Laser processing follow-up device and processing equipment

By introducing independent lifting drive components and limit sensors into laser processing equipment, the problem of low processing efficiency caused by machine tool Z-axis load is solved, and flexible adjustment of the distance between the laser focus and the workpiece surface is realized, thereby improving processing efficiency and accuracy and extending lens life.

CN223518909UActive Publication Date: 2025-11-07HANS LASER TECH IND GRP CO LTD +1
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Patent Information

Application Number
CN202422896061.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-26
Publication Date
2025-11-07
Estimated Expiration
2034-11-26

AI Technical Summary

Technical Problem

In existing laser processing equipment, the Z-axis load of the machine tool is relatively heavy and the height adjustment system is interlocked with the machine tool system control, resulting in low processing efficiency.

Method used

An independent lifting drive assembly is used to drive the light output component of the laser processing follow-up device to move along the height direction, so as to realize the independent adjustment of the distance between the laser focus and the workpiece surface. Through the combination of components such as the lifting drive assembly, limit sensor and dustproof telescopic component, the high efficiency of laser processing is ensured.

Benefits of technology

It improves the efficiency of laser processing, extends the service life of lenses, and enhances processing accuracy and equipment reliability.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model is suitable for the technical field of machining, and provides a laser machining follow-up device and machining equipment. The light emitting assembly is used for emitting laser; and the lifting driving assembly is arranged on the mounting component and connected to the light emitting assembly so as to drive the light emitting assembly to move relative to the mounting component in the height direction of the laser processing follow-up device. According to the laser processing follow-up device provided by the embodiment of the invention, the processing efficiency can be improved.
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Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of processing, and more particularly relates to a laser processing servo device and a processing equipment. BACKGROUND

[0002] The laser head is generally provided with a capacitive sensor for sensing the distance from the nozzle of the laser head to the surface of a workpiece. When the surface of the workpiece is uneven, the capacitive sensor will convert the distance signal into an electric signal and feed back to the height adjustment system, which will control the laser head to move up and down following the surface of the workpiece, so that the nozzle of the laser head and the laser focal point maintain a certain distance from the surface of the workpiece, and high-quality laser processing is achieved.

[0003] The foregoing process is usually completed by a servo device connected with the Z-axis of the machine tool. The servo device realizes the up-and-down movement by relying on the Z-axis of the machine tool. However, the Z-axis of the machine tool has a heavy load, and the height adjustment system and the machine tool system must be interlocked to control the Z-axis, so that only one of the two can control the Z-axis movement, resulting in low processing efficiency. CONTENT OF THE INVENTION

[0004] Embodiments of the application provide a laser processing servo device and a processing equipment, which can improve the processing efficiency.

[0005] In a first aspect, embodiments of the application provide a laser processing servo device, comprising:

[0006] a mounting component;

[0007] a light-emitting assembly for emitting laser;

[0008] a lifting driving assembly arranged on the mounting component and connected to the light-emitting assembly, to drive the light-emitting assembly to move relative to the mounting component along a height direction of the laser processing servo device.

[0009] In some possible implementation manners of the first aspect, the laser processing servo device further comprises:

[0010] a light-incident assembly arranged on the mounting component;

[0011] In the height direction, the light-incident assembly is located above the light-emitting assembly to propagate light to the light-emitting assembly;

[0012] The lifting driving assembly drives the light-emitting assembly to move relative to the light-incident assembly along the height direction.

[0013] In some possible implementation manners of the first aspect, the laser processing servo device further comprises:

[0014] A dustproof telescopic component, the light-in assembly is connected to the light-out assembly through the dustproof telescopic component, so that light energy can propagate to the light-out assembly through the inside of the dustproof telescopic component.

[0015] In some possible implementation manners of the first aspect, the light-in assembly comprises:

[0016] A mirror mounting seat is arranged on the mounting component.

[0017] A mirror is arranged on the mirror mounting seat.

