Double-station chip crystal oscillator laser frequency modulation machine

Abstract

The utility model discloses a double-station chip crystal oscillator laser frequency modulation machine which comprises a feeding device, a discharging device, a first laser frequency modulation device, a second laser frequency modulation device, a material moving device and a plurality of material carrying plates. The material loading plate is arranged on the feeding device and the discharging device and is used for loading the surface-mounted crystal oscillators; the first laser frequency modulation device and the second laser frequency modulation device are used for carrying out detection and frequency modulation on the patch crystal oscillator on the material loading plate; the material moving device is used for transferring the material carrying plate from the feeding device to the first laser frequency modulation device and the second laser frequency modulation device or transferring the material carrying plate from the first laser frequency modulation device and the second laser frequency modulation device to the discharging device. Through the structure, the speed between the feeding and discharging procedure and the laser frequency modulation procedure can be matched, the waiting time is shortened, the production efficiency can be improved, and very good practicability is achieved.

Description

Technical Field

[0001] This utility model relates to the field of laser frequency modulators, and in particular to a dual-station surface mount crystal oscillator laser frequency modulator. Background Technology

[0002] A crystal oscillator, also known as a quartz crystal resonator, is a type of quartz crystal component. Quartz crystal resonators, quartz crystal oscillators, and quartz crystal filters are all quartz crystal components; quartz crystals are piezoelectric crystals. When a piezoelectric crystal is compressed or stretched in a specific direction, different charges are generated at its two ends. Based on the different effects, they are classified as either direct piezoelectric effect or inverse piezoelectric effect.

[0003] Crystal oscillators require frequency adjustment during manufacturing to meet usage requirements. However, existing crystal oscillator frequency tuning machines are designed for cylindrical crystal oscillators. Surface mount crystal oscillators (SMOs) have a significantly different structure from cylindrical crystal oscillators and cannot be tuned using the same machines. Furthermore, the frequency tuning process is lengthy, typically taking several minutes, while the loading and unloading process is relatively quick. The existing SMO frequency tuning machines have an inadequate structural design, resulting in numerous gaps between processes and a lack of smooth transitions. The speed mismatch between the loading / unloading and frequency tuning processes leads to excessive waiting time, limiting production efficiency. Therefore, a dual-station SMO laser frequency tuning machine is urgently needed to solve these problems. Utility Model Content

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a dual-station chip crystal oscillator laser frequency modulation machine.

[0005] The technical solution adopted by one embodiment of this utility model to solve its technical problem is: a dual-station chip oscillator laser frequency modulation machine, including a feeding device, a discharging device, a first laser frequency modulation device, a second laser frequency modulation device, a material transfer device, and a plurality of carrier plates;

[0006] The carrier plate is mounted on the loading and unloading devices and is used to load the chip crystal oscillator.

[0007] The first laser frequency modulation device and the second laser frequency modulation device are used to detect and modulate the surface mount crystal oscillator on the carrier board;

[0008] The material transfer device is used to transfer the material carrier plate from the loading device to the first laser frequency modulation device and the second laser frequency modulation device, or to transfer the material carrier plate from the first laser frequency modulation device and the second laser frequency modulation device to the unloading device.

[0009] As one of the preferred embodiments of this utility model, the feeding device includes several feeding baskets with lateral openings, and the material plates are stacked sequentially and at intervals along the height direction in the feeding baskets.

[0010] As one of the preferred embodiments of the present invention, the first laser frequency modulation device includes a first worktable, a first detection component, a first driving component, a first visual recognition component, and a first laser frequency modulation component;

[0011] The first workbench is provided with a first support groove that runs vertically through it, and the material plate is placed in the first support groove.

[0012] The first detection component is set on the first workbench and located above the first support groove, and is used to detect the chip crystal oscillator on the carrier board;

[0013] The first drive component is set on the first worktable and is used to drive the first detection component to move closer to or away from the material carrier plate.

[0014] The first vision recognition component is set on the first workbench and located below the first support groove, and is used to take pictures and locate the surface mount crystal oscillator on the carrier board.

[0015] The first laser frequency modulation component is disposed on the first worktable and located below the first support groove, and is used to perform laser etching on the chip crystal oscillator on the carrier board.

