Electronic device

Abstract

Disclosed is an electronic device including a sensor layer including a first sensing electrode extending in a first direction, a second sensing electrode extending in a second direction, and a first electrode extending in the first direction. The first sensing electrode includes a first sub-electrode, and the first electrode includes a second sub-electrode. The first sub-electrode includes a first pattern and a first bridge pattern electrically connected to the first pattern. The two first sub-electrodes are electrically connected to each other at one end portion via a first connecting line. Two second sub-electrodes overlapping the two first sub-electrodes are connected to each other at a second end portion via a second connecting line. The second connection line and another second connection line adjacent to the second connection line are electrically connected to each other via a third connection line. The first connection line is electrically connected to the first pad, and the third connection line is electrically connected to the second pad.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2023-0189453, filed with the Korean Intellectual Property Office on December 22, 2023, and Korean Patent Application No. 10-2024-0077741, filed with the Korean Intellectual Property Office on June 14, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] One aspect of the embodiments of this disclosure relates to electronic devices capable of sensing pen input. Background Technology

[0004] Multimedia electronic devices such as televisions, mobile phones, tablet computers, navigation units, and game consoles include display devices for displaying images. In addition to general input methods such as buttons, keyboards, or mice, electronic devices may also include a sensor layer (e.g., input sensors) capable of providing touch-based input methods, allowing users to easily input information or commands in an intuitive and convenient manner. The sensor layer can sense the user's touch or pressure.

[0005] Users familiar with pen input or those accustomed to more precise touch input in specific applications (e.g., applications for sketching or drawing) are increasingly reliant on pens.

[0006] The information disclosed in this background section is intended to enhance the understanding of the background of this disclosure, and therefore, the information may include information that does not constitute prior art. Utility Model Content

[0007] One or more embodiments of this disclosure may relate to electronic devices capable of sensing pen input.

[0008] According to one or more embodiments of this disclosure, an electronic device includes a substrate, a circuit layer on the substrate including transistors, a light-emitting element layer on the circuit layer including light-emitting elements electrically connected to the transistors, and a sensor layer on the light-emitting element layer. The sensor layer includes: a plurality of first sensing electrodes extending in a first direction; a plurality of second sensing electrodes extending in a second direction intersecting the first direction; and a plurality of first electrodes extending in the first direction. Each of the plurality of first sensing electrodes includes a plurality of first sub-electrodes, and each of the plurality of first electrodes includes a plurality of second sub-electrodes, each having a first end and a second end. Each of the plurality of first sub-electrodes includes a first pattern and a first bridging pattern electrically connected to the first pattern. Two adjacent first sub-electrodes are electrically connected to each other at one end via a first connecting line, and two adjacent second sub-electrodes overlapping two adjacent first sub-electrodes are connected to each other at a first end via a second connecting line. The second connecting line and another second connecting line adjacent to the second connecting line are electrically connected to each other via a third connecting line. The first connecting line is electrically connected to a first pad, and the third connecting line is electrically connected to a second pad.

[0009] In one embodiment, two adjacent first electrodes among a plurality of first electrodes may be electrically connected to each other at a first end via a first loop trace.

[0010] In one embodiment, multiple first electrodes may be electrically connected to each other at a second end via a second loop trace.

[0011] In one implementation, a first end of the second loop trace may be connected to a third pad, and a second end of the second loop trace opposite to the first end may be connected to another third pad. In charge-driven mode, the second pad is configured to receive a first signal, and one of the third pads is configured to receive a second signal.

[0012] In an implementation, the second signal may be the inverted signal of the first signal.

[0013] In one embodiment, some of the plurality of second sensing electrodes may be electrically connected from one end of the plurality of second sensing electrodes to some fourth pads, and other of the plurality of second sensing electrodes may be electrically connected from the opposite end of the other second sensing electrodes to other fourth pads.

[0014] In the implementation, in the mutual capacitance detection mode, the first pad can be configured to receive a transmission signal, and the fourth pad can be configured to transmit and receive signals.

[0015] According to one or more embodiments of this disclosure, an electronic device includes a substrate, a circuit layer on the substrate including transistors, a light-emitting element layer on the circuit layer including light-emitting elements electrically connected to the transistors, and a sensor layer on the light-emitting element layer. The sensor layer includes: a first sensing electrode extending in a first direction and including a first pattern and a first bridging pattern electrically connected to the first pattern; a second sensing electrode extending in a second direction intersecting the first direction and intersecting the first sensing electrode; a first electrode extending in the first direction; and a first dummy pattern insulated from the first sensing electrode. At least one of the first patterns includes a first portion, a second portion opposite to the first portion, and a third portion connected to an end of the first portion and an end of the second portion. The first dummy pattern is located between the first portion and the second portion, and the first electrode overlaps with the first dummy pattern and the first and second portions of at least one first pattern. The first electrode and the first bridging pattern are located in a first layer, and the first pattern, the second sensing electrode, and the first dummy pattern are located in a second layer different from the first layer.

[0016] In one embodiment, the first dummy pattern may be completely surrounded by an opening defined by at least one first portion, a second portion, and a third portion of the first pattern.

[0017] In an implementation, the first dummy pattern may include multiple patterns, and the multiple patterns may be completely surrounded by an opening defined by a first portion, a second portion, and a third portion of at least one first pattern.

[0018] In one implementation, multiple patterns can be electrically floated to be electrically separated from each other.

[0019] In an implementation, the first dummy pattern may include multiple grid lines.

[0020] In one embodiment, the first electrode may include a second pattern and a second bridging pattern, the second bridging pattern being electrically connected to the second pattern and located in the same layer as the first bridging pattern.

[0021] In an embodiment, the sensor layer may further include a second electrode that extends in a second direction and includes a second pattern and a second bridging pattern electrically connected to the second pattern and intersecting with the first bridging pattern.

[0022] In one implementation, the second bridging pattern may include: grid lines that intersect each other to define at least one closed hole between them; and grid lines that intersect each other but do not define any closed holes between them. The first bridging pattern may intersect a portion of the grid lines of the second bridging pattern that intersect each other but do not define any closed holes between them.

[0023] According to one or more embodiments of this disclosure, an electronic device includes a substrate, a circuit layer on the substrate including transistors, a light-emitting element layer on the circuit layer including light-emitting elements electrically connected to the transistors, and a sensor layer on the light-emitting element layer. The sensor layer includes: a first sensing electrode; a second sensing electrode intersecting the first sensing electrode; a first electrode overlapping the first sensing electrode; and a second electrode overlapping the second sensing electrode. The first sensing electrode includes a first pattern and a first bridging pattern electrically connected to the first pattern. The second electrode includes a second pattern and a second bridging pattern electrically connected to the second pattern. The first bridging pattern and the second bridging pattern intersect each other, and each of the first bridging pattern and the second bridging pattern includes a first grid line and a second grid line intersecting the first grid line. The second bridging pattern has at least one closed aperture surrounded by the first grid line and the second grid line, and the first bridging pattern has a smaller number of closed apertures than the number of closed apertures in the second bridging pattern, wherein the number of closed apertures in the first bridging pattern is an integer greater than or equal to 0. The first electrode and the first bridging pattern are located in a first layer, and the first pattern, the second sensing electrode, and the second bridging pattern are located in a second layer different from the first layer.

[0024] In one implementation, the first bridging pattern may not have a closed hole.

[0025] In an implementation, the second bridging pattern may include: a first grid line and a second grid line that intersect each other to define at least one closed hole between them; and a first grid line and a second grid line that intersect each other but do not define any closed hole between them.

[0026] In an implementation, the first bridging pattern may intersect with a portion of the first grid line and the second grid line of the second bridging pattern that intersect each other but do not define any closed holes between them.

[0027] In an implementation, the first electrode may include a third pattern and a third bridging pattern electrically connected to the third pattern.

[0028] In an implementation, the third bridging pattern may include a first bridging portion and a second bridging portion opposite to the first bridging portion.

[0029] In one embodiment, the first bridging pattern may be located between the first bridging portion and the second bridging portion.

[0030] In an implementation, the first bridging pattern and the third bridging pattern may be located on the same first layer.

[0031] According to one or more embodiments of this disclosure, an electronic device includes a substrate, a circuit layer on the substrate including transistors, a light-emitting element layer on the circuit layer including light-emitting elements electrically connected to the transistors, and a sensor layer on the light-emitting element layer. The sensor layer includes: a first sensing electrode including a first pattern and a first bridging pattern electrically connected to the first pattern; a second sensing electrode intersecting the first sensing electrode; a first electrode overlapping the first sensing electrode and including a second pattern and a second bridging pattern electrically connected to the second pattern; and a second electrode overlapping the second sensing electrode. The second bridging pattern includes a first bridging portion and a second bridging portion opposite to the first bridging portion. The first bridging pattern is located between the first bridging portion and the second bridging portion. The first electrode, the first bridging pattern, and the second bridging pattern are located in a first layer, and the first pattern and the second sensing electrode are located in a second layer different from the first layer.

[0032] In an implementation, the second electrode may include: a third pattern; and a third bridging pattern electrically connected to the third pattern.

[0033] In this implementation, the first bridging pattern and the third bridging pattern may intersect each other.

[0034] In an implementation, each of the first bridging pattern and the third bridging pattern may include a first grid line and a second grid line intersecting the first grid line.

[0035] In an implementation, the third bridging pattern may have at least one closed hole surrounded by the first grid line and the second grid line, and the first bridging pattern may have a smaller number of closed holes than the number of closed holes in the third bridging pattern, wherein the number of closed holes in the first bridging pattern may be an integer greater than or equal to 0.

[0036] In an implementation, the first bridging pattern and the third bridging pattern may be located on different layers.

[0037] In an embodiment, at least one first pattern may include a first portion, a second portion opposite to the first portion, and a third portion connected to the end of the first portion and the end of the second portion. A first dummy pattern may be insulated from at least one first pattern and may be located between the first portion and the second portion. Attached Figure Description

[0038] The above and other aspects and features of this disclosure will be more clearly understood through the following detailed description of illustrative, non-limiting embodiments with reference to the accompanying drawings, in which:

[0039] FIG. 1A This is a perspective view showing an electronic device according to an embodiment of the present disclosure;

[0040] FIG. 1B This is a rear perspective view showing an electronic device according to an embodiment of the present disclosure;

[0041] FIG. 2 This is a perspective view showing an electronic device according to an embodiment of the present disclosure;

[0042] FIG. 3 This is a perspective view showing an electronic device according to an embodiment of the present disclosure;

[0043] FIG. 4 This is a schematic cross-sectional view showing a display panel according to an embodiment of the present disclosure;

[0044] FIG. 5 This is a schematic diagram illustrating the operation of an electronic device according to an embodiment of the present disclosure;

[0045] FIG. 6A This is a cross-sectional view showing a display panel according to an embodiment of the present disclosure;

[0046] FIG. 6B This is a cross-sectional view showing a sensor layer according to an embodiment of the present disclosure;

[0047] FIG. 7 This is a plan view illustrating a sensor layer according to an embodiment of the present disclosure;

[0048] FIG. 8A This is a plan view showing the first conductive layer of a sensing unit according to an embodiment of the present disclosure;

[0049] FIG. 8B It is shown FIG. 8A An enlarged plan view of region AA' in the diagram;

[0050] FIG. 9A This is a plan view showing the second conductive layer of a sensing unit according to an embodiment of the present disclosure;

[0051] FIG. 9B It is shown FIG. 9A A magnified plan view of region BB' in the diagram;

[0052] FIG. 10A This is a plan view showing the first conductive layer of a sensing unit according to an embodiment of the present disclosure;

[0053] FIG. 10B It is shown FIG. 10A An enlarged plan view of region XX' in the diagram;

[0054] FIG. 11A This is a plan view showing the second conductive layer of a sensing unit according to an embodiment of the present disclosure;

[0055] FIG. 11B It is shown FIG. 11A A magnified planar view of region YY' in the diagram;

[0056] FIG. 12 This is a plan view showing some components of a sensing unit according to an embodiment of the present disclosure;

[0057] FIG. 13 This is a plan view showing some components of a sensing unit according to an embodiment of the present disclosure;

[0058] FIG. 14A This is an enlarged plan view showing a portion of a sensing unit according to an embodiment of the present disclosure;

[0059] FIG. 14B It is according to the embodiments of this disclosure. FIG. 14A A cross-sectional view of the sensor layer taken by line I-I';

[0060] FIG. 15A This is an enlarged plan view showing a portion of a sensing unit according to an embodiment of the present disclosure;

[0061] FIG. 15B It is according to the embodiments of this disclosure. FIG. 15A A cross-sectional view of the sensor layer taken from line II-II';

[0062] FIG. 16A This is an enlarged plan view showing a portion of a sensing unit according to an embodiment of the present disclosure;

[0063] FIG. 16B It is according to the embodiments of this disclosure. FIG. 16A A cross-sectional view of the sensor layer taken by line III-III';

[0064] FIG. 17A This is an enlarged plan view showing a portion of the second conductive layer of the sensor layer according to an embodiment of the present disclosure;

[0065] FIG. 17B It is shown FIG. 17A Enlarged plan view of region EE' in the diagram;

[0066] FIG. 18A This is an enlarged plan view showing a portion of the first conductive layer of a sensor layer according to an embodiment of the present disclosure;

[0067] FIG. 18B It is shown FIG. 18A A magnified planar view of region FF' in the image;

[0068] FIG. 19 This is an enlarged plan view showing a portion of the sensor layer according to an embodiment of the present disclosure;

[0069] FIG. 20 This is an enlarged plan view showing a portion of the sensor layer according to an embodiment of the present disclosure;

[0070] FIG. 21 This is an enlarged plan view showing a portion of the sensor layer according to an embodiment of the present disclosure;

[0071] FIG. 22A This is a plan view illustrating a sensing unit according to an embodiment of the present disclosure;

[0072] FIG. 22B This is a plan view illustrating a sensing unit according to an embodiment of the present disclosure;

[0073] FIG. 23 This is a plan view illustrating a sensing unit according to an embodiment of the present disclosure;

[0074] FIG. 24 This is a plan view illustrating a sensing unit according to an embodiment of the present disclosure;

[0075] FIG. 25 This is a plan view illustrating a sensing unit according to an embodiment of the present disclosure;

[0076] FIG. 26 This is a block diagram illustrating the operation of a sensor driver according to an embodiment of the present disclosure;

[0077] FIG. 27 This is a schematic diagram illustrating the operation of a sensor driver according to an embodiment of the present disclosure;

[0078] FIG. 28 This is an equivalent circuit diagram showing four sensing units according to an embodiment of the present disclosure;

[0079] FIG. 29 This is a diagram illustrating a first mode according to an embodiment of the present disclosure;

[0080] FIG. 30A This is an equivalent circuit diagram showing four sensing units in a first mode according to an embodiment of the present disclosure;

[0081] FIG. 30B This is an equivalent circuit diagram showing four sensing units in a first mode according to an embodiment of the present disclosure;

[0082] FIG. 31 This is a diagram illustrating a second mode according to an embodiment of the present disclosure;

[0083] FIG. 32A It is a graph showing the waveform of the first signal according to an embodiment of the present disclosure;

[0084] FIG. 32B It is a graph showing the waveform of the second signal according to an embodiment of the present disclosure;

[0085] FIG. 33A This is a diagram illustrating a second mode according to an embodiment of the present disclosure; and

[0086] FIG. 33B This is a diagram illustrating a sensing unit in a second mode according to an embodiment of the present disclosure. Detailed Implementation

[0087] In the following description, embodiments will be presented in more detail with reference to the accompanying drawings, in which the same reference numerals refer to the same elements throughout. However, this disclosure may be implemented in a variety of different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided by way of example so that this disclosure will be comprehensive and complete, and will fully convey to those skilled in the art the aspects and features of this disclosure. Therefore, unnecessary processes, elements, and techniques may not be described for a person of ordinary skill in the art to fully understand the aspects and features of this disclosure. Unless otherwise stated, the same reference numerals refer to the same elements throughout the drawings and written description, and therefore, redundant descriptions may not be repeated.

[0088] When a particular implementation can be carried out differently, the specific process sequence may differ from the described sequence. For example, two consecutively described processes may be performed simultaneously or substantially simultaneously, or they may be performed in the reverse order of the described sequence.

[0089] Furthermore, as those skilled in the art will understand, in view of the entirety of this disclosure, each suitable feature of the various embodiments of this disclosure may be combined partially or entirely with each other, and may be technically interlocked and operated in a variety of suitable manners, and each embodiment may be implemented independently or in combination with each other in any suitable manner, unless otherwise stated or implied.

[0090] In the accompanying drawings, for clarity, the relative dimensions, thicknesses, and proportions of elements, layers, and regions may be exaggerated and / or simplified. For ease of illustration, spatial relative terms such as “below,” “under,” “lower,” “below,” “above,” “upper,” etc., may be used herein to describe the relationship of one element or feature to another(s) shown in the figures. It will be understood that, in addition to the orientations depicted in the figures, spatial relative terms are intended to encompass different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as “below,” “under,” or “below” other elements or features will consequently be oriented “above” other elements or features. Thus, the exemplary terms “below” and “below” can encompass both above and below orientations. The device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein should be interpreted accordingly.

[0091] Furthermore, it should be anticipated that the shapes shown in the figures may differ in practice depending on, for example, tolerances and / or manufacturing techniques. Therefore, embodiments of this disclosure should not be construed as limited to the specific shapes shown in the figures, but rather should be interpreted in light of possible variations in shape, such as those caused by manufacturing processes. Thus, the shapes shown in the figures may not depict the actual shape of an area of ​​the device, and this disclosure is not limited thereto.

[0092] In the accompanying drawings, the x-axis (e.g., DR1-axis), y-axis (e.g., DR2-axis), and z-axis (e.g., DR3-axis) are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis may be perpendicular to each other or substantially perpendicular to each other, or they may represent different directions that are not perpendicular to each other.

[0093] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or segment from another element, component, region, layer, or segment. Therefore, without departing from the spirit and scope of this disclosure, the first element, first component, first region, first layer, or first segment described below may be referred to as a second element, second component, second region, second layer, or second segment. For example, a first direction shown in the figures may be referred to as a second direction in the claims, and conversely, a second direction shown in the figures may be referred to as a first direction in the claims.