[0018] In some possible implementation manners of the first aspect, the lifting driving assembly comprises:

[0019] A moving component is connected to the light-out assembly.

[0020] A lifting driving body is arranged on the mounting component and connected to the moving component, so as to drive the moving component to move relative to the mounting component along the height direction.

[0021] In some possible implementation manners of the first aspect, the lifting driving assembly further comprises:

[0022] A limiting component is connected to the lifting driving body.

[0023] The moving component is connected to the limiting component and can move relative to the limiting component along the height direction within a limited height range.

[0024] In some possible implementation manners of the first aspect, the limiting component is provided with a movable slot.

[0025] The moving component is connected to the movable slot of the limiting component and can move relative to the limiting component along the height direction within a height range limited by the movable slot.

[0026] In some possible implementation manners of the first aspect, the limiting component is provided with a sensing part,

[0027] The laser processing follow-up device further comprises:

[0028] A limiting sensor is arranged around the limiting component, so that the sensing part can trigger the limiting sensor, so as to limit the moving component to move relative to the limiting component along the height direction within a limited height range.

[0029] In some possible implementation manners of the first aspect, the light-out assembly comprises:

[0030] A light-out shell is connected to the lifting driving assembly.

[0031] A focusing lens is disposed in the light-emitting housing;

[0032] A protective lens is positioned below the focusing lens in the height direction.

[0033] In some possible implementations of the first aspect, the light-emitting component further includes:

[0034] An adjustment component is provided on the light-emitting housing and can abut against the focusing lens to adjust the lateral position of the focusing lens;

[0035] The lateral direction is perpendicular to the height direction.

[0036] Secondly, embodiments of this application provide a processing apparatus, including the laser processing follow-up device described in any of the above claims.

[0037] The beneficial effects of the embodiments of this application are:

[0038] By driving the light-emitting component to move relative to the mounting component along the height direction of the laser processing follower device using a lifting drive assembly set on the mounting component, the position of the light-emitting component in the height direction can be independently adjusted, so that the laser focus and the surface of the workpiece are kept at a certain distance, thereby improving processing efficiency. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 A perspective view of a laser processing follower device provided in an embodiment of this application;

[0041] Figure 2 This is a schematic diagram of the optical path of a laser processing follower device provided in an embodiment of this application. Detailed Implementation

[0042] To make the technical problem to be solved, the technical solution and the beneficial effects of this application clearer, the following is in conjunction with the appendix. Figures 1 to 2 The present application will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

[0043] It is to be noted that when an element is referred to as being "fixed" or "set" on another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or indirectly connected to the other element.

[0044] It is to be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like, indicate directions or positions in the drawings or relative to the illustrated or operational orientation of the devices or elements illustrated therein and are used in the description and claims only for purposes of clarity and convenience, and are not intended to limit or imply specific orientations or relative positions of the devices or elements unless otherwise indicated by the context of the description.

[0045] It is to be understood that the term "and / or" as used in the specification and in the claims indicates any combination of one or more of the associated listed items and all possible combinations of the items.

[0046] In addition, the terms "first", "second", etc. are used only for descriptive purposes and are not to be construed as indicating or implying relative importance or a quantity of the specified features to which they refer. Thus, a feature defined with "first", "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0047] Embodiments of the present application provide a laser processing servo device, which can move up and down with the surface of a workpiece to maintain the relative distance between the laser focal point and the workpiece; the aforementioned workpiece can be a plate or a part.

[0048] Figure 1 A perspective view of a laser processing servo device provided by an embodiment of the present application. Figure 2 A schematic diagram of the optical path of a laser processing servo device provided by an embodiment of the present application. Figure 1 And Figure 2 Embodiments of the present application provide a laser processing servo device, which includes a mounting component 1, a light-emitting assembly 2, and a lifting driving assembly 3.

[0049] The mounting component 1 is used to mount the entire laser processing servo device to a designated position, such as a rotating shaft of a processing device, so that the rotating shaft can drive the entire laser processing servo device to rotate.

