Potting mold for X-ray source voltage-multiplying module

Abstract

The utility model belongs to the technical field of X-ray sources, and discloses an X-ray source voltage-multiplying module encapsulation mold, which comprises a bottom sealing plate, side sealing plates, a copper column positioning mold and a channel embedding mold, a cavity with an upper opening is enclosed by the bottom sealing plate and the plurality of side sealing plates, and the cavity is used for injecting liquid epoxy resin to cure an epoxy resin block of a voltage-multiplying module; the copper column positioning die is arranged on one side sealing plate and is used for positioning and supporting a hollow copper column of the voltage-multiplying module; the channel embedded die is arranged on the bottom sealing plate and used for forming an internal channel of the voltage-multiplying module. According to the X-ray source voltage-multiplying module encapsulating mold, the epoxy resin block, the internal channel of the epoxy resin block and the pre-embedded hollow copper column can be integrally formed into the voltage-multiplying module, the forming difficulty of the voltage-multiplying module is reduced, various functional requirements are met, and the performance of an X-ray source is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of X-ray source technology, and in particular to a potting mold for an X-ray source voltage multiplier module. Background Technology

[0002] Existing X-ray sources mainly consist of an X-ray tube, a voltage multiplier module, and a sealing cylinder. The X-ray tube has an anode electrically connected to the voltage multiplier module. The sealing cylinder is fitted over the anode, and its two ends are fixedly connected to the X-ray tube and the voltage multiplier module respectively, forming a sealed space filled with insulating oil. The voltage multiplier module in an X-ray source primarily converts the input low-voltage signal into a higher output voltage to meet the high voltage requirements of the X-ray source.

[0003] A voltage multiplier module is an integrated voltage multiplier rectifier module that integrates the entire circuitry into a single device. Therefore, it is unaffected by vibration and humidity, and is resistant to gas corrosion, dust, and oil immersion, enabling it to operate normally in harsh environments. However, in addition to meeting the technological requirements of miniaturization, integration, and reliability, voltage multiplier modules must also possess high-voltage insulation capabilities and meet certain functional molding requirements, such as embedded parts and internal channels. These factors increase the design and molding complexity of voltage multiplier modules. Utility Model Content

[0004] Based on the above problems, the purpose of this utility model is to provide a potting mold for an X-ray source voltage multiplier module, so as to form the voltage multiplier module and its functional features to meet the usage requirements.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An X-ray source voltage multiplier module potting mold is used to form a voltage multiplier module. The voltage multiplier module includes an epoxy resin block, a circuit board is disposed inside the epoxy resin block, and a hollow copper pillar is embedded in the first side surface of the epoxy resin block. The hollow copper pillar is used to make electrical contact with an external anode and to be electrically connected to the circuit board. An internal channel is also provided in the epoxy resin block, extending from the second side surface of the epoxy resin block to communicate with the inner cavity of the hollow copper pillar.

[0007] The X-ray source voltage multiplier module potting mold includes a bottom sealing plate, side sealing plates, a copper pillar positioning mold, and a channel insert mold. The bottom sealing plate and multiple side sealing plates form an upper-opening cavity, which is used to inject liquid epoxy resin to cure into an epoxy resin block. The copper pillar positioning mold is set on one of the side sealing plates and is used to position and support the hollow copper pillar. The channel insert mold is set on the bottom sealing plate and is used to form the internal channel.

[0008] As an alternative, the internal channel is straight, and the channel molding includes a round bar that penetrates the bottom sealing plate. The outer end of the round bar is provided with an end face flange, and the inner end of the round bar extends to the hollow copper column. The draft angle of the round bar is 1°.

[0009] As an alternative, the internal channel is curved, and the channel molding includes a PTFE hose that penetrates the bottom sealing plate. The outer end of the PTFE hose is provided with an end cap, and the inner end of the PTFE hose extends to the hollow copper column. The PTFE hose is curved and arranged according to the target shape and is pulled out after the epoxy resin block is cured.

[0010] As an alternative, the surface of the PTFE hose is coated with a release agent, and high-pressure air is introduced into the PTFE hose before it is pulled out to loosen the separation between the PTFE hose and the epoxy resin block.

[0011] As an alternative, the copper column positioning mold is provided with a protrusion that can be inserted into the inner cavity of the hollow copper column.

[0012] As an alternative, the first side surface of the epoxy resin block is provided with annular bosses arranged around the hollow copper pillar to enhance insulation.

[0013] As an optional solution, the potting mold for the X-ray source voltage multiplier module also includes a boss outer mold. An opening corresponding to the forming position of the annular boss is provided on a side sealing plate. The boss outer mold is set at the opening. The end of the copper pillar positioning mold blocks the port of the boss outer mold. A gap is formed between the outer wall of the copper pillar positioning mold and the inner wall of the boss outer mold. The gap is used to form the annular boss.