[0094] It will be understood that when an element or layer is referred to as being "on," "connected to," or "attached to" another element or layer, it may be directly on, directly connected to, or directly attached to that other element or layer, or there may be one or more intervening elements or layers. Similarly, when a layer, region, or element is referred to as being "electrically connected to" another layer, region, or element, it may be directly electrically connected to that other layer, region, or element, and / or may be indirectly electrically connected to that other layer, region, or element, with one or more intervening layers, regions, or elements between them. Furthermore, it will be understood that when an element or layer is referred to as being "between" two elements or layers, it may be the only element or layer between the two elements or layers, or there may be one or more intervening elements or layers.

[0095] The terminology used herein is for the purpose of describing particular embodiments and is not intended to limit this disclosure. As used herein, the singular forms “a” and “an” are intended to also include the plural forms unless the context clearly indicates otherwise. It will also be understood that, when used in this specification, the terms “comprising,” “including,” “containing,” “having,” “possessing,” and “having” specify the presence of the described features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the related listed items. For example, the expression “A and / or B” means A, B, or A and B. When following an element in a list, expressions such as “…at least one of” modify the entire list of elements rather than individual elements in the list. For example, the expressions “at least one of a, b and c” and “at least one of the groups consisting of a, b and c” mean: only a, only b, only c, both a and b, both a and c, both b and c, all of a, b and c or variations thereof.

[0096] As used herein, the terms “substantially,” “about,” and similar terms are used as approximate terms rather than terms of degree and are intended to account for inherent biases in measured or calculated values ​​that will be recognized by those skilled in the art. For example, the word “may” as used in describing embodiments of this disclosure means “one or more embodiments of this disclosure.” As used herein, the terms “use,” “using,” and “used” are to be understood as synonymous with the terms “utilize,” “utilizing,” and “utilized,” respectively. Additionally, the term “exemplary” is intended to indicate an example or illustration.

[0097] As used herein, the terms “component” and “unit” can refer to a software component or hardware component that performs a specific function. Hardware components can include, for example, field-programmable gate arrays (FPGAs) or application-specific integrated circuits (ASICs). Software components can refer to executable code and / or data used by the executable code in addressable memory media. Therefore, software components can be, for example, object-oriented software components, class components, and / or operational components, and can include processes, functions, attributes, programs, subroutines, program code segments, drivers, firmware, microcode, circuits, data, databases, data structures, tables, arrays, and / or variables.

[0098] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms (such as those defined in common dictionaries) shall be interpreted as having the same meaning as they have in the relevant field and / or the context of this specification, and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0099] FIG. 1A This is a perspective view showing an electronic device 1000 according to an embodiment of the present disclosure. FIG. 1B This is a rear perspective view of an electronic device 1000 according to an embodiment of the present disclosure.

[0100] refer to FIG. 1A and FIG. 1B The electronic device 1000 can be activated by an electrical signal. For example, the electronic device 1000 can display an image and can sense input applied from the outside (e.g., external input). External input can be user input. User input can include various suitable types of input (such as input made by using a part of the user's body, a pen, light, heat, or pressure).

[0101] Electronic device 1000 may include a first display panel DP1 and a second display panel DP2. The first display panel DP1 and the second display panel DP2 may be spaced apart from each other (e.g., they may be separate). The first display panel DP1 may be referred to as the main display panel. The second display panel DP2 may be referred to as the auxiliary display panel or the external display panel.

[0102] The first display panel DP1 may include a first display component DA1-F and a peripheral region NDA surrounding the first display component DA1-F, and the second display panel DP2 may include a second display component DA2-F. The second display panel DP2 may have a smaller area than the first display panel DP1. Corresponding to the dimensions of the first display panel DP1 and the second display panel DP2, the first display component DA1-F may have a larger area than the second display component DA2-F.

[0103] In the unfolded state of the electronic device 1000, the first display component DA1-F may have a plane parallel to or substantially parallel to the first direction DR1 and the second direction DR2. The first direction DR1 and the second direction DR2 may intersect each other. The electronic device 1000 may have a thickness direction parallel to or substantially parallel to a third direction DR3, which intersects the first direction DR1 and the second direction DR2. Therefore, the front surface (e.g., top surface) and the rear surface (e.g., bottom surface) of the components constituting the electronic device 1000 may be defined based on the third direction DR3.

[0104] The first display panel DP1 and / or the first display component DA1-F may include a folding region FA and multiple non-folding regions NFA1 and NFA2. The folding region FA can be folded and unfolded, and the multiple non-folding regions NFA1 and NFA2 are spaced apart from each other, with the folding region FA located between them. The second display panel DP2 may overlap with one of the multiple non-folding regions NFA1 and NFA2. For example, the second display panel DP2 may overlap with the first non-folding region NFA1.

[0105] The display orientation of the first image IM1a displayed on a portion of the first display panel DP1 (e.g., in the first non-folded region NFA1) may be opposite to the display orientation of the second image IM2a displayed on the second display panel DP2. For example, the first image IM1a may be displayed on a third direction DR3, and the second image IM2a may be displayed on a fourth direction DR4, which is opposite to the third direction DR3.

[0106] In embodiments of this disclosure, the folding region FA can be bent based on a folding axis extending in a direction parallel to or substantially parallel to the long side of the electronic device 1000 (e.g., extending in a direction parallel to or substantially parallel to the second direction DR2). In the folded state of the electronic device 1000, the folding region FA has a curvature (e.g., a predetermined curvature) and a radius of curvature. When the electronic device 1000 is folded, the first non-folding region NFA1 and the second non-folding region NFA2 can face each other, and the electronic device 1000 can fold inwards such that the first display components DA1-F are not exposed to the outside.

[0107] In embodiments of this disclosure, the electronic device 1000 can be folded outwards, exposing the first display component DA1-F to the outside. In embodiments of this disclosure, the electronic device 1000 can perform inward and / or outward folding from an unfolded state. However, this disclosure is not limited thereto.

[0108] Despite FIG. 1A The electronic device 1000 shown defines (e.g., provides or includes) a folding region FA, but this disclosure is not limited thereto. For example, multiple folding axes and multiple folding regions corresponding to the folding axes may be defined in the electronic device 1000, and the electronic device 1000 may fold inward and / or outward from an unfolded state in each of the multiple folding regions.

[0109] According to embodiments of this disclosure, even if the display panel may not include a digitizer, at least one of the first display panel DP1 and the second display panel DP2 can still sense the input of the pen PN. Therefore, since the digitizer for sensing the pen PN can be omitted, it is possible to prevent or substantially prevent (e.g., it may not occur) the increase in thickness and weight of the electronic device 1000 and the reduction in flexibility that might result from the addition of a digitizer. Therefore, in some embodiments, not only the first display panel DP1 can be designed to sense the pen PN, but the second display panel DP2 can also be designed to sense the pen PN.

[0110] FIG. 2 This is a perspective view showing an electronic device 1000-1 according to an embodiment of the present disclosure. FIG. 3 This is a perspective view showing an electronic device 1000-2 according to an embodiment of the present disclosure.

[0111] exist FIG. 2 In the example shown, electronic device 1000-1 is depicted as a mobile phone. Electronic device 1000-1 may include a display panel (DP). FIG. 3 In the example shown, electronic device 1000-2 is a notebook computer. Electronic device 1000-2 may include a display panel (DP). Although FIG. 3 It is a 3D diagram of electronic device 1000-2, but FIG. 3 The coordinate axes included are displayed based on the display panel DP within the electronic device 1000-2.

[0112] In embodiments of this disclosure, the display panel DP can sense various inputs applied from the outside (e.g., external inputs). External inputs can be user inputs. User inputs can include various suitable types of inputs (such as, by using a part of the user's body, a pen PN (e.g., a reference)). FIG. 1A (Inputs such as light, heat, or pressure).

[0113] According to embodiments of this disclosure, the display panel DP can sense the input of the pen PN even if it does not include a digitizer. Therefore, since the digitizer for sensing the pen PN can be omitted, it is possible to prevent or substantially prevent (e.g., it may not occur) the increase in thickness and weight and the reduction in flexibility of the electronic devices 1000-1 and 1000-2 that may be caused by the addition of a digitizer.

[0114] Although as an example FIG. 1A The image shows a foldable type of electronic device 1000, and as an example... FIG. 2 The diagram illustrates a strip-type electronic device 1000-1, but this disclosure is not limited thereto. For example, the embodiments described herein can be applied to various suitable types of electronic devices (such as rollable, sliding, and / or stretchable electronic devices).

[0115] FIG. 4 This is a schematic cross-sectional view showing a display panel DP according to an embodiment of the present disclosure.

[0116] refer to FIG. 4 The display panel DP may include a display layer 100 and a sensor layer 200.

[0117] Display layer 100 may be a component that generates or substantially generates an image. Display layer 100 may be a light-emitting display layer. For example, display layer 100 may be an organic light-emitting display layer, an inorganic light-emitting display layer, an organic-inorganic light-emitting display layer, a quantum dot display layer, a micron LED display layer, or a nano LED display layer. Display layer 100 may include a base layer 110, a circuit layer 120, a light-emitting element layer 130, and an encapsulation layer 140.

[0118] The base layer 110 may be a component for providing a base surface on which the circuit layer 120 is disposed. The base layer 110 may have a multilayer structure or a single-layer structure. For example, the base layer 110 may include (e.g.) a glass substrate, a metal substrate, a silicon substrate, or a polymer substrate, but this disclosure is not limited thereto.

[0119] Circuit layer 120 may be disposed on base layer 110. Circuit layer 120 may include insulating layers, semiconductor patterns, conductive patterns, and signal lines. Insulating layers, semiconductor layers, and conductive layers may be disposed on base layer 110 by suitable methods (such as coating and deposition), and the insulating layers, semiconductor layers, and conductive layers may then be selectively patterned by multiple photolithography processes.

[0120] The light-emitting element layer 130 may be disposed on the circuit layer 120. The light-emitting element layer 130 may include light-emitting elements. For example, the light-emitting element layer 130 may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, quantum rods, micron LEDs, or nano LEDs.

[0121] An encapsulation layer 140 may be disposed on the light-emitting element layer 130. The encapsulation layer 140 can protect the light-emitting element layer 130 from foreign substances such as moisture, oxygen and / or dust particles.

[0122] Sensor layer 200 may be disposed on display layer 100. Sensor layer 200 can sense external input applied from the outside. Sensor layer 200 may be an integrated sensor continuously disposed during the manufacturing process of display layer 100, or it may be an external sensor attached to display layer 100. Sensor layer 200 may be referred to as a sensor, input sensing layer, input sensing panel, or electronic device for sensing input coordinates.

[0123] According to embodiments of this disclosure, sensor layer 200 can sense all suitable types of input from passive input units (such as a user's body) and input devices that generate a magnetic field with a resonant frequency (e.g., a predetermined resonant frequency). The input device may be referred to as a pen, input pen, magnetic pen, stylus, or electromagnetic resonant pen.

[0124] FIG. 5 This is a schematic diagram illustrating the operation of an electronic device 1000 according to an embodiment of the present disclosure.

[0125] refer to FIG. 5 The electronic device 1000 may include a display layer 100, a sensor layer 200, a display driver 100C (e.g., a first driver circuit), a sensor driver 200C (e.g., a second driver circuit), a main driver 1000C (e.g., a third circuit), and a power supply circuit 1000P.

[0126] Sensor layer 200 can sense a first input 2000 or a second input 3000 applied from the outside. Each of the first input 2000 and the second input 3000 can be an input capable of providing a capacitance change to sensor layer 200 (e.g., an input unit) or an input capable of inducing a current in sensor layer 200 (e.g., an input unit). For example, the first input 2000 can be a passive type of input (e.g., a passive input unit), such as an input from a user's body. The second input 3000 can be an input to a pen PN or an input to an RFIC tag. For example, the pen PN can be a passive type of pen or an active type of pen.

[0127] In embodiments of this disclosure, the pen PN can be a device that generates a magnetic field having a resonant frequency (e.g., a predetermined resonant frequency). The pen PN can transmit output signals based on an electromagnetic resonance method. The pen PN can be referred to as an input device, an input pen, a magnetic pen, a stylus, or an electromagnetic resonant pen.

[0128] The pen PN may include an RLC resonant circuit, and the RLC resonant circuit may include an inductor L and a capacitor C. In embodiments of this disclosure, the RLC resonant circuit may be a variable resonant circuit that changes the resonant frequency. In this case, the inductor L may be a variable inductor and / or the capacitor C may be a variable capacitor. However, this disclosure is not limited thereto.

[0129] Sensor L generates current through a magnetic field provided in electronic device 1000 (e.g., in sensor layer 200). However, this disclosure is not limited thereto. For example, when pen PN operates as an active type of pen, pen PN can generate current even when pen PN does not receive a magnetic field from the outside. The generated current is transmitted to capacitor C. Capacitor C is charged with the current transmitted from sensor L and discharges the charged current to sensor L. Thereafter, sensor L can emit a magnetic field with a resonant frequency. Due to the magnetic field emitted by pen PN, induced current can flow through sensor layer 200, and induced current can be transmitted to sensor driver 200C as a received signal (e.g., as a sensing signal).

[0130] The main driver 1000C can control all operations of the electronic device 1000. For example, the main driver 1000C can control the operation of the display driver 100C and the sensor driver 200C. The main driver 1000C may include at least one microprocessor and may also include a graphics controller. The main driver 1000C may be referred to as an application processor, a central processing unit, or a main processor.

[0131] Display driver 100C can drive display layer 100. Display driver 100C can receive image data and control signals from main driver 1000C. Control signals can include various suitable signals. For example, control signals can include input vertical sync signal, input horizontal sync signal, master clock signal, and data enable signal.

[0132] Sensor driver 200C can drive sensor layer 200. Sensor driver 200C can receive control signals from main driver 1000C. The control signals may include a clock signal of sensor driver 200C. In addition, the control signals may also include a mode decision signal that determines the driving mode of sensor driver 200C and sensor layer 200.

[0133] The sensor driver 200C can be implemented as an integrated circuit (IC) and can be electrically connected to the sensor layer 200. For example, the sensor driver 200C can be directly mounted on a suitable area (e.g., a predetermined area) of the display panel DP, or it can be mounted on a separate printed circuit board using a chip-on-film (COF) method and electrically connected to the sensor layer 200.

[0134] The sensor driver 200C and the sensor layer 200 can selectively operate in either a first mode or a second mode. For example, the first mode may be a mode for sensing touch input (e.g., first input 2000). The second mode may be a mode for sensing pen input (e.g., second input 3000). The first mode may be referred to as a touch sensing mode, and the second mode may be referred to as a pen sensing mode.

[0135] Switching between the first mode and the second mode can be performed using various suitable methods. For example, the sensor driver 200C and the sensor layer 200 can be time-division driven in the first mode and the second mode to sense the first input 2000 and the second input 3000. As another example, switching between the first mode and the second mode can occur through user selection or a specific action (e.g., input), or one of the first mode and the second mode can be started or stopped by starting or stopping a specific application. As another example, switching from one mode to another can occur. As yet another example, when the sensor driver 200C and the sensor layer 200 operate alternately in the first mode and the second mode, the first mode can be maintained or substantially maintained when the first input 2000 is sensed, or the second mode can be maintained or substantially maintained when the second input 3000 is sensed.

[0136] The sensor driver 200C can calculate the input coordinate information based on the signal received from the sensor layer 200, and can provide a coordinate signal with the coordinate information to the main driver 1000C. The main driver 1000C performs an operation corresponding to the user's input based on the coordinate signal. For example, the main driver 1000C can operate the display driver 100C to display a new application image on the display layer 100.

[0137] The power supply circuit 1000P may include a power management integrated circuit (PMIC). The power supply circuit 1000P can generate multiple drive voltages for driving the display layer 100, sensor layer 200, display driver 100C, and sensor driver 200C. For example, the multiple drive voltages may include a gate high voltage, a gate low voltage, a first drive voltage (e.g., ELVSS voltage), a second drive voltage (e.g., ELVDD voltage), and an initialization voltage. However, this disclosure is not limited thereto.

[0138] FIG. 6A This is a cross-sectional view showing a display panel DP according to an embodiment of the present disclosure.

[0139] refer to FIG. 6A At least one buffer layer BFL may be disposed on the top surface of the base layer 110. The buffer layer BFL can improve the adhesion between the base layer 110 and the semiconductor pattern. The buffer layer BFL may have multiple layers. As another example, the display layer 100 may also include a barrier layer. The buffer layer BFL may include at least one of silicon oxide, silicon nitride, and silicon oxide nitride. For example, the buffer layer BFL may have a suitable structure in which silicon oxide layers and silicon nitride layers are alternately stacked.

[0140] Semiconductor patterns can be disposed on the buffer layer BFL. The semiconductor pattern may include polycrystalline silicon. However, this disclosure is not limited thereto. The semiconductor pattern may include amorphous silicon, low-temperature polycrystalline silicon, or oxide semiconductor.

[0141] FIG. 6A A portion of a semiconductor pattern is shown, and the semiconductor pattern can also be disposed in other regions. The semiconductor pattern can be arranged across multiple pixels based on suitable rules (e.g., specific or predetermined rules). The semiconductor pattern can have different electrical properties depending on whether it is doped. The semiconductor pattern may include a first region with high (e.g., relatively high) conductivity and a second region with low (e.g., relatively low) conductivity. The first region may be doped with n-type or p-type dopant. A p-type transistor may include a doped region doped with p-type dopant, and an n-type transistor may include a doped region doped with n-type dopant. The second region may be an undoped region or a doped region with a lower concentration than the first region.

[0142] The first region may have a higher conductivity than the second region and may be used, or substantially used, as an electrode or signal line. The second region may correspond to, or correspond to, the active region (e.g., channel) AL on the substrate corresponding to the transistor 100PC. In other words, a portion of the semiconductor pattern may be the active region AL of the transistor 100PC, another portion may be the source region SC or drain region DR of the transistor 100PC, and yet another portion may be a connection electrode or connection signal line SCL. The first region may include the source region SC, the drain region DR, and the connection signal line SCL, and the second region may include the active region AL.

