided on the substrate, and correspondingly, four through holes are provided on the heat sink. The four screw holes are located at the four corners of the chip; two screw holes are located on one side of the chip's longitudinal axis, and the other two are located on the other side. Simultaneously, the two screw holes on either side of the chip's transverse axis are symmetrically positioned about the transverse axis. If the distance L2 between the two screw holes on one side of the chip's longitudinal axis and the chip is larger than the distance L1 between the other two screw holes and the chip, it indicates that the two springs on that side need to provide a smaller counterforce F2; conversely, if the distance between the two screw holes on one side of the longitudinal axis and the chip is smaller than the distance between the other two screw holes and the chip, it indicates that the two springs on that side need to provide a larger counterforce.
[0053] It should be noted that the longitudinal axis of the chip is not absolutely longitudinal. Longitudinal can refer to the length direction of the chip or the width direction. Similarly, the transverse axis of the chip mentioned below is not absolutely transverse. When the longitudinal axis of the chip refers to the width direction of the chip, the transverse axis of the chip refers to the length direction of the chip; when the longitudinal axis of the chip refers to the length direction of the chip, the transverse axis of the chip refers to the width direction of the chip.
[0054] Specifically, please refer to Figure 5 In the first specific embodiment, the distance between the first screw hole 2a1 and the center of the chip 3 is greater than the distance between the other screw holes and the center of the chip 3. This indicates that the spring 42 at the first screw hole 2a1 needs to provide a smaller reaction force. Therefore, the adjustment part 5 includes a first groove 5a recessed on the lower side of the heat sink 1, and the bottom of the first groove 5a is provided with the first through hole 1b1. With this configuration, when multiple connecting bolts 41 are tightened to the same depth, the deformation of the spring 42 that abuts against the bottom of the first groove 5a will be smaller. Thus, the force of the spring 42 acting on the substrate 2 will be smaller, ultimately allowing the torque at this location relative to the center of the chip 3 to be adjusted to be approximately equal to the torque at the other connecting bolts 41 relative to the center of the chip 3. By directly opening the first groove 5a on the lower side of the heat sink 1, the torque at this location can be reduced without the need for different material springs 42 or additional components, thereby achieving pressure equalization without increasing costs.
[0055] Please see Figure 6In the second specific embodiment, the distance between the first screw hole 2a1 and the center of the chip 3 is smaller than the distance between the other screw holes and the center of the chip 3. The adjusting part 5 includes a first protrusion 51 protruding from the lower side of the heat sink 1, and the first through hole 1b1 is provided through the first protrusion 51. It can be understood that the end face of the first protrusion 51 is used for the end face of the spring 42 to abut against it. Thus, when the connecting bolts 41 are locked to the same depth, the deformation of the spring 42 cooperating with the first protrusion 51 is greater, and the reaction force will increase. Similarly, the torque can be adjusted so that the torque generated at each connection point is eventually approximately equal. Therefore, in addition to setting the first groove 5a to adjust the torque at the screw holes with larger distances, the first protrusion 51 can also be set to increase the reaction force at the screw holes with smaller distances, thereby achieving the final adjustment of the decoupling torque, so that the torque at that point relative to the center of the chip 3 can be adjusted to be approximately equal to the torque at the other connecting bolts 41 relative to the center of the chip 3.
[0056] Please see Figure 7 In the third specific embodiment, the adjustment structure further includes a first washer 61, which is placed between the head of the connecting bolt 41 for screwing into the first screw hole 2a1 and the spring 42. The thickness of the first washer 61 can be set according to the actual required compression. Since the first washer 61 occupies part of the original installation space, the installation space of the spring 42 is reduced, thereby increasing the compression of the spring 42 after the connecting bolt 41 is tightened. This also increases the reverse force at the screw hole with a small distance, thus achieving the final adjustment of the decoupling torque, so that the torque at that point relative to the center of the chip 3 can be adjusted to be approximately equal to the torque at other connecting bolts 41 relative to the center of the chip 3.
[0057] It is understandable that the thickness of the first washer 61 can be set to various specifications. For screw holes with different distances, washers of different thicknesses can be set accordingly, thereby adjusting the compression of the spring 42 to different degrees. It is also understandable that multiple first washers 61 can be set. The required thickness can be achieved by stacking multiple first washers 61 in different numbers.
[0058] Please see Figure 8In the fourth specific embodiment, the adjustment structure further includes a second shim 62, which is placed between the spring 42, which is corresponding to the first through hole 1b1, and the lower side of the heat sink 1. Thus, it is unnecessary to provide the first protrusion 51 when molding the heat sink 1, avoiding manufacturing tolerances. During assembly, different thicknesses and numbers of second shims 62 can be flexibly placed, ultimately reducing the installation space of the spring 42. This results in a greater compression of the spring 42 after the connecting bolt 41 is tightened, thereby increasing the reverse force at the screw holes with smaller distances.