[0016] In one of the preferred embodiments of this utility model, the first driving component is configured as a three-dimensional motion platform.

[0017] As one of the preferred embodiments of this utility model, the material transfer device includes a multi-axis manipulator and a gripping component. The output end of the multi-axis manipulator is connected to the gripping component and is used to drive the gripping component to move in the horizontal and / or vertical directions. The gripping component is used to grip the loading plate in the loading device or place the loading plate in the unloading device.

[0018] As one of the preferred embodiments of this utility model, the gripping component includes a feeding suction cup and a discharging suction cup arranged on both sides.

[0019] As one of the preferred embodiments of this utility model, the material transfer device is equipped with a detection device for detecting whether there is a material carrier plate on the feeding device and the unloading device.

[0020] In one of the preferred embodiments of this utility model, the detection device is configured as an optical fiber sensor.

[0021] The beneficial effects of this utility model are as follows: A dual-station surface mount crystal oscillator laser frequency modulation machine includes a loading device, a unloading device, a first laser frequency modulation device, a second laser frequency modulation device, a transfer device, and several carrier plates. The carrier plates are mounted on the loading device and the unloading device for loading surface mount crystal oscillators. The first laser frequency modulation device and the second laser frequency modulation device are used to detect and modulate the surface mount crystal oscillators on the carrier plates. The transfer device is used to transfer the carrier plates from the loading device to the first laser frequency modulation device and the second laser frequency modulation device, or to transfer the carrier plates from the first laser frequency modulation device and the second laser frequency modulation device to the unloading device. Through the above structure, the speed between the loading / unloading process and the laser frequency modulation process can be matched, reducing waiting time and improving production efficiency, thus having very good practicality. Attached Figure Description

[0022] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0023] Figure 1 This is a schematic diagram of the first structure of a dual-station chip crystal oscillator laser frequency modulation machine;

[0024] Figure 2 This is a schematic diagram of the second structure of a dual-station chip crystal oscillator laser frequency modulation machine;

[0025] Figure 3 This is a schematic diagram of the material transfer device;

[0026] Figure 4 for Figure 3 A magnified view of a portion of region A in the middle. Detailed Implementation

[0027] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0028] In the description of this utility model, "multiple" means two or more; "greater than," "less than," and "exceeding" are understood to exclude the stated number; "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly specifying the number of indicated technical features or their sequential relationship.

[0029] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0030] In this utility model, unless otherwise explicitly defined, the terms "setting," "installing," and "connecting" should be interpreted broadly. For example, they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to a fixed connection, a detachable connection, or an integral molding; they can refer to a mechanical connection; they can refer to the internal connection of two components or the interaction between two components. Those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0031] Reference Figures 1 to 4 A dual-station chip oscillator laser frequency modulation machine includes a feeding device 100, a discharging device 200, a first laser frequency modulation device 300, a second laser frequency modulation device 400, a material transfer device 500, and several carrier plates 600.

[0032] The carrier plate 600 is mounted on the loading device 100 and the unloading device 200 and is used to load the chip crystal oscillator;

[0033] The first laser frequency modulation device 300 and the second laser frequency modulation device 400 are used to detect and frequency-modulate the chip crystal oscillator on the carrier plate 600.

[0034] The material transfer device 500 is used to transfer the material carrier plate 600 from the loading device 100 to the first laser frequency modulation device 300 and the second laser frequency modulation device 400, or to transfer the material carrier plate 600 from the first laser frequency modulation device 300 and the second laser frequency modulation device 400 to the unloading device 200.

[0035] 1) In some embodiments of this utility model, the feeding device 100 includes a plurality of feeding baskets 110 with lateral openings, and the material carriers 600 are stacked sequentially at intervals along the height direction in the feeding baskets 110; preferably, the feeding device 100 includes two feeding baskets 110, which can work alternately, that is, when the material transfer device 500 is taking material from the material carriers 600 in the first feeding basket 110, the second feeding basket 110 is used as a spare. When the material carriers 600 in the first feeding basket 110 are used up, material can be taken from the second feeding basket 110, and at the same time, the worker replenishes the first feeding basket 110; similarly, the unloading device 200 is also like this.