[0143] Each pixel can have an equivalent circuit, which includes multiple transistors, at least one capacitor, and at least one light-emitting element. The equivalent circuit of a pixel can be deformed into various suitable shapes. FIG. 6AAs an example, a transistor 100PC and a light-emitting element 100PE are shown in the corresponding pixel.

[0144] The source region SC, active region AL, and drain region DR of transistor 100PC can be provided from a semiconductor pattern. In cross-section (e.g., in a sectional view), the source region SC and drain region DR can extend from the active region AL in opposite directions to each other. FIG. 6A A portion of the connection signal line SCL provided from a semiconductor pattern is shown. However, in a plane (e.g., in a planar view), the connection signal line SCL may be connected to the drain region DR of transistor 100PC.

[0145] The first insulating layer 10 may be disposed on the buffer layer BFL. The first insulating layer 10 may overlap with multiple pixels in a common manner and may cover a semiconductor pattern. The first insulating layer 10 may be an inorganic layer and / or an organic layer, and may have a single-layer structure or a multi-layer structure. The first insulating layer 10 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon nitride, zirconium oxide, and hafnium oxide. In this embodiment, the first insulating layer 10 may be a single-layer silicon oxide layer. Furthermore, similar to the first insulating layer 10, the insulating layer of the circuit layer 120, which will be described in more detail below, may be an inorganic layer and / or an organic layer, and may have a single-layer structure or a multi-layer structure. Although the inorganic layer may include at least one of the inorganic materials described above, this disclosure is not limited thereto.

[0146] The gate GT of transistor 100PC can be disposed on the first insulating layer 10. The gate GT can be part of a metal pattern. The gate GT overlaps with the active region AL. The gate GT can be used as a mask in processes of doping or reducing semiconductor patterns.

[0147] The second insulating layer 20 may be disposed on the first insulating layer 10 to cover the gate GT. The second insulating layer 20 may commonly overlap with the pixel. The second insulating layer 20 may be an inorganic layer and / or an organic layer, and may have a single-layer structure or a multilayer structure. The second insulating layer 20 may include at least one of silicon oxide, silicon nitride, and silicon oxide nitride. In this embodiment, the second insulating layer 20 may have a multilayer structure including a silicon oxide layer and a silicon nitride layer.

[0148] The third insulating layer 30 may be disposed on the second insulating layer 20. The third insulating layer 30 may have a single-layer structure or a multi-layer structure. For example, the third insulating layer 30 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0149] The first connection electrode CNE1 can be disposed on the third insulating layer 30. The first connection electrode CNE1 can be connected to the connection signal line SCL through a contact hole CNT-1 that passes through (e.g., penetrates) the first insulating layer 10, the second insulating layer 20 and the third insulating layer 30.

[0150] The fourth insulating layer 40 may be disposed on the third insulating layer 30. The fourth insulating layer 40 may be a single-layer silicon oxide layer. The fifth insulating layer 50 may be disposed on the fourth insulating layer 40. The fifth insulating layer 50 may be an organic layer.

[0151] The second connecting electrode CNE2 can be disposed on the fifth insulating layer 50. The second connecting electrode CNE2 can be connected to the first connecting electrode CNE1 through the contact hole CNT-2 passing through the fourth insulating layer 40 and the fifth insulating layer 50.

[0152] The sixth insulating layer 60 may be disposed on the fifth insulating layer 50 to cover the second connecting electrode CNE2. The sixth insulating layer 60 may be an organic layer.

[0153] The light-emitting element layer 130 may be disposed on the circuit layer 120. The light-emitting element layer 130 may include a light-emitting element 100PE. For example, the light-emitting element layer 130 may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, quantum rods, micron LEDs, or nano LEDs. In the following description, for ease of illustration, the light-emitting element 100PE may be described in more detail in the context of an organic light-emitting element as an example, but this disclosure is not limited thereto.

[0154] The light-emitting element 100PE may include a first electrode AE, a light-emitting layer EL, and a second electrode CE.

[0155] The first electrode AE ​​can be disposed on the sixth insulating layer 60. The first electrode AE ​​can be connected to the second connecting electrode CNE2 through a contact hole CNT-3 passing through (e.g., penetrating) the sixth insulating layer 60.

[0156] A pixel defining layer 70 may be disposed on the sixth insulating layer 60 to cover a portion of the first electrode AE. An opening 70-OP is defined in the pixel defining layer 70. The opening 70-OP of the pixel defining layer 70 exposes at least a portion of the first electrode AE.

[0157] The first display component DA1-F (for example, referring to FIG1) may include a light-emitting region PXA and a non-light-emitting region NPXA disposed adjacent to the light-emitting region PXA. The non-light-emitting region NPXA may surround the light-emitting region PXA (for example, around the periphery of the light-emitting region PXA). In this embodiment, the light-emitting region PXA is defined to correspond to the portion of the first electrode AE ​​exposed by the opening 70-OP.

[0158] The light-emitting layer EL can be disposed on the first electrode AE. The light-emitting layer EL can be disposed in the region corresponding to the opening 70-OP. Although, as an example, the light-emitting layer EL... FIG. 6A The arrangement shown is in the opening 70-OP, but this disclosure is not limited thereto. For example, the light-emitting layer EL may extend to cover a portion of the top surface of the pixel defining layer 70 and the side surface of the pixel defining layer 70 defining the opening 70-OP.

[0159] In embodiments of this disclosure, an emissive layer EL can be provided individually for each pixel. When an emissive layer EL is provided individually for each pixel, each emissive layer EL can emit light having at least one color among blue, red, and green. However, this disclosure is not limited thereto. For example, the emissive layer EL can have a monolithic shape and can be provided publicly for multiple pixels. In this case, the emissive layer EL can provide blue light or white light.

[0160] The second electrode CE can be disposed on the light-emitting layer EL. The second electrode CE can be included in multiple pixels while having a single integral shape.

[0161] In embodiments of this disclosure, a hole control layer may be disposed between the first electrode AE ​​and the light-emitting layer EL. The hole control layer may be commonly disposed in the light-emitting region PXA and the non-light-emitting region NPXA. The hole control layer may include a hole transport layer and may optionally include a hole injection layer. An electron control layer may be disposed between the light-emitting layer EL and the second electrode CE. The electron control layer may include an electron transport layer and may optionally include an electron injection layer. The hole control layer and the electron control layer may be commonly provided to multiple pixels using an aperture mask or an inkjet process.

[0162] An encapsulation layer 140 may be disposed on the light-emitting element layer 130. The encapsulation layer 140 may include sequentially stacked inorganic layers, organic layers, and inorganic layers, but this disclosure is not limited to these layers constituting the encapsulation layer 140. The inorganic layer may protect the light-emitting element layer 130 from moisture and oxygen, and the organic layer may protect the light-emitting element layer 130 from foreign substances such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxide nitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include an acrylic-based organic layer, but this disclosure is not limited thereto.

[0163] The sensor layer 200 may include a base layer 201, a first conductive layer 202, an intermediate insulating layer 203, a second conductive layer 204, and a cover insulating layer 205. The first conductive layer 202 may be referred to as the first layer, and the second conductive layer 204 may be referred to as the second layer.

[0164] The base layer 201 may be an inorganic layer comprising at least one of silicon nitride, silicon oxide nitride, and silicon oxide. As another example, the base layer 201 may be an organic layer comprising epoxy resin, acrylic resin, or an imide-based resin. The base layer 201 may have a monolayer structure or a multilayer structure stacked on a third-direction DR3. In embodiments of this disclosure, the sensor layer 200 may not include the base layer 201.

[0165] Each of the first conductive layer 202 and the second conductive layer 204 may have a single-layer structure or a multi-layer structure stacked on the third-direction DR3.

[0166] Each of the first conductive layer 202 and the second conductive layer 204, which may have a single-layer structure, may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, and / or suitable alloys thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (IZTO). Furthermore, the transparent conductive layer may include a conductive polymer such as poly(3,4-ethylenedioxythiophene) (PEDOT), metal nanowires, or graphene.

[0167] Each of the first conductive layer 202 and the second conductive layer 204, which may have a multilayer structure, may include multiple metal layers. The metal layers may have, for example, a three-layer structure of titanium / aluminum / titanium. The multilayer conductive layer may include at least one metal layer and at least one transparent conductive layer.

[0168] In embodiments of this disclosure, the first conductive layer 202 may have a thickness equal to or greater than the thickness of the second conductive layer 204. When the first conductive layer 202 has a thickness greater than that of the second conductive layer 204, the components included in the first conductive layer 202 (e.g., electrodes, patterns, or bridging patterns) may have reduced resistance. Furthermore, because the first conductive layer 202 is disposed below the second conductive layer 204, even when the thickness of the first conductive layer 202 increases, the probability of the components included in the first conductive layer 202 being identified due to external light reflection may be less than that of the second conductive layer 204.

[0169] At least one of the intermediate insulating layer 203 and the cover insulating layer 205 may include an inorganic layer. The inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon nitride, zirconium oxide, and hafnium oxide.

[0170] At least one of the intermediate insulating layer 203 and the cover insulating layer 205 may include an organic layer. The organic layer may include at least one of the following: acrylic acid-based resin, methacrylic acid-based resin, polyisoprene-based resin, ethylene-based resin, epoxy-based resin, urethane-based resin, cellulose-based resin, siloxane-based resin, polyimide-based resin, polyamide-based resin, and dinoflagellated resin.

[0171] As described above, by way of example, sensor layer 200 may include a first conductive layer 202 and a second conductive layer 204, but this disclosure is not limited thereto. For example, in some embodiments, sensor layer 200 may include three or more conductive layers.

[0172] FIG. 6B This is a cross-sectional view showing a sensor layer 200 according to an embodiment of the present disclosure.

[0173] refer to FIG. 6A and FIG. 6B The second grid line MS2 of the second conductive layer 204 can have a second width 204wt that is equal to or greater than the first width 202wt of the first grid line MS1 of the first conductive layer 202. When the user USR observes the first grid line MS1 and the second grid line MS2 from its side surface, the probability of the first grid line MS1 being recognized by the user USR can be reduced because the first grid line MS1 can have a width smaller than the width of the second grid line MS2.

[0174] Each of the first grid line MS1 and the second grid line MS2 may include a first metal layer M1 and a second metal layer M2 disposed between the first metal layers M1. For example, the first metal layer M1 may include titanium (Ti), and the second metal layer M2 may include aluminum (Al). However, this disclosure is not limited thereto.

[0175] In embodiments of this disclosure, the first thickness TK1 of the second metal layer M2 of the first grid line MS1 and the second thickness TK2 of the second metal layer M2 of the second grid line MS2 can be the same as or substantially the same as each other. However, this disclosure is not limited thereto. For example, the first thickness TK1 can be greater than the second thickness TK2. As another example, the second thickness TK2 can be greater than the first thickness TK1. In embodiments of this disclosure, for example, each of the first thickness TK1 and the second thickness TK2 can be... or larger (such as, ).

[0176] FIG. 7 This is a plan view showing the sensor layer 200 according to an embodiment of the present disclosure.

[0177] refer to FIG. 7The sensing area 200A and the peripheral area 200NA configured to be adjacent to the sensing area 200A can be defined at the sensor layer 200 (e.g., in the middle or on top).

[0178] The sensor layer 200 may include a plurality of first electrodes 210, a plurality of second electrodes 220, a plurality of third electrodes 230, and a plurality of fourth electrodes 240 disposed at a sensing region 200A (e.g., in the middle or above). The first electrode 210 may be referred to as the first sensing electrode, the second electrode 220 may be referred to as the second sensing electrode, the third electrode 230 may be referred to as the first electrode, and the fourth electrode 240 may be referred to as the second electrode.

[0179] The first electrode 210 and the second electrode 220 may intersect each other. The first electrode 210 may extend in the second direction DR2 and may be spaced apart from each other along the first direction DR1. The second electrode 220 may extend in the first direction DR1 and may be spaced apart from each other along the second direction DR2. The sensing unit (e.g., sensor, sensor region, or sensing node) SU of the sensor layer 200 may be the region where one of the first electrodes 210 and one of the second electrodes 220 intersect.

[0180] although FIG. 7 The example shows six first electrodes 210, ten second electrodes 220 and sixty sensing units SU, but this disclosure is not limited thereto, and the number of each of the first electrodes 210 and the second electrodes 220 can be modified in various ways as needed or desired.

[0181] The third electrodes 230 may each extend along the second direction DR2 and may be spaced apart from each other along the first direction DR1. A third electrode 230 may overlap with at least a portion of a first electrode 210. According to embodiments of this disclosure, the capacitance (e.g., coupling capacitance) between a first electrode 210 and a third electrode 230 can be adjusted by adjusting the overlap area between them.

[0182] In embodiments of this disclosure, at least some of the third electrodes 230 can be electrically connected in parallel with each other. For example, in FIG. 7 In this embodiment, two third electrodes 230 can be connected in parallel to each other to provide a first electrode group 230pc, and three first electrode groups 230pc can be arranged along a first direction DR1. However, this disclosure is not limited thereto, and the number of third electrodes 230 in the first electrode group 230pc can be modified in various ways as needed or desired. For example, in some embodiments, a first electrode group 230pc may include only one third electrode 230, or may include three or more third electrodes 230.

[0183] As the number of third electrodes 230 included in and connected in parallel with each other in the first electrode group 230pc increases, the resistance of the first electrode group 230pc decreases, and thus power efficiency and sensing sensitivity can be improved. On the other hand, as the number of third electrodes 230 included in the first electrode group 230pc decreases, the loop coil pattern provided by using the first electrode group 230pc can be designed to have more different shapes.

[0184] The fourth electrode 240 may be arranged along the second direction DR2 and may each extend along the first direction DR1. One fourth electrode 240 may overlap with at least a portion of one second electrode 220. According to embodiments of this disclosure, the capacitance (e.g., coupling capacitance) between one second electrode 220 and one fourth electrode 240 can be adjusted by adjusting the overlap area between them.

[0185] In embodiments of this disclosure, at least some of the fourth electrodes 240 may be electrically connected to each other to form a second electrode group 240pc. For example, as FIG. 7 As shown, five fourth electrodes 240 can be connected to, for example, a trace (such as fourth trace 240t) to form a second electrode group 240pc. Therefore, in FIG. 7 In this configuration, two second electrode groups 240pc are arranged along the second direction DR2. However, this disclosure is not limited to... FIG. 7 The number of fourth electrodes 240 in the second electrode group 240pc shown. For example, the number of fourth electrodes 240 constituting a second electrode group 240pc can be equal to 10, and in this case, the sensor layer 200 can include only one second electrode group 240pc.

[0186] The sensor layer 200 may further include multiple first traces 210t disposed at a peripheral region 200NA (e.g., in the middle or above), multiple first pads PD1 connected to the first traces 210t in a one-to-one correspondence, multiple second traces 220t, and multiple second pads PD2 connected to the second traces 220t in a one-to-one correspondence. The first traces 210t may be electrically connected to the first electrode 210 in a one-to-one correspondence. The second traces 220t may be electrically connected to the second electrode 220 in a one-to-one correspondence.

[0187] The sensor layer 200 may also include a third trace 230rt1 disposed at a peripheral region 200NA (e.g., in the middle or above), a plurality of third pads PD3 connected to one end and the other end (e.g., opposite ends) of the third trace 230rt1, a plurality of fourth traces 240t, a plurality of fourth pads PD4 connected to the fourth traces 240t in a one-to-one correspondence, a plurality of fifth traces 230rt2, and a plurality of fifth pads PD5 connected to the fifth traces 230rt2 in a one-to-one correspondence.

[0188] The third trace 230rt1 may be electrically connected to the third electrode 230. In embodiments of this disclosure, the third trace 230rt1 may be electrically connected to all of the third electrode 230. The third trace 230rt1 may include a first line portion 231t extending in a first direction DR1 and electrically connected to the third electrode 230, a second line portion 232t extending in a second direction DR2 from a first end of the first line portion 231t, and a third line portion 233t extending in a second direction DR2 from a second end of the first line portion 231t.

[0189] In embodiments of this disclosure, each of the second wire portion 232t and the third wire portion 233t may have the same or substantially the same resistance as one of the third electrodes 230. Therefore, the second wire portion 232t and the third wire portion 233t can be used as the third electrode 230 to exhibit the effect of the third electrode 230 even being positioned at the peripheral region 200NA (e.g., in the middle or above). For example, one of the second wire portion 232t and the third wire portion 233t, as well as one of the third electrodes 230, can provide a coil to each other. Thus, a pen positioned in a region adjacent to the peripheral region 200NA can also be adequately charged through a loop including the second wire portion 232t or the third wire portion 233t (e.g., a loop of coils).

[0190] In embodiments of this disclosure, the width of each of the second line portion 232t and the third line portion 233t in the first direction DR1 can be adjusted in various ways to adjust the resistance of each of the second line portion 232t and the third line portion 233t. However, this disclosure is not limited thereto, and the first line portion 231t, the second line portion 232t, and the third line portion 233t may have the same or substantially the same width as each other.

[0191] The fifth trace 230rt2 can be connected to the first electrode group 230pc in a one-to-one correspondence. In other words, the number of fifth traces 230rt2 can correspond to the number of first electrode groups 230pc. FIG. 7In the example shown, three fifth traces 230rt2 and three first electrode groups 230pc are illustrated. The fifth trace 230rt2 can be referred to as the first loop trace, and the third trace 230rt1 can be referred to as the second loop trace.

[0192] In embodiments of this disclosure, the fifth trace 230rt2 and the fifth pad PD5 may be omitted as needed or desired, and the charging drive mode for charging the pen may be omitted. In this case, the sensor layer 200 can sense input from an active type of pen capable of emitting a magnetic field even without a magnetic field being provided from the sensor layer 200.

[0193] The fourth traces 240t can be spaced apart from each other, and the sensing area 200A is located between the fourth traces 240t. The fourth traces 240t can be electrically connected to the second electrode group 240pc in a one-to-one correspondence. FIG. 7 In the example, two second electrode groups 240pc are arranged. The fourth trace 240t connected to one second electrode group 240pc and the fourth trace 240t connected to the other second electrode group 240pc can be spaced apart from each other, and the sensing area 200A is between them. However, this disclosure is not limited thereto.

