Continuous copper deposition device for circuit board

Abstract

The utility model discloses a continuous copper deposition device for a circuit board, which relates to the technical field of copper deposition devices and comprises a copper deposition box, a cover plate is arranged at the top end of the copper deposition box, a placing component is arranged in the copper deposition box, and lifting components for controlling the placing component to lift are arranged on two sides of the placing component. A stirring assembly is further arranged in the copper deposition box. According to the copper deposition device, the placement grooves with different sizes are formed in the two sides of the interior of the placement box, so that the effect that circuit boards with different sizes can be placed in the placement box for copper deposition is achieved, and the practicability and universality of the device are improved; the gas generated by the gas pump is sprayed out of the nozzle in a spiral gas form after passing through the spiral pipe, so that the effect of stirring the copper deposition liquid in the copper deposition box is achieved, the copper deposition liquid in the copper deposition box is kept uniform, the copper deposition quality of a circuit board is ensured, and the quality of the circuit board is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to copper deposition device technical field, concretely is circuit board continuous copper deposition device. BACKGROUND

[0002] Chemical copper plating is a process in circuit board manufacturing, usually also called copper deposition or hole (PTH), is a self-catalytic oxidation-reduction reaction, first with the treatment of activator, make the insulating substrate surface adsorb a layer of active particles, usually use metal palladium particles, copper ions are first reduced on these active metal palladium particles, and these reduced copper nuclei become the catalytic layer of copper ions, so that the reduction reaction of copper continues on the surface of these new copper nuclei, so the preparation is carried out by using copper deposition equipment.

[0003] According to the patent file with the announcement number CN220952053U circuit board copper deposition equipment, it is through the setting outside controller and timer, the reaction time is calculated through the timer, and the electric signal is sent after the reaction time reaches, so that the outside controller controls the replacement of copper deposition liquid by the liquid pump, and the labor input is saved. However, the device does not set the stirring assembly, and the copper deposition liquid in the device may not react fully with the circuit board, which affects the copper deposition quality of the circuit board, and in the actual use process, the thickness of the circuit board may be different each time, and the single distance of the holding plate body cannot meet the copper deposition operation of the circuit board with different thicknesses.

[0004] Based on this, the circuit board continuous copper deposition device is provided, which can eliminate the disadvantages of the existing device. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing circuit board continuous copper deposition device to solve the problem in the background art.

[0006] In order to achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0007] The circuit board continuous copper deposition device comprises a copper deposition box, a cover plate is arranged at the top end of the copper deposition box, a placing assembly is arranged in the copper deposition box, lifting assemblies for controlling the lifting of the placing assembly are arranged on the two sides of the placing assembly, and a stirring assembly is further arranged in the copper deposition box.

[0008] On the basis of the above technical scheme, the utility model further provides the following optional technical scheme:

[0009] In an optional scheme, the placing assembly comprises a placing box, a first placing groove and a second placing groove are formed in the two sides of the placing box, the widths of the first placing groove and the second placing groove are different, and a sliding block and a threaded block are fixedly connected to the left side and the right side of the placing box respectively.

[0010] In an optional scheme, the bottom end of the placing box is uniformly provided with a plurality of through holes, and a tapered block is arranged in the through hole.

[0011] In an optional scheme, the lifting assembly comprises a threaded rod and a sliding rod, the sliding rod and the threaded rod are arranged on the left side and the right side in the copper deposition tank respectively, a limiting plate is fixedly connected to the upper end of the sliding rod and the threaded rod, a motor is arranged on the limiting plate at the upper end of the threaded rod, and the threaded rod is fixedly connected to the output end of the motor through the limiting plate at the upper end.

[0012] In an optional scheme, the sliding block on the left side of the placing box is sleeved on the sliding rod, and the threaded block on the right side of the placing box is sleeved on the threaded rod.

[0013] In an optional scheme, the stirring assembly comprises a nozzle, a spiral pipe is arranged in the nozzle, a protection pipe is arranged outside the spiral pipe, the air inlet of the spiral pipe is connected with the filter box, and the filter box is provided with a gas pump.

[0014] In an optional scheme, the filter box is provided with a drying layer and a gas filter.

