High-temperature-resistant heat-shrinkable tube with good heat conduction effect

Abstract

The utility model relates to a high-temperature-resistant heat-shrinkable tube with a good heat-conducting effect. The high-temperature-resistant heat-shrinkable tube consists of a tubular heat-conducting shrinkage layer, a heat-resistant shrinkage layer, a bonding shrinkage layer and a moisture-proof shrinkage layer, the heat-conducting shrinkage layer is a nano ceramic polyether-ether-ketone layer; the thickness of the heat-conducting shrinkage layer is 0.5 to 2.0 mm; the heat-resistant shrinkage layer is a copolymerized polyether-ether-ketone layer; the thickness of the heat-resistant shrinkage layer is 0.1 to 1.5 mm; the bonding shrinkage layer is a polyether-ether-ketone / polyetherimide alloy layer; the thickness of the bonding shrinkage layer is 0.1 to 1.0 mm; the moisture-proof shrinkage layer is a polyetherimide layer; and the thickness of the moisture-proof shrinkage layer is 0.1 to 1.0 mm. According to the utility model, the performance of using temperature, heat conductivity coefficient, corrosion resistance, radiation resistance and the like is improved, the application field of the heat-shrinkable tube is widened, the heat-shrinkable tube can cope with more complex and changeable environments, the product performance is more stable, the service life is prolonged, and the heat-shrinkable tube can be recycled and is environment-friendly.

Description

Technical Field

[0001] This utility model relates to the field of heat shrink tubing, specifically to a high-temperature resistant heat shrink tubing with good thermal conductivity. Background Technology

[0002] Heat shrink tubing is a type of tubing that can shrink and wrap under specific conditions (high temperature). It can be widely used in fields such as insulation and heat protection of electronic components, insulation protection of joints in communication cables and power cables, and shielding connections of electrical components.

[0003] Currently, traditional heat-shrinkable tubing has a relatively low operating temperature, failing to meet the increasingly demanding high-temperature requirements. Furthermore, these materials exhibit poor aging resistance and abrasion resistance, limiting their use in high-end electronics manufacturing, petrochemicals, and nuclear power generation. Additionally, their low thermal conductivity makes it difficult for accumulated heat to dissipate, leading to increased temperature and faster failure. Moreover, the tubing is not recyclable after shrinkage, which is environmentally unfriendly. Utility Model Content

[0004] The purpose of this invention is to provide a high-temperature resistant heat shrink tube with good thermal conductivity.

[0005] This utility model achieves the above-mentioned objective through the following technical solution: a high-temperature resistant heat shrinkable tube with good thermal conductivity, comprising a tubular thermally conductive shrinkable layer, a heat-resistant shrinkable layer, an adhesive shrinkable layer, and a moisture-proof shrinkable layer; the thermally conductive shrinkable layer is disposed on the outside of the heat-resistant shrinkable layer; the heat-resistant shrinkable layer is disposed on the outside of the adhesive shrinkable layer; the adhesive shrinkable layer is disposed on the outside of the moisture-proof shrinkable layer, with the moisture-proof shrinkable layer located on the innermost side; the thermally conductive shrinkable layer, the heat-resistant shrinkable layer, the adhesive shrinkable layer, and the moisture-proof shrinkable layer are simultaneously extruded and integrally formed. A high-temperature heat-shrinkable tube structure with good thermal conductivity is formed; the thermally conductive shrinkable layer is a nano-ceramic polyether ether ketone layer; the thickness of the thermally conductive shrinkable layer is 0.5-2.0 mm; the heat-resistant shrinkable layer is a copolymer polyether ether ketone layer; the thickness of the heat-resistant shrinkable layer is 0.1-1.5 mm; the adhesive shrinkable layer is a polyether ether ketone / polyetherimide alloy layer; the thickness of the adhesive shrinkable layer is 0.1-1.0 mm; the moisture-proof shrinkable layer is a polyetherimide layer; the thickness of the moisture-proof shrinkable layer is 0.1-1.0 mm.

