Light-emitting diode structure and bracket of light-emitting diode

Abstract

The utility model provides a light-emitting diode structure and a bracket of a light-emitting diode. The light emitting diode structure comprises at least one support unit, a light emitting assembly and a packaging unit. Each support unit comprises a die bonding part, a first electrode part and a second electrode part. The first electrode part and the second electrode part extend along the first direction and are oppositely arranged on the two sides of the die bonding part; each support unit further comprises a plurality of first connecting parts which are formed by oppositely extending different sides of the die bonding parts in the first direction so as to bridge the die bonding parts of the adjacent support units. The plurality of second connecting parts are formed by extending the first electrode parts and the second electrode parts in the second direction so as to bridge the plurality of second connecting parts of the adjacent stent units. The first direction is perpendicular to the second direction. The light emitting assembly is fixed to the die bonding portion and electrically connected to the first electrode portion and the second electrode portion. The packaging unit completely covers the light emitting assembly and partially covers the at least one support unit. The support comprises at least one support unit.

Description

Technical Field

[0001] This utility model relates to the field of diode technology, and in particular to a light-emitting diode structure and a light-emitting diode bracket. Background Technology

[0002] The design of the support units within a light-emitting diode (LED) structure is crucial. The structure of these support units affects the LED's electrodes, the stability of its internal structure, and even its waterproofing performance. Current technology involves creating multiple identical support units from a single metal sheet, then separating them into individual support units through a cutting process. The cutting process also requires consideration of the stability of the connections between the support units.

[0003] A light-emitting diode (LED) structure can include a single LED or multiple LEDs. Different LEDs typically require separate electrical control, which is limited by the structural arrangement of the support units within the LED structure.

[0004] Currently, the mounting brackets for single-chip LED structures are generally not suitable for mounting brackets for multiple parallel LED structures. This is because the electrodes of the mounting brackets for multiple parallel LED structures need to be electrically independent. The mounting brackets for single-chip LED structures are even more difficult to apply to multi-LED structures arranged in a matrix. LED structures with different numbers of chips typically require different mounting brackets.

[0005] Therefore, how to improve the design of the support structure so that a single support can be used for LED structures with different numbers of light-emitting chips, thereby improving the manufacturing efficiency of LED structures and overcoming the above-mentioned defects, has become a problem that this technical field aims to solve. Utility Model Content

[0006] The technical problem to be solved by this utility model is to provide a light-emitting diode structure and a light-emitting diode bracket that are applicable to light-emitting diode structures with different numbers of light-emitting chips, in order to address the shortcomings of the prior art.

[0007] To solve the aforementioned technical problems, one technical solution adopted by this utility model is to provide a light-emitting diode (LED) support, which includes at least one support unit. Each support unit includes a die-bonding portion, a first electrode portion, and a second electrode portion. The first electrode portion and the second electrode portion are disposed opposite to each other on both sides of the die-bonding portion. The support unit further includes a plurality of first connecting portions and a plurality of second connecting portions. The plurality of first connecting portions are disposed opposite to each other on different sides of the die-bonding portion along a first direction to bridge the die-bonding portions of adjacent support units. The second connecting portions are respectively generated by the first electrode portion and the second electrode portion extending in a second direction to bridge the second connecting portions of adjacent support units. The first direction is perpendicular to the second direction, and the first electrode portion and the second electrode portion are disposed opposite to each other on different sides of the die-bonding portion along the second direction.

