Combined insoluble anode structure of pulse plating line
By using a combined insoluble anode structure, utilizing the division of labor between electroplating anodes and protective anodes, and combining anode diaphragms and unidirectional circuit control, the problems of anode corrosion and decreased conductivity in pulse electroplating are solved, thereby improving electroplating precision and equipment miniaturization capabilities.
Patent Information
- Application Number
- CN202423043218.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-10
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2034-12-10
AI Technical Summary
Existing pulse electroplating insoluble anodes are prone to problems such as surface hydrogen evolution corrosion and oxygen decomposition of macromolecular compounds. Furthermore, the conductivity of inert inorganic non-metallic conductive materials is limited, and they are prone to decomposition after long-term use, affecting the electroplating quality.
It adopts a combined insoluble anode structure, including an electroplating anode and a protective anode. The macromolecular compound is isolated by an anode diaphragm, and a unidirectional circuit control system is set up. The protective anode carries the reverse current, and the electroplating anode carries the forward current, which enhances the strength and conductivity of the anode diaphragm.
It improves the strength and penetration efficiency of the anode diaphragm, reduces hydrogen evolution corrosion, enhances processing precision and electroplating quality, and meets the requirements for equipment miniaturization.
Smart Images
Figure CN223510028U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the design and processing of electroplating equipment, and in particular to a combined insoluble anode structure for a pulse electroplating line. Background Technology
[0002] Pulse electroplating plays an important role in the electroplating process of circuit boards. Compared with the single DC electroplating method, pulse electroplating has a good ability to process deep holes (with a large ratio between the board body and the hole diameter). The current in pulse electroplating is a process in which the positive and negative electrodes are constantly changed according to time. Therefore, during electroplating, the roles of the electroplating anode and the electroplating cathode will also switch accordingly.
[0003] Insoluble anodes (used in conjunction with copper ion plating solutions) offer advantages over traditional metal sphere anodes (copper spheres used in circuit board manufacturing) in terms of processing precision and the generation of less anode sludge.
[0004] Currently, pulse electroplating uses insoluble anodes, which easily leads to surface hydrogen evolution corrosion, the generation of oxygen during the electrolysis process causing the oxidation and decomposition of macromolecular compounds such as brighteners in the solution, and the problem of metal (mainly copper) being plated onto the surface due to long-term reverse current.
[0005] Therefore, methods have emerged that use inert inorganic non-metallic conductive materials such as graphite and graphene as insoluble anodes, or that fabricate inert inorganic non-metallic conductive materials on the surface of insoluble metal anodes. These methods can improve hydrogen evolution corrosion and copper plating to a certain extent. However, since the conductivity of inert inorganic non-metallic conductive materials is limited and the materials themselves are relatively fragile, they are prone to decreased conductivity and decomposition after long-term use, and are also prone to producing impurities, affecting the electroplating quality.
[0006] Based on the above background technology and problems, a combined insoluble anode structure for pulse electroplating lines is provided for the insoluble anode of pulse electroplating lines. Utility Model Content
[0007] This invention aims to solve the problems of surface hydrogen evolution corrosion and oxygen decomposition of macromolecular compounds that easily occur with the insoluble anodes of existing pulse electroplating technology. It provides a combined insoluble anode structure for a pulse electroplating line, comprising a pulse rectifier, an anode, and a cathode. The anode is electrically connected to the positive terminal of the pulse rectifier, and the cathode is electrically connected to the cathode of the pulse rectifier. The anode is insoluble and includes an electroplating anode and a protective anode. The electroplating anode and the protective anode are not in contact with each other and are independently electrically connected to the positive terminal of the pulse rectifier. An anode diaphragm is provided between the electroplating anode and the cathode. The anode diaphragm is attached to the surface of the electroplating anode. A unidirectional circuit control system is provided between the electroplating anode and the positive terminal of the pulse rectifier.
[0008] Optionally, the anode membrane is a selectively permeable membrane, which is a cation exchange membrane.
[0009] Optionally, the cation exchange membrane is a sulfonic acid-based cation exchange membrane or a phosphate-based cation exchange membrane.
[0010] Optionally, the anode diaphragm is attached to one side of the electroplating anode and extends over the edge to cover the edge region of the other side; or, the anode diaphragm is attached to the entire surface of the electroplating anode.
[0011] Optionally, the anode is further provided with an insulating diaphragm, which is disposed between the electroplating anode and the protective anode.
