Semiconductor wafer-based thinning device

Abstract

The utility model relates to the technical field of semiconductor wafer thinning, and discloses a semiconductor wafer-based thinning device, which comprises a rack, a bearing assembly, a lifting assembly and a polishing assembly, the bearing assembly is fixedly installed on the rack to bear and fix a wafer, the grinding assembly is arranged above the bearing assembly to grind and reduce the thickness of the wafer, the grinding assembly is connected with the lifting assembly, and the lifting assembly drives the grinding assembly to move up and down; the bearing assembly comprises a workbench, an adsorption bearing structure and an auxiliary bearing structure, the workbench is fixedly installed on the rack, and the adsorption bearing structure and the auxiliary bearing structure are both installed on the workbench. According to the utility model, the fixed wafer is adsorbed and borne through the bearing assembly, so that the adsorption force and the bearing force of the wafer can be dispersed, the wafer is prevented from being broken due to stress concentration, and the stability and the safety of wafer fixation are effectively improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor wafer thinning technical field especially relates to a kind of based on semiconductor wafer's thinning device. BACKGROUND

[0002] In the semiconductor manufacturing process, wafer thinning is a key process step, the performance and integration of chip are higher and higher, the thickness of wafer also needs to be thinned constantly, by searching, application No.: CN202321643621.2, a kind of semiconductor wafer thinning holding device is disclosed, including base, the upper end of the base is fixedly connected with support frame, the upper end of the support frame is fixedly installed with air cylinder, the telescopic end of the air cylinder is slidably connected with support frame, the telescopic end of the air cylinder is fixedly connected with mounting bracket, the servo motor is fixedly installed on the mounting bracket, the output end of the servo motor is rotatably connected with mounting bracket.The utility model discloses a mounting plate is arranged on rotating shaft, motor two is arranged on mounting plate, threaded rod is arranged on the output shaft two of motor two, moving plate is arranged on threaded rod, connecting rod is arranged on mounting plate, guide rod is arranged on connecting rod, spring two is welded on connecting rod, by the setting of motor two, threaded rod and other structures, moving plate can be pushed to move, in turn drive clamping plate to move, in turn hold the semiconductor wafer of thinning and carry out holding processing.

[0003] But the fixing mode in prior art cannot evenly disperse stress, the adsorption force is too concentrated when wafer is fixed, so that wafer is adsorbed and fixed and force is concentrated on small area, due to the brittleness of wafer itself, wafer is easily broken, and the yield of wafer is reduced, therefore, in order to disperse stress and improve the yield of wafer thinning, a kind of based on semiconductor wafer's thinning device is proposed. UTILITY MODEL CONTENTS

[0004] The utility model aims at solving the shortcomings in prior art, and proposes a kind of based on semiconductor wafer's thinning device.

[0005] In order to achieve the above object, the utility model discloses the following technical scheme: a kind of based on semiconductor wafer's thinning device, including rack, bearing assembly, lifting assembly and polishing assembly;The bearing assembly is fixedly installed on rack and is loaded and fixed to wafer, the polishing assembly is located at the top of bearing assembly and is polished to wafer and is reduced in thickness, the polishing assembly is connected with lifting assembly, and lifting assembly drives the lifting movement of polishing assembly;The bearing assembly includes workbench, adsorption bearing structure and auxiliary bearing structure, and the workbench is fixedly installed on rack, and the adsorption bearing structure and auxiliary bearing structure are installed on workbench, the adsorption bearing structure generates negative pressure and is adsorbed and fixed to wafer, and the auxiliary bearing structure is auxiliary to load wafer;The polishing assembly includes mounting bracket, polishing disc and drive motor, and the polishing disc is fixedly installed on mounting bracket, and the drive motor drives mounting bracket to rotate.

[0006] As further description of the above technical solution:

[0007] The adsorption bearing structure includes fixed frame and negative pressure head, the fixed frame is fixedly installed on workbench, the top of the fixed frame is fixedly connected with bearing table, the diameter of the bearing table is greater than the diameter of the fixed frame, the fixed frame is hollow structure, the negative pressure head is installed in the inside of the fixed frame, the end of the negative pressure head is fixedly installed with negative pressure suction cup, and the negative pressure suction cup is used to adsorb wafer.

[0008] As further description of the above technical solution:

[0009] The auxiliary bearing structure includes auxiliary frame, the auxiliary frame is fixedly connected on workbench, the top of the auxiliary frame is fixedly connected with auxiliary table, the diameter of the auxiliary table is greater than the diameter of the auxiliary frame, and the upper surface of the auxiliary table and the bearing table are in the same plane.