[0008] To address the aforementioned technical problems, another technical solution adopted by this utility model is to provide a light-emitting diode structure, comprising at least one support unit, a light-emitting component, and a packaging unit. Each of the at least one support unit includes a die-bonding portion, a first electrode portion, and a second electrode portion. The first electrode portion and the second electrode portion extend along a first direction and are disposed opposite to each other on both sides of the die-bonding portion. Each support unit further includes a plurality of first connecting portions and a plurality of second connecting portions. The plurality of first connecting portions are formed by extending oppositely from different sides of the die-bonding portion along the first direction to bridge the die-bonding portions of adjacent support units. The plurality of second connecting portions are formed by the first electrode portion and the second electrode portion respectively extending along a second direction to bridge the plurality of second connecting portions of adjacent support units. The first direction is perpendicular to the second direction. The light-emitting component is fixed to the die-bonding portion and electrically connected to the first electrode portion and the second electrode portion, respectively. The packaging unit completely covers the light-emitting component and partially covers the at least one support unit.

[0009] One of the beneficial effects of this utility model is that the light-emitting diode structure and its support provided by this utility model can allow two or more support units to be connected in parallel along a first direction, or four support units to be arranged in a 2x2 matrix, through the arrangement and connection of multiple first connecting parts and multiple second connecting parts of the support unit. Furthermore, the electrode part of each support unit can be electrically separated without affecting each other. Thus, the light-emitting component on the die-bonding part can be independently controlled by the light-emitting diode structure of this utility model.

[0010] To further understand the features and technical content of this utility model, please refer to the following detailed description and drawings of this utility model. However, the drawings provided are for reference and illustration only and are not intended to limit this utility model. Attached Figure Description

[0011] Figure 1 This is a top view of the bracket for the light-emitting diode of this utility model.

[0012] Figure 2 This is a top perspective view of a single support unit of this utility model.

[0013] Figure 3 This is a bottom perspective view of a single support unit of this utility model.

[0014] Figure 4 This is a top view of the two parallel support units of this utility model.

[0015] Figure 5 This is a top view of the three parallel support units of this utility model.

[0016] Figure 6 This is a top view of the four support units of this utility model arranged in a matrix and connected in parallel.

[0017] Figures 7 to 9A This is a schematic diagram of the manufacturing process of the light-emitting diode structure of this utility model.

[0018] Figure 9B This is a cross-sectional schematic diagram of the lens portion of another embodiment of the light-emitting diode structure of this utility model.

[0019] Figure 10A This is a cross-sectional schematic diagram of the light-emitting diode structure of this utility model with a light-shielding layer.

[0020] Figure 10B This is a cross-sectional schematic diagram of a light-shielding layer in another embodiment of the light-emitting diode structure of this utility model.

[0021] Figure 10C This is a cross-sectional view of the light-emitting diode structure of this utility model, which has an opaque base.

[0022] Figure 11 This is a schematic diagram of the LED structure after cutting according to this utility model.

[0023] Figure 12 This is a perspective view of the light-emitting diode structure of this utility model with a single support unit.

[0024] Figure 13 This is a perspective view of the light-emitting diode structure with two support units according to this utility model.

[0025] Figure 14 This is a perspective view of the light-emitting diode structure with three support units according to this utility model.

[0026] Figure 15 This is a perspective view of the light-emitting diode structure with four support units according to this utility model. Detailed Implementation

[0027] The following specific embodiments illustrate the implementation methods disclosed in this utility model. Those skilled in the art can understand the advantages and effects of this utility model from the content disclosed in this specification. This utility model can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this utility model. Furthermore, the accompanying drawings of this utility model are for simple illustrative purposes only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this utility model in detail, but the disclosed content is not intended to limit the scope of protection of this utility model.

[0028] [First Embodiment]

[0029] See Figures 1 to 5 As shown, the first embodiment of this utility model provides a light-emitting diode (LED) support 100, which is formed from a metal sheet through etching, stamping, and other processing steps. The LED support 100 can be cut into multiple support units F. Furthermore, the support 100 of this embodiment can also be cut into two or more parallel support units F. Each support unit F includes a die-bonding portion 10, a first electrode portion 11, and a second electrode portion 12. The first electrode portion 11 and the second electrode portion 12 are disposed opposite to each other on both sides of the die-bonding portion 10. Each support unit F also includes multiple first connecting portions (101, 103, 105, 107) and multiple second connecting portions (102, 112, 114; 104, 122, 124).