[0014] The beneficial effects of this utility model are as follows: The potting mold for the X-ray source voltage multiplier module can realize the integral molding of the epoxy resin block, its internal channels, and the pre-embedded hollow copper pillar into a voltage multiplier module, which reduces the molding difficulty of the voltage multiplier module, meets various functional requirements, and ensures the performance of the X-ray source. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the potting mold for the X-ray source voltage multiplier module provided in this embodiment of the utility model;

[0016] Figure 2 This is a bottom view of the potting mold for the X-ray source voltage multiplier module provided in this embodiment of the utility model;

[0017] Figure 3 This is a schematic diagram of the voltage multiplier module involved in an embodiment of this utility model;

[0018] Figure 4 This is a schematic diagram of the forming of a linear internal channel according to an embodiment of the present utility model;

[0019] Figure 5This is a schematic diagram of the forming of the curved internal channel involved in the embodiment of this utility model.

[0020] In the attached image:

[0021] 10. Voltage multiplier module; 11. Epoxy resin block; 12. Circuit board; 13. Hollow copper pillar; 14. Internal channel; 15. Annular boss;

[0022] 1. Bottom sealing plate; 2. Side sealing plate; 3. Copper column positioning mold; 31. Protrusion; 4. Channel insert mold; 41. Round bar; 42. End flange; 43. PTFE hose; 44. End cap; 5. Cavity; 6. Boss outer mold. Detailed Implementation

[0023] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0024] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0025] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0026] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0027] Please see Figures 1 to 5 As shown, this preferred embodiment provides an X-ray source voltage multiplier module potting mold for molding a voltage multiplier module 10. The voltage multiplier module 10 includes an epoxy resin block 11, a circuit board 12 is disposed inside the epoxy resin block 11, and a hollow copper pillar 13 is embedded in the first side surface of the epoxy resin block 11. The hollow copper pillar 13 is used to make electrical contact with the external anode and to be electrically connected to the circuit board 12. An internal channel 14 is also provided in the epoxy resin block 11, extending from the second side surface of the epoxy resin block 11 to communicate with the inner cavity of the hollow copper pillar 13.

[0028] The X-ray source voltage multiplier module potting mold includes a bottom sealing plate 1, side sealing plates 2, copper pillar positioning mold 3, and channel insert mold 4. The bottom sealing plate 1 and multiple side sealing plates 2 form an upper-opening cavity 5, which is used to inject liquid epoxy resin to cure into an epoxy resin block 11. The copper pillar positioning mold 3 is set on one of the side sealing plates 2 and is used to position and support the hollow copper pillar 13. The channel insert mold 4 is set on the bottom sealing plate 1 and is used to form the internal channel 14.

[0029] The voltage multiplier module 10 here is integrally molded using a solid potting process. Liquid epoxy resin A and B are thoroughly mixed and injected into the cavity 5 where the circuit board 12 and the hollow copper pillar 13 are placed. Then, appropriate temperature and pressure are applied to cure it. After removing the bottom sealing plate 1, each side sealing plate 2, the copper pillar positioning mold 3, and the channel insert mold 4, the integral voltage multiplier module 10 can be obtained.

[0030] Therefore, the epoxy resin block 11, its internal channel 14, and the pre-embedded hollow copper column 13 can be integrally molded into a voltage multiplier module 10, which reduces the molding difficulty of the voltage multiplier module 10, meets various functional requirements, and ensures the performance of the X-ray source.

[0031] For cases where the internal channel 14 is straight, the channel insert 4 includes a cylindrical rod 41 that penetrates the bottom sealing plate 1. The outer end of the cylindrical rod 41 is provided with an end face flange 42, and the inner end of the cylindrical rod 41 extends to the hollow copper column 13. See details. Figure 4 Specifically, the draft angle of the cylindrical rod 41 is approximately 1°, which facilitates demolding after curing; the cylindrical rod 41 can be pulled out axially.

[0032] The design length of the internal channel 14 needs to be calculated based on the insulation coefficient of the insulating oil and the voltage of the X-ray source to determine the insulation distance. If the insulation distance of the straight internal channel 14 is insufficient, the channel can be designed as a bend to increase the total length of the oil path and thus increase the insulation distance.

[0033] To address the issue of a curved internal channel 14, the channel insert 4 includes a PTFE flexible tube 43 that penetrates the bottom sealing plate 1. The outer end of the PTFE flexible tube 43 is fitted with an end cap 44, and the inner end of the PTFE flexible tube 43 extends to the hollow copper pillar 13. The PTFE flexible tube 43 replaces the cylindrical rod 41. See details... Figure 5 The polytetrafluoroethylene hose 43 is bent and arranged according to the target shape and then pulled out after the epoxy resin block 11 is cured.

