Clamping point structure and boat piece assembly
By optimizing the design of the locking point structure, the contact area between the limiting component and the silicon wafer is reduced, solving the shading problem during the coating process and improving the appearance of the silicon wafer and the performance of the battery.
Patent Information
- Application Number
- CN202422684421.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-05
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2034-11-05
AI Technical Summary
During the coating process of BC cells, the dot structure severely obstructs the silicon wafer, resulting in poor appearance and performance degradation.
A locking structure is designed where the circumferential dimension of the limiting component is smaller than the sidewall dimension of the support component, thereby reducing the contact area between the limiting component and the silicon wafer. The shape of the limiting component is optimized by setting structures such as cutouts and grooves to reduce the occlusion area.
This reduces the area of the silicon wafer obstructed by the limiting components, improving the appearance of the silicon wafer and the performance of the solar cell.
Smart Images
Figure CN223522664U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of photovoltaic, in particular to a clamping point structure and a boat piece assembly. BACKGROUND
[0002] Back contact (BC) cell is an advanced design for improving the efficiency of solar cells, which places all metal electrodes of the cell on the back of the cell piece, so as to ensure that the front of the cell is not blocked by the metal electrode, thereby maximizing the area of the cell to absorb sunlight, reducing optical loss, and improving photoelectric conversion efficiency.
[0003] In the related art, in the film plating process of the BC cell, the silicon wafer can be inserted into the graphite boat, and the silicon wafer is fixed on the graphite boat through the clamping point structure, and then the graphite boat carrying the silicon wafer is placed in the film plating equipment to realize the film plating of the silicon wafer.
[0004] However, the above-mentioned clamping point structure has a serious shielding effect on the silicon wafer during the film plating process. Utility model content
[0005] Therefore, it is necessary to provide a clamping point structure and a boat piece assembly, which can reduce the shielding effect of the clamping point structure on the clamped piece.
[0006] In a first aspect, the embodiments of the present application provide a clamping point structure, comprising:
[0007] a base, a support member comprising two support portions, the two support portions are respectively arranged on both sides of the base along a first direction;
[0008] a limiting member arranged on the side wall of the end of the support portion away from the base; the limiting member, the support portion and the base form a limiting groove therebetween;
[0009] wherein the size of the limiting member along the circumferential direction of the support portion is smaller than the size of the side wall of the support portion along the circumferential direction of the support portion.
[0010] The clamping point structure provided by the embodiments of the present application can reduce the size of the limiting member along the circumferential direction of the support portion, so that the limiting member is only located at part of the outer circumference of the support portion, the size of the limiting member along the circumferential direction of the support portion is reduced, and the contact area between the limiting member and the silicon wafer during the film plating process is reduced, so as to reduce the shielding area of the limiting member on the silicon wafer, thereby reducing the adverse effects of the limiting member on the appearance of the silicon wafer, reducing the area of the clamping point printing, improving the appearance of the silicon wafer, and improving the performance of the solar cell.
[0011] In one of the embodiments, the clamping point structure comprises a plurality of limiting members on the same side of the base along the first direction, the plurality of limiting members are arranged at intervals along the circumference of the supporting part, and the sum of the dimensions of the plurality of limiting members along the circumference of the supporting part is less than the dimension of the side wall of the supporting part along the circumference of the supporting part;
[0012] The limiting member comprises an end portion, the distance between the end portion and the supporting part is greater than the distance between the remaining part of the limiting member and the supporting part;
[0013] The line between the end portions of the two adjacent limiting members has a spacing with the supporting part.
[0014] In one of the embodiments, the material of at least one of the limiting member and the supporting part comprises a metal material;
[0015] And / or, the limiting member and the supporting part are an integral structure.
[0016] In one of the embodiments, the limiting member is provided with a hollow portion, and the hollow portion penetrates the limiting member along the first direction.
[0017] In one of the embodiments, the hollow portion comprises a through hole, and the through hole is arranged at one end of the limiting member close to the supporting part.
[0018] In one of the embodiments, the hollow portion comprises a plurality of notches, the plurality of notches comprises a first notch and a second notch, the first notch and the second notch are arranged on two sides of the limiting member along the circumference of the supporting part respectively, and the first notch and the second notch are arranged at intervals along the circumference of the supporting part.
[0019] In one of the embodiments, the side of the limiting member facing the base is provided with a groove, and the groove is in communication with the hollow portion.
