Full-automatic laser processing device for diamond wafer

Abstract

The utility model discloses a full-automatic laser processing device for a diamond wafer, which comprises a lathe bed, a portal frame arranged on the lathe bed, a multi-shaft transmission module arranged on the portal frame and used for automatically feeding, and a spatial position movement module butted with the multi-shaft transmission module, the spatial position movement module is matched with a laser processing module and a visual identification module; the posture of the diamond wafer transmitted by the multi-axis transmission module is adjusted relative to the laser processing module through the spatial position movement module. According to the scheme, the visual recognition module and the multi-axis transmission module are adopted, so that wafers are automatically positioned, recognized and conveyed, and accurate control over the cutting position, thickness and depth is ensured. Through the means, the problems that in the prior art, manual operation efficiency is low, positioning precision is low, and production detection control is not facilitated are solved, so that the sample positioning precision and the yield are improved, the consistency of the production process and the production efficiency are enhanced, and finally efficient and stable automatic machining is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to diamond processing technical field especially is related to a kind of diamond wafer full-automatic laser processing device. BACKGROUND

[0002] Diamond has the highest hardness, rigidity, refractive index and thermal conductivity coefficient in nature, and excellent characteristics such as extremely high wear resistance and chemical stability, is widely used in mechanical processing, optical materials, electronics, gem processing and other fields, and has very broad application prospect in optical, thermal, electrical, acoustic and other high-tech fields.

[0003] Mechanical grinding is the most traditional, most common and most mature diamond processing method, and the main working form is generally to coat fine diamond abrasive particles on a high-speed rotating cast iron grinding disc, and the diamond crystal to be processed is in contact with the grinding disc under a certain pressure, and the diamond abrasive particles are ground with the surface of the diamond crystal to realize the processing of the diamond crystal, but the diamond has extremely high hardness, rigidity and wear resistance, resulting in extremely low efficiency, high stress and thick damage layer on the surface of the diamond. The subsequent thermal chemical reaction grinding method is used to improve the processing efficiency, but the conditions are harsh and the process is difficult to control, and it is still in the theoretical research stage. Therefore, finding a new method to improve the efficiency of diamond planar shaping and improve the surface quality is a core technical problem to be solved in the field of diamond processing.

[0004] Laser processing technology has the advantages of wide processable materials, small metamorphic influence area and strong controllability of processing precision, and is widely used in cutting, punching and surface modification of various materials. When cutting diamond with laser, it is necessary to fix its position, and when cutting with laser, the cutting range is limited, so when cutting different positions, the position of the diamond needs to be fixed again for processing, which is low in efficiency. The existing device for laser cutting of diamond cannot automatically cut and process the positions of all directions and angles of the diamond. One of the mainstream methods for fixing diamond at present is to use a jig, and one or several diamond particles are fixed on both sides of the jig by using adhesive or adsorption method, and then artificial positioning and processing are carried out. Since the diamond particles need to be manually removed and fixed each time laser processing is carried out, and the size of the diamond is measured manually, a large amount of labor and machine time is consumed in the whole process, and the efficiency is low. At the same time, this operation method requires high experience of the operator, which limits the number of machines that a single operator can maintain. In addition, manual operation also leads to low positioning accuracy, thereby reducing the product yield. This production method is not conducive to effective monitoring and control of the production process, further affecting the product quality and production efficiency. Therefore, improving the convenience and accuracy of diamond processing positioning and improving the automation level of diamond laser cutting device are urgent problems to be solved in the industry.

