Electroplating device
By designing a circulating container and a heating container, and utilizing a circulating heating medium and temperature sensing components, the problems of uneven heating and waste of the electroplating solution were solved, thereby improving the electroplating quality and making full use of the electroplating solution.
Patent Information
- Application Number
- CN202422712884.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-07
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2034-11-07
AI Technical Summary
In existing electroplating equipment, uneven heating of the chemical solution leads to inconsistent electroplating quality, and the large volume of the chemical solution tank results in chemical waste.
The design employs a circulating container and a heating container. The heating medium circulates between the circulating container and the heating container through a circulation component. Heat conduction and the circulating heating medium are used to heat the solution in the electroplating container. Combined with a temperature sensing component, the heating power is adjusted in real time to ensure the uniformity and stability of the solution temperature.
It achieves uniform heating of the plating solution, reduces the size of the electroplating container and the amount of plating solution used, improves the electroplating quality and reduces plating waste.
Smart Images
Figure CN223522709U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to surface treatment technical field, especially relate to a kind of electroplating device. BACKGROUND
[0002] The current electroplating device is generally in a medicine tank to hold medicine and heat the medicine by heater to improve the electroplating rate. In this process, the medicine is easy to be heated unevenly, resulting in uneven electroplating quality. Moreover, the volume of the medicine tank is generally large, and the medicine cannot be fully utilized and is easy to be wasted. SUMMARY
[0003] The main purpose of the utility model is to provide an electroplating device, which aims to reduce the waste of precious metals during electroplating and improve the quality of electroplating.
[0004] To achieve the above-mentioned purpose, the utility model provides an electroplating device, which comprises:
[0005] A circulating container is provided with a containing groove to accommodate a heating medium.
[0006] An electroplating container is arranged in the containing groove. The electroplating container is used to accommodate the medicine, and the heating medium is used to heat the electroplating container and the medicine.
[0007] A heating container is arranged on one side of the circulating container. The heating container is in communication with the circulating container. The heating medium flows from the circulating container into the heating container and is heated by the heating container.
[0008] A circulating assembly has an inlet end and an outlet end. The inlet end is in communication with the heating container, and the outlet end is in communication with the circulating container. The circulating assembly drives the heated heating medium to flow into the circulating container.
[0009] In an embodiment, the heating container comprises:
[0010] A heating box has a heating groove with a top opening. The heating groove is used to accommodate the heating medium.
[0011] A heater is arranged in the heating box. The heater is used to heat the heating medium.
[0012] In an embodiment, the heater is configured as a steam coil.
[0013] In an embodiment, the heating box has an inlet and an outlet. The inlet is arranged on the side wall of the heating groove, and the outlet is arranged on the groove bottom of the heating groove. The inlet is in communication with the circulating container, and the outlet is in communication with the inlet end. The steam coil is arranged on the groove bottom of the heating groove.
[0014] In an embodiment, the electroplating device further comprises a heat preservation layer, the heating container and at least one of the circulating container are provided with the heat preservation layer outside; and / or, the material of the electroplating container is PP material.
[0015] In an embodiment, the circulating assembly comprises:
[0016] a water pump having an inlet and an outlet;
[0017] an outlet pipeline, one end of which is communicated with the outlet and the other end of which is communicated with the circulating container;
[0018] an inlet pipeline, one end of which is communicated with the inlet and the other end of which is communicated with the heating container.
[0019] In an embodiment, the circulating assembly further comprises a flow regulating valve, the flow regulating valve is arranged on at least one of the outlet pipeline and the inlet pipeline.
[0020] In an embodiment, the electroplating device further comprises a temperature sensing assembly, the temperature sensing assembly is used to detect the temperature of the electroplating solution and the temperature of the heating medium.
[0021] In an embodiment, the temperature sensing assembly comprises:
[0022] a first sensor arranged in the electroplating container;
[0023] a second sensor arranged in the accommodating groove.