[0006] Furthermore, the nano-ceramic polyether ether ketone layer is a blend of polyether ether ketone and nano-ceramic modified together, wherein the polyether ether ketone component is 0.75-0.95 parts by weight and the nano-ceramic component is 0.5-0.15 parts by weight.

[0007] Furthermore, the nanoceramic is one or more of nano-alumina, nano-boron nitride, nano-zinc oxide, etc.

[0008] Furthermore, the polyetheretherketone / polyetherimide alloy layer contains 0.5-0.9 parts by weight of polyetheretherketone and 0.1-0.5 parts by weight of polyetherimide.

[0009] Furthermore, each layer of raw material is granulated according to conventional methods in the industry.

[0010] Compared with existing technologies, the advantages of this high-temperature heat shrink tube with good thermal conductivity are: improved operating temperature, thermal conductivity, corrosion resistance, and radiation resistance; broadened application fields of heat shrink tubes; able to cope with more complex and changeable environments; more stable product performance; improved service life; and recyclable, making it environmentally friendly. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of this utility model.

[0012] The numbers in the diagram are as follows:

[0013] 010 - Thermally conductive shrinkable layer;

[0014] 020 - Heat-resistant shrinkable layer;

[0015] 030 - Adhesive receiving shrinkage layer;

[0016] 040 - Moisture-proof shrinkage layer. Detailed Implementation Example 1

[0017] A high-temperature resistant heat shrinkable tube with good thermal conductivity is composed of a tubular thermally conductive shrinkable layer 010, a heat-resistant shrinkable layer 020, an adhesive shrinkable layer 030, and a moisture-proof shrinkable layer 040. The thermally conductive shrinkable layer 010 is disposed outside the heat-resistant shrinkable layer 020; the heat-resistant shrinkable layer 020 is disposed outside the adhesive shrinkable layer 030; the adhesive shrinkable layer 030 is disposed outside the moisture-proof shrinkable layer 040, with the moisture-proof shrinkable layer 040 located at the innermost edge. The thermally conductive shrinkable layer 010, the heat-resistant shrinkable layer 020, the adhesive shrinkable layer 030, and the moisture-proof shrinkable layer 040 are simultaneously extruded and integrally formed to create the high-temperature resistant heat shrinkable tube structure with good thermal conductivity.

[0018] A further improvement to the above technical solution is that the thermally conductive shrinkable layer 010 is a nano-ceramic polyetheretherketone (PEEK) layer. By using nano-ceramics to blend and modify PEEK, the high thermal conductivity of the nano-ceramics is utilized to improve the thermal conductivity of the PEEK material, facilitating the dissipation of heat generated during the use of electronic components, cables, etc., into the environment, thereby extending the product's lifespan. Simultaneously, the introduction of nano-ceramics can also improve the material's insulation strength, thereby enhancing the product's insulation performance.

[0019] A further improvement to the above technical solution is that the thickness of the thermally conductive shrinkable layer 010 is 0.5-2.0 mm; the optimal thickness is 1 mm.

[0020] A further improvement to the above technical solution is that the nano-ceramic polyether ether ketone layer is a blend of polyether ether ketone and nano-ceramic modified together, wherein the polyether ether ketone component is 0.75-0.95 parts by weight and the nano-ceramic component is 0.5-0.15 parts by weight.

[0021] A further improvement to the above technical solution is that the nanoceramic is one or more of nano-alumina, nano-boron nitride, and nano-zinc oxide.

[0022] A further improvement to the above technical solution is that the heat-shrinkable layer 020 is a copolymer polyetheretherketone (PEEK) layer. PEEK possesses excellent overall performance, maintaining good heat shrinkage properties up to 300℃. It is recyclable, environmentally friendly, and exhibits good corrosion resistance, radiation resistance, and abrasion resistance. It can be easily and flexibly designed and manufactured into heat-shrinkable films, pipes, etc. Furthermore, through copolymer modification, its heat shrinkage performance is further improved, with a shrinkage rate reaching 80%.