[0005] The patent application number CN202311234879.1 discloses an automatic laser processing all-in-one machine and a diamond compact processing method, which comprises a support frame and a protective shell. One side of the top end of the support frame is provided with a laser processing device. One side of the laser processing device is provided with a clamping mechanism. One side of the clamping mechanism is provided with a tablet storage mechanism. One side of the tablet storage mechanism close to the laser processing device is provided with a processing platform. This scheme realizes one-time transmission, detection and processing of the processing tablet, has faster transmission efficiency, higher detection accuracy, better processing effect, simple operation and stable and efficient performance. Meanwhile, the processing tablet inside the through hole can be supported and lifted during the transmission process. Not only can the processing tablet to be transmitted be cleaned and impurities removed, but also the extrusion friction during the subsequent processing tablet transmission can be reduced, the cleaning effect is higher, and the transmission efficiency is higher. However, the problem that manual replacement and positioning of the diamond may cause errors in matching the laser beam and the diamond attitude, affecting the processing quality, still needs to be solved, and therefore, other means are needed to improve the processing efficiency. Practical new type content

[0006] In view of the deficiencies of the existing diamond processing device in the background art, the present application realizes full-automatic high-precision laser processing of diamond materials through an information-based digital control scheme and an automatic feeding and discharging mechanism. The use of a measurement and recognition module and a multi-axis transmission module enables automatic positioning, recognition and transmission of the wafer, ensuring accurate control of the cutting position, thickness and depth. Through these means, the problems of low manual operation efficiency, low positioning accuracy and poor production detection control in the prior art are solved, thereby improving the sample positioning accuracy and yield, enhancing the consistency and production efficiency of the production process, and ultimately realizing efficient and stable automatic processing.

[0007] To achieve the above-mentioned purposes, the present application adopts the following technical solutions:

[0008] A full-automatic laser processing device for diamond wafers, comprising a bed table, a gantry frame arranged on the bed table, a multi-axis transmission module for automatic feeding arranged on the gantry frame, a spatial position movement module connected to the multi-axis transmission module, and a laser processing module and a measurement and recognition module matched with the spatial position movement module. The diamond wafer transmitted by the multi-axis transmission module is adjusted in attitude relative to the laser processing module by the spatial position movement module.

[0009] By precisely controlling the spatial positioning of the diamond wafer, the laser processing module can process the wafer with higher precision. The multi-axis transmission module is arranged on the gantry for automatic feeding, and the spatial position movement module is connected with the multi-axis transmission module to realize precise positioning and attitude adjustment of the wafer, providing a basis for subsequent laser processing. The introduction of the measurement and identification module enables the system to monitor the wafer position in real time, improving the processing precision. The device design integrates feeding, positioning, identification and processing functions in one system, significantly improving processing efficiency. Compared with traditional manual operation or single-function automated equipment, the device realizes full-process automation, reduces manual intervention and improves processing consistency.

[0010] Further, the multi-axis transmission module comprises a Y-axis moving mechanism and a Z-axis lifting mechanism, and the Y-axis moving mechanism / Z-axis lifting mechanism is provided with a material taking mechanism. The multi-axis transmission module realizes precise positioning in the horizontal direction through the Y-axis moving mechanism, and the Z-axis lifting mechanism ensures height adjustment in the vertical direction, so that the material taking mechanism can move flexibly in the vertical space to adapt to diamond wafers of different sizes and positions.

[0011] Further, the spatial position movement module is provided with a turntable and a sample table, the sample table is provided with a jig, and the turntable adjusts the deflection angle of the diamond wafer. Separating the functions of the turntable and the sample table can make the functions of each module independent and specific, and can be adjusted independently according to different processing needs. The turntable is responsible for adjusting the deflection angle of the diamond wafer, and the sample table clamps the diamond to be processed through the jig. The X-axis slide rail and the Y-axis slide rail included in the spatial position movement module can realize two-dimensional position adjustment of the wafer through precise movement in the X and Y axis directions, not only improving the positioning accuracy, but also realizing continuous automatic processing, especially in micron-level precision machining, which can effectively improve the consistency and quality of wafer processing. Compared with traditional manual operation or single-axis control mode, the spatial position movement module of the design can greatly reduce the intervention demand of the operator through multi-axis linkage and highly automated control system, thereby improving production efficiency and reducing human error.