[0020] In one of the embodiments, along the cross section perpendicular to the first direction, the cross-sectional area of the limiting member gradually decreases in the direction from the limiting member to the base;
[0021] And / or, the limiting member comprises a first surface facing the base, and the distance between the first surface and the base gradually increases in the direction from the supporting part to the limiting member;
[0022] And / or, the limiting member comprises a second surface away from the base, and the distance between the second surface and the base gradually decreases in the direction from the supporting part to the limiting member;
[0023] And / or, the dimension of the limiting member along the circumference of the supporting part gradually decreases in the direction from the supporting part to the limiting member.
[0024] In one of the embodiments, the supporting part comprises a connecting part, and the two supporting parts are connected through the connecting part; the base has a through hole penetrating the base along the first direction, and the connecting part is arranged in the through hole;
[0025] And / or, the shape of the base is circular;
[0026] And / or, the material of the base comprises graphite.
[0027] In a second aspect, the embodiments of the present application provide a boat piece assembly, comprising: a boat piece and the clamping point structure in the first aspect, the boat piece being connected with the clamping point structure.
[0028] The boat piece assembly provided by the embodiments of the present application comprises the clamping point structure, the size of the limiting piece along the circumferential direction of the support part can be smaller than the size of the side wall of the support part along the circumferential direction of the support part, so that the limiting piece is only located at part of the outer periphery of the support part, the size of the limiting piece along the circumferential direction of the support part can be reduced, so that the contact area between the limiting piece and the silicon wafer is reduced during the film plating process, the shielding area of the limiting piece to the silicon wafer is reduced, and thus the adverse effect of the limiting piece on the appearance of the silicon wafer is reduced, the area of the clamping point mark is reduced, the appearance beauty of the silicon wafer is improved, and the performance of the solar cell is improved. BRIEF DESCRIPTION OF DRAWINGS
[0029] Figure 1 A top view of the clamping point structure provided by the embodiments of the present application.
[0030] Figure 2 A sectional view of the clamping point structure provided by the embodiments of the present application.
[0031] Figure 3 A side view of the clamping point structure provided by the embodiments of the present application.
[0032] Figure 4 Another side view of the clamping point structure provided by the embodiments of the present application.
[0033] Figure 5 A side view of the support part and the limiting piece provided by the embodiments of the present application.
[0034] Figure 6 A sectional view of the support part provided by the embodiments of the present application.
[0035] Figure 7 A partial sectional view of the support part provided by the embodiments of the present application.
[0036] Figure 8 A structure schematic view of the shielding of the limiting piece to the silicon wafer provided by the embodiments of the present application.
[0037] Explanation of reference signs:
[0038] 100, card point structure; 101, limiting groove; 110, base; 111, through hole; 120, support; 121, support part; 122, connecting part; 130, limiting part; 131, first surface; 132, second surface; 133, hollow part; 134, through hole; 135, notch; 1351, first notch; 1352, second notch; 136, groove; 137, end; 200, silicon wafer. DETAILED DESCRIPTION
[0039] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a number of different ways beyond the specific embodiments described and it is therefore contemplated to cover all such modifications as fall within the scope of the application. It is also to be understood that the terminology used herein is for the purpose of describing the present application and the use of such terminology is only intended to encompass the specific embodiments which utilize the various elements and components described herein and is not intended to exclude other embodiments which can include or exclude other elements or components.
[0040] In the description of the present application, it should be understood that if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.
[0041] In addition, if these terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features referred to. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, if the term "a plurality of" appears, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.
[0042] In the present application, unless specifically defined and limited otherwise, if there is a description of the term "installation", "connection", "connection", "fixation" and the like, these terms should be broadly interpreted. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0043] In the present application, unless specifically defined and limited otherwise, if there is a description of the term "installation", "connection", "connection", "fixation" and the like, these terms should be broadly interpreted. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0044] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on another element or there can be a middle element. If an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are for illustrative purposes only and do not represent the only implementation.
[0045] In the related art, in the coating process of the BC battery, the silicon wafer can be inserted into the graphite boat, and the silicon wafer is fixed on the graphite boat through the clamping point structure, and then the graphite boat carrying the silicon wafer is placed in the coating equipment to realize the coating of the silicon wafer.
[0046] The clamping point structure can include a base, a support and two limiting pieces. The two limiting pieces are located on both sides of the thickness direction of the base, and the limiting pieces are connected with the base through the support. A limiting groove is formed between the limiting piece, the support and the base. In the coating process, the silicon wafer can be inserted into the limiting groove. The limiting piece is annular and annularly arranged on the outer periphery of the support.