[0024] In the technical scheme, the electroplating device comprises a circulating container for containing a heating medium, an electroplating container for containing an electroplating solution is arranged in an accommodating groove of the circulating container, the heating medium can heat the electroplating container and the electroplating solution through heat conduction, so that the electroplating solution in the electroplating container is uniformly heated, and the electroplating quality is ensured; in addition, a heating container is arranged on one side of the circulating container, the heating container is communicated with the circulating container, the heating medium flows into the heating container from the circulating container and is heated by the heating container, a circulating assembly is further arranged between the heating container and the circulating container, the heated heating medium flows back to the circulating container under the driving of the circulating assembly, so that the heat of the heating medium in the circulating container is kept relatively stable, the heating effect of the electroplating solution in the electroplating container is ensured, and the electroplating quality is ensured; in addition, since the electroplating solution is not directly heated, the size of the electroplating container can be smaller, the capacity of the electroplating solution can be adjusted to be sufficient to cover the product to be electroplated, so that the electroplating solution is more fully utilized, and waste is reduced. BRIEF DESCRIPTION OF DRAWINGS
[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings described below only show some of the embodiments of the present application, and for those skilled in the art, other drawings can also be obtained according to the structures shown in these drawings without creative labor.
[0026] Figure 1 The structure diagram of the electroplating device provided by the present application is shown.
[0027] Explanation of reference numerals:
[0028] 100, circulating container; 200, electroplating container; 300, heating container; 310, heating box; 320, heater; 400, circulating assembly; 410, water pump; 420, liquid outlet pipeline; 430, liquid inlet pipeline; 440, flow regulating valve; 500, heat preservation layer.
[0029] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION
[0030] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.
[0031] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship, movement condition, etc. between the components in a certain posture, and if the certain posture changes, the directional indications will also change accordingly.
[0032] In addition, if the description of "first", "second" and the like is involved in the embodiments of the present application, the description of "first", "second" and the like is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can be explicitly or implicitly included at least one of the features. In addition, if "and / or" or "and / or" appears throughout the text, it means that the three parallel schemes include the A scheme, or the B scheme, or the A and B schemes. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of the ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor in the protection scope required by the present application.
[0033] In order to reduce the waste of precious metals in the electroplating process and improve the electroplating quality, the technical scheme provides an electroplating device, which comprises: a circulating container 100, which is internally provided with a containing groove for containing a heating medium; an electroplating container 200, which is arranged in the containing groove and is used for containing a chemical solution, and the heating medium is used for heating the electroplating container 200 and the chemical solution; a heating container 300, which is arranged on one side of the circulating container 100 and is in communication with the circulating container 100, and the heating medium flows from the circulating container 100 into the heating container 300 and is heated by the heating container 300; and a circulating assembly 400, which has an inlet end and an outlet end, the inlet end is in communication with the heating container 300, the outlet end is in communication with the circulating container 100, and the circulating assembly 400 drives the heated heating medium to flow into the circulating container 100.
[0034] In the technical scheme of the present application, the electroplating device comprises a circulating container 100 for containing a heating medium, the electroplating container 200 is arranged in the containing groove of the circulating container 100 for containing a chemical solution, and the heating medium can heat the electroplating container 200 and the chemical solution by heat conduction, so that the chemical solution in the electroplating container 200 can be uniformly heated, and the electroplating quality can be ensured. In addition, the heating container 300 is arranged on one side of the circulating container 100 and is in communication with the circulating container 100, and the heating medium flows from the circulating container 100 into the heating container 300 and is heated by the heating container 300. The circulating assembly 400 is further arranged between the heating container 300 and the circulating container 100, and the heated heating medium flows back to the circulating container 100 under the driving of the circulating assembly 400, so that the heat of the heating medium in the circulating container 100 can be kept relatively stable, and the heating effect of the chemical solution in the electroplating container 200 can be ensured, and the electroplating quality can be ensured. In addition, since the present scheme does not need to heat the chemical solution directly, the size of the electroplating container 200 can be smaller, and the capacity of the chemical solution can be adjusted to be sufficient to cover the products that need to be electroplated, so that the chemical solution can be more fully utilized and the waste can be reduced.