[0015] In an optional scheme, the copper deposition tank is provided with a liquid discharge pipe at the bottom end away from the stirring assembly, and a liquid conveying pipe is arranged at the upper left corner of the copper deposition tank.

[0016] Compared with the prior art, the utility model has the advantages that:

[0017] 1. The gas pump, the nozzle and the spiral pipe are arranged, so that the gas generated by the gas pump can be sprayed out from the nozzle in the form of spiral gas after passing through the spiral pipe, the stirring effect of the copper deposition liquid in the copper deposition tank is achieved, the copper deposition liquid in the copper deposition tank is kept uniform, the copper deposition amount and the copper deposition speed of each copper deposition area on the circuit board in the placing box are consistent, the copper deposition quality of the circuit board is ensured, and the quality of the circuit board is improved.

[0018] 2. The placing grooves with different sizes are arranged on the two sides of the placing box, so that the placing box can place circuit boards with different sizes for copper deposition, and the practicability and universality of the device are improved.

[0019] 3. The filter box is arranged between the gas pump and the spiral pipe, the filtering effect of the gas entering the spiral pipe is achieved, the gas affecting the copper deposition is prevented from entering the copper deposition tank through the spiral pipe, the copper deposition of the circuit board is affected, and the copper deposition quality of the circuit board is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is a structural schematic view of the utility model.

[0021] Figure 2The utility model discloses a cross section structure schematic diagram.

[0022] Figure 3 The utility model discloses a placing box structure schematic diagram.

[0023] Figure 4 The utility model discloses a through -hole part amplification structure schematic diagram.

[0024] Figure 5 The utility model discloses a stirring assembly cross section structure schematic diagram.

[0025] Mark annotation: 100 copper deposition box, 101 liquid discharge pipe, 102 infusion pipe, 103 cover plate, 200 placing assembly, 201 placing box, 202 no. 1 placing groove, 203 no. 2 placing groove, 204 through -hole, 205 conical block, 300 lifting assembly, 301 threaded rod, 302 sliding rod, 303 threaded block, 304 sliding block, 305 motor, 306 limit board, 400 stirring assembly, 401 nozzle, 402 spiral pipe, 403 protection pipe, 404 filter box, 405 air pump, 406 dry layer, 407 gas filter. DETAILED DESCRIPTION

[0026] In order to make the utility model's purpose, technical scheme and advantage more clearly clear, following combining with the drawing and example, this utility model carries out further detailed explanation.

[0027] In one embodiment, as shown in Figures 1-5 Circuit board continuous copper deposition device, including copper deposition box 100, the copper deposition box 100 top is equipped with a cover plate 103, the copper deposition box 100 inside is equipped with placing assembly 200, the placing assembly 200 both sides are equipped with the lifting assembly 300 for controlling the lifting of placing assembly 200, the copper deposition box 100 inside is also equipped with stirring assembly 400;

[0028] In use, open the cover plate 103 at the top of copper deposition box 100, then through lifting assembly 300 with placing assembly 200 rises to the top of copper deposition box 100, then the circuit board needing to carry out copper deposition processing is placed in placing assembly 200, and again through lifting assembly 300 with placing assembly 200 is lowered to the appropriate position, then cover the cover plate 103, start stirring assembly 400 so that the copper deposition liquid in copper deposition box 100 and circuit board can fully contact reaction, carry out the copper deposition operation of circuit board, through setting cover plate 103 at the top of copper deposition box 100, can reduce the influence of external factors on circuit board when circuit board carries out copper deposition reaction in copper deposition box 100.

[0029] In one embodiment, as shown in Figure 3As shown, the placing assembly 200 includes a placing box 201, a first placing slot 202 and a second placing slot 203 are arranged in the placing box 201, the first placing slot 202 and the second placing slot 203 are different in width, and the placing box 201 is fixedly connected with a sliding block 304 and a threaded block 303 on the left side and the right side respectively;

[0030] In use, the circuit board placed in the placing box 201 can be fixed through the first placing slot 202 and the second placing slot 203 on the inner side of the placing box 201, so as to maintain the stability of the circuit board during the copper plating reaction in the copper plating box 100. The first placing slot 202 and the second placing slot 203 are different in width, so that the placing box 201 can fix circuit boards of different models, improving the practicability and versatility of the copper plating box 100. The sliding block 304 and the threaded block 303 fixedly connected on both sides of the placing box 201 can make the placing box 201 ascend and descend on the lifting assembly 300, facilitating the placement and removal of the circuit board in the placing box 201 by the staff.