[0050] The light-emitting assembly 2 is used to emit laser light to process the workpiece.

[0051] The lifting driving assembly 3 is arranged on the mounting component 1 and connected to the light emitting assembly 2 to drive the light emitting assembly 2 to move relative to the mounting component 1 along the height direction H of the laser processing servo device.

[0052] The lifting driving assembly 3 can be a motor-screw structure or a cylinder driving assembly.

[0053] According to the above, the light emitting assembly 2 is driven by the lifting driving assembly 3 arranged on the mounting component 1 to move relative to the mounting component 1 along the height direction H of the laser processing servo device, which can independently adjust the position of the light emitting assembly 2 in the height direction H, so that the laser focal point maintains a certain distance from the surface of the workpiece, and the processing efficiency is improved.

[0054] Referring to Figure 1 and Figure 2 The laser processing servo device can further include a light receiving assembly 4.

[0055] The light receiving assembly 4 is used to receive laser and propagate the laser to the light emitting assembly 2. The light receiving assembly 4 is arranged on the mounting component 1.

[0056] In the height direction H, the light receiving assembly 4 is located above the light emitting assembly 2 to propagate light to the light emitting assembly 2.

[0057] The lifting driving assembly 3 drives the light emitting assembly 2 to move relative to the light receiving assembly 4 along the height direction H to adjust the distance between the laser focal point and the surface of the workpiece, so that the distance between the laser focal point and the surface of the workpiece is basically kept constant.

[0058] The light receiving assembly 4 is arranged on the mounting component 1, and the light emitting assembly 2 is driven by the lifting driving assembly 3 to move relative to the light receiving assembly 4 along the height direction H, which adjusts the distance between the laser focal point and the surface of the workpiece, so that the light receiving position remains fixed, which facilitates the entry of laser and is convenient for operation.

[0059] Referring to Figure 1 The laser processing servo device can further include a dustproof telescopic component 5.

[0060] The light receiving assembly 4 is connected to the light emitting assembly 2 through the dustproof telescopic component 5, so that light can propagate to the light emitting assembly 2 through the inside of the dustproof telescopic component 5.

[0061] The dustproof telescopic component 5 can be a leather sheath or a bellows.

[0062] As the lifting driving assembly 3 drives the light emitting assembly 2 to move along the height direction H to approach or move away from the light receiving assembly 4, the dustproof telescopic component 5 will be compressed or elongated.

[0063] The dustproof telescopic part 5 is connected to the light-in assembly 4 and the light-out assembly 2, and can play a sealing role to prevent external pollution from entering the interior of the light-out assembly 2 and the interior of the light-in assembly 4.

[0064] With reference to Figure 2 The light-in assembly 4 can include a mirror mounting seat 41 and a mirror 42.

[0065] The mirror mounting seat 41 is arranged on the mounting part 1.

[0066] The mirror 42 is arranged on the mirror mounting seat 41.

[0067] The mirror 42 is used for receiving light and reflecting the light to the light-out assembly 2.

[0068] In other embodiments, the light-in assembly 4 can include a lens and a lens mounting seat, and the lens is arranged on the lens mounting seat and above the light-out assembly 2 in the height direction.

[0069] With reference to Figure 1 The lifting drive assembly 3 can include a moving part 31 and a lifting drive body 32.

[0070] The moving part 31 is connected to the light-out assembly 2 to drive the light-out assembly 2 to move relative to the mounting part 1 along the height direction H.

[0071] The lifting drive body 32 is arranged on the mounting part 1 and connected to the moving part 31 to drive the moving part 31 to move relative to the mounting part 1 along the height direction H.

[0072] The moving part 31 can be a screw nut, and the lifting drive body 32 can be a screw rod and a motor. The motor is integrated with the transmission screw rod, and the rotation of the motor is converted into linear motion by the screw nut, which can reduce the use of couplings and other components and simplify the structure.