[0035] As Figure 1 In an embodiment of the present application, the electroplating device comprises a circulating container 100, the circulating container 100 has a containing groove with a top opening, a heating medium is placed in the containing groove, the heating medium can be water or the like, a heating container 300 is arranged on one side of the circulating container 100, a pipeline in communication with the circulating container 100 is arranged on the heating container 300, the heating medium in the circulating container 100 can enter the heating container 300 from the circulating container 100, the heating container 300 is provided with a heating device such as an electric heating rod, and the heating medium entering the heating container 300 can be heated; in addition, the electroplating device further comprises a circulating assembly 400, the circulating assembly 400 can be an assembly composed of a water pump 410 and a water pipe, the circulating assembly 400 has a liquid inlet end and a liquid outlet end, the liquid inlet end is in communication with the heating container 300, and the liquid outlet end is connected with the circulating container 100; under the driving of the circulating assembly 400, the heated heating medium enters the circulating assembly 400 through the liquid inlet end and enters the circulating container 100 from the liquid outlet end, so that the heating medium in the circulating container 100 is cyclically heated, the stability of heating the medicine in the electroplating container 200 is ensured, and thus the electroplating quality is ensured; in addition, in the present application, the heater 320 is not directly placed in the electroplating container 200, therefore, the electroplating container 200 can be made smaller, the use amount of the medicine in the electroplating process can be smaller, and thus the waste of the medicine after the electroplating is completed is reduced, and the economy is improved.
[0036] Specifically, as Figure 1 In an embodiment of the present application, the heating container 300 comprises: a heating box 310, a heating groove with a top opening, the heating groove is used for containing a heating medium; a heater 320 arranged in the heating box 310, the heater 320 is used for heating the heating medium; wherein the heating box 310 is internally hollow to form a heating grass, the heating box 310 is in communication with the circulating container 100 through a pipeline, the heater 320 is arranged in the heating box 310, the heater 320 can be an electric heating rod or the like, and the heater 320 can be uniformly distributed in the heating groove to improve the uniformity of heating the heating medium.
[0037] In another embodiment of the present application, the heater 320 is configured as a steam coil; the steam coil has the advantages of high heating efficiency, can improve the heating efficiency of the heating medium, and also ensures that the heating medium in the heating container 300 is uniformly heated during the heating process.
[0038] In an embodiment of the utility model, heating box 310 has liquid inlet and liquid outlet, liquid inlet is established in the lateral wall of heating groove, liquid outlet is established in the groove bottom of heating groove, liquid inlet communicates with circulating container 100, liquid outlet communicates with liquid inlet end, steam coil is established in the groove bottom of heating groove, so that, can make heating medium after heating enter circulating assembly 400 and circulate to circulating container 100, so reduce the heat loss of heating medium in heating container 300, reduce energy consumption.
[0039] As Figure 1 In an embodiment of the utility model, the electroplating device further comprises a thermal insulation layer 500, and the thermal insulation layer 500 is arranged on the outer side of at least one of the heating container 300 and the circulating container 100. The thermal insulation layer 500 can be arranged on the outer sides of the circulating container 100 and the heating container 300. The thermal insulation layer 500 can be made of conventional rock wool XPS or other heat insulation materials. In this way, the heat loss of the heating medium can be reduced, the temperature of the heating medium can be stabilized, the heating efficiency can be improved, and the energy consumption can be reduced. In another embodiment of the utility model, the material of the electroplating container 200 is PP material. The use of such material can improve the corrosion resistance and durability of the electroplating container 200, prolong the service life, prevent the electroplating container 200 from participating in chemical reactions, reduce the waste of chemicals, and improve the economy.
[0040] As Figure 1 In an embodiment of the utility model, the circulating assembly 400 comprises a water pump 410 having an inlet and an outlet, a liquid outlet pipeline 420 having one end communicating with the outlet and the other end communicating with the circulating container 100, and a liquid inlet pipeline 430 having one end communicating with the inlet and the other end communicating with the heating container 300. In this scheme, the water pump 410 can be placed on one side of the heating container 300. The water pump 410 is responsible for providing power to drive the flow of the heating medium. The water pump 410 has two ports, namely the inlet and the outlet. The inlet is used to suck the heating medium from the heating container 300, and the outlet is used to discharge the pressurized heating medium into the circulating container 100. The water pump 410 can adopt a mature water pump 410 model on the market. The liquid inlet pipeline 430 is connected to the inlet of the water pump 410. One end of the liquid inlet pipeline 430 communicates with the heating container 300. The outlet of the water pump 410 is connected to the liquid outlet pipeline 420. One end of the liquid outlet pipeline 420 communicates with the circulating container 100. In this way, the heating medium can circulate along the path of the heating container 300-liquid inlet pipeline 430-water pump 410-liquid outlet pipeline 420-circulating container 100-heating container 300, and heat the chemicals when flowing through the circulating container 100. At the same time, the chemicals can be kept at a constant temperature, ensuring the smooth progress of the electroplating process.