[0034] Furthermore, the demolding process of the PTFE hose 43 is slightly different from that of the cylindrical rod 41. The surface of the PTFE hose 43 is coated with a release agent, and high-pressure air is introduced into the PTFE hose 43 before it is pulled out, so that the PTFE hose 43 and the epoxy resin block 11 are separated and loosened, making it easier to pull out the PTFE hose 43 when facing the curved internal channel 14.

[0035] Optionally, the copper pillar positioning mold 3 is provided with a protrusion 31 that is inserted into the inner cavity of the hollow copper pillar 13, so as to determine the position of the hollow copper pillar 13 and avoid the hollow copper pillar 13 from shifting when liquid epoxy resin is injected.

[0036] Optionally, the first side surface of the epoxy resin block 11 is provided with an annular boss 15 arranged around the hollow copper pillar 13 to enhance insulation. Specifically, the annular boss 15 is located between the anode and the outer sealing cylinder. Since the insulation coefficient of solid epoxy resin is higher than that of insulating oil, it can effectively enhance the insulation effect between the anode and the sealing cylinder. The thickness and height of the annular boss 15 are set according to the insulation requirements.

[0037] Furthermore, the X-ray source voltage multiplier module potting mold also includes a boss outer mold 6. An opening corresponding to the forming position of the annular boss 15 is provided on a side sealing plate 2. The boss outer mold 6 is set at the opening. The end of the copper pillar positioning mold 3 blocks the port of the boss outer mold 6. A gap is formed between the outer wall of the copper pillar positioning mold 3 and the inner wall of the boss outer mold 6. The gap is used to form the annular boss 15, so that the annular boss 15 is formed integrally when potting the voltage multiplier module 10.

[0038] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. An X-ray source voltage multiplier module potting mold, used for molding a voltage multiplier module (10), characterized in that, The voltage multiplier module (10) includes an epoxy resin block (11), a circuit board (12) is disposed inside the epoxy resin block (11), a hollow copper pillar (13) is embedded in the first side surface of the epoxy resin block (11), the hollow copper pillar (13) is used to make electrical contact with the external anode and to be electrically connected to the circuit board (12), and an internal channel (14) is also provided in the epoxy resin block (11) extending from the second side surface of the epoxy resin block (11) to communicate with the inner cavity of the hollow copper pillar (13); The X-ray source voltage multiplier module potting mold includes a bottom sealing plate (1), a side sealing plate (2), a copper pillar positioning mold (3), and a channel insert mold (4). The bottom sealing plate (1) and multiple side sealing plates (2) form an upper-opening cavity (5). The cavity (5) is used to inject liquid epoxy resin to cure it into the epoxy resin block (11). The copper pillar positioning mold (3) is set on one of the side sealing plates (2) and is used to position and support the hollow copper pillar (13). The channel insert mold (4) is set on the bottom sealing plate (1) and is used to form the internal channel (14).

2. The potting mold for the X-ray source voltage multiplier module according to claim 1, characterized in that, The internal channel (14) is straight. The channel insert (4) includes a round rod (41) that penetrates the bottom sealing plate (1). The outer end of the round rod (41) is provided with an end face flange (42). The inner end of the round rod (41) extends to the hollow copper column (13). The draft angle of the round rod (41) is 1°.

3. The potting mold for the X-ray source voltage multiplier module according to claim 1, characterized in that, The internal channel (14) is curved. The channel insert (4) includes a polytetrafluoroethylene (PTFE) hose (43) that penetrates the bottom sealing plate (1). The outer end of the PTFE hose (43) is provided with an end cap (44). The inner end of the PTFE hose (43) extends to the hollow copper column (13). The PTFE hose (43) is bent and arranged according to the target shape and is pulled out after the epoxy resin block (11) is cured.

4. The potting mold for the X-ray source voltage multiplier module according to claim 3, characterized in that, The surface of the polytetrafluoroethylene hose (43) is coated with a release agent, and high-pressure air is introduced into the polytetrafluoroethylene hose (43) before it is pulled out, so as to loosen the separation between the polytetrafluoroethylene hose (43) and the epoxy resin block (11).

5. The potting mold for the X-ray source voltage multiplier module according to claim 1, characterized in that, The copper column positioning mold (3) is provided with a protrusion (31) that is inserted into the inner cavity of the hollow copper column (13).

6. The potting mold for the X-ray source voltage multiplier module according to claim 1, characterized in that, The first side surface of the epoxy resin block (11) is provided with an annular boss (15) arranged around the hollow copper pillar (13) to enhance insulation.

7. The potting mold for the X-ray source voltage multiplier module according to claim 6, characterized in that, The X-ray source voltage multiplier module potting mold also includes a boss outer mold (6). One of the side sealing plates (2) is provided with an opening corresponding to the forming position of the annular boss (15). The boss outer mold (6) is located at the opening. The end of the copper pillar positioning mold (3) blocks the port of the boss outer mold (6). A gap is formed between the outer wall of the copper pillar positioning mold (3) and the inner wall of the boss outer mold (6). The gap is used to form the annular boss (15).

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