[0030] like Figure 2 and Figure 3 As shown, in this embodiment, the die-bonding portion 10, the first electrode portion 11, and the second electrode portion 12 are slightly elongated plates, with their long sides generally parallel to the first direction (such as the X-axis direction of a coordinate axis, hereinafter referred to as X), and the first electrode portion 11 and the second electrode portion 12 are disposed opposite to each other on different sides of the die-bonding portion 10. The first direction X is perpendicular to the second direction Y.

[0031] like Figure 1 As shown, in this embodiment, the support unit F is defined with two first boundaries E11, E12 parallel to the first direction X, and two second boundaries E21, E22 parallel to the second direction Y.

[0032] like Figure 1 As shown, in this embodiment, multiple first connecting portions (101, 103, 105, 107) are generated by extending relatively from opposite sides of the die-bonding portion 10 in the first direction X, to bridge the die-bonding portions 10 of adjacent support units F. In this embodiment, the die-bonding portion 10 has two sides parallel to the first direction X (or lateral sides) and two sides parallel to the second direction Y (or vertical sides). Specifically, the die-bonding portion 10 has two first connecting portions (101, 103) on the vertical side parallel to the second direction Y, and two first connecting portions (105, 107) on the other vertical side parallel to the second direction Y. The first connecting portion 101 bridges the first connecting portion 107 of the adjacent support unit F, and the first connecting portion 103 bridges the first connecting portion 105 of the adjacent support unit F.

[0033] Multiple second connecting portions (102, 112, 114; 104, 122, 124) are generated by the first electrode portion 11 and the second electrode portion 12 extending in the second direction Y, respectively, to bridge the second connecting portions (124, 122, 104; 114, 112, 102) of adjacent support units F. The multiple second connecting portions (102, 112, 114; 104, 122, 124) are divided into a first group and a second group of equal numbers; the multiple second connecting portions (102, 112, 114) of the first group extend across one of the first boundaries E11 to connect an adjacent support unit. The multiple second connecting portions (104, 122, 124) of the second group extend across the other first boundary E12 to connect another adjacent support unit.

[0034] Please also refer to Figure 2 and Figure 3Specifically, the first group has three second connecting portions (102, 112, 114), with the two outermost second connecting portions (102, 114) extending parallel to the second direction Y. Within the same support unit F, second connecting portion 102 and second connecting portion 114 are electrically separated. In other words, second connecting portion 102 is connected to the first connecting portions (101, 103), and another second connecting portion 114 is connected to the first electrode portion 11. Another second connecting portion 112 is connected to the first electrode portion 11. From another perspective, the first electrode portion 11 is connected to two second connecting portions 112 and 114 in the positive Y-axis direction. The second connecting portion 114 extends from one end of the first electrode portion 11, and the second connecting portion 112 extends from the middle section of the first electrode portion 11, making the connection between the first electrode portion 11 and the second connecting portions 112 and 114 approximately F-shaped. The second connecting portion 112 is generally located in the middle section between the second connecting portions 102 and 114. In this embodiment, the second connecting part 112 extends in the second direction Y and is slightly inclined in the first direction X; however, the present invention is not limited thereto.

[0035] Specifically, the second group has three second connecting portions (104, 122, 124), with the two outer second connecting portions (104, 124) extending parallel to the second direction Y. Within the same support unit F, second connecting portion 104 and second connecting portion 124 are electrically separate. In other words, second connecting portion 104 is connected to the first connecting portion (105, 107), and another second connecting portion 124 is connected to the second electrode portion 12. Another second connecting portion 122 is connected to the middle section of the second electrode portion 12. From another perspective, the second electrode portion 12 is connected to two second connecting portions 122 and 124 in the negative Y-axis direction. Second connecting portion 124 extends from one end of the second electrode portion 12. Second connecting portion 122 extends from the middle section of the second electrode portion 12, forming an F-shape. Second connecting portion 122 is generally located in the middle section of second connecting portion 104 and second connecting portion 124. In this embodiment, the second connecting portion 122 extends in the second direction Y and is slightly inclined in the first direction X; however, the present invention is not limited thereto.