[0041] As Figure 1In an embodiment of the utility model, circulation assembly 400 still includes flow regulating valve 440, and at least one of outlet liquid pipeline 420 and inlet liquid pipeline 430 is provided with flow regulating valve 440, in the scheme, flow regulating valve 440 can be arranged on outlet liquid pipeline 420 and inlet liquid pipeline 430, and flow regulating valve 440 can adopt mature specifications on the market, by adjusting the opening of flow regulating valve 440, the flow of heating medium circulation can be adjusted, and then the heat exchange rate of heating medium and medicine water is adjusted, the temperature of medicine water after heating is adjusted, so that the electroplating process requirement of different temperature parameters is satisfied, and the flexibility of the electroplating device is improved.
[0042] In an embodiment of the utility model, the electroplating device further comprises a temperature sensing assembly for detecting the temperature of the medicine water and the temperature of the heating medium. The temperature sensing assembly can be a sensor or other device. The temperature sensing assembly can measure the temperature of the medicine water and the temperature of the heating medium in the circulating container 100. This allows the user to more easily adjust the power of the heating container 300 in a timely manner based on the data measured by the temperature sensing assembly, ensuring the smooth progress of the electroplating process. In the present scheme, the temperature sensing assembly includes a first sensor disposed in the electroplating container 200 and a second sensor disposed in the accommodating groove. The first sensor is used to measure the temperature of the medicine water, and the second sensor is used to measure the temperature of the heating medium. In this way, the power of the heater 320 can be adjusted in real time, so that the heating medium in the circulating container 100 is always circulated at 100 degrees, and the medicine water in the electroplating container 200 is always maintained at 90±5 degrees, ensuring the smooth progress of the electroplating process and ensuring the quality of the electroplating.
[0043] The above is only an exemplary embodiment of the utility model, and does not limit the patent scope of the utility model. Any equivalent structural transformation or direct / indirect application in other related technical fields based on the technical concept of the utility model and the content of the utility model specification and drawings are included in the patent protection scope of the utility model.
Claims
1. An electroplating apparatus characterized by comprising: The electroplating device comprises: a circulating container, which has a receiving groove for receiving a heating medium; an electroplating container, which is arranged in the receiving groove and is used for containing a plating solution, and the heating medium is used for heating the electroplating container and the plating solution; a heating container, which is arranged on one side of the circulating container and is in communication with the circulating container, and the heating medium flows from the circulating container into the heating container and is heated by the heating container; a circulating assembly, which has an inlet end and an outlet end, the inlet end is in communication with the heating container, and the outlet end is in communication with the circulating container, and the circulating assembly drives the heated heating medium to flow into the circulating container.
2. The electroplating apparatus of claim 1, wherein The heating container comprises: a heating box, which has a heating groove with a top opening, and the heating groove is used for containing the heating medium; a heater, which is arranged in the heating box and is used for heating the heating medium.
3. The electroplating apparatus of claim 2, wherein The heater is configured as a steam coil.
4. The electroplating apparatus of claim 3, wherein The heating box has an inlet and an outlet, the inlet is arranged on the side wall of the heating groove, and the outlet is arranged on the bottom of the heating groove, the inlet is in communication with the circulating container, the outlet is in communication with the inlet end, and the steam coil is arranged on the bottom of the heating groove.
5. The electroplating apparatus of claim 1, wherein The electroplating device further comprises a heat preservation layer, the heat preservation layer is arranged on the outer side of at least one of the heating container and the circulating container; and / or the material of the electroplating container is PP material.
6. The electroplating apparatus of claim 1, wherein The circulating assembly comprises: a water pump, which has an inlet and an outlet; an outlet pipeline, one end of which is in communication with the outlet, and the other end is in communication with the circulating container; an inlet pipeline, one end of which is in communication with the inlet, and the other end is in communication with the heating container.
7. The electroplating apparatus of claim 6, wherein The circulating assembly further comprises a flow regulating valve, and the flow regulating valve is arranged on at least one of the outlet pipeline and the inlet pipeline.
8. The electroplating apparatus of claim 1, wherein The electroplating device further comprises a temperature sensing assembly, which is used for detecting the temperature of the plating solution and the temperature of the heating medium.
9. The electroplating apparatus of claim 8, wherein The temperature sensing assembly comprises: a first sensor, which is arranged in the electroplating container; a second sensor, which is arranged in the receiving groove.