[0036] 2) In some embodiments, the material transfer device 500 includes a multi-axis robot 510 and a gripping component 520. The output end of the multi-axis robot 510 is connected to the gripping component 520 and is used to drive the gripping component 520 to move in the horizontal and / or vertical directions. The gripping component 520 is used to grip the material plate 600 in the loading device 100 or to place the material plate 600 in the unloading device 200.

[0037] As a preferred embodiment of the gripping component 520, the gripping component 520 includes a feeding suction cup 521 and a discharging suction cup 522 arranged on both sides.

[0038] Specifically, in one workflow, a multi-axis robot 510 drives the gripping component 540 to move to the feeding device 100 and grip one of the carrier plates 600, then transfers it to the first laser frequency modulation device 300 for detection and laser frequency modulation. In the next workflow, the multi-axis robot 510 drives the gripping component 540 to move to the feeding device 100 and grip another carrier plate 600, then transfers it to the second laser frequency modulation device 400 for detection and laser frequency modulation. It should be noted that the multi-axis robot... The robotic arm 510 may include multiple rotating joints and a Z-axis motion mechanism to achieve three-dimensional spatial motion. Furthermore, when the material transfer device 500 picks up a carrier plate 600 to be frequency tuned by the loading suction cup 521, it first picks up the carrier plate 600 after frequency tuning by the unloading suction cup 522, and then rotates the loading suction cup 521 and the carrier plate 600 to be frequency tuned to the top of the support groove and places it in. At this time, it drives the unloading suction cup 522 and the carrier plate 600 to move to the unloading device 200 to achieve continuous operation.

[0039] 3)Reference Figures 1-2 In some embodiments, the first laser frequency modulation device 300 includes a first worktable 310, a first detection component 320, a first driving component 330, a first visual recognition component 340, and a first laser frequency modulation component 350; the first worktable 310 is provided with a vertically penetrating first support groove 360, and the carrier plate 600 is placed in the first support groove 360; the first detection component 320 is disposed on the first worktable 310 and located above the first support groove 360, and is used to detect the surface mount crystal oscillator on the carrier plate 600. The first drive component 330 is disposed on the first worktable 310 and is used to drive the first detection component 320 to move closer to or away from the carrier plate 600; the first vision recognition component 340 is disposed on the first worktable 310 and located below the first support groove 360, and is used to take pictures and locate the chip crystal oscillator on the carrier plate 600 for identification; the first laser frequency modulation component 350 is disposed on the first worktable 310 and located below the first support groove 360, and is used to perform laser etching on the chip crystal oscillator on the carrier plate 600.

[0040] Preferably, the second laser frequency modulation device 400 includes a first worktable 410, a second detection component 420, a second drive component 430, a second vision recognition component 440, and a second laser frequency modulation component 450; the first worktable 410 is provided with a second support groove 460 that extends vertically, and the carrier plate 600 is placed in the second support groove 460; the second detection component 420 is disposed on the first worktable 410 and located above the second support groove 460, and is used to detect the chip crystal oscillator on the carrier plate 600. The second drive component 430 is disposed on the first worktable 410 and is used to drive the second detection component 420 to approach or move away from the carrier plate 600; the second vision recognition component 440 is disposed on the first worktable 410 and located below the second support groove 460, and is used to perform image positioning and recognition on the surface mount crystal oscillator on the carrier plate 600; the second laser frequency modulation component 450 is disposed on the first worktable 410 and located below the second support groove 460, and is used to perform laser etching on the surface mount crystal oscillator on the carrier plate 600.

[0041] Specifically, preferably, the first driving component 330 is configured as a three-dimensional motion platform; the carrier plate 600 is located in the first support groove with the conductive electrodes of the chip crystal oscillator facing upwards and the body of the chip crystal oscillator facing downwards; the first driving component 330 drives the first detection component 320 to move above the carrier plate 600 and contact the conductive electrodes of the chip crystal oscillator, thereby obtaining the frequency of each chip crystal oscillator; then the first visual recognition component 340 positions each chip crystal oscillator on the carrier plate 600 to obtain the frequency tuning parameters of each chip crystal oscillator; finally, the first laser frequency tuning component 350 performs laser etching frequency tuning on the chip crystal oscillator; the working principle of the second laser frequency tuning device 400 is the same as that of the first laser frequency tuning device 300, and will not be described in detail here.