[0036] Please see Figure 2 and Figure 3 Two second connecting portions 102 and 104 are respectively connected to opposite corners on both sides of the die-bonding portion 10 and are parallel to the second direction Y. More specifically, each of the two opposite corners of each die-bonding portion 10 is connected to a second connecting portion 102 through a first connecting portion 101 and to a second connecting portion 104 through another first connecting portion 105.

[0037] like Figure 1As shown, the first group of multiple second connecting parts (102, 112, 114) are evenly distributed on the first boundary E11 of the support unit F, and the second group of multiple second connecting parts (104, 122, 124) are evenly distributed on the other first boundary E12 of the support unit F, thereby evenly dispersing the cutting and injection stress of the support unit F.

[0038] However, the present invention is not limited thereto, wherein each die-bonding portion 10 is connected to at least one first connecting portion on each side, the position of which may be located at the first connecting portion (101, 105), or the first connecting portion (103, 107), or at the middle of the side of the die-bonding portion 10. At least one first connecting portion extends across the second boundaries E21, E22 to connect to an adjacent die-bonding portion 10.

[0039] like Figure 2 and Figure 4 As shown, in addition to the above, a groove 108 and a groove 109 are formed on each side of the die-bonding portion 10 adjacent to the first connecting portion (101, 103; 105, 107), wherein the grooves 108 and 109 are in the length direction (e.g., Figure 4 The length L1 of each of the Y-direction sections is less than the side length L2 of its respective connection to the die-bonding section 10. A gap G1 is formed between the die-bonding section 10 and the first electrode section 11, and another gap G2 is formed between the die-bonding section 10 and the second electrode section 12. The formation of grooves 108 and 109 makes the top surface of the die-bonding section 10 discontinuous with the top surface of the first electrode section 11, and also discontinuous with the top surface of the second electrode section 12. This reduces the possibility of moisture approaching the die-bonding section 10 through the gap between the first electrode section 11 or the second electrode section 12 and the packaging unit (described in detail later) after subsequent encapsulation. Grooves 108 and 109 can extend the path for moisture to enter the die-bonding section 10 from the outside, thereby reducing the risk of moisture intrusion into the die-bonding section 10. At the same time, grooves 108 and 109 can improve the bonding strength between the packaging unit and the support unit F.

[0040] One side of the die-bonding section 10 has two first connecting parts 101 and 103 connected to the groove 108, forming a U-shape. The other side of the die-bonding section 10 has two first connecting parts 105 and 107 connected to the groove 109, forming a U-shape.

[0041] like Figure 2 and Figure 3As shown, within one of the support units F, a first electrode portion 11 is connected to two second connecting portions 112 and 114 to form an F-shape; a second electrode portion 12 is connected to two second connecting portions 122 and 124 to form an F-shape. On one side of the die-bonding portion 10, two first connecting portions 101 and 103 are connected to a second connecting portion 102 to form an F-shape; on the other side of the die-bonding portion 10, two first connecting portions 105 and 107 are connected to a second connecting portion 104 to form an F-shape.

[0042] like Figures 4 to 5 As shown, in this embodiment, through the above structural arrangement, the light-emitting diode support 100 is designed to be cut to generate one or more support units F connected in a single row along the first direction X. Figure 4 The support unit assembly 200 has two support units F along the first direction X. For example... Figure 5 The support unit assembly 300 has three support units F along the first direction X.