[0194] FIG. 8A This illustrates a sensing unit SU according to an embodiment of the present disclosure (e.g., reference SU). FIG. 7 A plan view of the first conductive layer SU202. FIG. 8B It is shown FIG. 8A An enlarged plan view of region AA' in the diagram. FIG. 9A This illustrates a sensing unit SU according to an embodiment of the present disclosure (e.g., reference SU). FIG. 7 A plan view of the second conductive layer SU204. FIG. 9B It is shown FIG. 9A A magnified plan view of region BB' in the diagram.

[0195] exist FIG. 8A and FIG. 9A In this illustration, for ease of explanation, the boundaries between components are shown as lines, rather than the shape of the mesh structure. In other words, FIG. 8A and FIG. 9A The lines shown can correspond to cuts. FIG. 8B and FIG. 9B The cut lines of the mesh structure shown, and the cut lines in FIG. 8B and FIG. 9B The line shown in the middle is a dashed line.

[0196] FIG. 7 , FIG. 8A , FIG. 8B , FIG. 9A and FIG. 9BThe shape of the sensing unit SU shown is a representative example, and this disclosure is not limited thereto. In other embodiments, the sensing unit SU may have various suitable shapes.

[0197] refer to FIG. 7 , FIG. 8A , FIG. 8B , FIG. 9A and FIG. 9B The first electrode 210 may include a plurality of first segmented electrodes 210-dp spaced apart from each other in a first direction DR1. Each of the first segmented electrodes 210-dp may extend in a second direction DR2. The first segmented electrodes 210-dp may be referred to as first sub-electrodes 210-dp.

[0198] The third electrode 230 may include a plurality of second segmented electrodes 230-dp spaced apart from each other in the first direction DR1. Each of the second segmented electrodes 230-dp may extend in the second direction DR2. The second segmented electrodes 230-dp may be referred to as second sub-electrodes 230-dp. Each of the second segmented electrodes 230-dp may include an annular pattern and may have a shape in which the patterns are connected to each other.

[0199] When viewed in a third-direction DR3 (e.g., in a plan view), the second segmented electrode 230-dp can overlap with the first segmented electrode 210-dp in a one-to-one correspondence. As used herein, terms such as overlap indicate that at least a portion of a first segmented electrode 210-dp overlaps with at least a portion of a second segmented electrode 230-dp (e.g., in a third-direction DR3).

[0200] Although, as an example, a sensing unit SU is as follows FIG. 8A and FIG. 9A The diagram shows three first segmented electrodes 210-dp and three second segmented electrodes 230-dp, but this disclosure is not limited thereto. For example, each of the number of first segmented electrodes 210-dp and second segmented electrodes 230-dp included in a sensing unit SU can be one, two, four, or more. Each of the first segmented electrodes 210-dp and second segmented electrodes 230-dp can correspond to a signal transmission path or a resistance path through which a signal is transmitted.

[0201] Also refer to FIG. 7 and FIG. 8A A fifth trace 230rt2 is electrically connected to a first electrode group 230pc. A first electrode group 230pc may include two third electrodes 230. In this case, the fifth trace 230rt2 may be electrically connected to six second segmented electrodes 230-dp. This reduces the increase in the number of pads in the sensor layer 200.

[0202] Compared to a case where the first electrode 210 in one of the sensing units SU has a single shape and is not segmented, when the first electrode 210 in one sensing unit SU includes a first segmented electrode 210-dp, the first segmented electrode 210-dp can be arranged in a relatively more uniform distribution within the sensing unit SU. In this case, signals can be provided or detected more uniformly within the sensing unit SU.

[0203] Furthermore, when the first electrode 210 in a sensing unit SU includes a first segmented electrode 210-dp, the number of first bridging patterns 212 in a sensing unit SU can be increased compared to the case where the first electrode 210 in one of the sensing units SU is not segmented. Two first bridging patterns 212 connected to the same two first patterns 211 can be considered as a pair, as an example... FIG. 8A The arrangement shown consists of 9 pairs of first bridging patterns 212. In other words, in FIG. 8A and FIG. 9A A total of 18 first bridging patterns 212 are shown.

[0204] More specifically, an increase in the number of first bridging patterns 212 arranged on a first direction DR1 intersecting the second direction DR2, which is the extending direction of the first electrode 210, can correspond to an increase in the number of signal paths. Therefore, as the number of signal paths increases, the resistance of the first electrode 210 can decrease. As a result, the sensing sensitivity of the sensor layer 200 can be improved.

[0205] Furthermore, the shape of each of the first segmented electrodes 210-dp can approximate or resemble a strip shape extending in the second direction DR2, and because this shape approximates or resembles a strip shape, the resistance path can be reduced. Therefore, when the resistance path is reduced and the number of resistance paths connected in parallel within a first electrode 210 increases, the resistance of the first electrode 210 can be reduced. As a result, the sensing sensitivity of the sensor layer 200 can be improved.

[0206] Furthermore, since the shape of each of the first segmented electrodes 210-dp is close to or similar to a strip shape extending in the second direction DR2, the proportion of the area available for pattern design within the entire region of a sensing unit SU can be increased. Therefore, the degree of freedom in pattern design can be improved.

[0207] According to embodiments of this disclosure, the degree of freedom in the pattern design of the sensing unit SU can be improved, and the resistance of the electrodes included in the sensing unit SU can be reduced. In this case, it is easier to ensure the frequency range (e.g., bandwidth) suitable for the signal provided to the sensor layer 200. Therefore, the degree of freedom in frequency selection can be improved.

[0208] refer to FIG. 8A and FIG. 9A Each of the first segmented electrodes 210-dp may include a plurality of first patterns 211 and a plurality of first bridging patterns 212 electrically connected to the first patterns 211. FIG. 9A In the diagram, a sensing unit SU (e.g., reference SU) is shown together. FIG. 7 The first bridging pattern 212 of the first conductive layer SU202 and the second conductive layer SU204 is used to illustrate their alignment relationship. Although two adjacent first patterns 211 can be connected to each other by two first bridging patterns 212, this disclosure is not limited to the number of first bridging patterns 212. The first patterns 211 and the first bridging patterns 212 can be defined in an intermediate insulating layer 203 (e.g., reference 1). FIG. 6A The contact hole 200cmt1 in ) (for example, refer to FIG. 8B and FIG. 9B They are electrically connected to each other.

[0209] refer to FIG. 9A The second electrode 220 may include a plurality of first branch portions 220b1 extending in a first direction DR1 and a plurality of second branch portions 220b2 extending in a second direction DR2 intersecting the first direction DR1. The first branch portions 220b1 may be spaced apart from each other in the second direction DR2. The second branch portions 220b2 may be spaced apart from each other in the first direction DR1. The first branch portions 220b1 and the second branch portions 220b2 may be connected to each other and may have an integral shape.

[0210] A portion of the first branch 220b1 and a second bridging pattern 242, described in more detail below, may be disposed between two adjacent first patterns 211. The first bridging pattern 212 may intersect with a portion of the first branch 220b1 and a second bridging pattern 242 in an insulating manner.

[0211] refer to FIG. 8A and FIG. 6A The fourth electrode 240 may include a plurality of third segmented electrodes 240-dp spaced apart from each other in the second direction DR2. Each of the third segmented electrodes 240-dp may extend in the first direction DR1. Each of the third segmented electrodes 240-dp may include a plurality of second patterns 241 and a plurality of second bridging patterns 242 electrically connected to the second patterns 241. Each of the second patterns 241 may have an annular shape. The second patterns 241 and the second bridging patterns 242 may be defined in an intermediate insulating layer 203 (e.g., reference 203). FIG. 8B The contact hole 200 cmt2 in ) (for example, refer to FIG. 9B and FIG. 8AThey are electrically connected to each other. Two adjacent second patterns 241 may be spaced apart from each other, with a second dividing electrode 230-dp and two first bridging patterns 212 between them.

[0212] refer to FIG. 8B and FIG. 9A The second dividing electrode 230-dp, the first bridging pattern 212, and the second pattern 241 can be disposed in the same layer as each other (e.g., in the middle or on top) and can comprise the same material as each other. For example, the second dividing electrode 230-dp, the first bridging pattern 212, and the second pattern 241 can be contained in the first conductive layer SU202.

[0213] refer to FIG. 9B and FIG. 8A The first pattern 211, the first branch portion 220b1, the second branch portion 220b2, and the second bridging pattern 242 can be disposed in the same layer as each other (e.g., in the middle or on top) and can comprise the same material as each other. For example, the first pattern 211, the first branch portion 220b1, the second branch portion 220b2, and the second bridging pattern 242 can be contained in the second conductive layer SU204.

[0214] refer to FIG. 9A and FIG. 4 In a sensing unit SU, the area occupied by the components included in the first electrode 210 and the second electrode 220 in the second conductive layer SU204 can be larger than the area occupied by the components included in the third electrode 230 and the fourth electrode 240. This is achieved by the first input 2000 (e.g., reference...). FIG. 4 The change in capacitance caused by the distance can increase as the distance decreases. Therefore, the component used to detect the first input 2000 (e.g., reference) FIG. 1A ) can be used with electronic devices 1000 (e.g., reference) FIG. 8B It occupies a relatively larger area in adjacent layers on the surface. As a result, touch performance can be improved.

[0215] refer to FIG. 9B and FIG. 6AEach of the second dividing electrode 230-dp, the second pattern 241, the first pattern 211, the second electrode 220, and the second bridging pattern 242 may have a grid structure. Each of the grid structures may include multiple grid lines. The multiple grid lines may each have a shape extending in a respective direction (e.g., a predetermined direction) and may be connected to each other. The shape of the grid lines may include various suitable shapes, such as straight lines, lines with protrusions, or uneven lines (e.g., wavy lines). Each of the grid structures may define (e.g., may be provided) an opening at least partially surrounded by grid lines (e.g., at least partially surrounded by grid lines around its periphery). The opening may be connected to the light-emitting region PXA (e.g., reference). FIG. 8B The grid lines may overlap with the non-luminescent region NPXA. However, this disclosure is not limited thereto.

[0216] like FIG. 9B and FIG. 8A As shown, as an example, the mesh structure may include mesh lines extending in a first intersecting direction CDR1 that intersects the first direction DR1 and the second direction DR2, and mesh lines extending in a second intersecting direction CDR2 that intersects the first intersecting direction CDR1. However, this disclosure is not limited to the aforementioned extension directions of the mesh lines in the mesh structure. For example, the mesh structure may include mesh lines extending only in the first direction DR1 and the second direction DR2, or mesh lines extending in the first direction DR1, the second direction DR2, the first intersecting direction CDR1, and the second intersecting direction CDR2. In other words, the mesh structure may have various suitable shapes.

[0217] refer to FIG. 9A and FIG. 1A In embodiments of this disclosure, a first opening 230op1 overlapping a portion of the first electrode 210 may be defined (e.g., may be provided) in the third electrode 230. For example, a plurality of first openings 230op1 overlapping the first segmented electrode 210-dp may be provided in each of the second segmented electrodes 230-dp. A first capacitance (e.g., a first coupling capacitance) provided between the first electrode 210 and the third electrode 230 may be adjusted in various ways as needed or desired based on the size of the first opening 230op1.

[0218] In embodiments of this disclosure, a second opening 240op that overlaps with a portion of the second electrode 220 may be defined (e.g., may be provided) in the fourth electrode 240. For example, a plurality of second openings 240op overlapping the fourth electrode 240 may be provided for each of the third segmented electrodes 240-dp. A second capacitance (e.g., a second coupling capacitance) provided between the second electrode 220 and the fourth electrode 240 may be adjusted in various ways as needed or desired based on the size of the second opening 240op.

[0219] As the first and second capacitors increase, the amount of induced current transferred from the third electrode 230 to the first electrode 210 can increase, and the amount of induced current transferred from the fourth electrode 240 to the second electrode 220 can also increase. Therefore, increasing the first and second capacitors improves the pen detection performance of the sensor layer 200. Furthermore, the first and second capacitors can be used as a load during touch sensing. Therefore, decreasing the first and second capacitors improves touch sensing performance.

[0220] According to embodiments of this disclosure, the overlapping areas of the first electrode 210 and the third electrode 230, as well as the overlapping areas of the second electrode 220 and the fourth electrode 240, can be adjusted as needed or desired (e.g., can be easily adjusted). Therefore, a sensor layer 200 with capacitance at an appropriate level, taking into account desired touch sensitivity and desired pen detection sensitivity, can be provided. As a result, an electronic device 1000 with improved pen sensitivity and touch sensitivity can be provided (e.g., referencing...). FIG. 1A ).

[0221] In embodiments of this disclosure, a first additional opening 230op2 may also be defined in the third electrode 230. For example, the first additional opening 230op2 may be disposed between two first bridging patterns 212 in the first bridging pattern 212.

[0222] In embodiments of this disclosure, the first conductive layer SU202 may further include a first dummy pattern 202dm1, a second dummy pattern 202dm2, a third dummy pattern 202dm3, and a fourth dummy pattern 202dm4. Each of the first dummy pattern 202dm1, the second dummy pattern 202dm2, the third dummy pattern 202dm3, and the fourth dummy pattern 202dm4 may be floated (e.g., electrically floated). Each of the first dummy pattern 202dm1, the second dummy pattern 202dm2, the third dummy pattern 202dm3, and the fourth dummy pattern 202dm4 may be divided into multiple conductive patterns. For example, a fourth dummy pattern 202dm4 may include multiple floated dummy patterns that are separated from each other (e.g., electrically separated).

[0223] The first dummy pattern 202dm1 may be surrounded by the first opening 230op1 (e.g., surrounded by the first opening 230op1 around its periphery) and may be insulated from the third electrode 230. In embodiments of this disclosure, the first dummy pattern 202dm1 may completely overlap with the first electrode 210. In other words, the entire or substantially the entire area of ​​the first dummy pattern 202dm1 may overlap with the first electrode 210 (e.g., may overlap with the first pattern 211).

[0224] The second dummy pattern 202dm2 may be surrounded by the second opening 240op (e.g., surrounded by the second opening 240op around its periphery) and may be insulated from the fourth electrode 240. For example, the second dummy pattern 202dm2 may be surrounded by the second pattern 241 (e.g., surrounded by the second pattern 241 around its periphery). In embodiments of this disclosure, a portion of the second dummy pattern 202dm2 may overlap with the second electrode 220, and another portion of the second dummy pattern 202dm2 may not overlap with the second electrode 220.

[0225] The third dummy pattern 202dm3 may be surrounded by the first additional opening 230op2 (e.g., surrounded around its periphery by the first additional opening 230op2) and may be insulated from the third electrode 230. The fourth dummy pattern 202dm4 may be surrounded by two second segmented electrodes 230-dp and two third segmented electrodes 240-dp (e.g., surrounded around its periphery by two second segmented electrodes 230-dp and two third segmented electrodes 240-dp).

[0226] In embodiments of this disclosure, the second conductive layer SU204 may further include a fifth dummy pattern 204dm1 and a sixth dummy pattern 204dm2. Each of the fifth dummy pattern 204dm1 and the sixth dummy pattern 204dm2 may be floated (e.g., electrically floated). Each of the fifth dummy pattern 204dm1 and the sixth dummy pattern 204dm2 may be divided into multiple conductive patterns. For example, the fifth dummy pattern 204dm1 may include multiple floating dummy patterns electrically separated from each other.

[0227] The fifth dummy pattern 204dm1 can be configured to be adjacent to the first dividing electrode 210-dp. A portion of the fifth dummy pattern 204dm1 can overlap with the second dividing electrode 230-dp, and another portion of the fifth dummy pattern 204dm1 can be non-overlapping with the fourth dummy pattern 202dm4.

[0228] The sixth dummy pattern 204dm2 may be completely or substantially completely surrounded by the second electrode 220 (e.g., completely or substantially completely surrounded by the second electrode 220 around its periphery). For example, the sixth dummy pattern 204dm2 may be disposed between the two first branch portions 220b1 and the two second branch portions 220b2. The sixth dummy pattern 204dm2 may overlap with another portion of the second dummy pattern 202dm2, the second pattern 241, and the fourth dummy pattern 202dm4.

[0229] According to embodiments of this disclosure, in each of the first conductive layer SU202 and the second conductive layer SU204, a dummy pattern may be provided in the space where the first electrode 210, the second electrode 220, the third electrode 230, and the fourth electrode 240 are not provided. Each of the dummy patterns may also have a grid structure. Therefore, since the grid lines extend throughout or substantially throughout the entire or substantially the entire sensing unit SU arrangement, the probability of a particular pattern being identified due to external light reflection can be reduced. In other words, an electronic device 1000 with improved visibility to external light reflection can be provided (e.g., see reference 1000). FIG. 8A to FIG. 9B ).

[0230] The above has been referenced. FIG. 10A An example is described in which each of the first electrode 210, the second electrode 220, the third electrode 230, and the fourth electrode 240 is divided and arranged at two conductive layers SU202 and SU204 (e.g., in the middle or on top). However, this disclosure is not limited thereto. For example, the first electrode 210, the second electrode 220, the third electrode 230, and the fourth electrode 240 may be divided and arranged at three or four conductive layers (e.g., in the middle or on top).

[0231] In embodiments of this disclosure, the third electrode 230, to which a signal is applied in the charging drive mode, may be included in a third conductive layer disposed below (e.g., below) the first conductive layer SU202 and the second conductive layer SU204. For example, the third conductive layer may be disposed below (e.g., below) the base layer 201. The third conductive layer may be disposed between the base layer 201 and the display layer 100, may be disposed below (e.g., below) the display layer 100, or may be included in the display layer 100.

[0232] The first electrode 210, the second electrode 220, and the fourth electrode 240 may be included in the first conductive layer SU202 and the second conductive layer SU204. For example, when the third electrode 230 is implemented as a separate conductive layer, like the third conductive layer described above, the shape of the third electrode 230 can be designed more freely. For example, the third electrode 230 may have a shape including multiple coils. Furthermore, by using the third conductive layer, the third electrode 230 can be arranged more densely, and in this case, pen sensing sensitivity can be improved. In another embodiment of this disclosure, the third conductive layer may include the fourth electrode 240 instead of the third electrode 230.