[0012] Optionally, the insulating film is made of PE, PC, PP, PI, PVC, PET, PTFE, PMMA, ABS, ETFE, TPX, silicone, epoxy resin, acrylic, ceramic, or nano-ceramic composite epoxy resin.
[0013] Optionally, the electroplating anode, the insulating diaphragm, and the protective anode are stacked in sequence to form a single integral structure.
[0014] Optionally, the area of the electroplating anode is greater than or equal to the area of the protective anode, and the area of the insulating diaphragm is greater than or equal to the area of the protective anode.
[0015] Optionally, the anode is further provided with an insulating frame; the top end of the electroplating anode and the top end of the protective anode are fixed to the insulating frame.
[0016] The insulating frame is made of PE, PC, PP, PI, PVC, PET, PTFE, PMMA, ABS, ETFE, TPX, silicone, or epoxy resin.
[0017] This utility model's technical solution involves configuring the insoluble anode as a structure with both an electroplating anode and a protective anode, and setting up a unidirectional circuit control system to form a protective anode that protects the electroplating anode. An anode diaphragm is also incorporated, attached to the surface of the electroplating anode. This diaphragm allows electrons, water, and metal ions to pass through, but not organic macromolecular compounds such as brighteners. The anode diaphragm and the electroplating anode form a unified whole, effectively enhancing the strength and penetration efficiency of the anode diaphragm, thereby improving processing precision and reducing the anode volume, meeting the miniaturization design and application requirements of the equipment. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0019] Figure 1 This is a schematic diagram of the first combined type insoluble anode structure in this embodiment;
[0020] Figure 2 This is a schematic diagram of the second combined type insoluble anode structure in this embodiment;
[0021] Figure 3 This is a schematic diagram of the third type of combined insoluble anode structure in this embodiment;
[0022] Figure 4 This is a schematic diagram of the fourth type of combined insoluble anode structure in this embodiment;
[0023] Figure 5 This is a schematic diagram of the fifth combined type insoluble anode structure in this embodiment;
[0024] Figure 6 This is a schematic diagram of the sixth combined type insoluble anode structure in this embodiment;
[0025] Figure 7 This is a schematic diagram of the seventh combined type insoluble anode structure in this embodiment;
[0026] Figure 8 This is a schematic diagram of the eighth combined type insoluble anode structure in this embodiment;
[0027] Figure 9 This is a schematic diagram of the ninth combined type insoluble anode structure in this embodiment;
[0028] Figure 10This is a schematic diagram of the tenth combined type insoluble anode structure in this embodiment;
[0029] Figure 11 This is a schematic diagram of the insoluble anode arrangement in the vertical electroplating line structure of this embodiment;
[0030] Figure 12 This is a schematic diagram of the insoluble anode setting in the horizontal electroplating line structure of this embodiment.
[0031] Attached image captions:
[0032]
[0033] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0035] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.
[0036] Furthermore, in this utility model, the use of terms such as "first," "second," etc., is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0037] Please see Figure 1 and Figure 2 ; Figure 1 This is a schematic diagram of the first combined type insoluble anode structure in this embodiment; Figure 2 This is a schematic diagram of the second combined type of insoluble anode structure in this embodiment.
[0038] The combined insoluble anode structure of the pulse electroplating line provided in this embodiment includes a pulse rectifier, an anode, and a cathode. The anode is electrically connected to the positive terminal of the pulse rectifier, and the cathode is electrically connected to the cathode of the pulse rectifier.
[0039] The anode is an insoluble anode, which includes an electroplating anode and a protective anode; the electroplating anode and the protective anode do not contact each other and are independently electrically connected to the positive terminal of the pulse rectifier; an anode diaphragm is provided between the electroplating anode and the cathode; the anode diaphragm is attached to the surface of the electroplating anode; a one-way circuit control system is provided between the electroplating anode and the positive terminal of the pulse rectifier.
[0040] In this embodiment, the electroplating anode functions as the electroplating anode when the pulse current is a forward current, and the protective anode functions as the reverse current when the pulse current is a reverse current, thus protecting the electroplating anode when a reverse current is generated. At the same time, a one-way circuit control system is set up so that the reverse current can only pass through the protective anode and not through the electroplating anode.
[0041] Since the anode is placed in the electroplating solution in the electroplating tank, the electroplating solution contains a large number of macromolecular compounds that assist in electroplating, such as brighteners. During electroplating, the insoluble anode will generate (hydrogen and) oxygen due to the electrolysis of water. If the macromolecular compounds come into contact with the anode, the oxygen will easily cause them to oxidize and decompose. Therefore, this embodiment sets up an anode diaphragm with a membrane having small pores and mesh, forming a membrane that allows particles such as electroplating solution, cations, and electrons to pass through, but prevents the macromolecular compounds from contacting the anode and causing oxidation and decomposition.