[0043] like Figure 6 As shown, in this embodiment, through the aforementioned structural arrangement, the light-emitting diode support unit assembly 400 is planned as four support units F arranged in a 2x2 matrix. Furthermore, it is worth noting that the first electrode portion 11 and the second electrode portion 12 of each support unit F in the above-mentioned support unit assembly can be electrically separated after cutting. Specifically, the first electrode portion 11 and the second electrode portion 12 near the middle along the second direction Y can be connected to the same polarity, such as a positive electrode. The uppermost first electrode portion 11 and the lowermost second electrode portion 12 can be connected to the same polarity, such as a negative electrode. Therefore, the light-emitting diode support 100 of this invention, through the aforementioned uniquely designed support unit F structure, can provide multiple parallel support units F, eliminating the need to redesign the support structure for different needs, increasing versatility and saving costs.

[0044] like Figures 7 to 11 The diagram illustrates the manufacturing process of the light-emitting diode structure of this invention. Each cross-sectional view is drawn along a position parallel to the second direction and passing through the middle of the die-bonding portion 10. (See diagram for reference.) Figure 7 As shown, the support 100 is illustrated with three support units F, each filled with an opaque base 14. In this embodiment, the base 14 partially protrudes from the top surface of the support 100, creating multiple bowl-shaped receiving spaces 140. Each support unit F is provided with a light-emitting component 13 fixed to the surface of the die-bonding portion 10. In this embodiment, the light-emitting component 13 can be a light-emitting diode chip, but is not limited thereto. The light-emitting component 13 is electrically connected to the first electrode portion 11 and the second electrode portion 12 respectively via wire bonding.

[0045] like Figure 8As shown, an encapsulation unit 15 is filled within the accommodating space 140. The encapsulation unit 15 is, for example, a transparent resin, which may be mixed with phosphor. The encapsulation unit 15 completely covers the light-emitting component 13 and partially covers the support unit F. In this embodiment, the top surface of the encapsulation unit 15 is flat and flush with the partially protruding portion of the base 14.

[0046] In another embodiment, due to the surface tension effect when filling the encapsulation unit 15, depending on the amount of filling in the encapsulation unit 15, the top surface of the encapsulation unit 15 is arc-shaped and substantially protrudes or is recessed into the partially protruding part of the base 14.

[0047] In one embodiment, such as Figure 9A As shown, a lens layer with multiple lens portions 16 is formed on the packaging unit 15 and covers the base 14. In this embodiment, the lens portions 16 are in the shape of convex lenses, and each corresponds to the packaging unit 15.

[0048] In one embodiment, such as Figure 9B As shown, multiple lens portions 16 are individually generated on each packaging unit 15 and cover the base 14. In this embodiment, the lens portions 16 are convex lens shaped, and are separate and not connected, and each corresponds to a packaging unit 15.

[0049] In one embodiment, such as Figure 10A As shown, a light-shielding layer 17 is applied around the lens portion 16. The light-shielding layer 17 is, for example, a dark-colored opaque adhesive, to block stray light and prevent it from escaping from areas other than the lens portion 16, thereby increasing the contrast between the support 100 and the lens portion 16.

[0050] In another embodiment, such as Figure 10B As shown, a light-shielding layer 17 is applied to the upper edge of the base 14. The light-shielding layer 17 is, for example, a dark opaque adhesive or a dark opaque paint, to increase the visual contrast between the bracket 100 and the lens portion 16.

[0051] In another embodiment, such as Figure 10C As shown, the base 14a is made of a dark, opaque material, such as epoxy resin, polyurethane, silicone or other dark, opaque materials, to increase the visual contrast between the bracket 100 and the lens portion 16.

[0052] like Figure 11 As shown, the cutting process involves cutting along the cutting line C between the two lens sections 16 within the required range.

[0053] like Figure 12As shown, after cutting in this embodiment, the light-emitting diode structure 100E includes only one support unit F. The light-emitting diode structure 100E includes one support unit F on the support 100, a light-emitting component 13, a packaging unit 15, and a lens portion 16. It should be noted that some light-emitting diode structures do not require a lens portion. The connection relationship between the plurality of first connecting portions and the plurality of second connecting portions of each support unit F is the same as... Figures 1 to 6 The instructions also apply to Figures 7 to 15 .

