Electroplating equipment and electroplating liquid disturbance device thereof
By using a fan-blade structure electroplating solution agitation device in electroplating equipment, the problem of uneven mixing of electroplating solution was solved, thereby improving the uniformity of coating thickness and the quality of electroplating.
Patent Information
- Application Number
- CN202422960799.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2023-12-29
- Filing Date
- 2024-12-03
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2034-12-03
AI Technical Summary
During the electroplating process, the electroplating solution is difficult to mix fully, resulting in uneven coating thickness. This is especially true for complex shapes or small parts, where eddies or turbulence can easily occur, affecting the electroplating quality.
An electroplating solution disturbance device including first and second fan blade structures is adopted. The fan blade structure is moved back and forth on the surface of the substrate to be plated by a horizontal drive device to maintain a specific distance and direction, thereby avoiding the generation of eddies or turbulence.
This process ensures thorough mixing of the electroplating solution, improves the uniformity of the coating thickness, and enhances the electroplating quality.
Smart Images
Figure CN223522704U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a kind of electroplating equipment, and especially a kind of electroplating liquid is fully mixed when electroplating is carried out, and vortex or turbulent flow is not prone to produce, to increase the electroplating quality of electroplating equipment and its electroplating liquid disturbance device. BACKGROUND
[0002] Semiconductor is the mother of the basic industry in the world in the research and development science at present.The lack of chip can lead to the production problem of many people's livelihood industry, for example, automobile cannot complete manufacturing delivery, leading to related peripheral industry to derive delivery payment cannot be paid on time and other problems.But the electroplating industry related to semiconductor industry is an important role, electroplating technology has an important technical stage so far.Further, electroplating is a common surface treatment technology, used to form a layer of metal film on the surface of article, to improve its corrosion resistance, appearance and other properties.
[0003] In the electroplating process, sometimes it is difficult to achieve the plating layer with uniform thickness, especially on the complex shape or small parts electroplating.The problem of uneven plating layer thickness (i.e., poor uniformity of plating layer thickness) can cause regional performance difference of product.Due to the electroplating solution is usually heated in the electroplating tank, and the stirring device is used to stir the electroplating solution, therefore, for electroplating equipment / system, how to make the flowing electroplating solution not produce turbulent flow, temperature uniform and fully mixed, which will be the key factor affecting the uniformity of plating layer thickness. SUMMARY
[0004] The utility model solves the technical problem, the main purpose of the utility model is to provide a kind of electroplating liquid disturbance device and electroplating equipment for electroplating equipment, to make electroplating liquid fully mixed when electroplating is carried out, and vortex or turbulent flow is not prone to produce, to increase the electroplating quality.
[0005] The technical means used by the utility model are as follows.
[0006] According to one of the purposes of the utility model, the utility model provides a kind of plating solution disturbance device for electroplating equipment, it includes first horizontal drive device, first fan blade structure and first fan blade structure drive device.First fan blade structure connects first horizontal drive device, wherein first horizontal drive device is used to drive first fan blade structure to the first surface of plated substrate moves or away from the first surface of plated substrate, so that first fan blade structure and the first surface of plated substrate have first specific distance between there is.The first fan blade structure drive device is connected to first fan blade structure, and it is used to drive entire first fan blade structure, so that first fan blade structure reciprocating moves in specific direction, wherein specific direction is perpendicular to the surface normal direction of plated substrate and the height direction of electroplating equipment.First fan blade structure includes at least one left fan blade, central fan blade and at least one right fan blade, the central fan blade of first fan blade structure is located between the left fan blade and right fan blade of first fan blade structure, the first angle between the width extension direction of the central fan blade of first fan blade structure and the width extension direction of the left fan blade of first fan blade structure, the second angle between the width extension direction of the central fan blade of first fan blade structure and the width extension direction of the right fan blade of first fan blade structure, and each of first angle and second angle is 10-50 degrees.
[0007] Optionally, the plating solution disturbance device further includes second horizontal drive device, second fan blade structure and second fan blade structure drive device.Second fan blade structure connects second horizontal drive device, wherein second horizontal drive device is used to drive second fan blade structure to the second surface of plated substrate moves or away from the second surface of plated substrate, so that second fan blade structure and the second surface of plated substrate have second specific distance between there is, wherein second surface is relative to first surface.Second fan blade structure drive device connects second fan blade structure, and it is used to drive entire second fan blade structure, so that second fan blade structure reciprocating moves in specific direction.Second fan blade structure includes at least one left fan blade, central fan blade and at least one right fan blade, the central fan blade of second fan blade structure is located between the left fan blade and right fan blade of second fan blade structure, the third angle between the width extension direction of the central fan blade of second fan blade structure and the width extension direction of the left fan blade of second fan blade structure, the fourth angle between the width extension direction of the central fan blade of second fan blade structure and the width extension direction of the right fan blade of second fan blade structure, and each of third angle and fourth angle is 10-50 degrees.