[0059] Please see Figure 9 This utility model also provides another chip heat dissipation structure 100, which includes a heat sink 1, an adjustment plate 7, a substrate 2, a chip 3, and a connection structure 4. The heat sink 1 has an upper side and a lower side that are arranged opposite each other in the vertical direction. A heat dissipation area 1a is formed in the middle of the upper side of the heat sink 1. The heat sink 1 has a plurality of through holes in the vertical direction, and the plurality of through holes are arranged at intervals around the periphery of the heat dissipation area 1a in the circumferential direction of the heat sink 1. The adjustment plate 7 has through holes corresponding to the heat dissipation area 1a, and the adjustment plate 7 is provided with a plurality of inner holes that are respectively arranged one-to-one with the plurality of through holes. Threaded hole 7a; substrate 2 and chip 3 are disposed above adjustment plate 7, chip 3 is sandwiched between heat sink 1 and substrate 2 and is disposed corresponding to heat sink area 1a, substrate 2 is fixedly connected to adjustment plate 7; connection structure 4 includes multiple connecting bolts 41 and multiple springs 42, each connecting bolt 41 passes through the corresponding through hole and is fixed to the internal threaded hole 7a, each spring 42 is sleeved on the outer periphery of the screw of the corresponding connecting bolt 41 and is disposed on the side of the through hole away from adjustment plate 7; wherein, the distance between each internal threaded hole 7a and the center of chip 3 is the same.
[0060] In the technical solution provided by this utility model, the substrate 2 and the adjusting plate 7 are fixedly connected to form an integral structure. After the connecting bolt 41 is fitted with the spring 42, it passes through the through hole and is screwed to the internal thread hole 7a on the adjusting plate 7. The chip 3 is disposed between the heat sink 1 and the substrate 2 and is disposed corresponding to the heat dissipation area 1a. The adjusting plate 7 is provided with through holes, through which the chip 3 can pass and abut against the heat dissipation area 1a. Because multiple through holes are arranged at intervals along the circumference of the heat sink 1 on the periphery of the heat dissipation area 1a, it is convenient to apply pressure to the periphery of the chip 3 sandwiched between the substrate 2 and the heat sink. This solution does not require attention to the position of the original screw holes on the substrate 2. The adjusting plate 7 is used to rearrange the multiple through holes of the connecting bolt 41. The position of the internal threaded holes 7a ensures that the chip 3 is always at the geometric center of the multiple internal threaded holes 7a. By setting each through hole and each internal threaded hole 7a to be at the same distance from the center of the chip 3, the torque of each spring 42 acting on the substrate 2 is equal, thus making the pressure acting on the chip 3 approximately equal. Finally, there will be no relative tilt between the substrate 2 and the heat sink 1, and the chip 3 can fit well with the heat sink area 1a. This solves the problem that when the CPU cannot be placed symmetrically with respect to the screw holes and mounting holes, the heat sink may tilt, leading to poor heat conduction. Furthermore, this method can be used when there are other heat-generating components on the substrate 2, enabling heat dissipation for multiple components.
[0061] Specifically, in this embodiment, the substrate 2 is provided with multiple screw holes, and the adjustment plate 7 is provided with multiple connection holes 7b corresponding one-to-one with the screw holes; the chip heat dissipation structure 100 also includes multiple fixing bolts 8, each of which passes through the corresponding connection hole 7b and is screwed into the corresponding screw hole. By fixing the multiple screw holes on the substrate 2 to the connection holes 7b on the adjustment plate 7 with ordinary fixing bolts 8, no additional connecting components are needed on the substrate 2, making the overall connection structure 4 simple and easy to operate.
[0062] This utility model also provides a controller, which includes the chip heat dissipation structure 100 described above. The controller also includes a power module, a memory, and peripheral interfaces, etc. Since the controller includes the chip heat dissipation structure 100, the specific structure of which is described in the above embodiments. Because the chip heat dissipation structure 100 of this controller adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.
[0063] This utility model also provides an industrial control device, which can generally be set as a frequency converter, motor or communication equipment, etc. The industrial control device includes a controller, and the specific structure of the controller is as described in the above embodiments. Since the controller of this industrial control device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.
[0064] This utility model also provides an electronic product, which can generally be set as a computer, mobile phone or laptop, etc. The electronic product includes industrial control equipment. The specific structure of the industrial control equipment is as described in the above embodiments. Since the industrial control equipment of this electronic product adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.
[0065] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.
Claims
1. A chip heat dissipation structure, characterized in that, include: A heat sink has an upper side and a lower side that are arranged opposite each other in the vertical direction. A heat dissipation area is formed in the middle of the upper side of the heat sink. The heat sink has a plurality of through holes in the vertical direction. The plurality of through holes are arranged at intervals around the periphery of the heat dissipation area in the circumferential direction of the heat sink. An adjustment plate is provided with through holes corresponding to the heat dissipation area, and the adjustment plate is provided with a plurality of internal threaded holes that correspond one-to-one with the plurality of through holes; A substrate and a chip are disposed above the adjustment plate. The chip is sandwiched between the heat sink and the substrate and is positioned corresponding to the heat dissipation area. The substrate is fixedly connected to the adjustment plate. The connection structure includes multiple connecting bolts and multiple springs. Each connecting bolt passes through the corresponding through hole and is fixed to the internal thread hole. Each spring is sleeved around the thread of the corresponding connecting bolt and is located on the side of the through hole away from the adjusting plate. The distance between each of the internal threaded holes and the center of the chip is the same.
2. The chip heat dissipation structure as described in claim 1, characterized in that, The substrate is provided with a plurality of screw holes, and the adjustment plate is provided with a plurality of connection holes that correspond one-to-one with the plurality of screw holes; The chip heat dissipation structure also includes multiple fixing bolts, each of which is threaded through the corresponding connecting hole and the corresponding screw hole.
3. A controller, characterized in that, Includes the chip heat dissipation structure as described in claim 1 or 2.
4. An industrial control device, characterized in that, Includes the controller as described in claim 3.
5. An electronic product, characterized in that, Including the industrial control equipment as described in claim 4.