[0042] Since the anode diaphragm needs to isolate macromolecular compounds without blocking other particles, its thickness is generally thin. However, during the electroplating process, the solution in the electroplating tank needs to be stirred, turbulent, and sprayed. If the anode diaphragm is set up alone, problems such as membrane rupture, deformation, and tearing are likely to occur. Therefore, in this embodiment, the anode diaphragm is made into a form that is attached to the surface of the electroplating anode, which can effectively increase the reliability and service life of the anode diaphragm. Preferably, a cation exchange agent can be used to prepare a cation exchange dynamic resin, and a cation exchange membrane can be formed on the surface of the electroplating anode by means of spraying, screen printing, casting, coating, pressing, etc., followed by drying.
[0043] Since the protective anode only serves to receive the reverse current of the pulse and protect the electroplating anode, it can be placed on either side of the electroplating anode (e.g., Figure 2 (As shown).
[0044] Preferably, the anode diaphragm is a selectively permeable membrane, and the selectively permeable membrane is a cation exchange membrane.
[0045] Preferably, the cation exchange membrane is a sulfonic acid-based cation exchange membrane or a phosphate-based cation exchange membrane.
[0046] Please see Figure 3 and Figure 4 ; Figure 3 This is a schematic diagram of the third type of combined insoluble anode structure in this embodiment; Figure 4 This is a schematic diagram of the fourth type of combined insoluble anode structure in this embodiment.
[0047] Preferably, the anode diaphragm is attached to one side of the electroplating anode and extends over the edge to cover the edge region of the other side; or, the anode diaphragm is attached to the entire surface of the electroplating anode.
[0048] In the electroplating process of planar workpieces such as circuit boards, the anode is generally also planar, with one side facing the cathode. This cathode-facing side will generate stronger electron and ion transfer processes with the cathode, resulting in greater losses such as oxidation of organic macromolecules. Therefore, the anode diaphragm facing the cathode can be set to partially enclose the electroplating anode, blocking most of the contact; or the anode diaphragm can be attached to the entire surface of the electroplating anode, forming an enclosed state, thus creating all-round isolation between the electroplating anode and organic macromolecules.
[0049] Please see Figures 5 to 9 ; Figure 5 This is a schematic diagram of the fifth combined type insoluble anode structure in this embodiment; Figure 6 This is a schematic diagram of the sixth combined type insoluble anode structure in this embodiment; Figure 7 This is a schematic diagram of the seventh combined type insoluble anode structure in this embodiment; Figure 8 This is a schematic diagram of the eighth combined type insoluble anode structure in this embodiment; Figure 9 This is a schematic diagram of the ninth combined type of insoluble anode structure in this embodiment.
[0050] Preferably, the anode is further provided with an insulating diaphragm, which is disposed between the electroplating anode and the protective anode.
[0051] Preferably, the insulating film is made of PE, PC, PP, PI, PVC, PET, PTFE, PMMA, ABS, ETFE, TPX, silicone, epoxy resin, acrylic, ceramic or nano-ceramic composite epoxy resin.
[0052] Preferably, the electroplating anode, the insulating diaphragm, and the protective anode are stacked in sequence to form a single integral structure.
[0053] Since the electroplating anode carries the forward current of the pulse current and the protective anode carries the reverse current of the pulse current, the two cannot come into contact. Setting an insulating diaphragm to isolate the two allows them to form a whole through the insulating diaphragm, which can reduce the volume of the anode and thus make it possible to arrange the anode in a smaller space. Preferably, the insulating diaphragm can be glued, heat-fused, riveted, or snapped to form a single whole structure of the electroplating anode, insulating diaphragm and protective anode.
[0054] Preferably, the area of the electroplating anode is greater than or equal to the area of the protective anode, and the area of the insulating diaphragm is greater than or equal to the area of the protective anode.
[0055] If the protective anode is positioned between the electroplating anode and the cathode, it can preferably be configured as a mesh structure or a structure where the area of the protective anode is smaller than that of the electroplating anode. This avoids the protective anode blocking the electron and ion exchange between the electroplating anode and the cathode. When the protective anode is smaller than or equal to the electroplating anode, the insulating diaphragm needs to play an insulating and barrier role, and its area needs to be greater than or equal to the area of the protective anode.