[0233] FIG. 7 This illustrates a sensing unit SU according to an embodiment of the present disclosure (e.g., reference SU). FIG. 10B A plan view of the first conductive layer SU202a. FIG. 10A It is shown FIG. 11A An enlarged plan view of region XX' in the diagram. FIG. 7This illustrates a sensing unit SU according to an embodiment of the present disclosure (e.g., reference SU). FIG. 11B A plan view of the second conductive layer SU204a. FIG. 11A It is shown FIG. 10A A magnified planar view of region YY' in the diagram.

[0234] exist FIG. 11A and FIG. 10A For ease of illustration, the boundaries between components are shown as lines, rather than the shape of the mesh structure. In other words, it can be understood that... FIG. 11A and FIG. 10B The lines shown can correspond to cuts such as FIG. 11B and FIG. 10B The cut lines of the mesh structure shown, and the cut lines in FIG. 11B and FIG. 7 It is shown in the middle by a dashed line.

[0235] refer to FIG. 10A , FIG. 10B , FIG. 11A , FIG. 11B and FIG. 5 The first electrode 210-x may include a plurality of first segmented electrodes 210-dpx spaced apart from each other in a first direction DR1. Each of the first segmented electrodes 210-dpx may extend in a second direction DR2. The third electrode 230-x may include a plurality of second segmented electrodes 230-dpx spaced apart from each other in the first direction DR1. Each of the second segmented electrodes 230-dpx may extend in the second direction DR2.

[0236] When viewed on a third-direction DR3 (e.g., in a plan view), the second segmented electrode 230-dpx can overlap with the first segmented electrode 210-dpx in a one-to-one correspondence. As used herein, the feature of overlap indicates that at least a portion of a first segmented electrode 210-dpx overlaps with at least a portion of a second segmented electrode 230-dpx (e.g., on a third-direction DR3).

[0237] According to embodiments of the present disclosure, each of the first segmented electrodes 210-dpx may include a plurality of first patterns 211x and a plurality of first bridging patterns 212x electrically connected to the first patterns 211x.

[0238] According to embodiments of this disclosure, each of the first patterns 211x has an annular shape, and the portion of each of the second segmented electrodes 230-dpx that overlaps with the first pattern 211x can have a strip shape or a near-strip shape. In this case, the overlap area between the first electrode 210-x and the third electrode 230-x can be more easily adjusted by adjusting the inner diameter of each of the first patterns 211x or the width of each of the second segmented electrodes 230-dpx.

[0239] According to an embodiment of this disclosure, the first segmented electrode 210-dpx includes a first pattern 211x and a first bridging pattern 212x disposed in different layers (e.g., middle or upper), and the first pattern 211x and the first bridging pattern 212x can be electrically connected to each other via contact portions. In this case, the resistance can be increased compared to the case where the first pattern 211x and the first bridging pattern 212x are disposed in the same layer (e.g., middle or upper) and integrated with each other.

[0240] In embodiments of this disclosure, the resistance of the portion of the second segmented electrode 230-dpx that overlaps with the first pattern 211x may be less than the resistance of the first pattern 211x. However, this disclosure is not limited thereto. The resistance relationship can be modified in various ways depending on the dimension of the width of the annulus of the first pattern 211x or the width of that portion of the second segmented electrode 230-dpx.

[0241] Each of the second segmented electrodes 230-dpx can extend in the same layer along the second direction DR2. Therefore, there may be no increase in resistance due to layer variation in the second segmented electrodes 230-dpx. The second segmented electrodes 230-dpx can be electrodes to which a signal is applied in the charging drive mode, which will be described in more detail below. Therefore, as the resistance of the second segmented electrodes 230-dpx decreases, the resistance used for the pen PN (e.g., reference PN)... FIG. 10B The resonant circuit can increase the strength of the charging current and the magnetic field of each element.

[0242] According to embodiments of this disclosure, since the portion of each of the second segmented electrodes 230-dpx that overlaps with the first pattern 211x has a strip shape or approximately a strip shape, the second segmented electrodes 230-dpx can have a shape with a width relatively smaller than that of the first segmented electrode 210-dpx. In this case, the parasitic capacitance that may occur in each of the second segmented electrodes 230-dpx can be reduced. Therefore, the performance of the sensor layer 200 can be improved.

[0243] refer to FIG. 6AThe second segmented electrode 230-dpx may include a first portion having a first width WT1x in the first direction DR1 and a second portion having a second width WT2x in the first direction DR1. The first width WT1x may be greater than the second width WT2x. For example, the first portion having the first width WT1x may be closer to the first bridging pattern 212x than the second portion having the second width WT2x.

[0244] In a plane (e.g., in a planar view), a first portion having a first width WT1x can overlap with a first pattern 211x to provide capacitance between them. Furthermore, a second portion having a second width WT2x can overlap with a dummy pattern surrounded by the first pattern 211x (e.g., around its periphery). By adjusting the second width WT2x, the overlap area between the first electrode 210-x and the third electrode 230-x can be easily adjusted.

[0245] The second segmented electrode 230-dpx may define an opening 230opx, and two first bridging patterns 212x may be provided in the opening 230opx. When the first bridging pattern 212x is surrounded by the second segmented electrode 230-dpx, the capacitance with temperature change value among the capacitances appearing in the first electrode 210-x can be reduced. Therefore, the temperature characteristics of the sensor layer 200 can be improved.

[0246] The second electrode 220-x may include a plurality of first branch portions 220b1x extending in a first direction DR1, a plurality of second branch portions 220b2x extending in a second direction DR2 intersecting the first direction DR1, and a connecting portion 220b3x disposed between the first patterns 211x. The first branch portions 220b1x may be spaced apart from each other in the second direction DR2, and the second branch portions 220b2x may be spaced apart from each other in the first direction DR1. The first branch portions 220b1x, the second branch portions 220b2x, and the connecting portion 220b3x may be connected to each other to have an integral shape.

[0247] The fourth electrode 240-x may include a plurality of third segmented electrodes 240-dpx spaced apart from each other in the second direction DR2. Each of the third segmented electrodes 240-dpx may extend in the first direction DR1. Each of the third segmented electrodes 240-dpx may include a plurality of second patterns 241x and a plurality of second bridging patterns 242x electrically connected to the second patterns 241x. The second patterns 241x may define an opening 240opx. Each of the second patterns 241x may have an annular shape. The second patterns 241x and the second bridging patterns 242x may be defined in an intermediate insulating layer 203 (e.g., reference 203). FIG. 10BThe contact holes in the first bridging pattern 212x are electrically connected to each other. Two adjacent second patterns 241x may be spaced apart from each other, with a second dividing electrode 230-dpx and two first bridging patterns 212x between them.

[0248] In embodiments of this disclosure, the third width WT3x of each of the first branch portions 220b1x in the second direction DR2 can be greater than the fourth width WT4x of each of the second branch portions 220b2x in the first direction DR1. For example, the first branch portion 220b1x can overlap with the second pattern 241x and a dummy pattern surrounded by the second pattern 241x (e.g., surrounded around its periphery by the second pattern 241x). By adjusting the third width WT3x, the overlap area between the second electrode 220-x and the fourth electrode 240-x can be easily adjusted. As another example, the overlap area between the second electrode 220-x and the fourth electrode 240-x can be easily adjusted by adjusting the inner diameter of the annular shape of each of the second patterns 241x surrounding (e.g., surrounding its periphery) the dummy pattern.

[0249] According to embodiments of this disclosure, each of the third segmented electrodes 240-dpx includes a second pattern 241x and a second bridging pattern 242x disposed in different layers (e.g., middle or upper), and the second pattern 241x and the second bridging pattern 242x can be electrically connected to each other via contact portions. In this case, the resistance can be increased compared to the case where the second pattern 241x and the second bridging pattern 242x are disposed in the same layer (e.g., middle or upper) and integrated with each other.

[0250] In embodiments of this disclosure, the third electrode 230-x corresponds to a component that transmits signals in the case of touch detection and pen sensing, and the fourth electrode 240-x corresponds to a component that provides capacitance with the third electrode 230-x in the case of pen sensing. Therefore, it may be suitable to reduce the resistance of the third electrode 230-x rather than the resistance of the fourth electrode 240-x. Thus, the third electrode 230-x can be implemented as a single layer, and the fourth electrode 240-x can be implemented as two different layers.

[0251] refer to FIG. 11B and FIG. 12 The second bridging pattern 242x may include a line extending in either the first crossing direction CDR1 or the second crossing direction CDR2 in some of its segments (e.g., it may include only one line). In this case, the first bridging pattern 212x overlapping the second bridging pattern 242x may intersect the second bridging pattern 242x in an insulating manner in some segments. Therefore, the capacitance between the first bridging pattern 212x and the second bridging pattern 242x can be minimized or reduced. Reference will be made below.FIG. 13 and FIG. 12 Provide a more detailed description.

[0252] FIG. 7 This illustrates a sensing unit SU according to an embodiment of the present disclosure (e.g., reference SU). FIG. 12 A floor plan of some components.

[0253] refer to FIG. 12 According to an embodiment, as an example, a second bridging pattern 242x and two first bridging patterns 212x overlapping the second bridging pattern 242x are shown. FIG. 13 In order to facilitate differentiation from each other, the first bridging pattern 212x and the second bridging pattern 242x are shown with different widths. The width of each of the first bridging patterns 212x may be equal to or less than the width of the second bridging pattern 242x.

[0254] Each of the first bridging patterns 212x may include a first main line 212m1 extending in a first intersecting direction CDR1 (or a second intersecting direction CDR2) and a second main line 212m2 extending in a second intersecting direction CDR2 (or a first intersecting direction CDR1). For example, adjacent first bridging patterns 212x may be symmetrical or substantially symmetrical to each other with respect to an imaginary axis extending in the second direction DR2 between them. One end of the first main line 212m1 may intersect with one end of the second main line 212m2. The first bridging pattern 212x may also include a plurality of first projection lines 212p1 intersecting the first main line 212m1 and a plurality of second projection lines 212p2 intersecting the second main line 212m2. The first projection lines 212p1 may be spaced apart from each other along the first intersecting direction CDR1 (or along the second intersecting direction CDR2), and the second projection lines 212p2 may be spaced apart from each other along the second intersecting direction CDR2 (or along the first intersecting direction CDR1). In another embodiment of this disclosure, the first projection line 212p1 and the second projection line 212p2 may be omitted as needed or desired.

[0255] The second bridging pattern 242x may include a first line 242m1 extending in a first crossing direction CDR1 and a second line 242m2 extending in a second crossing direction CDR2. According to embodiments of this disclosure, the second bridging pattern 242x may include a first portion B-CA1 and a second portion B-CA2, wherein in the first portion B-CA1, at least two first lines 242m1 intersect with at least two second lines 242m2, and in the second portion B-CA2, one first line 242m1 intersects with at least one second line 242m2, or at least one first line 242m1 intersects with one second line 242m2. The second portion B-CA2 may intersect with each of the first bridging patterns 212x. In other words, each of the second portions B-CA2 may intersect with a corresponding one of the first bridging patterns 212x.

[0256] In embodiments of this disclosure, each of the first portions B-CA1 includes at least two lines extending in the same direction as each other, and each of the second portions B-CA2 includes one line extending in one direction (e.g., only one line). Therefore, the minimum width WTB1 of each of the first portions B-CA1 in one direction can be greater than the minimum width WTB2 of each of the second portions B-CA2 in the same direction.

[0257] In the second part B-CA2, the first bridging pattern 212x overlapping the second bridging pattern 242x can intersect the second bridging pattern 242x in an insulating manner. In this case, the capacitance between the first bridging pattern 212x and the second bridging pattern 242x can be reduced. Furthermore, since the remaining portion of the second bridging pattern 242x that does not overlap with the first bridging pattern 212x is configured such that at least two first lines 242m1 intersect with at least two second lines 242m2, the probability of identifying the second bridging pattern 242x due to differences in external light reflectivity can be reduced.

[0258] FIG. 7 This illustrates a sensing unit SU according to an embodiment of the present disclosure (e.g., reference SU). FIG. 13 A floor plan of some components. FIG. 12 In this context, the same reference numerals are used to refer to references above. FIG. 13 The components described are the same or substantially the same, and therefore their redundant descriptions need not be repeated.

[0259] refer to FIG. 13 According to an embodiment, as an example, a second bridging pattern 242xa and two first bridging patterns 212xa overlapping the second bridging pattern 242xa are shown. FIG. 12In this diagram, for ease of distinction, the first bridging pattern 212xa and the second bridging pattern 242xa are shown with different widths. The width of each of the first bridging patterns 212xa may be equal to or less than the width of the second bridging pattern 242xa.

[0260] According to embodiments of this disclosure, the second bridging pattern 242xa may include a first portion B-CA1a and a second portion B-CA2a. In the first portion B-CA1a, at least two first lines 242m1 intersect with at least two second lines 242m2. In the second portion B-CA2a, one first line 242m1 intersects with at least one second line 242m2, or in the second portion B-CA2a, at least one first line 242m1 intersects with one second line 242m2. The second portion B-CA2a may intersect with the first bridging pattern 212xa.

[0261] When referring to the above FIG. 14A Compared to the described implementation, the second portion B-CA2a can have a relatively large area. The second portion B-CA2a can be a region overlapping with the first bridging pattern 212xa. Therefore, the design freedom for the position of the first bridging pattern 212xa can be improved. Furthermore, because the second portion B-CA2a includes not only the region overlapping with the first bridging pattern 212xa but also the region adjacent to the first bridging pattern 212xa, the capacitance between the first bridging pattern 212xa and the second bridging pattern 242xa can be further reduced.

[0262] FIG. 7 This illustrates a sensing unit SU according to an embodiment of the present disclosure (e.g., reference). FIG. 14B An enlarged plan view of a portion of the image. FIG. 14A It is according to the embodiments of this disclosure. FIG. 14A A sectional view taken by line I-I'. For example, FIG. 8A It shows FIG. 9A Region CC' and FIG. 14B The state of overlap of region CC', and FIG. 14A A cross-section of the sensor layer 200 is shown.

[0263] refer to FIG. 14B and FIG. 15A The diagram shows a portion of the first pattern 211 and the second segmented electrode 230-dp. A first opening 230op1 may be defined in the second segmented electrode 230-dp.

[0264] When viewed on a third-direction DR3 (e.g., in a plan view), the magnitude of the first coupling capacitance between the first electrode 210 and the third electrode 230 can be determined based on the area of ​​the first region OLA1 in which the first pattern 211 overlaps with the second segmented electrode 230-dp.

[0265] In embodiments of this disclosure, the dimensions of the first maximum width 230op1-wt1 of the first opening 230op1 in the first direction DR1 and the second maximum width 230op2-wt2 of the first opening 230op1 in the second direction DR2 can be adjusted as needed or desired. The size of the first coupling capacitance between the first electrode 210 and the third electrode 230 can be adjusted according to the desired size of the first opening 230op1.

[0266] FIG. 7 This illustrates a sensing unit SU according to an embodiment of the present disclosure (e.g., reference). FIG. 15B An enlarged plan view of a portion of the image. FIG. 15A It is along FIG. 15A A sectional view taken from line II-II'. For example, FIG. 8A It shows FIG. 9A Region DD' and FIG. 15B The state of overlap of regions DD', and FIG. 15A A cross-section of the sensor layer 200 is shown.

[0267] refer to FIG. 15B and FIG. 14A This shows a second pattern 241 and a portion of a second electrode 220. A second opening 240op may be defined in the second pattern 241.

[0268] When viewed on a third-direction DR3 (e.g., in a plan view), the magnitude of the second coupling capacitance between the second electrode 220 and the fourth electrode 240 can be determined based on the area of ​​the second region OLA2 in which the second pattern 241 overlaps with the second electrode 220.

[0269] In embodiments of this disclosure, the dimensions of the first maximum width 240op-wt1 of the second opening 240op in the first direction DR1 and the second maximum width 240op-wt2 of the second opening 240op in the second direction DR2 can be adjusted as needed or desired. The size of the second coupling capacitance between the second electrode 220 and the fourth electrode 240 can be adjusted according to the desired size of the second opening 240op.

[0270] Although the first opening 230op1 can have a closed curve shape defined as being completely surrounded by the second segmented electrode 230-dp (e.g., completely surrounded by the second segmented electrode 230-dp around its periphery), and the second opening 240op can have a closed curve shape defined as being completely surrounded by the second pattern 241 (e.g., surrounded by the second pattern 241 around its periphery), such as FIG. 15A and FIG. 16A The examples shown are for illustrative purposes only, but this disclosure is not limited thereto.

[0271] For example, when the area of ​​the first region OLA1 and the area of ​​the second region OLA2 are adjustable, the planar shape of each of the first opening 230op1 and the second opening 240op can be deformed into various shapes. For example, the planar shape of each of the first opening 230op1 and the second opening 240op can be defined by an opening curve having an open side. In this case, the side surface defining the first opening 230op1 can be connected to the edge of the second segmented electrode 230-dp, and the side surface defining the second opening 240op can be connected to the edge of the second pattern 241.

[0272] FIG. 7 This illustrates a sensing unit SU according to an embodiment of the present disclosure (e.g., reference). FIG. 16B An enlarged plan view of a portion of the image. FIG. 16A It is according to the embodiments of this disclosure. FIG. 16B A sectional view taken by line III-III'. For example, FIG. 16A A cross-section of the sensor layer 200 can be shown.

[0273] refer to FIG. 16B and FIG. 14A This shows a portion of a first pattern 211a and a second segmented electrode 230-dpa. (Refer to the above reference.) FIG. 14B and FIG. 16A The differences described, in the implementation, such as FIG. 16B and FIG. 17A As shown, a first opening 211aop may be defined in the first pattern 211a.

[0274] When viewed on a third-direction DR3 (e.g., in a plan view), the magnitude of the first coupling capacitance between the first electrode 210 and the third electrode 230 can be determined based on the area of ​​the first region OLA1a in which the first pattern 211a overlaps with the second segmented electrode 230-dpa.

[0275] In embodiments of this disclosure, the dimensions of the first maximum width 211aop-wt1 of the first opening 211aop in the first direction DR1 and the second maximum width 211aop-wt2 of the first opening 211aop in the second direction DR2 can be adjusted as needed or desired. The size of the first coupling capacitance between the first electrode 210 and the third electrode 230 can be adjusted according to the desired size of the first opening 211aop.