[0042] 4)Reference Figures 3-4 In some embodiments, the material transfer device 500 is provided with a detection device 700 for detecting whether there is a material carrier plate 600 on the feeding device 100 and the unloading device 200; as a preferred embodiment of the detection device 700, the detection device 700 is configured as an optical fiber sensor.

[0043] 5) The advantages of this utility model are: the above structure can match the speed between the loading and unloading process and the laser frequency modulation process, reduce the waiting time, improve production efficiency, and has very good practicality.

[0044] Of course, this utility model is not limited to the above-described embodiments. Those skilled in the art can make equivalent modifications or substitutions without departing from the spirit of this utility model. All such equivalent modifications and substitutions are included within the scope defined by the claims of this application.

Claims

1. A dual-station chip oscillator laser frequency modulation machine, characterized in that: It includes a feeding device (100), a discharging device (200), a first laser frequency modulation device (300), a second laser frequency modulation device (400), a material transfer device (500), and several carrier plates (600); The carrier plate (600) is mounted on the loading device (100) and the unloading device (200) for loading the chip crystal oscillator; The first laser frequency modulation device (300) and the second laser frequency modulation device (400) are used to detect and frequency-modulate the chip crystal oscillator on the carrier plate (600); The transfer device (500) is used to transfer the carrier plate (600) from the loading device (100) to the first laser frequency modulation device (300) and the second laser frequency modulation device (400), or to transfer the carrier plate (600) from the first laser frequency modulation device (300) and the second laser frequency modulation device (400) to the unloading device (200).

2. The dual-station chip oscillator laser frequency modulation machine according to claim 1, characterized in that: The feeding device (100) includes a plurality of feeding baskets (110) with lateral openings, and the material carriers (600) are stacked sequentially and at intervals in the feeding baskets (110) along the height direction.

3. The dual-station chip oscillator laser frequency modulation machine according to claim 1, characterized in that: The first laser frequency modulation device (300) includes a first worktable (310), a first detection component (320), a first driving component (330), a first vision recognition component (340), and a first laser frequency modulation component (350); The first workbench (310) is provided with a first support groove (360) that runs vertically through it, and the material carrier plate (600) is placed in the first support groove (360). The first detection component (320) is disposed on the first workbench (310) and located above the first support groove (360), and is used to detect the chip crystal oscillator on the carrier plate (600); The first driving component (330) is disposed on the first worktable (310) and is used to drive the first detection component (320) to move closer to or away from the material carrier plate (600); The first visual recognition component (340) is disposed on the first workbench (310) and located below the first support groove (360), and is used to take pictures and locate the chip crystal oscillator on the carrier plate (600). The first laser frequency modulation component (350) is disposed on the first worktable (310) and located below the first support groove (360) for laser etching of the chip crystal oscillator on the carrier plate (600).

4. A dual-station chip oscillator laser frequency modulation machine according to claim 3, characterized in that: The first drive component (330) is configured as a three-dimensional motion platform.

5. A dual-station chip oscillator laser frequency modulation machine according to claim 1, characterized in that: The material handling device (500) includes a multi-axis manipulator (510) and a gripping assembly (520). The output end of the multi-axis manipulator (510) is connected to the gripping assembly (520) and is used to drive the gripping assembly (520) to move in the horizontal and / or vertical directions. The gripping assembly (520) is used to grip the loading plate (600) in the loading device (100) or to place the loading plate (600) in the unloading device (200).

6. A dual-station chip oscillator laser frequency modulation machine according to claim 5, characterized in that: The gripping component (520) includes a feeding suction cup (521) and a discharging suction cup (522) arranged on both sides.

7. A dual-station chip oscillator laser frequency modulation machine according to claim 1, characterized in that: The material transfer device (500) is equipped with a detection device (700) for detecting whether there is a material carrier plate (600) on the feeding device (100) and the unloading device (200).

8. A dual-station chip oscillator laser frequency modulation machine according to claim 7, characterized in that: The detection device (700) is configured as an optical fiber sensor.

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