[0012] Further, the device comprises a measurement identification module connected with a control system, which acquires the position of the diamond wafer in real time and transmits the position information to the control system. The measurement identification module comprises a thickness measurement device and a visual recognition device. The thickness measurement device automatically acquires the thickness information of the wafer by using a thickness measurement probe. The visual recognition device measures the size information of the wafer by using visual recognition technology, and replaces manual positioning, thereby realizing high-precision and high-efficiency automatic processing. The measurement identification module can not only accurately measure the size of the wafer, but also monitor the specific position of the wafer in real time, and calculate the spatial coordinates of the wafer through image processing algorithms, thereby providing accurate positioning data for the control system and providing a reference basis for the subsequent cutting processing trajectory parameters. Through accurate control and data transmission, the system can further improve the transparency of the production process, support real-time monitoring and process optimization.

[0013] Further, the spatial position movement module comprises a feeding station and a discharging station. The feeding station is provided with a material carrier plate, and the discharging station is arranged below the sample table and falls into the discharging bin after the diamond wafer is processed. The material carrier plate of the feeding station is used to stabilize the feeding and improve the continuity. The discharging station realizes automatic discharging of the processed wafer by using gravity, simplifying the discharging process. This design not only improves the production efficiency, but also reduces the potential errors and pollution risks caused by manual operation.

[0014] Further, the material taking mechanism comprises a suction assembly which sucks the diamond wafer by a suction head and conveys it to the material carrier plate. The suction assembly realizes stable grabbing of the diamond wafer by using vacuum or electrostatic principle, ensuring the safety and reliability of the wafer in the transmission process. The suction assembly used in this scheme comprises a suction head and a vacuum pipe arranged behind the suction head. Compared with the traditional mechanical clamping method, it has higher flexibility and adaptability, and can handle wafers of different sizes and shapes.

[0015] Further, the measurement identification module is connected with a control system, which acquires the position of the diamond wafer in real time and transmits the position information to the control system.

[0016] Further, the measurement identification module comprises an optical sensor, a jig is arranged on the sample table, and the jig cooperates with the optical sensor to form a reference point, thereby realizing positioning of the diamond wafer.

[0017] The laser processing module comprises a laser, a galvanometer and a field lens are sequentially arranged below the laser, and the galvanometer and the field lens cooperatively work to focus a laser beam emitted by the laser to a processing surface of the diamond wafer.

[0018] Therefore, the utility model has following beneficial effect.

[0019] The automatic feeding and discharging device and the multi-axis transmission module are adopted to realize automatic transmission of the wafer, thereby greatly improving the processing efficiency.

[0020] The measurement identification module is introduced to realize real-time measurement and positioning of the wafer, thereby improving positioning accuracy and processing accuracy and effectively reducing dependence on experience of an operator.

[0021] The spatial position motion module is integrated to realize accurate adjustment of the wafer in multiple directions, thereby being capable of adapting to wafers of different sizes and shapes and improving applicability of the equipment.

[0022] Through the complete automatic processing control system, intelligent adjustment and optimization of processing parameters are realized, thereby improving processing quality and yield and reducing human operation errors.

[0023] The overall automation degree is improved, manual intervention is reduced, production efficiency is significantly improved, and real-time monitoring and quality control of a product production process are realized. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 This is a schematic diagram of the structure of this utility model.

[0025] In the diagram: 100. Bed, 1. Laser processing module, 2. Multi-axis transmission module, 21. Y-axis moving mechanism, 22. Z-axis lifting mechanism, 3. Spatial position motion module, 4. Turntable, 5. Sample stage, 6. Y-axis slide rail, 7. X-axis slide rail, 8. Adsorption head, 9. Measurement and recognition module, 91. Thickness measuring device, 92. Vision recognition device, 10. Fixture, 11. Unloading bin, 12. Gantry, 13. Material tray. Detailed Implementation