[0073] In other embodiments, the moving part 31 is a piston rod, and the lifting drive body 32 is a cylinder body of a gas cylinder.

[0074] With reference to Figure 1 The lifting drive assembly 3 can further include a limiting part 33.

[0075] The limiting part 33 is connected to the lifting drive body 32.

[0076] The moving part 31 is connected to the limiting part 33 and can move within a limited height range relative to the limiting part 33 along the height direction H.

[0077] The stroke of the moving part 31 is limited by the limiting part 33 to achieve limiting, which can avoid the components from falling off or being damaged due to exceeding the stroke and improve the reliability of the equipment.

[0078] Referring to Figure 2 The limiting component 33 can be provided with a movable slot 331.

[0079] The moving component 31 is connected to the movable slot 331 of the limiting component 33 and can move within the height range defined by the movable slot 331 relative to the limiting component 33 along the height direction H.

[0080] The movable slot 331 can be a waist-shaped hole or a square hole. The movable slot 331 can be a through hole or a blind hole.

[0081] The travel of the moving component 31 is limited by the movable slot 331, which can be provided on the limiting component 33, which is simple in structure, easy to implement, and can save space.

[0082] In other embodiments, the movable slot 331 is optional, and the moving component 31 is connected to the limiting component 33 through a guide rail and a sliding block to move within the height range defined by the guide rail relative to the limiting component 33 along the height direction H.

[0083] Referring to Figure 2 The limiting component 33 can be provided with a sensing portion 332.

[0084] The sensing portion 332 can be a protruding portion or a recessed portion.

[0085] Referring to Figure 1 The lifting drive assembly 3 can further include a drive mounting seat 34.

[0086] The lifting drive body 32 is arranged on the mounting component 1 through the drive mounting seat 34.

[0087] Referring to Figure 1 The lifting drive assembly 3 can further include a moving mounting seat 35 and a connecting component 36.

[0088] The moving mounting seat 35 is used for mounting the moving component 31.

[0089] The moving mounting seat 35 is further connected to the connecting component 36 to drive the connecting component 36 to move relative to the mounting component 1 along the height direction.

[0090] The connecting component 36 is connected to the light-emitting assembly 2 to drive the light-emitting assembly 2 to move relative to the mounting component 1 along the height direction H.

[0091] Referring to Figure 1 The lifting drive assembly 3 can further include a lifting drive cover plate 37.

[0092] The lifting drive cover plate 37 is arranged on the drive mounting seat 34 to shield the moving component 31 and the lifting drive body 32, which can block external contaminants.

[0093] Referring to Figure 1 The lifting driving assembly 3 can further include a first wear-resistant sealing strip 38.

[0094] The first wear-resistant sealing strip 38 is arranged on the moving mounting seat 35 and can abut against the lifting driving cover plate 37, thereby sealing the moving part (i.e., the moving mounting seat 35) and preventing external contaminants from affecting the moving part 31 and the lifting driving body 32.

[0095] Referring to Figure 1 The laser processing follow-up device can further include a fixed cover plate 10.

[0096] The fixed cover plate 10 is arranged on the mounting part 1 to block external contaminants from entering the light-emitting assembly 2.

[0097] Referring to Figure 1 The lifting driving assembly 3 can further include a second wear-resistant sealing strip 39.

[0098] The second wear-resistant sealing strip 39 is arranged on the connecting part 36 and can abut against the fixed cover plate 10, thereby sealing the moving part (i.e., the connecting part 36), preventing external contaminants from entering the light-emitting assembly 2 and the light-receiving assembly 4, protecting the optical device, and prolonging the service life of the optical lens.

[0099] Referring to Figure 2 The laser processing follow-up device can further include a limit sensor 6.

[0100] The limit sensor 6 is arranged around the limiting part 33, so that the sensing part 332 of the limiting part 33 can trigger the limit sensor 6 to limit the moving part 31 to move relative to the limiting part 33 in the height direction H within a limited height range.