[0010] As further description of the above technical solution:

[0011] The lifting assembly includes guide frame, sliding block and hydraulic part, the guide frame is fixedly connected on rack, the guide frame is provided with sliding slot, the guide frame is fixedly connected with guide sliding rail in the sliding slot, the sliding block is slidingly connected on the guide sliding rail, the guide frame is fixedly installed with hydraulic part, the output end of the hydraulic part is provided with telescopic head, the telescopic head is fixedly connected with sliding block, and the sliding block is fixedly connected with lifting plate.

[0012] As further description of the above technical solution:

[0013] The drive motor is fixedly installed on lifting plate, the reduction box is installed on the lifting plate, the input end of the reduction box is connected with the output end of drive motor, the output end of the reduction box is fixedly connected with main shaft, the main shaft rotates on the lifting plate, and the mounting bracket is fixedly connected on the main shaft.

[0014] As a further description of the above technical solutions:

[0015] The mounting frame and the polishing disc are arranged above the bearing assembly.

[0016] As a further description of the above technical solutions:

[0017] The adsorbing bearing structure and the auxiliary bearing structure are both provided with multiple groups.

[0018] As a further description of the above technical solutions:

[0019] The machine frame is provided with a negative pressure device, and a negative pressure end of the negative pressure device is connected with a negative pressure head.

[0020] The utility model has the advantages of:

[0021] 1. In the utility model, the wafer is fixed and adsorbed by the bearing assembly, the adsorption force and the bearing force of the wafer can be dispersed, the wafer is prevented from being damaged due to stress concentration, and the stability and safety of wafer fixation are effectively improved.

[0022] 2. The bearing assembly is provided with an adsorbing bearing structure and an auxiliary bearing structure, the diameter of the bearing table is greater than that of the fixing frame, the supporting area of the lower part of the wafer can be enlarged, the auxiliary table of the auxiliary bearing structure is in the same plane with the bearing table, the supporting area of the bottom of the wafer is further increased, multiple groups of such structures are arranged, multiple bearing surfaces can be formed on the lower surface of the wafer, the bearing force is dispersed, the wafer is effectively prevented from being damaged due to excessive local stress, and the stability and safety of the wafer in the processing process are improved.

[0023] 3. In addition, the wafer is adsorbed and fixed by multiple groups of adsorbing bearing structures, the adsorption force can be uniformly dispersed during wafer fixation, and the risk that the wafer is damaged due to excessive local stress is avoided. DRAWINGS

[0024] Figure 1 A perspective view of a thinning device based on a semiconductor wafer is provided for the utility model;

[0025] Figure 2 A partial structure schematic view of a thinning device based on a semiconductor wafer is provided for the utility model;

[0026] Figure 3 A partial structure schematic view of a bearing assembly is provided;

[0027] Figure 4 A structure schematic view of a lifting assembly and a polishing assembly is provided;

[0028] Figure 5A schematic view of a partial structure of the rack.

[0029] Legend:

[0030] 1, rack; 2, bearing assembly; 3, lifting assembly; 4, polishing assembly; 21, workbench; 22, adsorbing bearing structure; 23, auxiliary bearing structure; 221, fixing frame; 222, bearing table; 223, negative pressure head; 224, negative pressure chuck; 231, auxiliary frame; 232, auxiliary table; 31, guide frame; 32, guide slide rail; 33, sliding block; 34, lifting plate; 35, hydraulic part; 36, telescopic head; 41, mounting frame; 42, polishing disc; 43, driving motor; 44, speed reducer; 45, main shaft; 5, negative pressure part; 6, wafer. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0032] Reference Figures 1-5 The present application provides an embodiment: a thinning device based on a semiconductor wafer, comprising a rack 1, a bearing assembly 2, a lifting assembly 3 and a polishing assembly 4; the bearing assembly 2 is fixedly installed on the rack 1 to bear and fix the wafer, the polishing assembly 4 is arranged above the bearing assembly 2 to polish and thin the wafer, the polishing assembly 4 is connected with the lifting assembly 3, and the lifting assembly 3 drives the lifting movement of the polishing assembly 4; the bearing assembly 2 comprises a workbench 21, an adsorbing bearing structure 22 and an auxiliary bearing structure 23, the workbench 21 is fixedly installed on the rack 1, the adsorbing bearing structure 22 and the auxiliary bearing structure 23 are both installed on the workbench 21, the adsorbing bearing structure 22 generates negative pressure to adsorb and fix the wafer, and the auxiliary bearing structure 23 assists in bearing the wafer; the polishing assembly 4 comprises a mounting frame 41, a polishing disc 42 and a driving motor 43, the polishing disc 42 is fixedly installed on the mounting frame 41, and the driving motor 43 drives the mounting frame 41 to rotate.