[0026] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0027] Example 1

[0028] like Figure 1 As shown, the fully automated laser processing device for diamond wafers achieves efficient processing of diamond wafers through precise structural design and an automated control system. The bed 100 serves as the foundation of the entire device, providing stable support, while the gantry 12 constructs a highly rigid three-dimensional processing space on the bed 100. The multi-axis transmission module 2, mounted on the gantry 12, includes a Y-axis moving mechanism 21 and a Z-axis lifting mechanism 22, enabling precise positioning in the vertical plane. The material handling mechanism, integrated into the multi-axis transmission module 2, precisely grips and transports the diamond wafers through an adsorption assembly and an adsorption head 8. The turntable 4 adjusts the deflection angle of the diamond wafers, and the sample stage 5 clamps the diamonds to be processed using a fixture 10. The spatial position motion module 3, including the X-axis slide rail 7 and Y-axis slide rail 6, enables two-dimensional position adjustment of the wafers through precise movement in the X and Y axes. This not only improves positioning accuracy but also enables continuous automated processing, especially in micron-level precision processing, effectively enhancing the consistency and quality of wafer processing. The laser processing module 1 employs a high-precision laser, coupled with a galvanometer and field lens system, enabling precise focusing and rapid scanning of the laser beam. The measurement and recognition module 9 includes a thickness measuring device 91 and a vision recognition device 92. The thickness measuring device automatically acquires the wafer's thickness information via a thickness probe. The vision recognition device 92 acquires the wafer's position information in real time via a high-resolution optical sensor and works in conjunction with the fixture 10 on the sample stage 5 to form a reference point, ensuring high-precision wafer positioning. The entire system is uniformly scheduled by an advanced control system, achieving a fully automated process from loading, positioning, processing to unloading. Furthermore, the loading station is equipped with a material carrier tray 13, and the unloading station is located below the sample stage 5, utilizing gravity to achieve automatic unloading and improve production efficiency. Compared to traditional semi-automatic or manual operation methods, this device not only significantly improves processing accuracy and efficiency but also greatly reduces human error and the risk of contamination.

[0029] In this embodiment, the taking mechanism includes an adsorption assembly, which takes the diamond wafer through the adsorption head 8 connected with the vacuum pipe and conveys it to the material carrier tray 13. The stable grabbing of the diamond wafer is realized, and the safety and reliability of the wafer in the transmission process are ensured. The jig 10 provided on the sample table 5 is communicated with the vacuum pipe, which is used to ensure the stable clamping during the side machining of the diamond. The taking mechanism and the sample table 5 both use vacuum adsorption to grab the diamond, so as to avoid the grabbing damage during movement and further ensure the product quality.

[0030] In this embodiment, the operation process of the diamond wafer full-automatic laser processing device of the present application in actual application involves multiple steps, which ensures an efficient and accurate processing process. First, the operator places the tray carrying the diamond wafer in the feeding bin. The wafer in the tray is reasonably partitioned, which facilitates subsequent taking. After the taking mechanism is accurately positioned, the adsorption assembly starts taking. After the adsorption head 8 contacts the wafer, the wafer is grabbed and adjusted to the jig height of the sample table through vacuum adsorption. After the wafer is taken, the multi-axis transmission module 2 adjusts the position of the taking mechanism in the Y-Z plane, and moves the wafer to the vicinity of the sample table 5. In this process, the adsorption pressure of the taking mechanism and the jig 10 of the sample table 5 is adjusted to ensure smooth transfer of the wafer to the jig. The measurement and identification module 9 obtains the size information and position information of the diamond wafer in real time and transmits the information to the control system. The control system can control the multi-axis transmission module 2, the spatial position movement module 3 and the laser processing module 1 to work cooperatively. The jig 10 on the sample table 5 cooperates with the optical sensor of the measurement and identification module 9 to form a reference point, realizes the positioning of the diamond wafer, and ensures that the control system accurately controls the spatial position movement module 3 to match the wafer with the laser processing position. The turntable 4 of the spatial position movement module 3 cooperates with the sample table 5, the X-axis slide rail 7 cooperates with the Y-axis slide rail 6 to adjust the position of the turntable 4 in the X-Y plane, and the turntable 4 adjusts the angle and posture of the wafer adsorbed on the sample table 5, so that the laser processing module 1 can accurately process. After the laser processing module 1 is started, the laser, the galvanometer and the field lens jointly act to focus the laser beam on the wafer surface and cut or process along the predetermined track. After processing is completed, the jig 10 of the sample table 5 releases the adsorption, and the unloading bin 11 below the sample table 5 automatically receives the processed wafer to realize automatic unloading and reduce manual intervention. During the whole process, the control system monitors the state of each module in real time to ensure the consistency and efficiency of the processing process.