[0056] Please see Figure 10 ; Figure 10 This is a schematic diagram of the tenth combined type of insoluble anode structure in this embodiment.
[0057] In one implementation, the anode is also provided with an insulating frame; the top of the electroplating anode and the top of the protective anode are fixed to the insulating frame.
[0058] As one implementation method, the insulating frame is made of PE, PC, PP, PI, PVC, PET, PTFE, PMMA, ABS, ETFE, TPX, silicone, or epoxy resin.
[0059] When there is enough space in the electroplating line, an insulating frame can be used to fix the various parts of the anode to ensure the stability and reliability of the anode.
[0060] Please see Figure 11 ; Figure 11 This is a schematic diagram of the insoluble anode arrangement in the vertical electroplating line structure of this embodiment.
[0061] It is worth noting that the combined insoluble anode structure of this embodiment can be applied to a vertical electroplating line, that is, both the anode and the cathode to be electroplated are perpendicular to the horizontal plane, and a left anode is set on the left side of the cathode and a right anode is set on the right side, so as to electroplat the left and right sides of the cathode to be electroplated simultaneously.
[0062] Please see Figure 12 ; Figure 12 This is a schematic diagram of the insoluble anode setting in the horizontal electroplating line structure of this embodiment.
[0063] The combined insoluble anode structure of this embodiment can also be applied to a horizontal electroplating line. That is, both the anode and the cathode to be electroplated are parallel to the horizontal plane. An upper anode is set above the cathode to be electroplated, and a lower anode is set below it, so that the upper and lower surfaces of the cathode to be electroplated are electroplated simultaneously.
Claims
1. A combined insoluble anode structure for a pulse electroplating line, the pulse electroplating line comprising a pulse rectifier, an anode, and a cathode, wherein the anode is electrically connected to the positive terminal of the pulse rectifier, and the cathode is electrically connected to the cathode of the pulse rectifier; Its features are, The anode is an insoluble anode, which includes an electroplating anode and a protective anode; The electroplating anode and the protective anode are not in contact with each other and are independently electrically connected to the positive terminal of the pulse rectifier; An anode diaphragm is provided between the electroplating anode and the cathode; The anode diaphragm is attached to the surface of the electroplating anode; A one-way circuit control system is provided between the electroplating anode and the positive electrode of the pulse rectifier.
2. The combined insoluble anode structure of a pulse electroplating line as described in claim 1, characterized in that, The anode diaphragm is a selectively permeable membrane, and the selectively permeable membrane is a cation exchange membrane.
3. The combined insoluble anode structure of a pulse electroplating line as described in claim 2, characterized in that, The cation exchange membrane is a sulfonic acid-based cation exchange membrane or a phosphate-based cation exchange membrane.
4. The combined insoluble anode structure of a pulse electroplating line as described in claim 1, characterized in that, The anode diaphragm is attached to one side of the electroplating anode and extends over the edge to cover the edge region of the other side; or, the anode diaphragm is attached to the entire surface of the electroplating anode.
5. A combined insoluble anode structure for a pulse electroplating line as described in claim 1 or 4, characterized in that, The anode is also provided with an insulating diaphragm, which is disposed between the electroplating anode and the protective anode.
6. The combined insoluble anode structure of a pulse electroplating line as described in claim 5, characterized in that, The insulating diaphragm is made of PE, PC, PP, PI, PVC, PET, PTFE, PMMA, ABS, ETFE, TPX, silicone, epoxy resin, acrylic, ceramic or nano-ceramic composite epoxy resin.
7. The combined insoluble anode structure of a pulse electroplating line as described in claim 5, characterized in that, The electroplating anode, the insulating diaphragm, and the protective anode are stacked in sequence to form a single integral structure.
8. The combined insoluble anode structure of a pulse electroplating line as described in claim 7, characterized in that, The area of the electroplating anode is greater than or equal to the area of the protective anode, and the area of the insulating diaphragm is greater than or equal to the area of the protective anode.
9. A combined insoluble anode structure for a pulse electroplating line as described in claim 1 or 4, characterized in that, The anode is also provided with an insulating frame; the top end of the electroplating anode and the top end of the protective anode are fixed to the insulating frame.
10. The combined insoluble anode structure of a pulse electroplating line as described in claim 9, characterized in that, The insulating frame is made of PE, PC, PP, PI, PVC, PET, PTFE, PMMA, ABS, ETFE, TPX, silicone, or epoxy resin.