[0033] Specifically, the adsorbing bearing structure 22 comprises a fixing frame 221 and a negative pressure head 223, the fixing frame 221 is fixedly installed on the workbench 21, the top of the fixing frame 221 is fixedly connected with a bearing table 222, the diameter of the bearing table 222 is larger than that of the fixing frame 221, the fixing frame 221 is a hollow structure, the negative pressure head 223 is installed in the interior of the fixing frame 221, the end of the negative pressure head 223 is fixedly installed with a negative pressure chuck 224, the negative pressure chuck 224 is used for adsorbing the wafer, since the diameter of the bearing table 222 is larger than that of the fixing frame 221, the supporting area of the lower part of the wafer can be expanded, so that the wafer is more stable during the process of being adsorbed and fixed, at the same time, the upper surface of the auxiliary table 232 is in the same plane with the bearing table 222, the auxiliary frame 231 also provides additional supporting force for the wafer, further expanding the supporting area of the bottom of the wafer.

[0034] In the embodiment, the auxiliary bearing structure 23 comprises an auxiliary frame 231, the auxiliary frame 231 is fixedly connected on the workbench 21, the top of the auxiliary frame 231 is fixedly connected with an auxiliary table 232, the diameter of the auxiliary table 232 is larger than that of the auxiliary frame 231, the upper surface of the auxiliary table 232 is in the same plane with the bearing table 222, the setting of the plurality of adsorbing bearing structures 22 and the auxiliary bearing structure 23 can form a bearing surface on the lower surface of the wafer, disperse the bearing force, and avoid damaging the wafer due to excessive local stress.

[0035] In addition, the lifting assembly 3 comprises a guide frame 31, a sliding block 33 and a hydraulic part 35, the guide frame 31 is fixedly connected on the rack 1, the guide frame 31 is provided with a sliding groove, the guide sliding rail 32 is fixedly connected in the sliding groove, the sliding block 33 is slidingly connected on the guide sliding rail 32, the guide sliding rail 32 is a vertical guide rail, the hydraulic part 35 is fixedly installed on the guide frame 31, the output end of the hydraulic part 35 is provided with a telescopic head 36, the telescopic head 36 is fixedly connected with the sliding block 33, the lifting plate 34 is fixedly connected on the sliding block 33.

[0036] In the embodiment, the driving motor 43 is fixedly installed on the lifting plate 34, the lifting plate 34 is installed with a speed reducer 44, the input end of the speed reducer 44 is connected with the output end of the driving motor 43, the output end of the speed reducer 44 is fixedly connected with a main shaft 45, the main shaft 45 rotates on the lifting plate 34, and the mounting frame 41 is fixedly connected on the main shaft 45.

[0037] Specifically, the mounting frame 41 and the polishing disc 42 are arranged above the bearing assembly 2, and the adsorbing bearing structure 22 and the auxiliary bearing structure 23 are each provided with a plurality of groups.

[0038] In addition, the rack 1 is installed with a negative pressure part 5, and the negative pressure end of the negative pressure part 5 is connected with the negative pressure head 223.

[0039] Working principle: when the semiconductor wafer is polished and thinned, first, the wafer is placed on the bearing assembly 2, at this time, the lower surface of the wafer is on the bearing table 222 and the negative pressure head 223, the bearing table 222 and the negative pressure head 223 bear the wafer together, then start the negative pressure piece 5, the negative pressure piece 5 makes the negative pressure generated at the negative pressure chuck 224, and then adsorbs the lower surface of the wafer, so that the wafer is fixed on the bearing assembly 2, because the adsorption bearing structure 22 and the auxiliary bearing structure 23 are provided with multiple groups, the lower surface of the wafer can be carried in multiple places, so that the lower surface of the wafer has multiple bearing places, which can avoid the wafer from being damaged due to excessive concentration of clamping force;

[0040] The output end of the driving motor 43 drives the main shaft 45 to rotate through the speed reducer 44, so as to drive the mounting frame 41 and the polishing disc 42 to rotate, when the output end of the hydraulic piece 35 makes the telescopic head 36 descend, the sliding block 33 moves downward along the guide sliding rail 32, the polishing disc 42 gradually approaches the upper surface of the wafer, so as to polish the upper surface of the wafer, after polishing, the output end of the hydraulic piece 35 drives the telescopic head 36 to contract, so that the mounting frame 41 and the polishing disc 42 are lifted, at this time, the negative pressure piece 5 is closed, and the wafer is taken out from the bearing assembly 2, and the polishing and thinning of the wafer is completed.