[0023] A further improvement to the above technical solution is that the thickness of the heat-resistant shrinkable layer 020 is 0.1-1.5mm, with an optimal thickness of 0.8mm.

[0024] A further improvement to the above technical solution is that the adhesive shrink-receiving layer 030 is a polyetheretherketone / polyetherimide alloy layer. This layer connects the heat-resistant shrink-receiving layer 020 and the moisture-proof shrink-receiving layer 040, increasing the adhesion between the two layers and preventing peeling. In the polyetheretherketone / polyetherimide alloy layer, the polyetheretherketone component is 0.5-0.9 parts by weight, and the polyetherimide component is 0.1-0.5 parts by weight.

[0025] A further improvement to the above technical solution is that the thickness of the adhesive shrinkage layer 030 is 0.1-1.0 mm, with an optimal thickness of 0.5 mm.

[0026] A further improvement to the above technical solution is that the moisture-proof shrinkage layer 040 is a polyetherimide layer. Polyetherimide can maintain excellent insulation performance even in high temperature and high humidity environments, and can effectively isolate the influence of moisture on cables or electronic devices.

[0027] A further improvement to the above technical solution is that the thickness of the moisture-proof shrinkage layer 040 is 0.1-1.0 mm, with an optimal thickness of 0.5 mm.

[0028] Polyetheretherketone (PEEK) and polyetherimide (PEI) have similar processing temperatures, technologies, and equipment. Therefore, each layer of raw material can be granulated using industry-standard methods, and all four layers can be extruded simultaneously into a single integrated molding process without post-processing, facilitating large-scale production. Furthermore, both PEEK and PEI are thermoplastics and can be recycled, aligning with sustainable development goals.

[0029] The advantages of this utility model are: 1. It is recyclable and environmentally friendly; 2. It is suitable for high-value products that are in extreme environments; 3. It has high thermal conductivity, high reliability, and long service life.

[0030] This utility model provides a high-temperature resistant heat shrink tube with good thermal conductivity, which improves the performance of operating temperature, thermal conductivity, and corrosion resistance, and broadens the application field of heat shrink tubes. It can cope with more complex and changeable environments, making the product performance more stable and extending its service life. At the same time, it can be recycled and is environmentally friendly.

[0031] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.

Claims

1. A high-temperature resistant heat shrink tube with good thermal conductivity, characterized in that: It consists of a tubular thermally conductive shrinkable layer, a heat-resistant shrinkable layer, an adhesive shrinkable layer, and a moisture-proof shrinkable layer. The thermally conductive shrinkable layer is disposed outside the heat-resistant shrinkable layer; the heat-resistant shrinkable layer is disposed outside the adhesive shrinkable layer; the adhesive shrinkable layer is disposed outside the moisture-proof shrinkable layer, and the moisture-proof shrinkable layer is located on the innermost side. The thermally conductive shrinkable layer, the heat-resistant shrinkable layer, the adhesive shrinkable layer, and the moisture-proof shrinkable layer are simultaneously extruded and integrally formed to form a high-temperature resistant heat-shrinkable tube structure with good thermal conductivity. The thermally conductive shrinkable layer is a nano-ceramic polyetheretherketone layer; the thickness of the thermally conductive shrinkable layer is 0.5-2.0 mm. The heat-resistant shrinkable layer is a copolymer polyetheretherketone layer; the thickness of the heat-resistant shrinkable layer is 0.1-1.5 mm. The adhesive shrinkable layer is a polyetheretherketone / polyetherimide alloy layer; the thickness of the adhesive shrinkable layer is 0.1-1.0 mm. The moisture-proof shrinkable layer is a polyetherimide layer; the thickness of the moisture-proof shrinkable layer is 0.1-1.0 mm.

2. The high-temperature resistant heat shrink tube with good thermal conductivity according to claim 1, characterized in that: The nano-ceramic polyether ether ketone layer is a blend of polyether ether ketone and nano-ceramics, wherein the polyether ether ketone component is 0.75-0.95 parts by weight and the nano-ceramic component is 0.5-0.15 parts by weight.

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