[0047] However, since the limiting piece is annular, and the size of the support piece in the circumferential direction is large, the contact area between the limiting piece and the silicon wafer is large in the film coating process, which causes the limiting piece to seriously shield the silicon wafer. The part of the limiting piece in contact with the silicon wafer will shield the film layer deposited on the silicon wafer to form a card point mark, thereby causing adverse effects on the appearance of the silicon wafer, and also affecting the performance of the solar cell.
[0048] To solve the above problems, the embodiments of the present application provide a card point structure 100 and a boat piece assembly, which can reduce the shielding area of the limiting piece 130 to the to-be-clamped piece.
[0049] The following will be combined with Figures 1-8 The card point structure 100 and the boat piece assembly provided by the embodiments of the present application will be described.
[0050] Referring to Figure 1 , the embodiments of the present application provide a card point structure 100, which is used for a to-be-clamped piece. The to-be-clamped piece can be a silicon wafer 200 ( Figure 8 ) or other to-be-clamped pieces. The silicon wafer 200 can be used to form a solar cell.
[0051] Referring to Figure 1 and Figure 2 , the card point structure 100 can include a base 110, a support piece 120, and a limiting piece 130. The support piece 120 can include two support portions 121, and the two support portions 121 are respectively arranged on both sides of the base 110 along a first direction A. The limiting piece 130 can be arranged at one end of the support portion 121 away from the base 110, and the limiting piece 130 can be arranged on the side wall of the support portion 121 extending along the first direction A.
[0052] Among them, a limiting groove 101 is formed between the limiting piece 130, the support portion 121 and the base 110. In the film coating process of the silicon wafer 200, the silicon wafer 200 can be inserted into the limiting groove 101. For example, the surface of the silicon wafer 200 on the side facing the limiting piece 130 can be coated.
[0053] Referring to Figure 3 , the size of the limiting piece 130 along the circumferential direction (i.e. Figure 3 direction B) of the support portion 121 can be smaller than the size of the side wall of the support portion 121 along the circumferential direction of the support portion 121, so that the limiting piece 130 is located only at part of the outer circumference of the support portion 121. The size of the limiting piece 130 along the circumferential direction of the support portion 121 can be reduced, so that the contact area between the limiting piece 130 and the silicon wafer 200 is reduced in the film coating process, thereby reducing the shielding area of the limiting piece 130 to the silicon wafer 200. Thus, the adverse effects of the limiting piece 130 on the appearance of the silicon wafer 200 are reduced, the area of the card point mark is reduced, the appearance of the silicon wafer 200 is improved, and the performance of the solar cell is improved. Among them, Figure 8When the limiting piece is ring-shaped, the shielding area of the limiting piece 130 to the silicon wafer 200 is the range shown by the dashed line E. The shielding area of the limiting piece 130 to the silicon wafer 200 provided by the embodiment of the present application is obviously smaller than the area shown by the dashed line E.
[0054] In some embodiments, referring to Figure 4 On the same side of the base 110 along the first direction A, the clamping point structure 100 comprises a plurality of limiting pieces 130, and the plurality of limiting pieces 130 are arranged at intervals along the circumference of the supporting part 121. By arranging a plurality of limiting pieces 130, the number of limiting pieces 130 is large, so that when the clamping point structure 100 is installed on the boat piece, the orientation of the limiting piece 130 does not need to be considered, and at least one limiting piece 130 can also be oriented towards the silicon wafer 200, so as to facilitate the insertion of the silicon wafer 200 into the limiting groove 101, and avoid the situation that a single limiting piece 130 causes the limiting groove 101 to deviate from the silicon wafer 200 and cannot be inserted, thereby simplifying the assembly between the clamping point structure 100 and the boat piece and reducing the assembly difficulty of the two.
[0055] Exemplarily, referring to Figure 4 On the same side of the base 110 along the first direction A, the sum of the circumferential dimensions of the plurality of limiting pieces 130 is smaller than the circumferential dimension of the sidewall of the supporting part 121 along the supporting part 121, so that the plurality of limiting pieces 130 only cover part of the outer circumference of the supporting part 121 instead of the entire outer circumference. The sum of the circumferential dimensions of the plurality of limiting pieces 130 can be reduced, in addition, the adjacent two limiting pieces 130 are arranged at intervals, so that the interval area between the adjacent two limiting pieces 130 is not shielded to the silicon wafer 200, thereby reducing the contact area between the limiting piece 130 and the silicon wafer 200 during the film coating process of the silicon wafer 200, reducing the shielding area of the limiting piece 130 to the silicon wafer 200, and reducing the adverse effects of the limiting piece 130 on the appearance of the silicon wafer 200, thereby improving the performance of the solar cell.