[0031] In practical production, the device can be widely used in the machining of diamond tools, diamond optical elements and semiconductor devices. In the production of diamond cutting tools, the device can be used to accurately control the geometric shape and surface roughness of the cutting edge. By optimizing the laser parameters (such as pulse energy, repetition frequency, etc.), a surface roughness of Ra<50nm can be achieved, greatly improving the cutting performance and service life of the tool. For the machining of diamond optical elements, the high-precision positioning system and visual feedback mechanism of the device can ensure that the machining precision reaches λ / 10 (λ is the wavelength used) or more. This is particularly important for the production of high-quality X-ray optical elements. For example, in the production of diamond Fresnel zone plates, the device can be used to accurately control the width and spacing of each zone, enabling high-resolution X-ray imaging.

[0032] Embodiment 2

[0033] In this embodiment, the diamond wafer full-automatic laser machining device includes a bed 100, a gantry 12 is arranged on the bed 100, a multi-axis transmission module 2 for automatic feeding is arranged on the gantry 12, a spatial position motion module 3 is connected to the multi-axis transmission module 2, and the spatial position motion module 3 is matched with a laser machining module 1 and a measurement and identification module 9; the diamond wafer delivered by the multi-axis transmission module 2 is adjusted in posture relative to the laser machining module 1 through the spatial position motion module 3. The multi-axis transmission module 2 includes a Y-axis moving mechanism 21 and a Z-axis lifting mechanism 22, and a material taking mechanism is arranged on the Z-axis lifting mechanism 22. The functions of the turntable 4 and the sample table 5 are separated, so that the functions of each module are independent and specific, and can be independently adjusted according to different machining requirements. The turntable 4 is responsible for adjusting the deflection angle of the diamond wafer, and the sample table 5 clamps the diamond to be machined through the jig 10. The spatial position motion module 3 includes a feeding station and a discharging station; the feeding station is provided with a material loading tray 13, and the discharging station is arranged below the sample table 5 and falls into the discharging bin 11 after the diamond wafer is machined. The material taking mechanism includes a suction assembly, which sucks the diamond wafer through the suction head 8 and delivers it to the material loading tray 13.

[0034] In this embodiment, by precisely controlling the spatial positioning of the diamond wafer, the laser processing module can process the wafer with higher precision. The multi-axis transmission module 2 is arranged on the gantry 12 for automatic feeding, and the spatial position movement module 3 is connected with the multi-axis transmission module 2 to realize precise positioning and attitude adjustment of the wafer, providing a basis for subsequent laser processing. The introduction of the measurement and identification module 9 enables the system to monitor the wafer position in real time, improving the processing precision. The device design integrates feeding, positioning, identification and processing functions in one system, significantly improving processing efficiency. Compared with traditional manual operation or single-function automated equipment, the device realizes full-process automation, reduces manual intervention and improves processing consistency. The multi-axis transmission module 2 realizes precise positioning in the horizontal direction through the Y-axis moving mechanism 21, and the Z-axis lifting mechanism 22 ensures the height adjustment in the vertical direction, ensuring that the feeding mechanism can move flexibly in the vertical space to adapt to diamond wafers of different sizes and positions.