[0008] Optionally, each of the first specific distance and the second specific distance is 1-30 centimeters.
[0009] Optionally, the first specific distance and the second specific distance are equal to each other.
[0010] Optionally, each of the first specific distance and the second specific distance is 2 centimeters.
[0011] Optionally, the first, second, third and fourth angles are identical to each other.
[0012] Optionally, each of the first, second, third and fourth angles is 15 degrees.
[0013] Optionally, each of the at least one left and right leaflets of the first leaflet structure has a plurality of leaflets, and each of the at least one left and right leaflets of the second leaflet structure has a plurality of leaflets.
[0014] According to one of the purposes of the present application, the present application provides an electroplating device, which comprises the aforementioned electroplating liquid disturbance device with two leaflet structures, an electroplating tank, a cathode device, a clamp, a first anode device, a second anode device and a vertical driving device. The electroplating liquid disturbance device is arranged in the electroplating tank. The top of the clamp is connected to the cathode device and is used to clamp the plated substrate. The first anode device is connected to the back side of the first leaflet structure. The second anode device is connected to the back side of the second leaflet structure. The vertical driving device is connected to the cathode device and is used to drive the cathode device and the clamp to move vertically and position, so that the plated substrate clamped by the clamp enters or exits the electroplating tank or is positioned in the electroplating tank.
[0015] Optionally, the clamp comprises a first clamp frame and a second clamp frame, which are respectively located on both sides of the top of the clamp and extend downward in the vertical direction of the clamp to clamp the two side edges of the plated substrate, respectively.
[0016] Optionally, the electroplating device further comprises a first electroplating current providing device and a second electroplating current providing device. The first electroplating current providing device is electrically connected to the first anode device to provide a first electroplating current to the first anode device. The second electroplating current providing device is electrically connected to the second anode device to provide a second electroplating current to the second anode device.
[0017] Optionally, the electroplating device further comprises an electroplating current providing device. The electroplating current providing device is electrically connected to the first anode device and the second anode device to provide an electroplating current to the first anode device and the second anode device.
[0018] The technical effects of the present application are as follows:
[0019] In the electroplating liquid disturbance device for the electroplating device and the electroplating device provided by the present application, when the leaflet structure faces the surface of the plated substrate and reciprocally moves towards the two side edges of the surface of the plated substrate, the electroplating liquid can be fully mixed during electroplating, and vortex or turbulent flow is not easily generated, thereby increasing the electroplating quality. BRIEF DESCRIPTION OF DRAWINGS
[0020] Figure 1A partial structure perspective view of the electroplating equipment according to the present application;
[0021] Figure 2 A partial structure sectional view of the electroplating equipment according to the present application;
[0022] Figure 3 A structure perspective view of the first fan structure of the electroplating equipment according to the present application;
[0023] Figure 4 A configuration perspective view of the multiple fans in the first fan structure of the electroplating equipment according to the present application;
[0024] Figure 5 A structure perspective view of the clamp of the electroplating equipment according to the present application;
[0025] Figure 6 An actuation schematic view of the electroplating liquid disturbance device of the electroplating equipment according to the present application.