[0276] The sensor layer 200 may also include multiple dummy patterns. For example, the multiple dummy patterns may include a first dummy pattern 202dm1a and a second dummy pattern 204dm1a. The first dummy pattern 202dm1a may be disposed in the same layer as the layer of the second segmented electrode 230-dpa (e.g., in the middle or on top), and may overlap with a portion of the first pattern 211a. The second dummy pattern 204dm1a may be surrounded by a first opening 211aop (e.g., surrounded around its periphery by the first opening 211aop), and may be disposed in the same layer as the layer of the first pattern 211a (e.g., in the middle or on top).

[0277] FIG. 6A This illustrates a sensor layer 200 according to an embodiment of the present disclosure (e.g., reference 200). FIG. 6A The second conductive layer 204 (e.g., reference) FIG. 17B An enlarged plan view of a portion of the image. FIG. 17A It is shown FIG. 7 A magnified plan view of region EE' in the diagram.

[0278] refer to FIG. 16A , FIG. 17A , FIG. 17B and FIG. 17A A first electrode 210a of a sensing unit SU may include a plurality of first segmented electrodes 210-dpa. Each of the first segmented electrodes 210-dpa may include a first pattern 211a. FIG. 17A The image shows three first patterns 211a included in a sensing unit SU.

[0279] The second dummy pattern 204dm1a can be divided into multiple patterns. For example, the second dummy pattern 204dm1a surrounded by a first opening 211aop (e.g., surrounded by a first opening 211aop around its periphery) may include multiple floating patterns that are separate from or electrically separated from each other. Although the second dummy pattern 204dm1a is referenced above FIG. 18A The example described includes two floating patterns, but this disclosure is not limited thereto.

[0280] In embodiments of this disclosure, the first patterns 211a included in a sensing unit SU can be electrically connected to each other. For example, the sensor layer 200 may also include a connecting line 210-ct disposed near the peripheral region 200NA, and the first patterns 211a can be electrically connected to each other via the connecting line 210-ct. Furthermore, the first patterns 211a can be electrically connected to a first trace 210t. Therefore, each of the first segmented electrodes 210-dpa included in the first electrodes 210a may have one end electrically connected to the connecting line 210-ct and another end electrically connected to the first trace 210t (e.g., opposite ends).

[0281] Each of the first patterns 211a may have a grid structure. The first pattern 211a may be located on the same layer as the layer of the connecting line 210-ct (e.g., in the middle or on top) and may include the same material as the connecting line 210-ct. The first pattern 211a and the connecting line 210-ct may be connected to each other to have an integral shape.

[0282] FIG. 6A This illustrates a sensor layer 200 according to an embodiment of the present disclosure (e.g., reference 200). FIG. 6A The first conductive layer 202 (e.g., reference) FIG. 18B An enlarged plan view of a portion of the image. FIG. 18A It is shown FIG. 19 A magnified planar view of region FF' in the image. FIG. 6A This illustrates a sensor layer 200 according to an embodiment of the present disclosure (e.g., reference 200). FIG. 19 An enlarged plan view of a portion of ( ). For example, FIG. 17A It shows FIG. 18A The region GG' and FIG. 7 The state of overlapping regions GG'.

[0283] refer to FIG. 17A , FIG. 18A , FIG. 18B , FIG. 19 and FIG. 20 The third electrode 230a of a sensing unit SU may include a plurality of second segmented electrodes 230-dpa. The second segmented electrodes 230-dpa may overlap with the first segmented electrodes 210-dpa in a one-to-one correspondence. The second segmented electrodes 230-dpa may be electrically connected to the third trace 230rt1.

[0284] In embodiments of this disclosure, the first line portion 231t of the third trace 230rt1 may include a first layer line 231ta and a second layer line 231tb connected to the first layer line 231ta and disposed at a layer different from the layer of the connecting line 210-ct (e.g., in the middle or on top). The second layer line 231tb may overlap with at least a portion of the connecting line 210-ct. The second layer line 231tb may overlap with both the connecting line 210-ct and the first layer line 231ta. The second layer line 231tb may be electrically insulated from the connecting line 210-ct and may be electrically connected to the first layer line 231ta.

[0285] FIG. 6A This illustrates a sensor layer 200 according to an embodiment of the present disclosure (e.g., reference 200). FIG. 20 An enlarged plan view of a portion of the image.

[0286] refer to FIG. 6A As an example, a portion of the fourth electrode 240 and a portion of the second electrode 220 are shown. The second electrode 220 may have a mesh structure, and the fourth electrode 240 may also have a mesh structure. The mesh lines of the second electrode 220 may have a greater thickness than the mesh lines of the fourth electrode 240.

[0287] In embodiments of this disclosure, the second electrode 220 may be electrically connected to the second trace 220t. For example, the second electrode 220 and the second trace 220t may comprise the same material and may be disposed in the same layer (e.g., middle or upper). The second electrode 220 and the second trace 220t may be connected to each other to have an integral shape. For example, the second electrode 220 and the second trace 220t may be included in the first conductive layer 202 (e.g., reference layer 202). FIG. 6A )middle.

[0288] In embodiments of this disclosure, the fourth electrode 240 may be electrically connected to the fourth trace 240t. For example, the fourth electrode 240 and the fourth trace 240t may comprise the same material and be disposed in the same layer (e.g., middle or upper). The fourth electrode 240 and the fourth trace 240t may be connected to each other to have an integral shape. For example, the fourth electrode 240 and the fourth trace 240t may be included in the second conductive layer 204 (e.g., reference layer 204). FIG. 21 In the sensor layer 200, there may also be a dummy pattern 204dm overlapping with the fourth electrode 240.

[0289] FIG. 6A This illustrates a sensor layer 200 according to an embodiment of the present disclosure (e.g., reference 200). FIG. 21 An enlarged plan view of a portion of the image.

[0290] refer to FIG. 6AThe first pattern 211a can be electrically connected to a first trace 210t. Each of the first patterns 211a can have a mesh structure. The first pattern 211a can be disposed in the same layer as the first trace 210t (e.g., in the middle or on top) and can comprise the same material as the first trace 210t. The first pattern 211a and the first trace 210t can be connected to each other to have an integral shape. For example, the first pattern 211a and the first trace 210t can be included in the second conductive layer 204 (e.g., reference 204). FIG. 6A )middle.

[0291] The second segmented electrode 230-dpa can be electrically connected to a fifth trace 230rt2. Each of the second segmented electrodes 230-dpa can have a mesh structure. The second segmented electrode 230-dpa can be disposed in the same layer as the fifth trace 230rt2 (e.g., in the middle or on top) and can comprise the same material as the fifth trace 230rt2. The second segmented electrode 230-dpa and the fifth trace 230rt2 can be connected to each other to have an integral shape. For example, the second segmented electrode 230-dpa and the fifth trace 230rt2 can be included in a first conductive layer 202 (e.g., reference 202). FIG. 7 )middle.

[0292] Reference FIG. 10A , FIG. 11A , FIG. 17A and FIG. 17A In some embodiments, the sensor layer 200 may include a plurality of first sensing electrodes (e.g., first electrode 210 or 210-x) and a plurality of second sensing electrodes (e.g., second electrode 220 or 220-x). Each of the first sensing electrodes includes a plurality of first segmented electrodes (e.g., a first segmented electrode 210-dpa or 210-dpx of a first electrode 210 or 210-x) extending in one direction (e.g., the second direction DR2 in the figure), and the plurality of second sensing electrodes extending in another direction (e.g., the first direction DR1 in the figure) intersecting the one direction.

[0293] Each of the plurality of first segmented electrodes (e.g., 210-dpa or 210-dpx) may include at least two first patterns (e.g., first pattern 211 or 211x) and a first bridging pattern (e.g., first bridging pattern 212 or 212x) electrically connected to the first patterns. At least two adjacent first segmented electrodes (e.g., 210-dpa or 210-dpx) may be connected to each other at one end via a first connection line 210-cl. The first connection line 210-cl may be electrically connected to a first trace 210t, and the first connection line 210-cl may be electrically connected to a first pad PD1.

[0294] First connecting line 210-cl and connecting line 210-ct (for example, refer to...) FIG. 10A The first sensing electrodes 210-dpa or 210-dpx, which are spaced apart in the second direction DR2, are interposed between the first connecting line 210-cl and the connecting line 210-ct. Therefore, the first ends of the multiple first segmented electrodes 210-dpa or 210-dpx included in a first sensing electrode 210 or 210-x can be connected to the first connecting line 210-cl, and the second ends of the multiple first segmented electrodes 210-dpa or 210-dpx can be connected to the connecting line 210-ct. Therefore, since a first sensing electrode 210 or 210-x includes multiple electrically connected first segmented electrodes 210-dpa or 210-dpx, two or more first bridging patterns 212 or 212x arranged in the first direction DR1 can be included within a single first sensing electrode 210 or 210-x.

[0295] In some embodiments, the sensor layer 200 may further include a plurality of third electrodes 230. Each of the plurality of third electrodes 230 includes a plurality of second segmented electrodes (e.g., a second segmented electrode 230-dpa or 230-dpx of a third electrode 230 or 230-x) extending in one direction (e.g., the second direction DR2 in the figure). At least two adjacent second segmented electrodes (e.g., 230-dpa or 230-dpx) that overlap with at least two adjacent first segmented electrodes (e.g., 210-dpa or 210-dpx) may be connected to each other at one end via a second connecting line 230-cl1 (e.g., a portion of the fifth trace 230rt2 extending from one of the third electrodes 230 or 230-x). The second connection line 230-cl1 and another second connection line 230-cl1a adjacent to the second connection line 230-cl1 (e.g., another portion of the fifth trace 230rt2 extending from another third electrode 230 or 230-x) can be connected to each other via a third connection line 230-cl2 (e.g., the portion of the fifth trace 230rt2 that connects other portions to the fifth pad PD5), and the third connection line 230-cl2 can be electrically connected to the fifth pad PD5. In some embodiments, the fifth pad PD5 can be adjacent to the first pad PD1, or the fifth pad PD5 can be arranged alternately with the first pad PD1 along another direction (e.g., the first direction DR1 in the figure).

[0296] In some embodiments, at least one first pattern (e.g., 211x) may include a first portion 211x-p1, a second portion 211x-p2 opposite to the first portion 211x-p1, and a third portion 211x-p3 connected to one end of the first portion 211x-p1 and one end of the second portion 211x-p2. For example, in some embodiments, at least one first pattern (e.g., 211x) may have a closed loop shape having two third portions 211x-p3 connecting the ends of the first portion 211x-p1 and the second portion 211x-p2 to each other, such that the first portion 211x-p1, the second portion 211x-p2, and the third portion 211x-p3 define an opening 211aop therebetween. In some embodiments, the second dummy pattern (e.g., the second dummy pattern 204dm1a) may be located between the first portion 211x-p1 and the second portion 211x-p2 of the first pattern (e.g., 211x), and may be insulated from the first pattern (e.g., 211x). In other words, the second dummy pattern (e.g., 204dm1a) may be formed by the first portion 211x-p1, the second portion 211x-p2, and the third portion 211x-p2 of the first pattern (e.g., 211x). The first electrode (e.g., 230-dpa or 230-dpx) is surrounded by (e.g., by a first portion 211x-p1, a second portion 211x-p2, and a third portion 211x-p3 of a first pattern (e.g., 211x). Thus, the first electrode (e.g., 230-dpa or 230-dpx) can overlap with the second dummy pattern (e.g., 204dm1a) and with the first portion 211x-p1 and the second portion 211x-p2 of the first pattern (e.g., 211x).

[0297] In some implementations, the second segmented electrode (e.g., 230-dpx) may include at least two second patterns 230bp (e.g., reference 230bp). FIG. 10A (e.g., a strip-shaped component) and a second bridging pattern 230cp electrically connected to the second pattern 230bp (e.g., reference). FIG. 10A (For example, components shaped like brackets < or >). FIG. 11B As shown, the second bridging pattern 230cp may include a first bridging portion 230cp1 (e.g., one of the bracket-shaped components) and a second bridging portion 230cp2 (e.g., another of the bracket-shaped components) opposite to the first bridging portion 230cp1. In some embodiments, the first bridging pattern 212x may be located between the first bridging portion 230cp1 and the second bridging portion 230cp2 of the second segmented electrode (e.g., 230-dpx), and may be located on the same layer as the second segmented electrode (e.g., 230-dpx) and the second bridging pattern 230cp (e.g., bracket < or > shaped components).

[0298] In some embodiments, the sensor layer 200 may further include a third segmented electrode (e.g., third segmented electrode 240-dpx) extending in another direction (e.g., the first direction DR1 in the figure) and overlapping with the second sensing electrode (e.g., 220-x). In some embodiments, the third segmented electrode (e.g., 240-dpx) may include at least two second patterns (e.g., second pattern 241x) and a second bridging pattern (e.g., second bridging pattern 242x) electrically connected to the second patterns. The second bridging pattern (e.g., 242x) may be located on the same layer as the first pattern (e.g., 211x) and the second sensing electrode (e.g., 220-x), and may intersect with a first bridging pattern (e.g., 212x) located on a different layer than the second bridging pattern. Each of the first bridging pattern and the second bridging pattern (e.g., 212x and 242x) may include a first grid line and a second grid line intersecting the first grid line. FIG. 10B As shown, the second bridging pattern (e.g., 242x) may have at least one closed hole (e.g., a hole with a closed loop shape) surrounded by the first and second grid lines (e.g., surrounded by the first and second grid lines around its periphery), and as... FIG. 22A As shown, the first bridging pattern (e.g., 212x) may not have any closed holes. In other words, in some embodiments, the first bridging pattern (e.g., 212x) may have a smaller number of closed holes than the second bridging pattern (e.g., 242x), wherein the number of closed holes in the first bridging pattern (e.g., 212x) may be an integer greater than or equal to 0.

[0299] FIG. 7 This is a plan view showing a sensing unit SUa according to an embodiment of the present disclosure.

[0300] refer to FIG. 22A and FIG. 6A A sensing unit SUa may include a first electrode 210-1, a second electrode 220-1, a third electrode 230-1, and a fourth electrode 240-1.

[0301] The first electrode 210-1 may include a first pattern 211-1 and a first bridging pattern 212-1. The fourth electrode 240-1 may include a second pattern 241-1 and a second bridging pattern 242-1.

[0302] The first pattern 211-1, the second electrode 220-1, and the second bridging pattern 242-1 may be included in the second conductive layer 204 (e.g., reference). FIG. 6AThe third electrode 230-1, the first bridging pattern 212-1, and the second pattern 241-1 can be disposed in the first conductive layer 202 (e.g., reference). FIG. 22A (e.g., middle or top).

[0303] In embodiments of this disclosure, one of the first electrode 210-1 and the third electrode 230-1 may define a first opening 210op-1, and one of the second electrode 220-1 and the fourth electrode 240-1 may define a second opening 220op-1. Although FIG. 1A The example shown illustrates that a first opening 210op-1 is defined in a first electrode 210-1 and a second opening 220op-1 is defined in a second electrode 220-1, but this disclosure is not limited thereto.

[0304] According to embodiments of this disclosure, the capacitance between the first electrode 210-1 and the third electrode 230-1, and the capacitance between the second electrode 220-1 and the fourth electrode 240-1, can be adjusted as needed or desired by adjusting the area or shape of each of the first opening 210op-1 and the second opening 220op-1. Therefore, capacitance at an appropriate level that takes into account desired touch sensitivity and desired pen detection sensitivity can be provided.

[0305] Furthermore, the sensing unit SUa may also include a dummy pattern DMP. The dummy pattern DMP may be floated or electrically floated, and may be disposed in the space where the first electrode 210-1, second electrode 220-1, third electrode 230-1, and fourth electrode 240-1 are not disposed. Since the dummy pattern DMP can be disposed in an empty space, the probability of a specific pattern being recognized due to external light reflection can be reduced. In other words, an electronic device 1000 with improved visibility to external light reflection can be provided (e.g., reference...). FIG. 22B ).

[0306] FIG. 22B This is a plan view showing a sensing unit SUb according to an embodiment of the present disclosure.

[0307] refer to FIG. 22A A sensing unit SUb can have the above references. FIG. 22B The described structure involves the repeated arrangement of multiple sensing units SUa. FIG. 22A The above reference is shown as an example in the text. FIG. 22A The described structure is arranged in a repeating 2×2 pattern. However, this disclosure is not limited thereto. For example, the sensing unit may have the above references wherein... FIG. 23 The described structure is a structure arranged in a repeating 3×3 pattern.

[0308] A first electrode 210-2 included in a sensing unit SUb may include a plurality of first segmented electrodes 210-dpb. The first segmented electrodes 210-dpb may be electrically connected to each other and may receive or provide the same signal to each other. A second electrode 220-2 may include a plurality of second segmented electrodes 220-dpa. A third electrode 230-2 may include a plurality of third segmented electrodes 230-dpb. A fourth electrode 240-2 may include a plurality of fourth segmented electrodes 240-dpa.

[0309] Each of the first segmented electrode 210-dpb, the second segmented electrode 220-dpa, the third segmented electrode 230-dpb, and the fourth segmented electrode 240-dpa can correspond to a signal transmission path or a resistance path through which a signal is transmitted. Each of the first segmented electrode 210-dpb, the second segmented electrode 220-dpa, the third segmented electrode 230-dpb, and the fourth segmented electrode 240-dpa can have a strip shape extending in an appropriate direction (e.g., a specific or predetermined direction). In this case, the resistance path can be minimized or reduced. Therefore, when the resistance path is reduced and the number of resistance paths connected in parallel with each other increases, the resistance of each of the first electrode 210-2, the second electrode 220-2, the third electrode 230-2, and the fourth electrode 240-2 can be reduced. As a result, the sensing sensitivity of the sensor layer 200 can be improved.

[0310] FIG. 23 This is a plan view showing a sensing unit SUc according to an embodiment of the present disclosure.

[0311] refer to FIG. 24 A sensing unit SUc may include a first electrode 210-3, a second electrode 220-3, a third electrode 230-3, and a fourth electrode 240-3.

