Thin SMD (Surface Mount Device) diode with protection structure

Abstract

The utility model discloses a thin surface-mounted diode with a protection structure, which comprises a dustproof shell, a diode main piece is fixedly mounted in the middle of the top end of the inner wall of the dustproof shell, an anode pin is fixedly mounted at one end of the diode main piece, and a cathode pin is fixedly mounted at the other end of the diode main piece. The two sides of the top end of the dustproof shell are fixedly communicated with heat dissipation assemblies, the four corners of the top end of the inner wall of the dustproof shell are fixedly provided with supporting assemblies, and each heat dissipation assembly comprises a heat dissipation shell and two installation blocks. The filter plate in the heat dissipation assembly intercepts impurities in external environment low-temperature gas, then the gas is cooled through the refrigeration rod and then makes contact with the diode main part, heat transfer cooling and heat dissipation are conducted, the dustproof shell intercepts dust in the external environment gas from the outer side of the diode main part, and the service life of the patch diode is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of surface mount diode technology, specifically a thin surface mount diode with a protective structure. Background Technology

[0002] Surface mount diodes (SMDs) utilize surface mount technology, resulting in small size and light weight, making them suitable for use in confined spaces. They are particularly well-suited for high-density mounting in electronic devices. SMDs are ideal for high-speed mounting, significantly reducing the rejection rate. They are also suitable for reflow soldering and wave soldering, improving production efficiency and product quality. SMDs exhibit unidirectional conductivity, meaning their on-resistance is very low under forward voltage and extremely high or infinite under reverse voltage. This allows them to perform switching, protection, and rectification functions in circuits.

[0003] However, traditional surface mount diodes have the following disadvantages:

[0004] Traditional surface mount diodes are directly exposed to the external environment. Dust in the air adheres directly to the surface mount diode, reducing its heat dissipation area and causing it to operate at high temperatures for extended periods, thus shortening its lifespan. Utility Model Content

[0005] The purpose of this invention is to provide a thin surface mount diode with a protective structure to solve the problem mentioned in the background art that traditional surface mount diodes are directly exposed to the external environment, and dust in the external air directly adheres to the surface mount diode, reducing the heat dissipation area of ​​the surface mount diode itself, causing the surface mount diode to operate at a high temperature for a long time, and shortening the service life of the surface mount diode itself.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a thin surface-mount diode with a protective structure, comprising a dustproof housing, a diode main component fixedly mounted at the middle of the top of the inner wall of the dustproof housing, a positive lead fixedly mounted at one end of the diode main component, a negative lead fixedly mounted at the other end of the diode main component, heat dissipation components fixedly connected to both sides of the top of the dustproof housing, and support components fixedly mounted at the four corners of the top of the inner wall of the dustproof housing, the heat dissipation components comprising a heat dissipation shell and two mounting blocks, two filter plates provided inside the heat dissipation shell, mounting blocks fixedly mounted at the middle of both sides of the inner wall of the heat dissipation shell, a limiting plate fixedly mounted on the opposite side of the two mounting blocks, a cooling rod fixedly mounted between the two limiting plates, and four support components each comprising a connecting plate and a height shell, the bottom end of the connecting plate being fixedly connected to the top end of the height shell, and a positioning plate provided at the bottom end of the height shell.

[0007] Preferably, lifting grooves are provided at both ends of the inner wall of the heat sink, and lifting blocks are slidably connected inside the four lifting grooves. One side of each of the four lifting blocks is fixedly connected to the two ends of the two filter plates. The two ends of the two limiting plates are respectively contacted and connected to the two ends of the opposite side of the two filter plates. Support springs are fixedly installed between the four lifting blocks and the four lifting grooves. The low-temperature gas in the external environment first passes through the filter plate to purify impurities, and then passes through the cooling rod to cool it down before directly contacting the diode main component to transfer heat to the diode main component.

[0008] Preferably, the top of the heat sink is provided with a plurality of heat dissipation holes, and the bottom of the heat sink is fixedly connected to the dustproof shell. Low-temperature gas from the external environment is injected into the heat sink through the heat dissipation holes and then transferred to the dustproof shell after being cooled.

[0009] Preferably, the bottom end of the height housing is threaded with a screw, and the bottom end of the screw is rotatably connected to the middle of the top end of the positioning plate. When the user screws the screw, the thread on the surface of the screw matches the thread on the inner wall of the height housing, and the screw rotates and rises relative to the height housing. The screw pushes the positioning plate from the top to adjust the support height of the thin surface mount diode.