[0101] The limit sensor 6 can be arranged on the moving part 31 to move with the moving part 31 relative to the limiting part 33 in the height direction H. When the limit sensor 6 moves to the position of the sensing part 332, the sensing part 332 triggers the limit sensor 6, so that the limit sensor 6 sends a signal to control the lifting driving body 32 to stop driving the moving part 31 to move, thereby limiting the moving part 31, preventing the moving part 31 from exceeding the stroke and causing the parts to fall off or be damaged, and also achieving the alarm function, thereby improving the reliability of the equipment.

[0102] The limit sensor 6 can be a non-contact sensor or a contact sensor.

[0103] The limit sensor 6 and the limiting part 33 jointly limit the moving part 31, thereby achieving the functions of limiting and alarming, and further improving the reliability of the equipment.

[0104] Referring toFigure 1 and Figure 2 The light-out assembly 2 can include a light-out housing 21 and a focusing mirror 22.

[0105] The light-out housing 21 is connected to the lifting driving assembly 3, and is driven by the lifting driving assembly 3 to move along the height direction H relative to the mounting component.

[0106] The focusing mirror 22 is arranged in the light-out housing 21.

[0107] Referring to Figure 1 and Figure 2 The light-out assembly 2 can further include a protective mirror 23.

[0108] In the height direction H, the protective mirror 23 is arranged below the focusing mirror 22 to protect the focusing mirror 22 from being damaged by external objects.

[0109] It should be understood that if the light-in assembly 4 has a focusing mirror, the focusing mirror 22 is optional. In this case, the light-out assembly 2 includes the light-out housing 21 and the protective mirror 23.

[0110] Referring to Figure 1 The light-out assembly 2 can further include an adjusting component 24.

[0111] The adjusting component 24 is arranged in the light-out housing 21 and can abut against the focusing mirror 22 to adjust the position of the focusing mirror 22 in the lateral direction W, so as to change the position of the laser beam, reduce or eliminate the position error, and improve the machining precision.

[0112] The lateral direction W is perpendicular to the height direction H.

[0113] The adjusting component 24 can be a bolt or a pin arranged in the light-out housing 21.

[0114] The number of the adjusting component 24 can be one or more. When the number of the adjusting component 24 is more than one, each adjusting component 24 is arranged around the light-out housing 21, and can adjust the position of the focusing mirror 22 from multiple directions (such as adjusting the focusing mirror 22 to move slightly in the front-rear and left-right directions), so as to center the laser beam and further improve the machining precision.

[0115] Referring to Figure 1 The light-out housing 21 can include a focusing mirror housing 211 and a protective mirror housing 212.

[0116] The focusing mirror 22 is arranged in the focusing mirror housing 211.

[0117] The protective mirror 23 is arranged in the protective mirror housing 212.

[0118] Referring to Figure 1The laser processing follow-up device can further include a capacitive sensor 11, a ceramic ring 12 and a laser nozzle 13.

[0119] The capacitive sensor 11 is connected to the light-emitting assembly 2.

[0120] In the height direction H, the ceramic ring 12 is located between the capacitive sensor 11 and the laser nozzle 13.

[0121] The laser processing follow-up device provided by the embodiment of the present application works as follows:

[0122] The mounting component 1 is fixed to the rotating shaft of a machine tool, and can realize follow-up of the laser processing follow-up device in other angles in three-dimensional space; the laser is incident along the transverse direction W, enters the interior of the device, and is reflected by 90 degrees by the mirror 42 mounted on the mirror mounting seat 41; the lifting driving main body 32 is mounted on the driving mounting seat 34 fastened with the mounting component 1; in this way, the lifting driving main body 32, the driving mounting seat 34, the mirror mounting seat 41 and the mounting component 1 constitute a fixed part; and the moving component 31 connected to the lifting driving main body 32 is mounted on the moving mounting seat 35 connected with the connecting component 36, in this way, the moving mounting seat 35, the connecting component 36, the focusing mirror housing 211, the protective mirror housing 212, the capacitive sensor 11, the ceramic ring 12 and the laser nozzle 13 constitute a moving part, the fixed part and the moving part are limited together by a linear guide rail slider, the slider is mounted on the mounting component 1 of the fixed part, and the guide rail is fixed on the moving mounting seat 35; when the lifting driving main body 32 works, the moving component 31 of the moving part can move along the height direction H, in this way, the focusing mirror 22 mounted in the focusing mirror housing 211, the protective mirror 23 mounted in the protective mirror housing 212, the capacitive sensor 11, the ceramic ring 12 and the laser nozzle 13 can move together, and the simultaneous movement of the laser nozzle 13 and the laser focal point is realized.

[0123] The laser processing follow-up device provided by the embodiment of the present application can improve the follow-up speed of laser processing, improve the efficiency of laser processing, and effectively prolong the service life of the lens.

[0124] The embodiment of the present application further provides a processing equipment, which includes the laser processing follow-up device provided by any of the above embodiments.

[0125] The above only describes the preferred embodiments of the present application, and is not used to limit the present application, any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A laser machining follow-up device, characterized by, The laser processing follow-up device comprises: a mounting component; a light emitting assembly for emitting laser light; a lifting driving assembly arranged on the mounting component and connected to the light emitting assembly to drive the light emitting assembly to move relative to the mounting component along a height direction of the laser processing follow-up device.

2. The laser machining follow-up apparatus of claim 1, wherein The laser processing follow-up device further comprises: a light receiving assembly arranged on the mounting component; in the height direction, the light receiving assembly is above the light emitting assembly to transmit light to the light emitting assembly; the lifting driving assembly drives the light emitting assembly to move relative to the light receiving assembly along the height direction.

3. The laser machining follow-up apparatus of claim 2, wherein The laser processing follow-up device further comprises: a dustproof telescopic component, the light receiving assembly is connected to the light emitting assembly through the dustproof telescopic component to enable light to be transmitted to the light emitting assembly through the inside of the dustproof telescopic component.

4. The laser processing follow-up apparatus according to claim 2, wherein The light receiving assembly comprises: a mirror mounting seat arranged on the mounting component; a mirror arranged on the mirror mounting seat.

5. The laser processing follow-up apparatus according to claim 1, wherein The lifting driving assembly comprises: a moving component connected to the light emitting assembly; a lifting driving body arranged on the mounting component and connected to the moving component to drive the moving component to move relative to the mounting component along the height direction; a limiting component connected to the lifting driving body; the moving component is connected to the limiting component and can move relative to the limiting component within a limited height range along the height direction.

6. The laser processing follow-up apparatus according to claim 5, wherein The limiting component is provided with a movable slot; the moving component is connected to the movable slot of the limiting component and can move relative to the limiting component within a height range limited by the movable slot along the height direction.

7. The laser processing follow-up apparatus according to claim 5, wherein The limiting component is provided with a sensing part, The laser processing follow-up device further comprises: a limiting sensor arranged around the limiting component, so that the sensing part can trigger the limiting sensor to limit the moving component to move relative to the limiting component along the height direction within a limited height range.

8. The laser processing follow-up apparatus according to any one of claims 1 to 7, wherein The light emitting assembly comprises: a light emitting shell connected to the lifting driving assembly; a focusing mirror arranged on the light emitting shell; a protective mirror arranged below the focusing mirror in the height direction.

9. The laser machining follow-up apparatus of claim 8, wherein, The light emitting assembly further comprises: an adjusting component arranged on the light emitting shell and capable of abutting against the focusing mirror to adjust the position of the focusing mirror in a transverse direction; the transverse direction is perpendicular to the height direction.

10. A processing apparatus characterized by comprising: The laser processing follow-up device comprises the laser processing follow-up device according to any one of claims 1 to 9.