Packaging structure pin bending die

Abstract

The utility model provides a packaging structure pin bending die, which comprises a lower die, an upper die, a rotating structure and a limiting block, and is characterized in that the lower die comprises a lower die first side part support plate; the upper die comprises an upper die first side supporting plate, one end, facing the lower die, of the upper die first side supporting plate is an arc-shaped end, and the lower die first side supporting plate and the upper die first side supporting plate are matched to clamp pins; the rotating structure is located on the side face of the first side supporting plate of the lower die, and when the rotating structure makes contact with the pin and rotates in the direction facing the first side supporting plate of the lower die, the pin makes contact with the arc-shaped end and deforms; the limiting block is used for limiting the rotating angle of the rotating structure. According to the pin bending die of the packaging structure, the limiting block is arranged to accurately control the rotating angle and position of the rotating structure, the stability of pin bending is effectively controlled, the accuracy and consistency of products are ensured, and the quality control requirement for high quality is met.

Description

Technical Field

[0001] This utility model belongs to the field of packaging technology and relates to a pin bending mold for packaging structure. Background Technology

[0002] In the pin bending process of microelectronic packaging structures, the pin height (standing force) refers to the vertical height of the pin relative to the horizontal plane after the bending process is completed, and the pin coplanarity (coplanarity) refers to the degree to which the upper surfaces of all pins are on the same horizontal plane. The pin height and coplanarity directly affect the installation and use of electronic components on the circuit board.

[0003] To ensure that the pin height and flatness meet design requirements, pin bending is typically performed using a die to maintain consistent quality during mass production. Currently, the TO-263 package structure suffers from low pin bending stability, resulting in inconsistent product height and flatness, lower process capability, and an inability to meet high-quality control requirements.

[0004] Therefore, how to provide a pin bending die for a package structure to improve the stability of pin bending height and flatness has become a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0005] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a pin bending mold for packaging structures to solve the problem of low pin bending stability in the prior art.

[0006] To achieve the above and other related objectives, this utility model provides a lead bending die for a packaging structure. The packaging structure includes a first side and a second side disposed opposite to each other. The first side is provided with leads, and the second side is provided with a heat sink. The lead bending die for the packaging structure includes:

[0007] The lower mold includes a first side support plate of the lower mold;

[0008] An upper mold is located above the lower mold. The upper mold includes a first side support plate, and the end of the first side support plate facing the lower mold is an arc-shaped end. The first side support plate of the lower mold and the first side support plate of the upper mold cooperate to clamp the pin.

[0009] A rotating structure is located on the side of the first side support plate of the lower mold. The rotating structure is spaced at a preset distance from the first side support plate of the lower mold. When the rotating structure contacts the pin and rotates in the direction toward the first side support plate of the lower mold, the pin contacts and deforms with the arc-shaped end.

[0010] The limiting block is used to limit the rotation angle of the rotating structure.

[0011] Optionally, the lower mold further includes a second side support plate, and the upper mold further includes a second side support plate, wherein the second side support plate of the lower mold and the second side support plate of the upper mold cooperate to clamp the heat sink.

[0012] Optionally, the lower mold further includes a lower mold bottom support plate, which is located below the lower mold first side support plate and the lower mold second side support plate, and both the lower mold first side support plate and the lower mold second side support plate are connected to the lower mold bottom support plate.

[0013] Optionally, it also includes a lifting seat, which is located above the bottom support plate of the lower mold and between the first side support plate and the second side support plate of the lower mold.

[0014] Optionally, the upper mold further includes an upper mold top support plate, which is located above the upper mold first side support plate and the upper mold second side support plate. The upper mold first side support plate and the upper mold second side support plate are both connected to the upper mold top support plate. When the upper mold top support plate moves toward or away from the lower mold, it drives the upper mold first side support plate and the upper mold second side support plate to move toward or away from the lower mold.

[0015] Optionally, the limiting block is located below the rotating structure.

[0016] Optionally, the limiting block is located on the side of the first side support plate of the lower mold.

[0017] Optionally, the limiting block comprises two parts: one part of the limiting block is located below the rotating structure, and the other part of the limiting block is located on the side of the first side support plate of the lower mold.

[0018] Optionally, it also includes a rotating structure support base located below the rotating structure.

[0019] As described above, in the pin bending mold of the packaging structure of this utility model, the rotation angle and position of the rotating structure are precisely controlled by setting a limit block, which effectively controls the stability of pin bending, ensures the accuracy and consistency of the product, and meets the high-quality control requirements. Attached Figure Description

[0020] Figure 1 The diagram shows the TO-263 package structure before the pins are bent.

[0021] Figure 2The diagram shows the TO-263 package structure with the pins bent.

[0022] Figure 3 This is a schematic diagram showing the upper mold before it moves downwards during vertical fixed molding.

[0023] Figure 4 The diagram shows the upper mold moving downwards during vertical fixed molding.

[0024] Figure 5 The diagram shows a single-point contact rotational molding process.

[0025] Figure 6 The diagram shown is a schematic of the pin bending mold of the first packaging structure in the embodiment of this utility model.