[0026] Symbol explanation:
[0027] 1: electroplating equipment
[0028] 11: cathode device
[0029] 12: clamp
[0030] 121: top
[0031] 122: first clamp frame
[0032] 123: second clamp frame
[0033] 13: first horizontal driving device
[0034] 14: first fan structure
[0035] 15: first fan structure driving device
[0036] 16A: first anode device
[0037] 16B: second anode device
[0038] 17: second horizontal driving device
[0039] 18: second fan structure
[0040] 19: second fan structure driving device
[0041] 141: left fan
[0042] 142: central fan
[0043] 143: right fan
[0044] 2: electroplating tank
[0045] 3: Vertical drive unit
[0046] A: Substrate to be plated
[0047] D: First specific distance
[0048] θ1: First included angle
[0049] θ2: The second included angle. Detailed Implementation
[0050] First, please refer to Figure 1 , Figure 2 , Figure 3 and Figure 6 , Figure 1 This is a partial three-dimensional view of an electroplating device according to the present invention. Figure 2 This is a partial structural cross-sectional view of the electroplating equipment of this utility model. Figure 3 This is a three-dimensional structural view of the first fan blade structure of the electroplating equipment of this utility model, and... Figure 6 This is a schematic diagram illustrating the operation of the electroplating solution agitation device in the electroplating equipment of this invention. The main purpose of this invention is to design an electroplating solution agitation device for electroplating equipment, which enables the electroplating solution (not shown) in the electroplating tank 2 of the electroplating equipment 1 to be fully mixed during electroplating, and to prevent the generation of eddies or turbulence, thereby increasing the electroplating quality. Further, when only the first surface of the substrate A needs to be electroplated, the electroplating solution agitation device includes at least a first horizontal drive device 13, a first fan-blade structure 14, and a first fan-blade structure drive device 15. However, if both the first and second surfaces of the substrate A need to be electroplated, the electroplating solution agitation device may further include a second horizontal drive device 17, a second fan-blade structure 18, and a second fan-blade structure drive device 19. In this embodiment, taking the need to electroplate the first and second surfaces of the substrate A as an example, the electroplating solution disturbance device includes a first horizontal drive device 13, a first fan blade structure 14, a first fan blade structure drive device 15, a second horizontal drive device 17, a second fan blade structure 18, and a second fan blade structure drive device 19.
[0051] The electroplating apparatus 1 comprises the above-mentioned electroplating solution agitating device, the electroplating tank 2, the cathode device 11, the clamp 12, the first anode device 16A, the second anode device 16B and the vertical driving device 3. The electroplating solution agitating device is disposed in the electroplating tank 2. The top 121 of the clamp 12 is connected to the cathode device 11 and is used to clamp the plated substrate A. The first anode device 16A is connected to the rear side of the first fan structure 14 (i.e. the side of the first fan structure 14 extending in the negative direction of the X axis), and the second anode device 16B is connected to the rear side of the second fan structure 18 (i.e. the side of the second fan structure 18 extending in the positive direction of the X axis). The vertical driving device 3 is connected to the cathode device 11 and is used to drive the cathode device 11 and the clamp 12 to move vertically (i.e. move in the positive and negative directions of the Z axis) and to be positioned, so that the plated substrate A clamped by the clamp 12 enters and exits the electroplating tank 2 or is positioned in the electroplating tank 2.
[0052] The first fan structure 14 is connected to the first horizontal driving device 13, wherein the first horizontal driving device 13 is used to drive the first fan structure 14 to move towards the first surface of the plated substrate A (i.e. move in the positive direction of the X axis) or away from the first surface of the plated substrate A (i.e. move in the negative direction of the X axis), so that the first fan structure 14 has a first specific distance D (as shown in the partial enlarged view in FIG. 1) from the first surface of the plated substrate A. Figure 2 The first fan structure driving device 15 is connected to the first fan structure 14 and is used to drive the entire first fan structure 14, so that the first fan structure 14 moves back and forth in a specific direction (i.e. move in the positive and negative directions of the Y axis), wherein the specific direction is perpendicular to the normal direction of the surface of the plated substrate A (i.e. the negative direction of the X axis) and the height direction of the electroplating apparatus 1 (i.e. the positive direction of the Z axis).
[0053] The second fan structure 18 is connected to the second horizontal driving device 17, wherein the second horizontal driving device 17 is used to drive the second fan structure 18 to move towards the second surface of the plated substrate A (i.e. move in the negative direction of the X axis) or away from the second surface of the plated substrate A (i.e. move in the positive direction of the X axis), so that the second fan structure 18 has a second specific distance (not shown in the figure) from the second surface of the plated substrate A, wherein the second surface of the plated substrate A is opposite to the first surface. The second fan structure driving device 19 is connected to the second fan structure 18 and is used to drive the entire second fan structure 18, so that the second fan structure 18 moves back and forth in a specific direction (i.e. move in the positive and negative directions of the Y axis).
[0054] In the embodiments of the present application, the first specific distance D and each of the second specific distances are 1-30 cm, so that the electroplating solution at the first surface and the second surface of the plated substrate A can be fully disturbed and uniformly distributed. Preferably, the first specific distance D and the second specific distances are equal to each other and are 2 cm. However, the present application is not limited thereto, and the first specific distance D and the second specific distances can be different from each other according to requirements and can not necessarily be 2 cm.