[0054] like Figure 13 As shown, after cutting in this embodiment, the light-emitting diode structure 200E includes two support units F on the support 100 arranged along the first direction X. Similar to the description above, each support unit F includes a die-bonding portion 10, a first electrode portion 11, and a second electrode portion 12, with the first electrode portion 11 and the second electrode portion 12 disposed opposite to each other on both sides of the die-bonding portion 10. The multiple electrode portions of the two support units F can be electrically separated independently, thereby allowing separate control of each light-emitting component 13.

[0055] like Figure 14 As shown, after cutting in this embodiment, the light-emitting diode structure 300E includes three support units F on the support 100 arranged along the first direction X. Similar to the description above, each support unit F includes a die-bonding portion 10, a first electrode portion 11, and a second electrode portion 12, with the first electrode portion 11 and the second electrode portion 12 disposed opposite to each other on both sides of the die-bonding portion 10. The multiple electrode portions of the three support units F can be electrically separated independently, thereby allowing separate control of each light-emitting component 13.

[0056] like Figure 15 As shown, after cutting in this embodiment, the light-emitting diode structure 400E includes four support units F on the support 100 arranged in a 2x2 rectangle. Two support units F are arranged along the first direction X, and two support units F are arranged along the second direction Y. Similar to the description above, each support unit F includes a die-bonding portion 10, a first electrode portion 11, and a second electrode portion 12. The first electrode portion 11 and the second electrode portion 12 are disposed opposite to each other on both sides of the die-bonding portion 10. The multiple electrode portions of the four support units F can be electrically separated independently, thereby allowing separate control of each light-emitting component 13.

[0057] [Beneficial Effects of the Examples]

[0058] One of the beneficial effects of this invention is that the LED structure and LED support provided by this invention allow for the parallel connection of two or more support units along a first direction, or the arrangement and connection of four support units in a 2x2 matrix, through the arrangement and connection of multiple first connecting parts and multiple second connecting parts of the support unit. Furthermore, the electrode portion of each support unit can be electrically separated without affecting each other. Therefore, the LED support of this invention can be applied to LED structures with different numbers of light-emitting chips. Consequently, the LED structure of this invention can independently control one or more light-emitting components located on the die-bonding portion.

[0059] The above-disclosed content is only a feasible embodiment of the present utility model and is not intended to limit the scope of the present utility model. Therefore, all equivalent changes and modifications made based on the content of the present utility model specification and drawings are included within the protection scope of the present utility model.

Claims

1. A bracket for a light-emitting diode, characterized in that, include: At least one support unit, each support unit including a die-bonding portion, a first electrode portion, and a second electrode portion, wherein the first electrode portion and the second electrode portion are disposed opposite to each other on both sides of the die-bonding portion; wherein, the support unit further includes: A plurality of first connecting portions are disposed opposite to each other on different sides of the die-bonding portion along a first direction, to bridge the die-bonding portions of adjacent support units; and Multiple second connecting portions are respectively generated by the first electrode portion and the second electrode portion extending in a second direction to bridge the second connecting portions of adjacent support units; Wherein, the first direction is perpendicular to the second direction, and the first electrode portion and the second electrode portion are disposed on different sides of the die-bonding portion along the second direction.

2. The bracket for a light-emitting diode according to claim 1, characterized in that, The bracket of the light-emitting diode is designed to be cut along the first direction to generate one or more bracket units connected in a single row, or multiple bracket units arranged in a 2x2 matrix, and the first electrode portion and the second electrode portion of each bracket unit can be electrically separated.

3. The bracket for a light-emitting diode according to claim 2, characterized in that, The support unit is defined with two first boundaries parallel to the first direction and two second boundaries parallel to the second direction; wherein, the plurality of second connecting portions are divided into a first group and a second group of equal number; The plurality of second connecting portions of the first group extend across one of the first boundaries to connect an adjacent support unit; The plurality of second connecting portions of the second group extend across another of the first boundaries to connect another adjacent support unit.