[0026] Figure 7 The diagram shown is a schematic of the pin bending mold for the second type of packaging structure in this embodiment of the present invention.

[0027] Component designation explanation

[0028] 1 Packaging Structure

[0029] 100 pins

[0030] 101 heatsink

[0031] 2. Lower mold

[0032] 200 Lower mold first side support plate

[0033] 201 Second side support plate of the lower mold

[0034] 202 Lower mold bottom support plate

[0035] 3. Upper mold

[0036] 300 Upper mold first side support plate

[0037] 301 Upper mold second side support plate

[0038] 302 Upper mold top support plate

[0039] 4. Rotational Structure

[0040] 5 limit blocks

[0041] 6. Adjustable seat

[0042] 7 Rotating structural support base

[0043] 8 Fixed boss Detailed Implementation

[0044] like Figure 1The diagram shown is a schematic of the TO-263 package structure before pin bending. Package structure 1 includes a first side and a second side arranged opposite to each other. The first side has pins 100, and the second side has a heat sink 101. Figure 2 The image shows a schematic diagram of the TO-263 package pins after bending. Pin 100, after bending, forms a Z-shaped structure. There are two ways to bend the package pins; the first is a vertically fixed molding method. Please refer to [link to relevant documentation]. Figure 3 and Figure 4 The lower mold 2 is fixed in place. A lifting seat 6 is provided on the bottom support plate of the lower mold. The encapsulation structure 1 is placed on the lifting seat 6. The fixed boss 8 is fixed on the side of the lower mold 2. When the upper mold 3 moves towards the lower mold 2, it pushes against the encapsulation structure 1 and moves downwards. During the downward movement of the encapsulation structure 1, the fixed boss 8 pushes against the pin 100 and contacts the side arc-shaped end of the upper mold 3, causing the pin 100 to bend. In this method, the area of ​​the fixed boss 8 rubbing against the pin 100 is relatively large, posing a risk of solder scraping. The second method is a single-point contact rotational molding method; please refer to [link to relevant documentation]. Figure 5 The lower mold 2 has a rotating structure 4 on its side. When the upper mold 3 moves downward, it drives the rotating structure 4 to rotate synchronously. The rotating structure 4 presses against the pin 100 and contacts the arc-shaped end of the side of the upper mold 3, causing the pin 100 to bend. In this method, the rotating structure 4 and the pin 100 have a single-point contact, which effectively reduces the contact area between the rotating structure 4 and the pin 100 and reduces abnormal solder scraping of the pin 100. However, due to the instability of the stamping pressure, the rotating structure 4 may over-rotate, resulting in poor bending stability of the pin 100. Therefore, the purpose of this application is to provide a pin bending mold for a packaging structure to improve the stability of pin bending.

[0045] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0046] Please see Figure 6 and Figure 7 It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show the components related to this utility model and are not drawn according to the actual number, shape and size of the components. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0047] This embodiment provides a package structure with pins molded. Please refer to [link to relevant documentation]. Figure 6The system includes a lower mold 2, an upper mold 3, a rotating structure 4, and a limiting block 5. The lower mold 2 includes a first side support plate 200. The upper mold 3 is located above the lower mold 2 and includes a first side support plate 300. The end of the first side support plate 300 facing the lower mold 2 is arc-shaped. The first side support plate 200 of the lower mold and the first side support plate 300 of the upper mold cooperate to clamp the pin 100. The rotating structure 4 is located on the side of the first side support plate 200 of the lower mold. The rotating structure 4 is spaced at a preset distance from the first side support plate 200 of the lower mold. When the rotating structure 4 contacts the pin 100 and rotates in the direction facing the first side support plate 200 of the lower mold, the pin 100 deforms in contact with the arc-shaped end. The limiting block 5 is used to limit the rotation angle of the rotating structure 4.

[0048] As an example, in the direction from the first side support plate 200 of the lower mold to the rotating structure 4, at least a portion of the first side support plate 300 of the upper mold protrudes from the first side support plate 200 of the lower mold, so that when the rotating structure 4 rotates, it can abut against the pin 100 and contact the arc-shaped end of the first side support plate 300 of the upper mold.

[0049] As an example, the lower mold 2 further includes a second side support plate 201, and the upper mold 3 further includes a second side support plate 301. The second side support plate 201 of the lower mold and the second side support plate 301 of the upper mold cooperate to clamp the heat sink 101.

[0050] As an example, the lower mold 2 also includes a lower mold bottom support plate 202, which is located below the lower mold first side support plate 200 and the lower mold second side support plate 201. The lower mold first side support plate 200 and the lower mold second side support plate 201 are both connected to the lower mold bottom support plate 202, and the lower mold bottom support plate 202 is used to provide support for the lower mold first side support plate 200 and the lower mold second side support plate 201.

[0051] As an example, the upper mold 3 also includes an upper mold top support plate 302, which is located above the upper mold first side support plate 300 and the upper mold second side support plate 301. The upper mold first side support plate 300 and the upper mold second side support plate 301 are both connected to the upper mold top support plate 302. When the upper mold top support plate 302 moves toward or away from the lower mold 2, it drives the upper mold first side support plate 300 and the upper mold second side support plate 301 to move toward or away from the lower mold 2.

