Suction nozzle for automatic lossless surface mounting of light-emitting diode material for SMT (surface mount technology) with lens

Abstract

The utility model discloses a suction nozzle for automatic lossless surface mounting of light-emitting diode materials with lenses for SMT (Surface Mount Technology), which is characterized in that a first clamping groove and a second clamping groove are respectively arranged on the upper surface of a connecting disc from left to right, a reflector is arranged on the lower surface of the connecting disc, a suction nozzle head is arranged on the lower surface of the reflector, and a lens is arranged on the suction nozzle head. The upper end of the suction nozzle head is further integrally connected with a connector, a second cavity and an air suction port are formed in the suction nozzle head from top to bottom, a first cavity communicated with the second cavity is formed in the mounting rod, and a sealing protection pad is further arranged at the lower end of the suction nozzle head. The utility model relates to the technical field of SMT surface mounting. According to the suction nozzle for automatic lossless surface mounting of the light emitting diode material with the lens for SMT, the suction nozzle head can effectively avoid important and sensitive working areas on the upper surface of the diode material, so that protection is achieved, and the purpose of efficient sealing and lossless adsorption of the light emitting diode can be achieved through the sealing protection pad.

Description

TECHNICAL FIELD

[0001] The utility model relates to SMT surface mount technology field, concretely is a kind of nozzle for the automatic non-destructive mounting of light emitting diode material with lens for SMT. BACKGROUND

[0002] SMT is the most popular technique and process in electronic assembly industry, it installs pinless or short lead sign assembly component on the surface of printed circuit board PCB or the surface of other substrate, and is welded and assembled by reflow soldering or immersion soldering etc., SMT technology greatly improves the density and performance of electronic product, is the key technology in modern electronic manufacturing;

[0003] SMT is important component in SMT surface mount technology when mounting, is used for the suction and fixation of light emitting diode material.

[0004] However, the nozzle of the existing SMT is mostly damaged to the suction diode material, and the stability of suction is poor, and it is easy to fall off and affect work. Therefore, the technical personnel in the art provides a nozzle for the automatic non-destructive mounting of light emitting diode material with lens for SMT to solve the problems raised in the above background technology. UTILITY MODEL CONTENTS

[0005] In view of the deficiencies of prior art, the utility model provides a nozzle for the automatic non-destructive mounting of light emitting diode material with lens for SMT to solve the problems raised in the above background technology.

[0006] To achieve the above object, the utility model is realized by the following technical scheme: a nozzle for the automatic non-destructive mounting of light emitting diode material with lens for SMT, including connecting disc and installation rod being arranged on the upper surface of connecting disc, the upper surface of connecting disc is opened with first clamping groove and second clamping groove from left to right, and the lower surface of connecting disc is installed with reflector, the lower surface of reflector is installed with nozzle head, the upper end of nozzle head is also integrally connected with connecting head, and the inside of nozzle head is opened with second cavity and suction port from top to bottom, the inside of installation rod is opened with first cavity, and the lower end of nozzle head is also provided with sealing protective pad.

[0007] Preferably, the installation rod is in the shape of a circular truncated cone with the upper end smaller than the lower end.

[0008] Preferably, the first clamping groove and the second clamping groove are both "U"-shaped.

[0009] Preferably, the lower surface of the installation rod is opened with a mounting groove matched with the connecting head.

[0010] Preferably, the second chamber is cylindrically opened, and the air inlet and the second chamber are mutually penetrated.

[0011] Preferably, the material of the nozzle head and the connecting head is ceramic.

[0012] Advantages

[0013] The utility model provides a take lens SMT with emitting diode material automation nondestructive mounting with suction nozzle.

[0014] The take lens SMT with emitting diode material automation nondestructive mounting with suction nozzle, through the connecting head of suction nozzle head one end and the installation groove of the lower surface of connecting disc opening are sleeved, the fixation of suction nozzle head is completed, and the design of suction nozzle head makes it and the pair of edges of diode material upper surface abut, and this design makes suction nozzle head can effectively avoid the important and sensitive work area of diode material upper surface, thereby realizes protection, and through sealing protection pad can realize the purpose of high -efficient sealing nondestructive emitting diode adsorption. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a kind of structure schematic diagram of the suction nozzle for emitting diode material automation nondestructive mounting with lens SMT;

[0016] Figure 2 It is the front view of the installation rod in the suction nozzle for emitting diode material automation nondestructive mounting with lens SMT;

[0017] Figure 3 It is the plan view of the installation rod in the suction nozzle for emitting diode material automation nondestructive mounting with lens SMT;

[0018] Figure 4 It is the sectional view of the nozzle head in the suction nozzle for emitting diode material automation nondestructive mounting with lens SMT;

[0019] Figure 5 It is the structure schematic diagram of the nozzle head in the suction nozzle for emitting diode material automation nondestructive mounting with lens SMT.

[0020] In the drawing: 1, installation rod;11, connecting disc;12, first clamping groove;13, second clamping groove;14, first chamber;2, reflector;3, nozzle head;31, air inlet;32, second chamber;33, connecting head;4, sealing protection pad. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0022] Please refer to Figures 1-5 The utility model provides a kind of technical scheme: a kind of nozzle for automatic non-destructive mounting of LED material with lens SMT, including connecting disc 11 and the mounting rod 1 being set on the upper surface of connecting disc 11, the upper surface of connecting disc 11 is respectively provided with first clamping groove 12 and second clamping groove 13 from left to right, and the lower surface of connecting disc 11 is equipped with reflector 2, the lower surface of reflector 2 is equipped with nozzle head 3, the upper end of nozzle head 3 is also integrally connected with connecting head 33, and the inside of nozzle head 3 is provided with second chamber 32 and suction port 31 from top to bottom, the inside of mounting rod 1 is provided with first chamber 14 that is mutually penetrated with second chamber 32, and the lower end of nozzle head 3 is also provided with sealing protective pad 4.