[0031] In one embodiment, as shown in Figure 4 The bottom end of the placing box 201 is uniformly provided with a plurality of through holes 204, and a tapered block 205 is arranged in the through hole 204.

[0032] In use, the through hole 204 is arranged at the bottom end of the placing box 201, so that when the placing box 201 is in the copper plating box 100, the copper plating liquid can enter the placing box 201 through the through hole 204 at the bottom end of the placing box 201 and contact the circuit board, ensuring the circulation of the copper plating liquid in the placing box 201 and improving the quality of the copper plating of the circuit board. The tapered block 205 at the through hole 204 can prevent bubbles from entering the placing box 201 through the through hole 204, affecting the copper plating of the circuit board.

[0033] In one embodiment, as shown in Figure 2 The lifting assembly 300 includes a threaded rod 301 and a sliding rod 302, the sliding rod 302 and the threaded rod 301 are arranged on the left and right sides of the copper plating box 100 respectively, a limiting plate 306 is fixedly connected to the upper end of the sliding rod 302 and the threaded rod 301, a motor 305 is arranged on the limiting plate 306 at the upper end of the threaded rod 301, and the threaded rod 301 penetrates through the limiting plate 306 and is fixedly connected with the output end of the motor 305;

[0034] In use, by starting the motor 305 at the upper end of the threaded rod 301, the motor 305 output end can drive the threaded rod 301 to rotate, thereby driving the placement box 201 to rise and fall on the threaded rod 301 and the slide rod 302, facilitating the staff to place and take the circuit board in the placement box 201. The limiting plate 306 arranged at the upper end of the threaded rod 301 and the slide rod 302 can limit the rising height of the placement box 201, preventing the placement box 201 from falling off the threaded rod 301 and the slide rod 302.

[0035] In one embodiment, as shown in Figure 2 The slide block 304 on the left side of the placement box 201 is sleeved on the slide rod 302, and the threaded block 303 on the right side of the placement box 201 is sleeved on the threaded rod 301.

[0036] In use, when the motor 305 output end drives the threaded rod 301 to rotate, the threaded block 303 sleeved on the threaded rod 301 will move on the threaded rod 301, driving the placement box 201 to move, and then driving the slide block 304 to move on the slide rod 302, thereby realizing the lifting operation of the placement box 201.

[0037] In one embodiment, as shown in Figure 5 The stirring assembly 400 includes a nozzle 401, a spiral pipe 402 is arranged in the nozzle 401, a protection pipe 403 is arranged outside the spiral pipe 402, the air inlet of the spiral pipe 402 is connected with a filter box 404, and an air pump 405 is arranged on one side of the filter box 404.

[0038] In use, the air pump 405 generates gas, the gas enters the spiral pipe 402 after being filtered by the filter box 404, and finally is sprayed out of the nozzle 401 through the spiral pipe 402. The gas sprayed out of the nozzle 401 through the spiral pipe 402 is spiral gas, which can stir the copper deposition liquid in the copper deposition tank 100, so that the copper deposition liquid in the copper deposition tank 100 remains uniform, thereby ensuring that the copper deposition amount and the copper deposition speed of each copper deposition area on the circuit board in the placement box 201 are consistent, ensuring the copper deposition quality of the circuit board and improving the quality of the circuit board.

[0039] In one embodiment, as shown in Figure 5 The filter box 404 is provided with a drying layer 406 and a gas filter 407.

[0040] In use, the drying layer 406 in the filter box 404 can remove the water vapor contained in the gas, preventing the water vapor from entering the copper deposition liquid and affecting the copper deposition quality of the circuit board. At the same time, the gas after removing the water vapor is filtered again by the gas filter 407, so that the gas that can affect the copper deposition quality is filtered, ensuring the copper deposition quality of the circuit board and improving the quality of the circuit board.

[0041] In one embodiment, as shown in Figure 1 The copper deposition tank 100 is provided with a liquid discharge pipe 101 at the bottom end away from the stirring assembly 400, and a liquid supply pipe 102 at the upper left corner of the copper deposition tank 100.