[0312] The first electrode 210-3 may include a plurality of first segmented electrodes 210-dpc spaced apart from each other in the first direction DR1. The second electrode 220-3 may include a plurality of second segmented electrodes 220-dpb spaced apart from each other in the second direction DR2. Each of the first segmented electrodes 210-dpc may include a first sub-segmented electrode 210dv1 and a second sub-segmented electrode 210dv2 spaced apart from each other in the first direction DR1. Each of the second segmented electrodes 220-dpb may include a third sub-segmented electrode 220dv1 and a fourth sub-segmented electrode 220dv2 spaced apart from each other in the second direction DR2.

[0313] The third electrode 230-3 may include a plurality of third segmented electrodes 230-dpc spaced apart from each other in the first direction DR1, and the fourth electrode 240-3 may include a plurality of fourth segmented electrodes 240-dpb spaced apart from each other in the second direction DR2.

[0314] The first segmenting electrode 210-dpc and the third segmenting electrode 230-dpc can be adjacent to each other in a one-to-one correspondence. The second segmenting electrode 220-dpb and the fourth segmenting electrode 240-dpb can also be adjacent to each other in a one-to-one correspondence. For example, a third segmenting electrode 230-dpc can be disposed between a first sub-segmenting electrode 210dv1 and a second sub-segmenting electrode 210dv2 of a first segmenting electrode 210-dpc. A fourth segmenting electrode 240-dpb can be disposed between a third sub-segmenting electrode 220dv1 and a fourth sub-segmenting electrode 220dv2 of a second segmenting electrode 220-dpb.

[0315] FIG. 24 This is a plan view showing a sensing unit SUd according to an embodiment of the present disclosure.

[0316] refer to FIG. 23 When compared with the above references FIG. 24 In comparison to the described implementation, the sensing unit SUd may also include an auxiliary electrode 230axp.

[0317] In embodiments of this disclosure, the auxiliary electrode 230axp may overlap with one of the plurality of third segmented electrodes 230-dpc of the third electrode 230-3. In other words, the auxiliary electrode 230axp can be electrically connected to that one third segmented electrode 230-dpc through the contact portion 230ct. In this case, the total resistance of the third electrode 230-3 can be reduced. However, this disclosure is not limited thereto.

[0318] Despite the above references FIG. 25 In the described example, only one third segmented electrode 230-dpc overlaps with the auxiliary electrode 230axp, but this disclosure is not limited thereto. For example, the sensing unit SUd may also include auxiliary electrodes that overlap with multiple third segmented electrodes 230-dpc, and the multiple third segmented electrodes 230-dpc may be electrically connected to the overlapping auxiliary electrodes respectively.

[0319] In another embodiment of this disclosure, the sensing unit SUd may further include auxiliary electrodes, and the auxiliary electrodes may be arranged in various suitable arrangements. For example, the auxiliary electrodes may overlap with the first electrode 210-3, and the first segmented electrode 210-dpc may be electrically connected to the overlapping auxiliary electrodes. As another example, the auxiliary electrodes may overlap with the second electrode 220-3, and the second segmented electrode 220-dpb may be electrically connected to the overlapping auxiliary electrodes. As yet another example, the auxiliary electrodes may overlap with the fourth electrode 240-3, and the fourth segmented electrode 240-dpb may be electrically connected to the overlapping auxiliary electrodes.

[0320] FIG. 25 This is a plan view showing a sensing unit SUe according to an embodiment of the present disclosure.

[0321] refer to FIG. 25 A sensing unit SUe may include a first electrode 210-4, a second electrode 220-4, a third electrode 230-4, and a fourth electrode 240-4.

[0322] The first electrode 210-4 may include a plurality of first segmented electrodes 210-dpc1, 210-dpc2 and 210-dpc3 spaced apart from each other in the first direction DR1. The second electrode 220-4 may include a plurality of second segmented electrodes 220-dpb1, 220-dpb2 and 220-dpb3 spaced apart from each other in the second direction DR2.

[0323] In embodiments of this disclosure, a third electrode 230-4 may be adjacent to all of the first segmented electrodes 210-dpc1, 210-dpc2, and 210-dpc3. For example, the third electrode 230-4 may include a first adjacent pattern 231a adjacent to one of the first segmented electrodes 210-dpc1, 210-dpc2, and 210-dpc3; a second adjacent pattern 231b adjacent to the other first segmented electrode 210-dpc2; and a connection pattern 231c electrically connected to the first adjacent pattern 231a and the second adjacent pattern 231b.

[0324] In embodiments of this disclosure, a fourth electrode 240-4 may be adjacent to one of the second segmented electrodes 220-dpb1, 220-dpb2, and 220-dpb3. FIG. 26In the illustration, as an example, the fourth electrode 240-4 is shown disposed adjacent to the second segmented electrode 220-dpb2. However, this disclosure is not limited thereto. The fourth electrode 240-4 may have a shape similar to that of the third electrode 230-4, and may be disposed adjacent to all of the second segmented electrodes 220-dpb1, 220-dpb2, and 220-dpb3.

[0325] In embodiments of this disclosure, in a sensing unit SUe, each of the first electrode 210-4 and the second electrode 220-4 may have multiple resistance paths, and the third electrode 230-4 and the fourth electrode 240-4 may have a single resistance path.

[0326] FIG. 5 This illustrates a sensor driver 200C according to an embodiment of the present disclosure (e.g., reference...). FIG. 5 A flowchart of the operation.

[0327] refer to FIG. 26 and FIG. 27 The sensor driver 200C can be selectively driven in one of the first operating mode DMD1, the second operating mode DMD2, and the third operating mode DMD3.

[0328] The first operation mode DMD1 can be referred to as the touch and pen standby mode. The second operation mode DMD2 can be referred to as the touch activation and pen standby mode. The third operation mode DMD3 can be referred to as the pen activation mode. The first operation mode DMD1 can be a mode that waits for the first input 2000 and the second input 3000. The second operation mode DMD2 can be a mode that senses the first input 2000 and waits for the second input 3000. The third operation mode DMD3 can be a mode that senses the second input 3000.

[0329] In embodiments of this disclosure, the sensor driver 200C may initially operate in a first operating mode DMD1. When a first input 2000 is sensed in the first operating mode DMD1, the sensor driver 200C may switch (e.g., may transition) to a second operating mode DMD2. When a second input 3000 is sensed in the first operating mode DMD1, the sensor driver 200C may switch (e.g., may transition) to a third operating mode DMD3.

[0330] In embodiments of this disclosure, when the second input 3000 is sensed in the second operating mode DMD2, the sensor driver 200C can switch to the third operating mode DMD3. When the first input 2000 is released (e.g., not sensed) in the second operating mode DMD2, the sensor driver 200C can switch to the first operating mode DMD1. When the second input 3000 is released (e.g., not sensed) in the third operating mode DMD3, the sensor driver 200C can switch back to the first operating mode DMD1.

[0331] FIG. 5 This illustrates a sensor driver 200C according to an embodiment of the present disclosure (e.g., reference...). FIG. 27 A diagram illustrating the operation of ).

[0332] exist FIG. 5 In the example, the operation under the first operation mode DMD1, the second operation mode DMD2, and the third operation mode DMD3 is shown in sequence with time t.

[0333] refer to FIG. 26 , FIG. 27 and FIG. 27 In the first operating mode DMD1, the sensor driver 200C can be repeatedly driven in a second mode MD2-d and a first mode MD1-d. During the second mode MD2-d, the sensor layer 200 can be scanned to detect the second input 3000. During the first mode MD1-d, the sensor layer 200 can be scanned to detect the first input 2000. Although in FIG. 7 In the example shown, the sensor driver 200C operates sequentially in a second mode MD2-d and then in a first mode MD1-d, but this disclosure is not limited to this order.

[0334] In the second operating mode DMD2, the sensor driver 200C can be driven repeatedly in the second mode MD2-d and the first mode MD1. During the second mode MD2-d, the sensor layer 200 can be scanned to detect the second input 3000. During the first mode MD1, the sensor layer 200 can be scanned to detect the coordinates caused by the first input 2000.

[0335] In the third operating mode DMD3, the sensor driver 200C can be driven in the second mode MD2. During the second mode MD2, the sensor layer 200 can be scanned to detect coordinates caused by the second input 3000. In the third operating mode DMD3, the sensor driver 200C may not operate in the first mode MD1-d or MD1 until the second input 3000 is released (e.g., not sensed).

[0336] Let's refer to it together. FIG. 28 In both first modes MD1-d and first mode MD1, all of the third electrode 230 and the fourth electrode 240 can be grounded, or a constant or substantially constant voltage can be applied to them. As another example, in first mode MD1, all of the third electrode 230 and the fourth electrode 240 can be floated (e.g., electrically floated). As another example, in both first modes MD1-d and first mode MD1, a signal having the same phase as the transmission signal provided to the first electrode 210 can be applied to the third electrode 230 and the fourth electrode 240. In this case, the introduction of touch noise through the third electrode 230 and the fourth electrode 240 can be prevented or substantially prevented.

[0337] In both the second mode MD2-d and the second mode MD2, one end of each of the third electrode 230 and the fourth electrode 240 can be floated. As another example, in both the second mode MD2-d and the second mode MD2, the other end (e.g., the opposite end) of each of the third electrode 230 and the fourth electrode 240 can be grounded or floated. Therefore, through the coupling between the first electrode 210 and the third electrode 230, and the coupling between the second electrode 220 and the fourth electrode 240, compensation for the sensed signal can be increased or maximized.

[0338] FIG. 28 This is an equivalent circuit diagram showing four sensing units SU11, SU12, SU21 and SU22 according to an embodiment of the present disclosure.

[0339] refer to ​ The diagram illustrates, as an example, a first sensing unit SU11, a second sensing unit SU12, a third sensing unit SU21, and a fourth sensing unit SU22. The first sensing unit SU11 and the second sensing unit SU12 may be adjacent to each other in a first direction DR1 and may commonly include a second electrode 220x and a fourth electrode 240x. The first sensing unit SU11 and the third sensing unit SU21 may be adjacent to each other in a second direction DR2 and may commonly include a first electrode 210x and a third electrode 230x.

[0340] The third sensing unit SU21 and the fourth sensing unit SU22 may be adjacent to each other in the first direction DR1, and may commonly include the second electrode 220y and the fourth electrode 240y. The second sensing unit SU12 and the fourth sensing unit SU22 may be adjacent to each other in the second direction DR2, and may include the first electrode 210y and the third electrode 230y.

[0341] First capacitor CM11, second capacitor CM21, third capacitor CM31, and fourth capacitor CM41 can be disposed in the first sensing unit SU11. First capacitor CM12, second capacitor CM22, third capacitor CM32, and fourth capacitor CM42 can be disposed in the second sensing unit SU12. First capacitor CM13, second capacitor CM23, third capacitor CM33, and fourth capacitor CM43 can be disposed in the third sensing unit SU21. First capacitor CM14, second capacitor CM24, third capacitor CM34, and fourth capacitor CM44 can be disposed in the fourth sensing unit SU22. The first sensing unit SU11, as a representative example, will be described in more detail below.

[0342] Each of the first capacitor CM11, the second capacitor CM21, the third capacitor CM31, and the fourth capacitor CM41 can have a temperature-varying value. Therefore, as the temperature characteristics of the sensor layer 200 decrease, the temperature characteristics can be improved. This improved temperature characteristic means that the probability of a ghost touch being recognized as a touch is reduced, even when no touch occurs, because the dielectric constant can change with temperature.

[0343] In embodiments of this disclosure, the first capacitor CM11 may be defined between the first electrode 210x and the second electrode 220x. The design range of the first capacitor CM11 can be determined according to the sensor driver 200C (e.g., reference...). Figure 5 The capacitance CM11 varies depending on the driving method. For example, when no touch is generated, the first capacitor CM11 can be several hundred fF (fefefarads), and when a touch is generated, the change in the first capacitor CM11 can be tens of fF. However, this disclosure is not limited thereto.

[0344] In embodiments of this disclosure, the change in the first capacitance CM11 can be increased. The minimum value of the change in the first capacitance CM11 can be determined based on the sensor driver 200C (e.g., reference). Figure 5 The change in capacitance CM11 can vary. For example, when a touch occurs, the minimum change in capacitance CM11 can be 30 fF or greater (e.g., 34 fF). However, this disclosure is not limited to the minimum change in capacitance CM11.

[0345] In an embodiment, each of the second capacitor CM21, the third capacitor CM31, and the fourth capacitor CM41 may be reduced in size. For example, each of the second capacitor CM21, the third capacitor CM31, and the fourth capacitor CM41 may be several hundred fF or less, or tens of fF or less. However, this disclosure is not limited thereto.

[0346] A first coupling capacitance Ccp1 (e.g., referred to as the first capacitor) can be defined between the first electrode 210x and the third electrode 230x. A second coupling capacitance Ccp2 (e.g., referred to as the second capacitor) can be defined between the second electrode 220x and the fourth electrode 240x. As the first coupling capacitance Ccp1 and the second coupling capacitance Ccp2 increase, the sensor layer 200 can be improved (e.g., reference 200). Figure 7 The pen detection performance of the sensor layer 200 can be improved by reducing the first coupling capacitor Ccp1 and the second coupling capacitor Ccp2. Figure 7 The touch sensing performance of the first coupling capacitor Ccp1 and the second coupling capacitor Ccp2 can be set to an appropriate range.

[0347] According to embodiments of this disclosure, the first coupling capacitor Ccp1 and the second coupling capacitor Ccp2 can be adjusted by adjusting the overlap area of ​​the first electrode 210x and the third electrode 230x, and by adjusting the overlap area of ​​the second electrode 220x and the fourth electrode 240x. For example, the first coupling capacitor Ccp1 may be 8 pF (picofarads) or larger and 15 pF or smaller, and the second coupling capacitor Ccp2 may be 8 pF or larger and 15 pF or smaller.

[0348] Figure 29 This illustrates first modes MD1-d and MD1 (e.g., reference to embodiments of the present disclosure) according to the present disclosure. Figure 27 (The image is missing.)

[0349] refer to Figure 5 , Figure 27 and Figure 29 Each of the first operating mode DMD1-d of the first operating mode DMD1 and the first operating mode DMD2 of the second operating mode DMD2 may include a mutual capacitance detection mode. Figure 29 This is a diagram showing the mutual capacitance detection modes in the first mode MD1-d of the first operating mode DMD1 and the first mode MD1 of the second operating mode DMD2.

[0350] In mutual capacitance detection mode, the sensor driver 200C can sequentially provide a transmission signal TX to the first electrode 210, and can detect the coordinates of the first input 2000 by using the received signal RX detected by the second electrode 220. For example, the sensor driver 200C can calculate the input coordinates by sensing the change in mutual capacitance between the first electrode 210 and the second electrode 220.

[0351] exist Figure 29 In the diagram, as an example, a transmitted signal TX is shown as being provided to a first electrode 210, and a received signal RX is shown as being output from a second electrode 220. To clearly represent the signals, Figure 29A first electrode 210, which is provided with the transmission signal TX, is shown in bold. The sensor driver 200C can detect the input coordinates of the first input 2000 by sensing the change in capacitance between the first electrode 210 and the second electrode 220.

[0352] In another embodiment of this disclosure, at least one of the first mode MD1-d of the first operating mode DMD1 and the first mode MD1 of the second operating mode DMD2 may further include a self-capacitance detection mode. The sensor driver 200C can output drive signals to the first electrode 210 and the second electrode 220, and can calculate the input coordinates by sensing the change in capacitance of each of the first electrode 210 and the second electrode 220 in the self-capacitance detection mode.

[0353] Figure 30A This illustrates first modes MD1-d and MD1 (e.g., reference to embodiments of the present disclosure) according to the present disclosure. Figure 27 The equivalent circuit diagram of the four sensing units SU11, SU12, SU21 and SU22 under )

[0354] refer to Figure 29 and Figure 30A As an example, a touch event TC that occurs in the fourth sensing unit SU22 in mutual capacitance detection mode is shown.

[0355] When the transmission signal TX is provided to the first electrode 210y, the sensor driver 200C receives the reception signals RX and RXS from the second electrodes 220x and 220y. The sensor driver 200C can detect the input coordinates of the touch event TC by sensing the change in capacitance (e.g., the first capacitance CM14) between the first electrode 210y and the second electrode 220y.

[0356] According to embodiments of this disclosure, in the mutual capacitance detection mode, all of the third electrode 230 and the fourth electrode 240 can be grounded. In this case, even if the transmission signal TX supplied to the first electrode 210y is transmitted to the third electrode 230x, the transmission signal TX can escape to the ground instead of being transmitted to the other first electrode 210x. In other words, the parasitic component NSS that may cause ghosting touch can escape to the ground. Therefore, noise can be avoided by not introducing noise through the third electrode 230 and the fourth electrode 240.

[0357] Although the above is for illustrative purposes Figure 30A All of the described third electrodes 230x and 230y and fourth electrodes 240x and 240y may be grounded, but this disclosure is not limited thereto. For example, the third electrodes 230x and 230y may be grounded, and the fourth electrodes 240x and 240y may be floating.

[0358] Figure 30B This illustrates first modes MD1-d and MD1 (e.g., reference to embodiments of the present disclosure) according to the present disclosure. Figure 27 The equivalent circuit diagram of the four sensing units SU11, SU12, SU21 and SU22 under )

[0359] refer to Figure 29 and Figure 30B A constant or substantially constant voltage DCV can be applied to the third electrode 230 and the fourth electrode 240 in mutual capacitance detection mode. The constant voltage DCV can be a DC voltage with an appropriate level (e.g., a predetermined level).

[0360] According to embodiments of this disclosure, although the transmission signal TX provided to the first electrode 210y is transmitted to the third electrode 230x, the transmission signal TX can be transmitted to a node supplied with a constant voltage DCV, instead of being transmitted to the first electrode 210x via the third electrode 230x. In other words, the parasitic component NSS that may cause ghosting touch can escape to this node.

[0361] although Figure 30B As an example, a constant voltage DCV is shown to be provided to all of the third electrodes 230x and 230y and the fourth electrodes 240x and 240y, but this disclosure is not limited thereto. For example, a constant voltage DCV may be provided to the third electrodes 230x and 230y, and the fourth electrodes 240x and 240y may be floated.

[0362] Figure 31 This illustrates a second mode MD2 according to an embodiment of the present disclosure (e.g., refer to...). Figure 27 (The image is missing.) Figure 32A This is a graph showing the waveform of the first signal SG1 according to an embodiment of the present disclosure. Figure 32B This is a graph showing the waveform of the second signal SG2 according to an embodiment of the present disclosure.