[0055] Please continue to refer to Figures 1 to 4 and Figure 6 , Figure 4 is a configuration perspective view of a plurality of leaves of a first leaf structure of the electroplating apparatus of the present application. The first leaf structure 14 includes at least one left leaf 141, a central leaf 142, and at least one right leaf 143. In this embodiment, the number of leaves of each of the at least one left leaf 141 and the at least one right leaf 143 of the first leaf structure 14 is a plurality. The central leaf 142 of the first leaf structure 14 is located between the left leaf 141 and the right leaf 143 of the first leaf structure 14. The width extension direction of the central leaf 142 of the first leaf structure 14 and the width extension direction of the left leaf 141 of the first leaf structure 14 have a first included angle θ1. The width extension direction of the central leaf 142 of the first leaf structure 14 and the width extension direction of the right leaf 143 of the first leaf structure 14 have a second included angle θ2. Each of the first included angle θ1 and the second included angle θ2 is 10-50 degrees.
[0056] Similarly, the second leaf structure 18 includes at least one left leaf (not shown), a central leaf (not shown), and at least one right leaf (not shown). In this embodiment, the number of leaves of each of the at least one left leaf and the at least one right leaf of the second leaf structure is a plurality. The central leaf of the second leaf structure 18 is located between the left leaf and the right leaf of the second leaf structure 18. The width extension direction of the central leaf of the second leaf structure 18 and the width extension direction of the left leaf of the second leaf structure 18 have a third included angle. The width extension direction of the central leaf of the second leaf structure 18 and the width extension direction of the right leaf of the second leaf structure 18 have a fourth included angle. Each of the third included angle and the fourth included angle is 10-50 degrees.
[0057] Preferably, in this embodiment, the first, second, third and fourth angles are identical to each other and are 15 degrees. However, the present application is not limited thereto, and the first, second, third and fourth angles can be completely different or partially identical in some embodiments. Furthermore, in one embodiment, the first, second, third and fourth angles can be rotated by a tool or a driving member to meet predetermined requirements (usually related to the material of the electroplating solution).
[0058] Please refer to Figures 1 to 6 , Figure 5 is a perspective view of the structure of the clamp of the electroplating apparatus. In one embodiment of the present application, the clamp 12 includes a first clamp frame 122 and a second clamp frame 123, which are respectively located on both sides of the top 121 of the clamp 12 and extend downward in the vertical direction of the clamp 12 (i.e., extend in the negative direction of the Z-axis) to clamp the two side edges of the plated substrate A. Please note that the above implementation of the clamp 12 is not used to limit the present application, and in other embodiments, the clamp 12 can be implemented in other ways.
[0059] It is noted that the electroplating apparatus can further include a first electroplating current providing device and a second electroplating current providing device. The first electroplating current providing device is electrically connected to the first anode device to provide a first electroplating current to the first anode device. The second electroplating current providing device is electrically connected to the second anode device to provide a second electroplating current to the second anode device.
[0060] In addition, the first anode device and the second anode device can also use the same electroplating current, and therefore, in another embodiment, the electroplating apparatus can further include an electroplating current providing device. The electroplating current providing device is electrically connected to the first anode device and the second anode device to provide an electroplating current to the first anode device and the second anode device.
[0061] Accordingly, the electroplating liquid disturbance device for the electroplating apparatus and the electroplating apparatus provided by the present application mainly include a fan structure including at least one left fan blade, a central fan blade and at least one right fan blade, wherein the width extension direction of the central fan blade and the width extension direction of each of the left fan blade and the right fan blade have an included angle of 10-50 degrees. Through the design of the above-mentioned included angle and maintaining a specific distance between the fan structure and the surface of the plated substrate, when the fan structure faces the surface of the plated substrate and reciprocally moves to both side edges of the surface of the plated substrate, the electroplating liquid can be fully mixed during electroplating, and vortex or turbulent flow is not easily generated, thereby increasing the electroplating quality.