[0023] In Figure 1 In the specific implementation process: the mounting rod 1 is provided in the shape of circular table with the upper small and the lower big, which is configured to be matched with SMT mounting negative pressure equipment, so as to facilitate installation.

[0024] In Figure 3 In the specific implementation process: first clamping groove 12 and second clamping groove 13 are both provided in the shape of "U", and the first clamping groove 12 is larger than the second clamping groove 13, so that the first clamping groove 12 and the second clamping groove 13 can be matched with equipment for installation.

[0025] In Figure 4 In the specific implementation process: the lower surface of mounting rod 1 is provided with mounting groove that is mutually adapted with connecting head 33, which is made by interference fit and integral molding, and the two ends are provided with chamfer structure, so as to improve the efficiency of production and assembly.

[0026] In Figure 4 In the specific implementation process: second chamber 32 is provided in the shape of cylinder, and suction port 31 is mutually penetrated with second chamber 32, which is penetrated by suction port 31 and second chamber 32, so that air can be extracted when SMT is started to adsorb diode material under negative pressure.

[0027] In Figure 5 In the specific implementation process: the material of nozzle head 3 and connecting head 33 is ceramic, which is made of high-quality material with wear resistance and corrosion resistance, so as to improve the durability and stability of the nozzle.

[0028] When working (or in use), the suction nozzle head 3 is assembled with the connecting disc 11, and the connecting head 33 at the upper end of the suction nozzle head 3 is made by interference fit and one-piece forming with the mounting groove on the lower surface of the connecting disc 11, and the two ends are provided with chamfered structures to improve the efficiency of production and assembly;

[0029] In the process of sucking the chip or other micro devices (such as light emitting diode with lens), the design of the suction nozzle head 3 makes the first notch abut against a pair of edges on the upper surface of the device, which can effectively avoid the important and sensitive working area on the upper surface of the device, thereby achieving protection. In addition, the various structural designs of the suction nozzle head 3 can ensure that it does not come into direct contact with the upper surface of the device during the process of pasting the chip, further protecting the sensitive area.

[0030] When the suction nozzle head 3 moves above the light emitting diode material, the external SMT negative pressure system is started, and the suction nozzle head 3 generates negative pressure, that is, air flows through the air inlet 31, the second chamber 32 and the first chamber 14 to generate negative pressure, and the light emitting diode material is adsorbed on the suction nozzle head 3; under the drive of the chip mounter, the suction nozzle head 3 carries the material to the designated mounting position; after reaching the designated position, the negative pressure system is closed, and the suction nozzle head 3 releases the light emitting diode material, thereby completing the suction and release of the light emitting diode material. At the same time, the lower end of the suction nozzle head 3 has a sealing protective pad 4, which can play a high-efficiency sealing protection purpose when it comes into contact with the light emitting diode material, and improve the purpose of non-destructive adsorption of the light emitting diode material.

[0031] The use steps of the suction nozzle are not unique, and can be reasonably adjusted according to the setting of the production process. The overall structure is simple. At the same time, the suction nozzle has wide application range, low cost, adjustable suction force, and is very suitable for automatic non-destructive mounting.

[0032] During the mounting process, the mounting stability and precision can be further improved by adjusting the suction speed and placement speed and other parameters.

[0033] Meanwhile, the contents not described in detail in the specification all belong to the prior art known to those skilled in the art.

Claims

1. A nozzle for material automation non-destructive mounting of a light emitting diode with lens for SMT, comprising a connecting disc (11) and a mounting rod (1) arranged on the upper surface of the connecting disc (11), characterized in that: The upper surface of the connecting disc (11) is provided with a first clamping groove (12) and a second clamping groove (13) from left to right, respectively, and the lower surface of the connecting disc (11) is provided with a reflecting sheet (2), the lower surface of the reflecting sheet (2) is provided with a suction head (3), the upper end of the suction head (3) is integrally connected with a connecting head (33), and the inside of the suction head (3) is provided with a second cavity (32) and an air inlet (31) from top to bottom, the inside of the mounting rod (1) is provided with a first cavity (14) which is mutually penetrated with the second cavity (32), and the lower end of the suction head (3) is further provided with a sealing protective pad (4).

2. The nozzle for pick-and-place of LEDs with lenses for SMT according to claim 1, characterized in that: The mounting rod (1) is in the shape of a circular table with the upper part being smaller than the lower part.

3. The nozzle for pick-and-place of LEDs with lens for SMT according to claim 1, characterized in that: The first clamping groove (12) and the second clamping groove (13) are both provided in the shape of "U".

4. The nozzle for pick-and-place of LEDs with lens for SMT material automation according to claim 1, characterized in that: The lower surface of the mounting rod (1) is provided with a mounting groove which is mutually adapted with the connecting head (33).

5. The nozzle for pick-and-place of LEDs with lens for SMT material automation according to claim 1, characterized in that: The second cavity (32) is provided in the shape of a cylinder, and the air inlet (31) is mutually penetrated with the second cavity (32).

6. The nozzle for pick-and-place of LEDs with lens for SMT material automation according to claim 1, characterized in that: The materials of the suction head (3) and the connecting head (33) are both ceramic.

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