Reflow soldering cooling air duct structure
By placing the condenser within the lower cooling duct module in the reflow soldering equipment and rearranging the airflow path, the problems of liquefied water vapor and flux dripping caused by the condenser were solved, resulting in better cooling performance and product quality.
Patent Information
- Application Number
- CN202422974749.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-03
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2034-12-03
AI Technical Summary
In existing reflow soldering equipment, the condenser is placed inside the upper cooling duct module, causing liquefied water vapor and flux to drip onto the product, affecting product quality.
The condenser is placed inside the lower cooling duct module, and the airflow path is rearranged through the design of the upper and lower cooling duct modules, so that the cold air from the condenser is delivered to the upper cooling duct module, avoiding liquefied water vapor and flux dripping.
It improves cooling efficiency, prevents liquefied water vapor and flux from dripping onto the product, and enhances product quality.
Smart Images
Figure CN223518824U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to reflow soldering equipment technical field especially a reflow soldering cooling air duct structure. BACKGROUND
[0002] In the reflow soldering equipment production process, after the product is heated and welded at high temperature, a cooling section needs to be added at the reflow soldering tail end to reduce the product temperature and solidify, and reduce the product panel temperature to prevent scalding the staff. The reflow soldering cooling section generally uses air cooling and cold water cooling two ways, wherein the nitrogen reflow soldering generally uses the condenser subcooled water mode to cool. If the condenser is placed in the upper cooling air duct module, after the condenser subcooled water, the surrounding temperature drops to make the water vapor in the air and the vaporized flux gradually liquefy and adhere to the upper cooling air outlet plate, resulting in dripping on the product when passing through the plate, reducing the product quality, and even causing batch failure. UTILITY MODEL CONTENTS
[0003] The technical problem to be solved by the utility model lies in that, in view of the deficiency of the prior art, a reflow soldering cooling air duct structure is provided.
[0004] To solve the above technical problem, the utility model adopts the following technical scheme.
[0005] A reflow soldering cooling air duct structure, comprising an upper cooling air duct module, a lower cooling air duct module and a condenser, the upper cooling air duct module and the lower cooling air duct module are mutually covered, the upper cooling air duct module comprises an upper cooling air duct box, the middle of the top of the upper cooling air duct box is provided with an upper plenum chamber, the bottom of the upper cooling air duct box is an upper air outlet plate, the two sides of the upper cooling air duct module are respectively provided with an upper return air flow channel, the upper return air flow channel is communicated with the upper cooling air duct box, the airflow in the upper return air flow channel flows to the upper plenum chamber and the upper air outlet plate, the two sides of the lower cooling air duct module are respectively provided with a lower return air channel, the lower cooling air duct module is provided with a lower rectifier box and a condenser, the middle of the bottom of the lower cooling air duct module is provided with a lower plenum chamber, the lower plenum chamber and the upper plenum chamber are respectively provided with a motor, the top of the lower rectifier box is a lower air outlet plate, the lower rectifier box is provided with an air inlet channel, the upper cooling air duct box and the lower rectifier box surround a product welding solidification area, the product welding solidification area is communicated with the condenser through the return air channel, part of the airflow in the product welding solidification area flows to the return air channel, the condenser, the lower return air channel, the upper return air flow channel and the upper cooling air duct box in turn, and part of the airflow in the lower rectifier box flows to the product welding solidification area.
[0006] A preferred scheme is that the upper air outlet plate is penetrated by a plurality of upper air outlet holes, and the lower air outlet plate is penetrated by a plurality of lower air outlet holes.
[0007] A preferable solution is that the condenser comprises circulating water pipes and fixed sheets arranged alternately, the circulating water pipes pass through the fixed sheets in sequence, and gaps exist between adjacent fixed sheets.
[0008] A preferable solution is that one end of the circulating water pipe is provided with a water inlet, and the other end is provided with a water outlet.
[0009] The reflow soldering cooling air duct structure has at least the following beneficial effects: the condenser is placed in the lower cooling air duct module, so that the liquefied water vapor and the flux can not drop on the product, the cold air of the lower cooling air duct module is delivered to the upper cooling air duct module, and the cooling effect is improved.