[0035] The X-axis slide rail 7 and Y-axis slide rail 6 included in the spatial position movement module 3 can realize two-dimensional position adjustment of the wafer through precise movement in the X and Y axis directions, not only improving positioning accuracy, but also realizing continuous automatic processing, especially in micron-level precision machining, which can effectively improve the consistency and quality of wafer processing. Compared with traditional manual operation or single-axis control method, the spatial position movement module 3 of the design can greatly reduce the intervention demand of the operator through multi-axis linkage and highly automated control system, thereby improving production efficiency and reducing human error. Specifically, the sample table 5 is arranged on the Y-axis slide rail 6, the Y-axis slide rail 6 is arranged on the X-axis slide rail 7, and the X-axis slide rail 7 is installed on the bed table 100. Compared with traditional manual operation, the embodiment significantly reduces the intervention demand of the operator, thereby improving production efficiency and reducing human error.

[0036] In this embodiment, the device includes a measurement identification module 9 connected with a control system, which acquires the position of the diamond wafer in real time and transmits the position information to the control system. The visual recognition technology is used to replace manual positioning, so as to realize high-precision and high-efficiency automatic processing. The measurement identification module 9 can not only accurately measure the size of the wafer, but also monitor the specific position of the wafer in real time, and calculate the spatial coordinates of the wafer through image processing algorithm, so as to provide accurate positioning data for the control system and provide reference basis for the subsequent cutting processing track parameters. Through accurate control and data transmission, the system can further improve the transparency of the production process, support real-time monitoring and process optimization. The measurement identification module 9 includes an optical sensor, and a jig 10 is arranged on the sample table 5, which cooperates with the optical sensor to form a reference point to realize the positioning of the diamond wafer. The laser processing module 1 includes a laser, and a galvanometer and a field lens are arranged below the laser in sequence, and the galvanometer and the field lens work cooperatively to focus the laser beam emitted by the laser to the processing surface of the diamond wafer. The field lens focuses the laser beam, and the galvanometer controls the focal point to realize the movement of the laser beam, so as to ensure the accurate alignment of the laser beam and the wafer surface, and avoid the inaccurate processing caused by the position error. Through the multi-axis linkage structure, the device can realize the three-dimensional position adjustment of the wafer, meet different processing requirements, especially for the diamond wafer processing with complex cutting path or micron-level precision requirement.

[0037] According to the parameters provided by the visual recognition system, the control system controls the sample table 5 to move on the Y-axis slide rail 6, and cooperates with the control of the Y-axis slide rail 6 to move on the X-axis slide rail 7, so that the jig arranged on the sample table is accurately connected with the suction head 8 of the taking device, so as to ensure that the wafer is accurately transferred to the jig by the suction head, and then the laser processing is waited.

[0038] In this embodiment, the material carrier 13 of the feeding station is used to stabilize the material supply and improve continuity. The discharging station uses gravity to realize automatic discharging of the wafer after processing is completed, simplifying the discharging process. This design not only improves production efficiency, but also reduces potential errors and pollution risks caused by manual operation. The adsorption assembly uses the principle of vacuum to realize stable grabbing of the diamond wafer, ensuring the safety and reliability of the wafer during transmission. The adsorption assembly used in this scheme includes an adsorption head 8 and a vacuum pipe arranged behind the adsorption head 8. Compared with the traditional mechanical clamping method, it has higher flexibility and adaptability, and can handle wafers of different sizes and shapes. The measurement and recognition module 9 collects the size information and position information of the diamond wafer in real time and transmits the information to the control system. The control system adjusts the spatial position motion module 3 according to this information to ensure the relative position between the laser processing module and the wafer is accurate. By replacing traditional manual positioning with automated visual recognition, human error is reduced and positioning accuracy is improved. The optical sensor cooperates with the jig 10, and the jig 10 is connected with a vacuum pipe, making the positioning of the diamond wafer on the sample table 5 more stable and accurate, avoiding deviations in manual operation. In addition, the introduction of the measurement and recognition module 9 enables the entire system to automatically adapt and adjust when processing wafers of different shapes or sizes, thereby improving processing efficiency and accuracy.