[0010] Preferably, positioning holes are provided on both sides of the top of the positioning plate. The user can screw the screw through the positioning holes to position the positioning plate, thereby completing the fixing of the thin surface mount diode.

[0011] Preferably, the top ends of the four connecting plates are fixedly connected to the dustproof housing, and the support assembly is installed on the dustproof housing through the connecting plates.

[0012] Preferably, the surface of the dustproof shell is provided with a plurality of ventilation slots, and each ventilation slot is fixedly installed with a filter screen. Low-temperature gas from the external environment passes through the ventilation slots, and impurities in the external environment gas are intercepted by the filter screen and then injected into the dustproof shell.

[0013] Compared with the prior art, the beneficial effects of this utility model are: by setting up a heat dissipation component and a dustproof shell, the filter plate inside the heat dissipation component intercepts impurities in the low-temperature gas of the external environment, and then the gas is cooled by the cooling rod and then comes into contact with the diode main component for heat transfer and cooling. In addition, the dustproof shell intercepts dust in the external environment gas from the outside of the diode main component, thus extending the service life of the surface mount diode itself. Attached Figure Description

[0014] Figure 1 This is a side view of the present invention;

[0015] Figure 2 This is a cross-sectional view of the present invention;

[0016] Figure 3This is a cross-sectional view of the heat dissipation component of this utility model;

[0017] Figure 4 This is a side view of the support component of this utility model.

[0018] In the diagram: 1. Dustproof housing; 2. Support assembly; 21. Positioning plate; 22. Positioning hole; 23. Screw; 24. Height shell; 25. Connecting plate; 3. Positive pin; 4. Negative pin; 5. Ventilation slot; 6. Filter screen; 7. Heat dissipation assembly; 71. Heat dissipation shell; 72. Heat dissipation hole; 73. Lifting slot; 74. Lifting block; 75. Support spring; 76. Filter plate; 77. Cooling rod; 78. Limiting plate; 79. Mounting block; 8. Diode main component. Detailed Implementation

[0019] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0020] Please see Figure 1-4 This utility model provides a thin surface-mount diode with a protective structure, including a dustproof housing 1. A diode main component 8 is fixedly installed in the middle of the top of the inner wall of the dustproof housing 1. A positive lead 3 is fixedly installed at one end of the diode main component 8, and a negative lead 4 is fixedly installed at the other end of the diode main component 8. Heat dissipation components 7 are fixedly connected to both sides of the top of the dustproof housing 1. Support components 2 are fixedly installed at the four corners of the top of the inner wall of the dustproof housing 1. The heat dissipation components 7 include a heat dissipation shell 71 and two mounting blocks 79. Two filter plates 76 are provided inside the heat dissipation shell 71. Mounting blocks 79 are fixedly installed in the middle of both sides of the inner wall of the heat dissipation shell 71. Limiting plates 78 are fixedly installed on the opposite side of the two mounting blocks 79. A cooling rod 77 is fixedly installed between the two limiting plates 78. Each of the four support components 2 includes a connecting plate 25 and a height shell 24. The bottom end of the connecting plate 25 is fixedly connected to the top end of the height shell 24. A positioning plate 21 is provided at the bottom end of the height shell 24.

[0021] Lifting grooves 73 are provided at both ends of the inner wall of the heat sink 71. Lifting blocks 74 are slidably connected inside the four lifting grooves 73. One side of the four lifting blocks 74 is fixedly connected to the two ends of the two filter plates 76 respectively. The two ends of the two limiting plates 78 are respectively in contact with the two ends of the opposite side of the two filter plates 76. Supporting springs 75 are fixedly installed between the four lifting blocks 74 and the four lifting grooves 73. The low-temperature gas in the external environment first passes through the filter plate 76 to purify impurities and then passes through the cooling rod 77 to cool down before directly contacting the diode main component 8 to transfer heat to the diode main component 8.

[0022] The top of the heat sink 71 has several heat dissipation holes 72, and the bottom of the heat sink 71 is fixedly connected to the dustproof shell 1. Low-temperature gas from the external environment is injected into the heat sink 71 through the heat dissipation holes 72 and then transferred to the dustproof shell 1 after being cooled.

[0023] The bottom end of the height housing 24 is threaded with a screw 23. The bottom end of the screw 23 is rotatably connected to the middle of the top of the positioning plate 21. When the user screws the screw 23, the threads on the surface of the screw 23 match the threads on the inner wall of the height housing 24. The screw 23 rotates and rises relative to the height housing 24. The screw 23 pushes the positioning plate 21 from the top to adjust the support height of the thin surface mount diode.