[0010] The above description is only a summary of the technical scheme of the utility model, in order to make the technical means of the utility model more clearly understood, the content of the specification can be implemented, and in order to make the above and other purposes, characteristics and advantages of the utility model more obvious and easy to understand, the following preferred embodiments are described in detail, and the accompanying drawings are as follows. BRIEF DESCRIPTION OF DRAWINGS
[0011] Figure 1 It is the three-dimensional view of the utility model Figure 1 ;
[0012] Figure 2 It is the three-dimensional view of the utility model Figure 2 ;
[0013] Figure 3 It is the three-dimensional view of the utility model Figure 3 ;
[0014] Figure 4 It is the sectional view of the utility model Figure 1 ;
[0015] Figure 2 It is the sectional view of the utility model Figure 6 ;
[0016] Figure 3 It is the sectional view of the utility model Figures 1 to 6 . DETAILED DESCRIPTION
[0017] In order to explain the idea and purpose of the present application, the present application will be further described in combination with the drawings and specific embodiments.
[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application; the use herein of terms such as "comprise", "have" and "include" or variations such as "comprises", "comprising", "including" and "includes", are intended to be inclusive or open-ended and do not exclude additional, unrecited elements or method steps; the use herein of terms such as "first", "second" and "left", "right" and the like are used for distinguishing between similar elements and not necessarily for describing a specific sequential or chronological order unless otherwise indicated. The use herein of terms such as "about", "substantially", "approximately" and the like are intended to account for variations in measurement, fabrication and other processes, and are intended to cover a range of values including the value itself.
[0019] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily mutually exclusive or alternative embodiments. It is expressly understood that the embodiments described herein are combinable.
[0020] As shown in Figures 1 to 6 The reflow soldering cooling air duct structure provided by the embodiments of the application comprises an upper cooling air duct module 10, a lower cooling air duct module 20 and a condenser 30, the upper cooling air duct module 10 and the lower cooling air duct module 20 are overlapped with each other; the upper cooling air duct module 10 comprises an upper cooling air duct box 11, a middle portion of the top of the upper cooling air duct box 11 is provided with an upper plenum 12, a bottom of the upper cooling air duct box 11 is an upper air outlet plate 13, two sides of the upper cooling air duct module 10 are respectively provided with upper return air flow channels 14, the upper return air flow channels 14 are communicated with the upper cooling air duct box 11; air flow in the upper return air flow channels 14 flows to above the upper plenum 12 and below the upper air outlet plate 13; two sides of the lower cooling air duct module 20 are respectively provided with lower return air flow channels 21, the lower cooling air duct module 20 is provided with a lower flow regulation box 22 and the condenser 30, a middle portion of the bottom of the lower cooling air duct module 20 is provided with a lower plenum 23, the lower plenum 23 and the upper plenum 12 are respectively provided with motors, a top of the lower flow regulation box 22 is a lower air outlet plate 24, the lower flow regulation box 22 is provided with an air inlet channel 25, the upper cooling air duct box 11 and the lower flow regulation box 22 surround a product soldering solidification area 40, the product soldering solidification area 40 is communicated with the condenser 30 through a return air channel 26 provided therebetween; air flow in the product soldering solidification area 40 flows to the return air channel 26, the condenser 30, the lower return air flow channels 21, the upper return air flow channels 14 and the upper cooling air duct box 11 in sequence, part of air flow in the lower flow regulation box 22 flows to the product soldering solidification area 40.
[0021] As shown in Figures 1 to 6As shown in the drawings, the upper cooling air duct module 10 is installed in the reflow soldering upper furnace, the lower cooling air duct module 20 is installed in the reflow soldering lower furnace, the upper cooling air duct module 10 is located on the upper side of the lower cooling air duct module 20, and the upper cooling air duct module 10 and the lower cooling air duct module 20 are covered to form a product welding curing area 40 between the upper cooling air duct module 10 and the lower cooling air duct module 20.
[0022] As shown in the drawings, Figures 1 to 6 As shown in the drawings, the air flow direction in the utility model is shown in the drawings, when the motors in the lower plenum 23 and the upper plenum 12 work, the external air flow enters the lower rectifier box 22 from the air inlet channel 25, and the air flow in the lower rectifier box 22 flows to the product welding curing area 40 in sequence. The air flow in the product welding curing area 40 flows to the air return channel 26, the condenser 30, the lower air return duct 21, the upper air return duct 14 and the upper cooling air duct box 11 in sequence, and part of the air flow in the upper cooling air duct box 11 flows to the product welding curing area 40. The cold air flow in the product welding curing area 40 blows on the product 50, and the product welding curing is completed.