[0042] In use, the reacted copper deposition liquid in the copper deposition tank 100 can be discharged through the liquid discharge pipe 101, and the discharged copper deposition liquid can be uniformly collected and treated to avoid waste of resources. At the same time, the copper deposition liquid can be conveniently introduced into the copper deposition tank 100 through the liquid supply pipe 102 at the upper left corner of the copper deposition tank 100, thereby improving the copper deposition efficiency.

[0043] The utility model discloses a circuit board copper deposition device, including the copper deposition box 100, the copper deposition box 100 bottom end is equipped with the liquid outlet pipe 101, the copper deposition box 100 top end is equipped with the cover plate 103, the copper deposition box 100 left upper corner is equipped with the infusion tube 102, the copper deposition box 100 right upper corner is equipped with the motor 305, the motor 305 is equipped with the threaded rod 301, the threaded rod 301 is equipped with the threaded block 303, the threaded block 303 is equipped with the sliding block 304, the sliding block 304 is equipped with the slide rod 302, the slide rod 302 is equipped with the placing box 201, the placing box 201 is equipped with the first placing slot 202 and the second placing slot 203, the placing box 201 bottom end is equipped with the through -hole 204, the through -hole 204 is equipped with the conical block 205, the copper deposition box 100 right lower corner is equipped with the filter box 404, the filter box 404 is equipped with the dry layer 406, the filter box 404 is equipped with the spiral pipe 402, the spiral pipe 402 is equipped with the nozzle 401, the nozzle 401 is equipped with the air pump 405, the air pump 405 is equipped with the gas filter machine 407.The discharged copper precipitation liquid is collected and treated uniformly, and resource waste is avoided.

[0044] The above merely provides a specific implementation of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of changes or replacements within the technical scope disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A continuous copper plating device for circuit board, comprising a copper plating tank (100), the top end of the copper plating tank (100) is provided with a cover plate (103), characterized in that, The copper deposition box (100) is internally provided with a placing assembly (200), both sides of the placing assembly (200) are provided with a lifting assembly (300) for controlling the lifting of the placing assembly (200), and the copper deposition box (100) is internally further provided with a stirring assembly (400).

2. The apparatus according to claim 1, wherein The placing assembly (200) comprises a placing box (201), a first placing groove (202) and a second placing groove (203) are formed in both sides of the placing box (201), the first placing groove (202) and the second placing groove (203) are different in width, and a sliding block (304) and a threaded block (303) are fixedly connected to the left side and the right side of the placing box (201) respectively.

3. The apparatus according to claim 2, wherein A plurality of through holes (204) are uniformly formed in the bottom end of the placing box (201), and a tapered block (205) is arranged in each through hole (204).

4. The apparatus according to claim 3, wherein The lifting assembly (300) comprises a threaded rod (301) and a sliding rod (302), the sliding rod (302) and the threaded rod (301) are arranged on the left side and the right side in the copper deposition box (100) respectively, a limiting plate (306) is fixedly connected to the upper end of the sliding rod (302) and the threaded rod (301), a motor (305) is arranged on the limiting plate (306) at the upper end of the threaded rod (301), and the threaded rod (301) is fixedly connected to the output end of the motor (305) and penetrates through the limiting plate (306).

5. The apparatus according to claim 4, wherein The sliding block (304) on the left side of the placing box (201) is sleeved on the sliding rod (302), and the threaded block (303) on the right side of the placing box (201) is sleeved on the threaded rod (301).

6. The apparatus of claim 1 wherein, The stirring assembly (400) comprises a nozzle (401), a spiral pipe (402) is arranged in the nozzle (401), a protection pipe (403) is arranged on the outer side of the spiral pipe (402), the air inlet of the spiral pipe (402) is connected with a filtering box (404), and a gas pump (405) is arranged on one side of the filtering box (404).

7. The apparatus according to claim 6, wherein The filtering box (404) is internally provided with a drying layer (406) and a gas filter (407).

8. The apparatus of claim 1 wherein, A liquid discharge pipe (101) is arranged at the bottom end of the side, away from the stirring assembly (400), of the copper deposition box (100), and a liquid supply pipe (102) is arranged at the upper left corner of the copper deposition box (100).

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