[0363] refer to Figure 27 , Figure 32A and Figure 32B The second mode, MD2, can include a charging-driven mode. The charging-driven mode can include a search-based charging-driven mode and a tracking-based charging-driven mode.

[0364] The search-to-charge drive mode can be a drive mode prior to sensing the pen's position. Therefore, the first signal SG1 or the second signal SG2 can be provided to all channels included in the sensor layer 200. In other words, the entire area of ​​the sensor layer 200 can be scanned in the search-to-charge drive mode. When the pen PN is sensed in the search-to-charge drive mode, the sensor layer 200 can be tracked for search drive. For example, in the tracked-to-charge drive mode, the sensor driver 200C can sequentially output the first signal SG1 and the second signal SG2 to the area overlapping with the point where the pen PN is sensed, instead of the entire sensor layer 200.

[0365] In charging drive mode, the sensor driver 200C can apply a first signal SG1 to one of the third pad PD3 and the fifth pad PD5, and can apply a second signal SG2 to the other pad. The second signal SG2 can be the inverted signal of the first signal SG1. For example, the first signal SG1 can be a sine wave.

[0366] Since a first signal SG1 and a second signal SG2 are applied to at least two pads, the current RFS can have a current path flowing from one pad to the other. Furthermore, because the first signal SG1 and the second signal SG2 can be sinusoidal signals with opposite phases, the direction of the current RFS can change periodically. In another embodiment of this disclosure, the first signal SG1 and the second signal SG2 can be square wave signals with opposite phases.

[0367] When the first signal SG1 and the second signal SG2 are out of phase with each other, the first signal SG1 appears on the display layer 100 (e.g., reference). Figure 4 Noise in the display layer 100 can be canceled out by the second signal SG2. Therefore, flickering can be eliminated in the display layer 100, and the display quality of the display layer 100 can be improved.

[0368] In another embodiment of this disclosure, the first signal SG1 may be a square wave signal. However, this disclosure is not limited thereto. For example, the first signal SG1 may be a sine wave signal. Furthermore, the second signal SG2 may have a constant or substantially constant voltage (e.g., a predetermined constant voltage). For example, the second signal SG2 may be a ground voltage. In other words, the pad to which the second signal SG2 is applied may be grounded. Even in this case, the current RFS may flow from one pad to another. Furthermore, although the other pad is grounded, the direction of the current RFS may change periodically because the first signal SG1 may be a sine wave signal or a square wave signal.

[0369] refer to Figure 31A second signal SG2 is provided to a third pad PD3 connected to a third trace 230rt1, and a first signal SG1 is provided to a fifth pad PD5 connected to a third electrode 230. Current RFS can flow from the fifth pad PD5 through a current path defined by the fifth trace 230rt2 connected to the fifth pad PD5, the third electrode 230, a portion of the third trace 230rt1 connected to the third pad PD3, and the third pad PD3. The current path can have a coil shape. Therefore, in the charging drive mode of the second mode MD2, the resonant circuit of the pen PN can be charged through the current path.

[0370] According to embodiments of this disclosure, the current path of the loop coil pattern can be realized by the components included in the sensor layer 200. Therefore, the electronic device 1000 (e.g., reference) Figure 1A The pen PN can be charged using the sensor layer 200. Thus, since no additional component with a coil for charging the pen PN is used, the electronic device 1000 can be made without increasing its thickness and weight or reducing its flexibility.

[0371] In charging drive mode, the first electrode 210, the second electrode 220, and the fourth electrode 240 can be grounded or electrically floated, or they can have a constant voltage applied to them. More specifically, the first electrode 210, the second electrode 220, and the fourth electrode 240 can be floated. In this case, the current RFS may not flow through the first electrode 210, the second electrode 220, and the fourth electrode 240.

[0372] Figure 33A This illustrates a second mode MD2 according to an embodiment of the present disclosure (e.g., refer to...). Figure 27 (The image is missing.) Figure 33B This illustrates a second mode MD2 according to an embodiment of the present disclosure (e.g., refer to...). Figure 27 A diagram of a sensing unit SU under ) .

[0373] refer to Figure 33A and Figure 33B The second mode MD2 can include a charging drive mode and a pen sensing drive mode. Figure 33A and Figure 33B This is a diagram illustrating the pen sensing drive modes. In Figure 33B The diagram shows a first induced current Ia, a second induced current Ib, a third induced current Ic, and a fourth induced current Id generated by a pen PN and flowing through a sensing unit SU.

[0374] In pen sensing drive mode, the sensor driver 200C can receive a first receive signal PRX1 from the first electrode 210 and a second receive signal PRX2 from the second electrode 220.

[0375] In embodiments of this disclosure, the routing directions of one overlapping electrode and another electrode of the sensor layer 200 can be different from each other. For example, the routing directions of the first electrode 210x and the third electrode 230x can be different from each other. Furthermore, the routing directions of the second electrode 220x and the fourth electrode 240x can be different from each other. For example, in... Figure 33B In this sensor unit SU, the first electrode 210x and the first trace 210t can be connected to each other at the lower part of the sensor unit SU, and the third electrode 230x and the third trace 230rt1 can be connected to each other at the upper part of the sensor unit SU. The second electrode 220x and the second trace 220t can be connected to each other at the right side of the sensor unit SU, and the fourth electrode 240x and the fourth trace 240t can be connected to each other at the left side of the sensor unit SU.

[0376] The RLC resonant circuit of the pen PN can emit a magnetic field with a resonant frequency while releasing the charged charge. A first induced current Ia can be generated in the first electrode 210x, and a second induced current Ib can be generated in the second electrode 220x by the magnetic field provided by the pen PN. In addition, a third induced current Ic can be generated in the third electrode 230x, and a fourth induced current Id can be generated in the fourth electrode 240x.

[0377] A first coupling capacitor Ccp1 can be provided between the first electrode 210x and the third electrode 230x, and a second coupling capacitor Ccp2 can be provided between the second electrode 220x and the fourth electrode 240x. The third induced current Ic can be transmitted to the first electrode 210x through the first coupling capacitor Ccp1, and the fourth induced current Id can be transmitted to the second electrode 220x through the second coupling capacitor Ccp2.

[0378] The sensor driver 200C can receive a first received signal PRX1a based on a first induced current Ia and a third induced current Ic from the first electrode 210x, and a second received signal PRX2a based on a second induced current Ib and a fourth induced current Id from the second electrode 220x. The sensor driver 200C can detect the input coordinates of the pen PN based on the first received signal PRX1a and the second received signal PRX2a.

[0379] The sensor driver 200C can receive a first received signal PRX1a from the first electrode 210x and a second received signal PRX2a from the second electrode 220x. In this case, all ends of the third electrode 230x and the fourth electrode 240x can be floated. Therefore, through the coupling between the first electrode 210x and the third electrode 230x and the coupling between the second electrode 220x and the fourth electrode 240x, the compensation of the sensing signal can be increased or maximized.

[0380] Furthermore, the other ends of the third electrode 230x and the fourth electrode 240x can be floated. Therefore, through the coupling between the first electrode 210x and the third electrode 230x, and the coupling between the second electrode 220x and the fourth electrode 240x, the third induced current Ic and the fourth induced current Id can be sufficiently transmitted to the first electrode 210x and the second electrode 220x.

[0381] According to some embodiments of the present disclosure described above, by using a sensor layer, not only touch input but also pen input can be sensed. Therefore, because additional components for pen sensing (e.g., digitizers) can be omitted or included in the electronic device, the electronic device can avoid increased thickness and weight, and can maintain its flexibility without the addition of additional components (e.g., digitizers).

[0382] According to some embodiments of the present disclosure described above, by adjusting the overlap area of ​​the first and third electrodes and the overlap area of ​​the second and fourth electrodes of the sensor layer, the capacitance between the first and third electrodes and the capacitance between the second and fourth electrodes can be adjusted as needed or desired. Therefore, a sensor layer with capacitance at an appropriate level, taking into account desired touch sensitivity and desired pen detection sensitivity, can be provided. As a result, an electronic device with improved pen sensitivity and touch sensitivity can be provided.

[0383] According to some embodiments of the present disclosure described above, the first electrode may include a plurality of segmented electrodes connected in parallel with each other. As the number of segmented electrodes included in the first electrode increases, the resistance of the first electrode can decrease. As a result, the sensing sensitivity of the sensor layer can be improved. Furthermore, the shape of each of the segmented electrodes may be the same as or substantially the same as (e.g., close to or similar to) a strip shape. In this case, the proportion of the entire region of a sensing unit that can be used for pattern design can be increased. Therefore, the degree of freedom in pattern design can be improved. In addition, as the resistance path corresponding to the segmented electrodes shortens, the resistance can be further reduced. In this case, it is easier to ensure the frequency range (e.g., bandwidth) suitable for the signal provided to the sensor layer. Therefore, the degree of freedom in frequency selection can be improved.

[0384] The foregoing is a description of some embodiments of this disclosure and should not be construed as limiting it. Although some embodiments have been described, those skilled in the art will readily understand that various modifications may be made to the embodiments without departing from the spirit and scope of this disclosure. It will be understood that, unless otherwise described, the description of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Therefore, it will be apparent to those skilled in the art that, unless specifically indicated otherwise, features, characteristics, and / or elements described in connection with a particular embodiment may be used alone or in combination with features, characteristics, and / or elements described in connection with other embodiments. Therefore, it should be understood that the foregoing is a description of various exemplary embodiments and should not be construed as limiting to the specific embodiments disclosed herein, and various modifications to the disclosed embodiments and other exemplary embodiments are intended to be included within the spirit and scope of this disclosure as defined by the appended claims and their equivalents.

Claims

1. An electronic device, characterized in that, The electronic device includes: A circuit layer, on a substrate, includes transistors; A light-emitting element layer, on the circuit layer, and including light-emitting elements electrically connected to the transistor; and A sensor layer, on the light-emitting element layer, and comprising: Multiple first sensing electrodes extend in a first direction; Multiple second sensing electrodes extend in a second direction intersecting the first direction; and Multiple first electrodes extend in the first direction. Each of the plurality of first sensing electrodes includes a plurality of first sub-electrodes. Each of the plurality of first electrodes includes a plurality of second sub-electrodes, each having a first end and a second end. Each of the plurality of first sub-electrodes includes a first pattern and a first bridging pattern electrically connected to the first pattern. Among the plurality of first sub-electrodes, two adjacent first sub-electrodes are electrically connected to each other at one end via a first connecting line. Among the plurality of second sub-electrodes, two adjacent second sub-electrodes that overlap with the two adjacent first sub-electrodes are connected to each other at the first end via a second connecting line. The second connecting line and another second connecting line adjacent to the second connecting line are electrically connected to each other via a third connecting line. The first connecting line is electrically connected to the first pad, and the third connecting line is electrically connected to the second pad.

2. The electronic device according to claim 1, characterized in that, Two adjacent first electrodes of the plurality of first electrodes are electrically connected to each other at the first end via a first loop trace.

3. The electronic device according to claim 2, characterized in that, The plurality of first electrodes are electrically connected to each other at the second end via a second loop trace.

4. The electronic device according to claim 3, characterized in that, The first end of the second loop trace is connected to a third pad, and the second end of the second loop trace opposite to the first end is connected to another third pad. In the charging drive mode, the second pad is configured to receive a first signal, and one of the third pads is configured to receive a second signal.

5. The electronic device according to claim 4, characterized in that, The second signal is the inverse of the first signal.

6. The electronic device according to claim 1, characterized in that, Some of the plurality of second sensing electrodes are electrically connected from one end of the plurality of second sensing electrodes to some fourth pads, and other of the plurality of second sensing electrodes are electrically connected from the opposite end of the other second sensing electrodes to other fourth pads.

7. The electronic device according to claim 6, characterized in that, In mutual capacitance detection mode, the first pad is configured to receive a transmission signal, and the fourth pad is configured to transmit and receive signals.

8. An electronic device, characterized in that, The electronic device includes: A circuit layer, on a substrate, includes transistors; A light-emitting element layer, on the circuit layer, and including light-emitting elements electrically connected to the transistor; and A sensor layer, on the light-emitting element layer, and comprising: A first sensing electrode extends in a first direction and includes a first pattern and a first bridging pattern electrically connected to the first pattern; The second sensing electrode extends in a second direction that intersects the first direction and intersects the first sensing electrode; A first electrode extends in the first direction; and The first dummy pattern is insulated from the first sensing electrode. Wherein, at least one of the first patterns includes a first portion, a second portion opposite to the first portion, and a third portion connected to the end of the first portion and the end of the second portion. The first dummy pattern is located between the first part and the second part. Wherein, the first electrode overlaps with the first dummy pattern and the first and second portions of the at least one first pattern. Wherein, the first electrode and the first bridging pattern are located in the first layer, and The first pattern, the second sensing electrode, and the first dummy pattern are located in a second layer that is different from the first layer.

9. The electronic device according to claim 8, characterized in that, The first dummy pattern is completely surrounded by an opening defined by the first portion, the second portion, and the third portion of the at least one first pattern.

10. The electronic device according to claim 8, characterized in that, The first dummy pattern includes multiple patterns, and the multiple patterns are completely surrounded by an opening, which is defined by the first portion, the second portion and the third portion of the at least one first pattern.

11. The electronic device according to claim 10, characterized in that, The plurality of patterns are electrically separated from each other.

12. The electronic device according to claim 8, characterized in that, The first dummy pattern includes multiple grid lines.

13. The electronic device according to claim 8, characterized in that, The first electrode includes a second pattern and a second bridging pattern, the second bridging pattern being electrically connected to the second pattern and located in the same layer as the first bridging pattern.

14. The electronic device according to claim 8, characterized in that, The sensor layer further includes a second electrode extending in the second direction and including a second pattern and a second bridging pattern electrically connected to the second pattern and intersecting with the first bridging pattern.

15. The electronic device according to claim 14, characterized in that, The second bridging pattern includes: Grid lines, intersecting each other to define at least one closed hole between them; and Grid lines that intersect each other but do not define any closed holes between them, and Wherein, a portion of the grid lines of the first bridging pattern and the second bridging pattern intersect each other and do not define any closed holes between them.

16. An electronic device, characterized in that, The electronic device includes: A circuit layer, on a substrate, includes transistors; A light-emitting element layer, on the circuit layer, and including light-emitting elements electrically connected to the transistor; and A sensor layer, on the light-emitting element layer, and comprising: First sensing electrode; The second sensing electrode intersects with the first sensing electrode; The first electrode overlaps with the first sensing electrode; and The second electrode overlaps with the second sensing electrode. The first sensing electrode includes a first pattern and a first bridging pattern electrically connected to the first pattern. The second electrode includes a second pattern and a second bridging pattern electrically connected to the second pattern. The first bridging pattern and the second bridging pattern intersect each other. Each of the first bridging pattern and the second bridging pattern includes a first grid line and a second grid line intersecting the first grid line. The second bridging pattern has at least one closed hole surrounded by the first grid line and the second grid line. The first bridging pattern has a smaller number of closed holes than the second bridging pattern, wherein the number of closed holes in the first bridging pattern is an integer greater than or equal to 0. Wherein, the first electrode and the first bridging pattern are located in the first layer, and The first pattern, the second sensing electrode, and the second bridging pattern are located in a second layer, which is different from the first layer.

17. The electronic device according to claim 16, characterized in that, The first bridging pattern does not have closed holes.

18. The electronic device according to claim 16, characterized in that, The second bridging pattern includes: The first grid line and the second grid line intersect each other to define the at least one closed hole between them; and The first grid line and the second grid line intersect each other and do not define any closed holes between them.

19. The electronic device according to claim 18, characterized in that, A portion of the first grid line and the second grid line intersect each other and do not define any closed holes between them.

20. The electronic device according to claim 16, characterized in that, The first electrode includes: The third pattern; and The third bridging pattern is electrically connected to the third pattern.

21. The electronic device according to claim 20, characterized in that, The third bridging pattern includes a first bridging portion and a second bridging portion opposite to the first bridging portion.

22. The electronic device according to claim 21, characterized in that, The first bridging pattern is located between the first bridging portion and the second bridging portion.

23. The electronic device according to claim 22, characterized in that, The first bridging pattern and the third bridging pattern are located on the same first layer.

24. An electronic device, characterized in that, The electronic device includes: A circuit layer, on a substrate, includes transistors; A light-emitting element layer, on the circuit layer, and including light-emitting elements electrically connected to the transistor; and A sensor layer, on the light-emitting element layer, and comprising: The first sensing electrode includes a first pattern and a first bridging pattern electrically connected to the first pattern; The second sensing electrode intersects with the first sensing electrode; A first electrode, overlapping the first sensing electrode, and including a second pattern and a second bridging pattern electrically connected to the second pattern; and The second electrode overlaps with the second sensing electrode. The second bridging pattern includes a first bridging portion and a second bridging portion opposite to the first bridging portion. The first bridging pattern is located between the first bridging portion and the second bridging portion. Wherein, the first electrode, the first bridging pattern, and the second bridging pattern are located in the first layer, and The first pattern and the second sensing electrode are located in a second layer, which is different from the first layer.

25. The electronic device according to claim 24, characterized in that, The second electrode includes: The third pattern; and The third bridging pattern is electrically connected to the third pattern.

26. The electronic device according to claim 25, characterized in that, The first bridging pattern and the third bridging pattern intersect each other.

27. The electronic device according to claim 25, characterized in that, Each of the first bridging pattern and the third bridging pattern includes a first grid line and a second grid line intersecting the first grid line.

28. The electronic device according to claim 27, characterized in that, The third bridging pattern has at least one closed hole surrounded by the first grid line and the second grid line, and The first bridging pattern has a smaller number of closed holes than the third bridging pattern, wherein the number of closed holes in the first bridging pattern is an integer greater than or equal to 0.

29. The electronic device according to claim 25, characterized in that, The first bridging pattern and the third bridging pattern are located on different layers.

30. The electronic device according to claim 24, characterized in that, At least one of the first patterns includes a first portion, a second portion opposite to the first portion, and a third portion connected to the end of the first portion and the end of the second portion. The first dummy pattern is insulated from the at least one first pattern and is located between the first portion and the second portion.

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