[0023] As shown in the drawings, Figures 1 to 6 As shown in the drawings, the upper cooling air duct module 10 and the lower cooling air duct module 20 blow cold air on the product through the upper air outlet plate 13 and the lower air outlet plate 24 respectively, and the product welding curing is completed. In the structure, the condenser 30 is arranged in the lower cooling air duct module 20, so that the liquefied water vapor and the flux can be prevented from dropping on the product, the cold air of the lower cooling air duct module 20 is delivered to the upper cooling air duct module 10, and the cooling effect is improved.
[0024] As shown in the drawings, Figures 1 to 6 As shown in the drawings, the upper air outlet plate 13 is provided with a plurality of upper air outlet holes, and the lower air outlet plate 24 is provided with a plurality of lower air outlet holes.
[0025] As shown in the drawings, Figures 1 to 6 As shown in the drawings, part of the air flow in the upper cooling air duct box 11 flows to the product welding curing area 40 through the upper air outlet holes, and the air flow in the lower rectifier box 22 flows to the product welding curing area 40 through the lower air outlet holes, so that the cold air flow is blown on the product 50, and the product welding curing is completed.
[0026] As shown in the drawings, Figures 1 to 6 As shown in the drawings, the condenser 30 comprises a circulating water pipe 31 and fixed sheets 32 arranged alternately, the circulating water pipe 31 passes through the fixed sheets 32 in sequence, and gaps exist between adjacent fixed sheets 32. The fixed sheets 32 have heat dissipation and fixing functions, and the cooling effect is good,
[0027] As shown in the drawings, Figures 1 to 6 As shown in the drawings, one end of the circulating water pipe 31 is provided with a water inlet 33, and the other end is provided with a water outlet 34. Cold water can be circulated continuously.
[0028] As shown in the drawings, As shown, the bottom of the lower cooling air duct module 20 is provided with a water outlet pipe 27, which is located at the bottom of the condenser 30.
[0029] The above is the specific embodiment of the present application, it should be pointed out that, for those skilled in the technical field, without departing from the principles of the present application, can make a number of improvements and refinements, these improvements and refinements also as the protection scope of the present application.
Claims
1. A reflow soldering cooling air duct structure characterized by comprising: The application relates to a cooling air duct module, which comprises an upper cooling air duct module, a lower cooling air duct module and a condenser, wherein the upper cooling air duct module and the lower cooling air duct module are mutually covered; the upper cooling air duct module comprises an upper cooling air duct box, the middle of the top of the upper cooling air duct box is provided with an upper pressure-increasing cover, the bottom of the upper cooling air duct box is an upper air outlet plate, the two sides of the upper cooling air duct module are respectively provided with upper return air flow channels, the upper return air flow channels are communicated with the upper cooling air duct box, the airflow in the upper return air flow channels flows upwards to the upper pressure-increasing cover and the lower part of the upper air outlet plate; the two sides of the lower cooling air duct module are respectively provided with lower return air channels, the lower cooling air duct module is internally provided with a lower flow regulation box and the condenser, the middle of the bottom of the lower cooling air duct module is provided with a lower pressure-increasing cover, the lower pressure-increasing cover and the upper pressure-increasing cover are respectively internally provided with a motor, the top of the lower flow regulation box is a lower air outlet plate, the lower flow regulation box is provided with an air inlet channel, the product welding and solidification area is surrounded between the upper cooling air duct box and the lower flow regulation box, the product welding and solidification area is communicated with the condenser through the return air channel, the airflow in the product welding and solidification area flows to the return air channel, the condenser, the lower return air channel, the upper return air flow channel and the upper cooling air duct box in sequence, and part of the airflow in the lower flow regulation box flows to the product welding and solidification area.
2. The reflow soldering cooling air duct structure according to claim 1, characterized by, The upper air outlet plate is penetrated by a plurality of upper air outlet holes, and the lower air outlet plate is penetrated by a plurality of lower air outlet holes.
3. The reflow soldering cooling air duct structure according to claim 1, characterized by, The condenser comprises circulating water pipes and fixed sheets arranged alternately, the circulating water pipes pass through the fixed sheets in sequence, and gaps exist between adjacent fixed sheets.
4. The reflow soldering cooling air duct structure according to claim 3, characterized by One end of the circulating water pipe is provided with a water inlet, and the other end is provided with a water outlet.