[0056] In some embodiments, referring to Figure 4 In the same limiting piece 130, the limiting piece 130 can comprise an end portion 137, and the distance between the end portion 137 and the supporting part 121 is greater than the distance between the remaining part of the limiting piece 130 and the supporting part 121. The end portion 137 of the limiting piece 130 can be the part farthest from the supporting part 121.
[0057] Exemplarily, referring to Figure 4On the same side of the base 110 along the first direction A, the line D between the end portions 137 of the two adjacent limiting members 130 and the support portion 121 has a spacing L, which can prevent the support portion 121 from protruding beyond the line D so that the two adjacent limiting members 130 cannot jointly limit the silicon wafer 200, thereby improving the versatility of the clamping point structure 100. When only one limiting member 130 faces the silicon wafer 200, only one limiting member 130 can limit and fix the silicon wafer 200. When the two adjacent limiting members 130 both face the silicon wafer 200, the two adjacent limiting members 130 can both limit and fix the silicon wafer 200
[0058] In some embodiments, the material of at least one of the limiting member 130 and the support member 120 includes a metal material, which is beneficial to improve the mechanical strength of at least one of the limiting member 130 and the support member 120, and can also improve the plasticity of at least one of the limiting member 130 and the support member 120. The embodiments of the present application take the case that the limiting member 130 and the support member 120 are both metal materials as an example for description.
[0059] In some embodiments, the limiting member 130 and the support member 120 can be an integrated structure, and the limiting member 130 and the support member 120 can be formed by integral molding. The limiting member 130 and the support member 120 can be completed by single processing without more than two times of processing, which can simplify the preparation process of the limiting member 130 and the support member 120, and can also improve the connection strength between the limiting member 130 and the support member 120.
[0060] In some embodiments, referring to Figure 5 , the limiting member 130 is provided with a hollow portion 133, and the hollow portion 133 penetrates the limiting member 130 along the first direction A Figure 2 . In the film plating process of the silicon wafer 200, the hollow portion 133 does not shield the silicon wafer 200, so that the contact area of the limiting member 130 and the silicon wafer 200 can be reduced by setting the hollow portion 133, the shielding area of the limiting member 130 to the silicon wafer 200 is reduced, and the adverse effect of the limiting member 130 on the appearance of the silicon wafer 200 is reduced, so as to improve the performance of the solar cell.
[0061] For example, referring to Figure 5The hollow part 133 includes a through hole 134 penetrating the limiting piece 130 along the first direction A, and the through hole 134 does not shield the silicon wafer 200 during the film plating process of the silicon wafer 200. For example, the through hole 134 is arranged at one end of the limiting piece 130 close to the support 120, so that the size of the one end of the limiting piece 130 close to the support 120 can be set larger to improve the connection stability between the limiting piece 130 and the support 120, and in addition, the through hole 134 arranged at the one end of the limiting piece 130 close to the support 120 can avoid the case that the size of the one end of the limiting piece 130 close to the support 120 is too large to shield the silicon wafer 200 more seriously.
[0062] For example, referring to Figure 5 On the same limiting piece 130, the hollow part 133 includes a plurality of notches 135 penetrating the limiting piece 130 along the first direction A, and the notches 135 do not shield the silicon wafer 200 during the film plating process of the silicon wafer 200. The plurality of notches 135 includes a first notch 1351 and a second notch 1352, and the first notch 1351 and the second notch 1352 are arranged at two sides of the limiting piece 130 along the circumferential direction of the support 121 respectively, and the first notch 1351 and the second notch 1352 are arranged staggered along the circumferential direction of the support 121, so that the size of the limiting piece 130 between the first notch 1351 and the second notch 1352 can be avoided to be too small due to the relative arrangement of the first notch 1351 and the second notch 1352 along the circumferential direction of the support 121, and thus the influence of the first notch 1351 and the second notch 1352 on the mechanical strength of the limiting piece 130 can be reduced.
[0063] For example, referring to Figure 2 The limiting piece 130 includes a first surface 131 and a second surface 132 arranged opposite along the first direction A, and the first surface 131 is arranged towards the base 110, and the second surface 132 is arranged away from the base 110.