[0041] Finally, it should be pointed out that: the above only for the preferred embodiments of the utility model, and does not limit the utility model, although the utility model is described in detail with reference to the foregoing embodiments, for the person skilled in the art, it still can modify the technical scheme recorded in the foregoing each embodiment, or equivalent replacement to part of technical features, any modification, equivalent replacement, improvement etc. made within the spirit and principles of the utility model, should be included in the protection scope of the utility model.

Claims

1. A semiconductor wafer-based thinning apparatus, characterized by: It include frame (1), bearing assembly (2), lifting assembly (3) and polishing assembly (4); The bearing assembly (2) is fixedly installed on the frame (1) to bear and fix the wafer, the polishing assembly (4) is arranged above the bearing assembly (2) to polish and reduce the thickness of the wafer, the polishing assembly (4) is connected with the lifting assembly (3), and the lifting assembly (3) drives the lifting movement of the polishing assembly (4); The bearing assembly (2) includes a workbench (21), an adsorption bearing structure (22) and an auxiliary bearing structure (23), the workbench (21) is fixedly installed on the frame (1), the adsorption bearing structure (22) and the auxiliary bearing structure (23) are installed on the workbench (21), the adsorption bearing structure (22) generates negative pressure to adsorb and fix the wafer, and the auxiliary bearing structure (23) assists in bearing the wafer. The polishing assembly (4) includes a mounting frame (41), a polishing disc (42) and a driving motor (43), the polishing disc (42) is fixedly installed on the mounting frame (41), and the driving motor (43) drives the mounting frame (41) to rotate.

2. The semiconductor wafer-based thinning apparatus of claim 1, wherein: The adsorption bearing structure (22) includes a fixed frame (221) and a negative pressure head (223), the fixed frame (221) is fixedly installed on the workbench (21), a bearing table (222) is fixedly connected to the top of the fixed frame (221), the diameter of the bearing table (222) is greater than that of the fixed frame (221), the fixed frame (221) is a hollow structure, the negative pressure head (223) is installed in the fixed frame (221), a negative pressure suction disc (224) is fixedly installed at the end of the negative pressure head (223), and the negative pressure suction disc (224) is used for adsorbing the wafer.

3. The semiconductor wafer-based thinning apparatus of claim 2, wherein: The auxiliary bearing structure (23) includes an auxiliary frame (231), the auxiliary frame (231) is fixedly connected to the workbench (21), an auxiliary table (232) is fixedly connected to the top of the auxiliary frame (231), the diameter of the auxiliary table (232) is greater than that of the auxiliary frame (231), and the auxiliary table (232) is in the same plane as the upper surface of the bearing table (222).

4. The semiconductor wafer-based thinning apparatus of claim 3, wherein: The lifting assembly (3) includes a guide frame (31), a sliding block (33) and a hydraulic part (35), the guide frame (31) is fixedly connected to the frame (1), a sliding groove is arranged in the guide frame (31), a guide sliding rail (32) is fixedly connected in the sliding groove, the sliding block (33) is slidingly connected to the guide sliding rail (32), the hydraulic part (35) is fixedly installed on the guide frame (31), an extension head (36) is arranged at the output end of the hydraulic part (35), the extension head (36) is fixedly connected with the sliding block (33), and a lifting plate (34) is fixedly connected to the sliding block (33).

5. A semiconductor wafer-based thinning apparatus as claimed in claim 4, wherein: The driving motor (43) is fixedly installed on the lifting plate (34), a speed reducer (44) is installed on the lifting plate (34), the input end of the speed reducer (44) is connected with the output end of the driving motor (43), the output end of the speed reducer (44) is fixedly connected with a main shaft (45), the main shaft (45) rotates on the lifting plate (34), and the mounting frame (41) is fixedly connected on the main shaft (45).

6. The semiconductor wafer-based thinning apparatus of claim 5, wherein: The mounting frame (41) and the polishing disc (42) are arranged above the bearing assembly (2).

7. The semiconductor wafer-based thinning apparatus of claim 6, wherein: The adsorbing bearing structure (22) and the auxiliary bearing structure (23) are provided with multiple groups.

8. The semiconductor wafer-based thinning apparatus of claim 7, wherein: The negative pressure device (5) is installed on the rack (1), and the negative pressure end of the negative pressure device (5) is connected with the negative pressure head (223).

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