[0024] Positioning holes 22 are provided on both sides of the top of the positioning plate 21. The user can screw the screw through the positioning holes 22 to position the positioning plate 21, thereby completing the fixing of the thin surface mount diode.

[0025] The tops of the four connecting plates 25 are fixedly connected to the dustproof housing 1, and the support assembly 2 is installed on the dustproof housing 1 through the connecting plates 25.

[0026] The surface of the dustproof housing 1 is provided with several ventilation slots 5, and a filter screen 6 is fixedly installed inside each ventilation slot 5. Low-temperature gas from the external environment passes through the ventilation slots 5, and impurities in the external environment gas are intercepted by the filter screen 6 and then injected into the dustproof housing 1.

[0027] In this embodiment, during use: the user screws the screw 23, the thread on the surface of the screw 23 matches the thread on the inner wall of the height shell 24, the screw 23 rotates and rises relative to the height shell 24, the screw 23 pushes the positioning plate 21 from the top to adjust the support height of the thin surface mount diode, the user screws the screw through the positioning hole 22 to position the positioning plate 21, thereby completing the fixation of the thin surface mount diode, the low temperature gas from the external environment is injected into the heat dissipation shell 71 through the heat dissipation hole 72 and then transferred to the dustproof shell 1 after being cooled. Specifically, the low temperature gas from the external environment is first purified by the filter plate 76 and then cooled by the cooling rod 77 before directly contacting the diode main component 8 to dissipate heat through heat transfer to the diode main component 8.

[0028] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A thin surface-mount diode with a protective structure, comprising a dustproof housing (1), characterized in that: A diode main component (8) is fixedly installed at the middle of the top of the inner wall of the dustproof housing (1). A positive electrode pin (3) is fixedly installed at one end of the diode main component (8), and a negative electrode pin (4) is fixedly installed at the other end of the diode main component (8). Heat dissipation components (7) are fixedly connected to both sides of the top of the dustproof housing (1). Support components (2) are fixedly installed at the four corners of the top of the inner wall of the dustproof housing (1). The heat dissipation components (7) include a heat dissipation shell (71) and two mounting blocks (79). The interior of the heat dissipation shell (71) is provided with two filter plates (76). Mounting blocks (79) are fixedly installed in the middle of both sides of the inner wall of the heat dissipation shell (71). Limiting plates (78) are fixedly installed on the opposite side of the two mounting blocks (79). A cooling rod (77) is fixedly installed between the two limiting plates (78). The four support components (2) each include a connecting plate (25) and a height shell (24). The bottom end of the connecting plate (25) is fixedly connected to the top end of the height shell (24). The bottom end of the height shell (24) is provided with a positioning plate (21).

2. A thin-film surface-mount diode with a protective structure according to claim 1, characterized in that: The heat dissipation shell (71) has lifting grooves (73) at both ends on both sides of its inner wall. Lifting blocks (74) are slidably connected inside the four lifting grooves (73). One side of each of the four lifting blocks (74) is fixedly connected to the two ends of the two filter plates (76). The two ends of each of the two limiting plates (78) are in contact with the two ends of the opposite side of the two filter plates (76). Supporting springs (75) are fixedly installed between each of the four lifting blocks (74) and the four lifting grooves (73).

3. A thin-film surface-mount diode with a protective structure according to claim 1, characterized in that: The top of the heat dissipation shell (71) is provided with a number of heat dissipation holes (72), and the bottom of the heat dissipation shell (71) is fixedly connected to the dustproof shell (1).

4. A thin-film surface-mount diode with a protective structure according to claim 1, characterized in that: The bottom end of the height shell (24) is threaded with a screw (23), and the bottom end of the screw (23) is rotatably connected to the middle of the top end of the positioning plate (21).

5. A thin-film surface-mount diode with a protective structure according to claim 1, characterized in that: Positioning holes (22) are provided on both sides of the top of the positioning plate (21).

6. A thin-film surface-mount diode with a protective structure according to claim 1, characterized in that: The tops of the four connecting plates (25) are fixedly connected to the dustproof housing (1).

7. A thin-film surface-mount diode with a protective structure according to claim 1, characterized in that: The surface of the dustproof shell (1) is provided with a plurality of ventilation slots (5), and a filter screen (6) is fixedly installed inside each of the plurality of ventilation slots (5).

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