[0064] In some embodiments, referring to Figure 6 and Figure 7 The limiting piece 130 is provided with a groove 136 on the side close to the base 110, and during the film plating process of the silicon wafer 200, the distance between the groove bottom wall of the groove 136 and the silicon wafer 200 is farther than the distance between at least part of the first surface 131 and the silicon wafer 200, so that the groove bottom wall of the groove 136 is not easy to contact the silicon wafer 200, which is beneficial to reduce the contact area between the first surface 131 and the silicon wafer 200, reduce the film plating shielding of the limiting piece 130 to the silicon wafer 200, and thus reduce the adverse effects of the limiting piece 130 on the appearance of the silicon wafer 200, so as to improve the performance of the solar cell.
[0065] For example, referring to Figure 7, the recess 136 can be in communication with the hollow part 133, and process gas can enter the recess 136 through the hollow part 133, thereby facilitating the contact between the silicon wafer 200 and the part of the limiting piece 130 along the first direction A and the process gas, facilitating the film coating on the part of the silicon wafer 200 and the limiting piece 130 along the first direction A, and thereby reducing the adverse effects of the limiting piece 130 on the appearance of the silicon wafer 200, so as to improve the performance of the solar cell.
[0066] In some embodiments, along a cross section perpendicular to the first direction A, the cross-sectional area of the limiting piece 130 gradually decreases in the direction from the limiting piece 130 to the base 110, so that the area of the surface (i.e., the first surface 131) of the limiting piece 130 close to the base 110 is small, which is conducive to reducing the contact area between the first surface 131 and the silicon wafer 200, thereby reducing the film coating shielding of the limiting piece 130 to the silicon wafer 200, reducing the adverse effects of the limiting piece 130 on the appearance of the silicon wafer 200, and improving the performance of the solar cell. In addition, the area of the surface (i.e., the second surface 132) of the limiting piece 130 away from the base 110 can be large, thereby facilitating the mechanical strength of the limiting piece 130.
[0067] In some embodiments, referring to Figure 2 , the distance C1 between the first surface 131 and the base 110 gradually increases in the direction from the support 120 to the limiting piece 130. When the silicon wafer 200 enters the limiting groove 101, the first surface 131 can play a guiding role, reducing the difficulty of the silicon wafer 200 entering the limiting groove 101. In addition, the end of the first surface 131 away from the support 121 is far away from the base 110, which is conducive to the end of the first surface 131 away from the support 121 not easily contacting the silicon wafer 200, thereby reducing the contact area between the first surface 131 and the silicon wafer 200, reducing the film coating shielding of the limiting piece 130 to the silicon wafer 200, reducing the adverse effects of the limiting piece 130 on the appearance of the silicon wafer 200, and improving the performance of the solar cell.
[0068] In some embodiments, referring to Figure 2 , the distance C2 between the second surface 132 and the base 110 gradually decreases in the direction from the support 120 to the limiting piece 130, which is conducive to reducing the size of the limiting piece 130, thereby reducing the manufacturing cost of the limiting piece 130.
[0069] In some embodiments, referring to Figure 3The size of the limiting member 130 along the circumference of the support part 121 gradually decreases from the support member 120 to the limiting member 130, so that the size of the limiting member 130 far away from the one end of the support member 120 is small, which is beneficial to reduce the contact area between the limiting member 130 far away from the one end of the support member 120 and the silicon wafer 200, thereby reducing the film coating shielding of the limiting member 130 to the silicon wafer 200, reducing the adverse effects of the limiting member 130 on the appearance of the silicon wafer 200, so as to improve the performance of the solar cell. In addition, the size of the limiting member 130 close to the one end of the support member 120 is large, so as to be beneficial to improve the mechanical strength of the limiting member 130.
[0070] In some embodiments, referring to Figure 2 The support member 120 includes a connecting part 122, the connecting part 122 is located between the two support parts 121, and the two support parts 121 are connected through the connecting part 122. The base 110 has a through hole 111 penetrating through the base 110 along the first direction A, and the connecting part 122 is arranged in the through hole 111, that is, the support member 120 is arranged in the through hole 111. By arranging the through hole 111, the assembly between the support member 120 and the base 110 is facilitated.
[0071] For example, the through hole 111 is arranged at the center of the base 110.
[0072] For example, the sizes of the two support parts 121 along the first direction A are the same.
[0073] In some embodiments, the shape of the base 110 is circular Figure 3 , polygonal, elliptical or other shapes.
[0074] In some embodiments, the material of the base 110 includes graphite or other materials.