[0039] Embodiment 3

[0040] This embodiment explains the scheme in combination with actual application cases: Due to the extremely high hardness of diamond, high-power laser is needed to achieve effective processing. A fiber laser with a power of 50-100W and a wavelength of 1064nm is selected. Secondly, to avoid thermal damage, femtosecond laser technology is used. Femtosecond laser has extremely short pulse width (usually 10^ -15 seconds), which can produce nonlinear absorption effect in the diamond lattice, realize cold processing, and effectively reduce the heat affected zone. In addition, a water cooling system is set up on the sample table 5, or compressed air is used to assist heat dissipation, and the temperature of the cooling system is controlled within the range of 20±2℃ to ensure the processing quality. In terms of visual recognition, a high-resolution CCD camera is used in combination with image processing algorithms. In this embodiment, the sub-pixel edge detection algorithm can improve the positioning accuracy to below 1μm. At the same time, in order to cope with the high reflectivity of the diamond surface, a polarizing filter is added in the optical path to improve the image contrast. In addition, it is worth noting that since the spatial position motion module 3 is used to ensure that the wafer posture under the laser beam during the entire processing process conforms to the preset processing trajectory, high precision and low latency are required. This embodiment selects a precision slide table driven by a linear motor, such as the KR series of THK. This slide table has high rigidity and low friction, and can achieve a positioning accuracy of 0.1μm with a response time of 1-5ms.

Claims

1. A fully automated laser processing apparatus for diamond wafers, comprising a table, characterized in that, The gantry is arranged on the bed, the multi-axis transmission module for automatic feeding is arranged on the gantry, the spatial position movement module is connected to the multi-axis transmission module, the spatial position movement module is matched with the laser processing module and the measurement and identification module, and the diamond wafer transferred by the multi-axis transmission module is adjusted in posture relative to the laser processing module through the spatial position movement module.

2. The fully automated laser processing apparatus for diamond wafers according to claim 1, characterized by, The multi-axis transmission module comprises a Y-axis moving mechanism and a Z-axis lifting mechanism, and the Y-axis moving mechanism / Z-axis lifting mechanism is provided with the material taking mechanism.

3. The fully automated laser processing apparatus for diamond wafers according to claim 2, characterized by, The spatial position movement module is provided with a rotary table and a sample table, the sample table is provided with a jig capable of adsorbing the wafer, and the rotary table adjusts the deflection angle of the diamond wafer.

4. The fully automated laser processing apparatus for diamond wafers according to claim 3, characterized by, The spatial position movement module comprises a feeding station and a discharging station, the feeding station is provided with a material carrier, and the discharging station is arranged below the sample table and falls into the discharging bin after the diamond wafer is processed.

5. The fully automated laser processing apparatus for diamond wafers according to claim 4, characterized by, The material taking mechanism comprises an adsorption assembly, the adsorption assembly transports the diamond wafer from the material carrier to the sample table through the adsorption head.

6. The fully automated laser processing apparatus for diamond wafers according to claim 3, wherein The measurement and identification module is connected with a control system, the measurement and identification module acquires the position of the diamond wafer in real time and transmits the position information to the control system.

7. The fully automated laser processing apparatus for diamond wafers according to claim 6, characterized by The measurement and identification module comprises an optical sensor, the jig cooperates with the optical sensor to form a reference point, and the diamond wafer is positioned.

8. The fully automated laser processing apparatus for diamond wafers according to any one of claims 1 to 7, characterized in that, The laser processing module comprises a laser, a galvanometer and a field lens are sequentially arranged below the laser, and the galvanometer and the field lens cooperatively focus the laser beam emitted by the laser on the processing surface of the diamond wafer and move along the processing track.

Images