Claims
1. A device for agitating electroplating solutions in electroplating equipment, characterized in that, Comprising: a first horizontal driving device (13); a first leaf structure (14) connected to the first horizontal driving device (13), wherein the first horizontal driving device (13) is used to drive the first leaf structure (14) to move towards or away from a first surface of a plated substrate (A) so that the first leaf structure (14) has a first specific distance (D) with the first surface of the plated substrate (A); and a first leaf structure driving device (15) connected to the first leaf structure (14) and used to drive the whole first leaf structure (14) to reciprocate in a specific direction, wherein the specific direction is perpendicular to a surface normal direction of the plated substrate (A) and a height direction of the electroplating equipment (1); wherein the first leaf structure (14) comprises at least a left leaf (141), a central leaf (142) and at least a right leaf (143), the central leaf (142) of the first leaf structure (14) is located between the left leaf (141) and the right leaf (143) of the first leaf structure (14), a first included angle (θ1) is between a width extension direction of the central leaf (142) of the first leaf structure (14) and a width extension direction of the left leaf (141) of the first leaf structure (14), a second included angle (θ2) is between the width extension direction of the central leaf (142) of the first leaf structure (14) and a width extension direction of the right leaf (143) of the first leaf structure (14), and each of the first included angle (θ1) and the second included angle (θ2) is 10-50 degrees.
2. The electroplating fluid perturbation apparatus of claim 1, wherein, Further comprising: a second horizontal driving device (17); a second leaf structure (18) connected to the second horizontal driving device (17), wherein the second horizontal driving device (17) is used to drive the second leaf structure (18) to move towards or away from a second surface of the plated substrate (A) so that the second leaf structure (18) has a second specific distance with the second surface of the plated substrate (A), wherein the second surface is relative to the first surface; and a second leaf structure driving device (19) connected to the second leaf structure (18) and used to drive the whole second leaf structure (18) to reciprocate in the specific direction; The second leaf structure (18) includes at least one left leaf, a central leaf, and at least one right leaf. The central leaf of the second leaf structure (18) is located between the left leaf and the right leaf of the second leaf structure (18). A third included angle is between a width extension direction of the central leaf of the second leaf structure (18) and a width extension direction of the left leaf of the second leaf structure (18). A fourth included angle is between the width extension direction of the central leaf of the second leaf structure (18) and a width extension direction of the right leaf of the second leaf structure (18). Each of the third included angle and the fourth included angle is 10-50 degrees.
3. The electroplating fluid perturbation apparatus of claim 2, wherein, Each of the first specific distance (D) and the second specific distance is 1-30 cm.
4. The electroplating fluid perturbation apparatus of claim 3, wherein, The first specific distance (D) and the second specific distance are equal to each other.
5. The electroplating fluid perturbation apparatus of claim 4, wherein, Each of the first specific distance (D) and the second specific distance is 2 cm.
6. The electroplating fluid perturbation apparatus of claim 2, wherein, The first included angle (θ1), the second included angle (θ2), the third included angle, and the fourth included angle are the same as each other.
7. The electroplating fluid perturbation apparatus of claim 6, wherein, Each of the first included angle (θ1), the second included angle (θ2), the third included angle, and the fourth included angle is 15 degrees.
8. The electroplating solution perturbation apparatus of claim 2, wherein, Each of the at least one left leaf (141) and the at least one right leaf (143) of the first leaf structure (14) has a plurality of leaf numbers. Each of the at least one left leaf and the at least one right leaf of the second leaf structure (18) has a plurality of leaf numbers.
9. An electroplating apparatus, characterized by, Comprising: The plating solution disturbance device of any one of claims 2-8; A plating tank (2), wherein the plating solution disturbance device is disposed in the plating tank (2); A cathode device (11); A clamp (12) located in the plating tank (2) when the plating equipment is plating the plated substrate (A), wherein a top (121) of the clamp (12) is connected to the cathode device (11), and the clamp (12) is used to clamp the plated substrate (A); A first anode device (16A) connected to a back side of the first leaf structure (14); A second anode device (16B) connected to a back side of the second leaf structure (18); and A vertical driving device (3) connected to the cathode device (11) and used to drive the cathode device (11) and the clamp (12) to move vertically and position, so that the plated substrate (A) clamped by the clamp (12) enters or exits the plating tank (2) or is positioned in the plating tank (2).
10. The electroplating apparatus of claim 9, wherein, The clamp (12) includes a first clamp frame (122) and a second clamp frame (123), which are respectively located on both sides of the top (121) of the clamp (12) and extend downward in the vertical direction of the clamp (12) to clamp both sides of the plated substrate (A) respectively.
11. The electroplating apparatus of claim 9, wherein, Further comprising: A first plating current providing device electrically connected to the first anode device (16A) to provide a first plating current to the first anode device (16A); and A second plating current providing device electrically connected to the second anode device (16B) for providing a second plating current to the second anode device (16B).
12. The electroplating apparatus of claim 9, wherein, Further comprising: A plating current providing device electrically connected to the first anode device (16A) and the second anode device (16B) for providing a plating current to the first anode device (16A) and the second anode device (16B).