[0075] The embodiment of the present application provides a boat piece assembly, the boat piece assembly includes a boat piece and the clamping point structure 100 in the above embodiments, and the boat piece is connected with the clamping point structure 100.
[0076] For example, the boat piece assembly can be used to load and unload the silicon wafer 200 Figure 8 .
[0077] For example, the boat piece can be a graphite boat piece or a boat piece formed by other materials.
[0078] In some embodiments, one silicon wafer can be connected to the boat wafer through at least one clamping point structure 100. Embodiments of the present application are described by taking an example of one silicon wafer connected to the boat wafer through three clamping point structures 100. The boat wafer assembly fixes the silicon wafer 200 on the boat wafer through the three clamping point structures 100 to prevent the silicon wafer 200 from shaking in the boat wafer assembly. For example, the surface of one side of the silicon wafer 200 in the thickness direction can be attached to the boat wafer, and the surface of the other side of the silicon wafer 200 in the thickness direction can be coated.
[0079] For example, the boat wafer assembly can be applied to chemical vapor deposition (for example, plasma enhanced chemical vapor deposition (PECVD)), physical vapor deposition, atomic layer deposition, etc.
[0080] The technical features of the above-described embodiments can be combined in any manner. In order to make the description simple, all possible combinations of the technical features in the above-described embodiments are not described, however, as long as the combinations of the technical features do not contradict each other, they should be considered as falling within the scope of the present application.
[0081] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, however, it should not be understood as a limitation on the patent scope of the present application. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all fall within the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.
Claims
1. A card point structure, characterized by, The application relates to a clamping point structure comprising: a base; a support comprising two support portions arranged on two sides of the base along a first direction; a limiting member arranged on a side wall of an end of the support portion away from the base, and a limiting groove being formed among the limiting member, the support portion and the base; wherein a size of the limiting member along a circumferential direction of the support portion is smaller than a size of the side wall of the support portion along the circumferential direction of the support portion.
2. The card point structure according to claim 1, characterized by On the same side of the base along the first direction, the clamping point structure comprises a plurality of limiting members, the plurality of limiting members are arranged at intervals along the circumferential direction of the support portion, and a sum of sizes of the plurality of limiting members along the circumferential direction of the support portion is smaller than the size of the side wall of the support portion along the circumferential direction of the support portion. The limiting member comprises an end portion, a distance between the end portion and the support portion is greater than a distance between a remaining part of the limiting member and the support portion. A line between the end portions of two adjacent limiting members and the support portion has a spacing.
3. The card point structure according to claim 1, wherein Materials of at least one of the limiting member and the support portion comprise a metal material. And / or, the limiting member and the support portion are an integral structure.
4. The card point structure according to any one of claims 1 to 3, characterized in that, The limiting member is provided with a hollow portion, and the hollow portion penetrates the limiting member along the first direction.
5. The card point structure according to claim 4, wherein The hollow portion comprises a through hole arranged at an end of the limiting member close to the support portion.
6. The card point structure according to claim 4, wherein The hollow portion comprises a plurality of notches, the plurality of notches comprise a first notch and a second notch, the first notch and the second notch are arranged on two sides of the limiting member along the circumferential direction of the support portion, and the first notch and the second notch are arranged at intervals along the circumferential direction of the support portion.
7. The card point structure according to claim 4, wherein A side of the limiting member facing the base is provided with a groove, and the groove is communicated with the hollow portion.
8. The card point structure according to any one of claims 1 to 3, wherein Along a cross section perpendicular to the first direction, a cross section area of the limiting member gradually decreases in a direction from the limiting member to the base. And / or, the limiting member comprises a first surface facing the base, and a distance between the first surface and the base gradually increases in a direction from the support portion to the limiting member. And / or, the limiting member comprises a second surface away from the base, and a distance between the second surface and the base gradually decreases in the direction from the support portion to the limiting member. And / or, a size of the limiting member along the circumferential direction of the support portion gradually decreases in the direction from the support portion to the limiting member.
9. The card point structure according to any one of claims 1 to 3, wherein The support comprises a connecting portion, the two support portions are connected through the connecting portion, the base has a through hole penetrating the base along the first direction, and the connecting portion is arranged in the through hole. And / or, the base is circular in shape. And / or, a material of the base comprises graphite.
10. A boat piece assembly, characterized by The application further relates to a boat piece and the clamping point structure according to any one of claims 1-9, and the boat piece is connected with the clamping point structure.