[0052] As an example, a lifting seat 6 is also included. The lifting seat 6 is located above the bottom support plate 202 of the lower mold and between the first side support plate 200 and the second side support plate 201 of the lower mold. The packaging structure 1 is placed on the lifting seat 6. When the upper mold 3 moves against the packaging structure 1, the lifting seat 6 is used to provide stable support for the packaging structure 1.

[0053] As an example, the lifting seat 6 is connected to the bottom support plate 202 of the lower mold via elastic elements such as springs.

[0054] As an example, when the upper mold 3 moves downward, it drives the rotating structure 4 to rotate synchronously. The rotating structure 4 makes single-point contact with the pin 100 to avoid the rotating structure 4 scratching the pin 100, thereby avoiding the risk of the pin 100 being scratched and thus avoiding the risk of solder damage.

[0055] As an example, a rotating structure support 7 is provided below the rotating structure 4 to provide support for the rotating structure 4.

[0056] As an example, the limiting block 5 is located below the rotating structure 4. When the rotating structure 4 rotates to a preset position, the bottom surface of the rotating structure 4 contacts the limiting block 5, which can accurately control the rotation angle and position of the rotating structure 4, thereby effectively controlling the bending stability of the pin 100.

[0057] As an example, in another example, such as Figure 7 As shown, the limiting block 5 is located on the side of the first side support plate 200 of the lower mold. When the rotating structure 4 rotates to a preset position, the side of the rotating structure 4 contacts the limiting block 5, which can accurately control the rotation angle and position of the rotating structure 4, thereby effectively controlling the bending stability of the pin 100. In another example, the limiting block 5 can also be divided into two parts: one part is located below the rotating structure 4, and the other part is located on the side of the first side support plate 200 of the lower mold, so as to accurately control the rotation angle and position of the rotating structure 4. The two parts of the limiting block 5 can be used separately or in combination.

[0058] As an example, in the pin bending mold of the packaging structure in this embodiment, the rotation angle and position of the rotating structure 4 are precisely controlled by setting the limiting block 5, and the process capability (CPK) is 1.63, while the process capability of the pin bending mold of the packaging structure without the limiting block is 1.31. That is, the process of the pin bending mold of the packaging structure in this application is more stable, effectively controlling the stability of the pin bending 100, and ensuring the accuracy and consistency of the product.

[0059] In summary, the pin bending mold of this utility model, by setting a limiting block, precisely controls the rotation angle and position of the rotating structure, effectively controlling the stability of pin bending, ensuring product accuracy and consistency, and meeting high-quality control requirements. Therefore, this utility model effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0060] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A pin bending die for a packaging structure, the packaging structure comprising a first side and a second side disposed opposite to each other, the first side having pins and the second side having a heat sink, characterized in that... include: The lower mold includes a first side support plate of the lower mold; An upper mold is located above the lower mold. The upper mold includes a first side support plate, and the end of the first side support plate facing the lower mold is an arc-shaped end. The first side support plate of the lower mold and the first side support plate of the upper mold cooperate to clamp the pin. A rotating structure is located on the side of the first side support plate of the lower mold. The rotating structure is spaced at a preset distance from the first side support plate of the lower mold. When the rotating structure contacts the pin and rotates in the direction toward the first side support plate of the lower mold, the pin contacts and deforms with the arc-shaped end. The limiting block is used to limit the rotation angle of the rotating structure.

2. The pin bending die for the packaging structure according to claim 1, characterized in that: The lower mold further includes a second side support plate, and the upper mold further includes a second side support plate. The second side support plate of the lower mold and the second side support plate of the upper mold cooperate to clamp the heat sink.

3. The pin bending die for the packaging structure according to claim 2, characterized in that: The lower mold also includes a bottom support plate, which is located below the first side support plate and the second side support plate of the lower mold. Both the first side support plate and the second side support plate of the lower mold are connected to the bottom support plate of the lower mold.

4. The pin bending die for the packaging structure according to claim 3, characterized in that: It also includes a lifting seat, which is located above the bottom support plate of the lower mold and between the first side support plate and the second side support plate of the lower mold.

5. The pin bending die for the packaging structure according to claim 2, characterized in that: The upper mold also includes a top support plate, which is located above the first side support plate and the second side support plate of the upper mold. The first side support plate and the second side support plate of the upper mold are both connected to the top support plate of the upper mold. When the top support plate of the upper mold moves toward or away from the lower mold, it drives the first side support plate and the second side support plate of the upper mold to move toward or away from the lower mold.

6. The pin bending die for the packaging structure according to claim 1, characterized in that: The limiting block is located below the rotating structure.

7. The pin bending die for the packaging structure according to claim 1, characterized in that: The limiting block is located on the side of the first side support plate of the lower mold.

8. The pin bending die for the packaging structure according to claim 1, characterized in that: The limiting block comprises two parts: one part is located below the rotating structure, and the other part is located on the side of the first side support plate of the lower mold.

9. The pin bending die for the packaging structure according to claim 1, characterized in that: It also includes a rotating structure support base, which is located below the rotating structure.

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