4. The bracket for a light-emitting diode according to claim 3, characterized in that, The first group has three second connecting parts, wherein two outer second connecting parts are parallel to the second direction and are respectively connected to the first electrode part and one of the first connecting parts, and the other second connecting part is connected to the middle section of the first electrode part; The second group has three second connecting parts, wherein two outer second connecting parts are parallel to the second direction and are respectively connected to the second electrode part and one of the first connecting parts, and the other second connecting part is connected to the middle section of the second electrode part.

5. The bracket for a light-emitting diode according to claim 3, characterized in that, Each of the two diagonal sections of the die-bonding portion is connected to a second connecting portion via a first connecting portion.

6. The bracket for a light-emitting diode according to claim 3, characterized in that, Each of the die-bonding portions is connected to at least one of the first connecting portions on both sides, and each of the first connecting portions extends across the second boundary to connect to an adjacent die-bonding portion.

7. The bracket for a light-emitting diode according to claim 3, characterized in that, A groove is formed on each side of the die-bonding part adjacent to the first connecting part, a gap is formed between the die-bonding part and the first electrode part, and another gap is formed between the die-bonding part and the second electrode part.

8. The bracket for a light-emitting diode according to claim 7, characterized in that, The length of the groove is less than the side length of the connection edge with the die-bonding part.

9. The bracket for a light-emitting diode according to claim 7, characterized in that, The die-bonding portion has two first connecting portions on each of its two opposite sides and is connected to the groove, forming a U-shape.

10. The bracket for a light-emitting diode according to claim 9, characterized in that, Within one of the support units, the first electrode portion is connected to two second connecting portions to form an F-shape; the second electrode portion is connected to two second connecting portions to form an F-shape; and the two first connecting portions are connected to one second connecting portion to form an F-shape.

11. A light-emitting diode structure, characterized in that, include: At least one support unit, each support unit including a die-bonding portion, a first electrode portion, and a second electrode portion, wherein the first electrode portion and the second electrode portion extend along a first direction and are disposed opposite to each other on both sides of the die-bonding portion; wherein each support unit further includes: Multiple first connecting portions are generated from different sides of the die-bonding portion in the first direction to bridge the die-bonding portions of adjacent support units; A plurality of second connecting portions, each extending from the first electrode portion and the second electrode portion in a second direction, are provided to bridge the plurality of second connecting portions of adjacent support units; and Wherein, the first direction is perpendicular to the second direction; and A light-emitting component is fixed to the die-bonding portion and electrically connected to the first electrode portion and the second electrode portion, respectively; and A packaging unit that completely covers the light emitting component and partially covers the at least one support unit.

12. The light-emitting diode structure according to claim 11, characterized in that, The plurality of first connecting parts are divided into two groups of the same number, and the plurality of second connecting parts are divided into two groups of the same number.

13. The light-emitting diode structure according to claim 11, characterized in that, Each of the two diagonal sections of the die-bonding portion is connected to a second connecting portion via a first connecting portion.

14. The light-emitting diode structure according to claim 11, characterized in that, A groove is formed on each side of the die-bonding part adjacent to the first connecting part, a gap is formed between the die-bonding part and the first electrode, and another gap is formed between the die-bonding part and the second electrode.

15. The light-emitting diode structure according to claim 14, characterized in that, The length of the groove is less than the side length of the connection edge with the die-bonding part.

16. The light-emitting diode structure according to claim 14, characterized in that, The die-bonding portion has two first connecting portions on each of its two opposite sides and is connected to the groove, forming a U-shape.

17. The light-emitting diode structure according to claim 11, characterized in that, Within one of the support units, the first electrode portion is connected to two second connecting portions to form an F-shape; the second electrode portion is connected to two second connecting portions to form an F-shape; and the two first connecting portions are connected to one second connecting portion to form an F-shape.

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