Micromechanical inertial measurement unit gluing tool
By designing a micromechanical inertial measurement unit adhesive fixture, which employs a fixture substrate and an elastic rubber pad structure, the problems of complex adhesive fixtures and chip damage in existing technologies are solved, achieving the effects of simplified operation and improved measurement accuracy.
Patent Information
- Application Number
- CN202422845959.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-21
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2034-11-21
AI Technical Summary
Existing adhesive tooling solutions for micromechanical inertial measurement units are complex and difficult to standardize, resulting in poor chip verticality, easy chip damage, and impact on measurement accuracy and product consistency.
A micromechanical inertial measurement unit adhesive fixture was designed, which adopts a fixture base and an elastic rubber pad structure. The fixture is fixed by screws and the elastic rubber pad makes elastic contact with the chip to avoid the fixture moving and damaging the chip.
It simplifies the operation process, ensures the verticality and consistency of the chip, avoids chip damage, and improves measurement accuracy and product quality.
Smart Images
Figure CN223524155U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a kind of assembly process tooling technology of micromechanical inertial measurement unit, in particular to a kind of micromechanical inertial measurement unit glue tooling, for solving the problem of micromechanical inertial measurement unit gluing. BACKGROUND
[0002] Micromechanical inertial measurement unit is the device for measuring the three-axis angular rate and acceleration of object, and has important application value in navigation. Compared with other types of inertial measurement unit, it has the advantages of small size, light weight, low power consumption, high reliability, etc.
[0003] Micromechanical inertial measurement unit is composed of circuit board and structural parts, and the circuit board mainly includes three micromechanical gyroscope chips, three micromechanical accelerometer chips and other components. With the miniaturization trend of micromechanical inertial measurement unit, the three micromechanical gyroscope chips and the three micromechanical accelerometer chips are connected together through rigid-flexible combination board. The circuit board needs to be fixed on the structural part base of micromechanical inertial measurement unit by gluing. In order to ensure the accuracy of micromechanical inertial measurement unit, the three micromechanical gyroscope chips and the three micromechanical accelerometer chips should be vertically fixed on the base after the circuit board is glued and fixed.
[0004] At present, the gluing scheme of the circuit board is to place the original gluing tool on the circuit board after the circuit board is placed on the base, so that the left end face, right end face, bottom face and front face of the original gluing tool are attached to the three micromechanical gyroscopes and the three micromechanical accelerometers, to ensure the perpendicularity of the three micromechanical gyroscope chips and the three micromechanical accelerometer chips. Then glue is applied at the gap between the chips and the base, and after the glue is applied, sponge is filled in the gap between the original gluing tool and the structural part base, and a weight is placed on the top surface of the original tooling to fix the original gluing tool.
[0005] However, the original adhesive tool has the following defects: 1. The original adhesive tool fills the gap between the side surfaces with sponge and fixes the position of the top weight. During the curing process of the adhesive, the position of the original adhesive tool is prone to moving, which can cause the verticality of the three micro-mechanical gyroscope chips and the three micro-mechanical accelerometer chips to be poor, thereby affecting the measurement accuracy of the micro-mechanical inertial measurement unit. 2. The original adhesive tool fills the gap between the side surfaces with sponge and fixes the position of the top weight. The operation process is complex, and it is difficult to standardize the operation. The product assembly effect varies from person to person, and the product consistency is poor. 3. The surface of the product chip and the original tool is in rigid contact. When the weight is too heavy, the bottom chip is easily damaged. The left end surface and the right end surface of the original adhesive tool are in contact with the chip. When the gap between the left end surface, the right end surface of the original tool and the chip is too large, reliable contact between the left end surface and the right end surface of the tool and the chip cannot be ensured. When the size between the left end surface and the right end surface of the original tool is large, the gap between the tool and the chip is too small or the interference fit is too large, and the tool reference surface will damage the chip. Especially after the adhesive is cured, the chip position is fixed, and the chip is more easily damaged when the adhesive tool is removed, causing the micro-mechanical inertial measurement unit to fail. SUMMARY
[0006] The technical problem to be solved by the utility model is to provide a micro-mechanical inertial measurement unit adhesive tool, which avoids the problems of complex assembly of the original adhesive tool scheme, non-verticality of the circuit board chip after the adhesive is cured, and chip damage, so as to improve the quality of the micro-mechanical inertial measurement unit product.
[0007] In order to achieve the purpose of solving the above technical problems, the utility model adopts the following technical scheme:
[0008] The utility model relates to a micro-mechanical inertial measurement unit adhesive tool, which is an adhesive tool used in the assembly process of a product to be adhered, comprising a tool base body, a left elastic rubber pad, a right elastic rubber pad, a lower first elastic rubber pad and a lower second elastic rubber pad.
[0009] The tool base body comprises a tool body and a support leg. The tool body is a cuboid with a length dimension greater than a height dimension, and the height dimension is greater than a width dimension. The support leg is provided at four corners of the tool body and has an L-shaped structure with a column and a beam.
[0010] A circular hole is arranged at the center of the column of each support leg structure. The positions of the four circular holes correspond to the positions of four threaded holes on the product to be adhered.
[0011] The left elastic rubber pad and the right elastic rubber pad are fixed on the left end surface and the right end surface of the tool body by glue, respectively. The lower first elastic rubber pad and the lower second elastic rubber pad are fixed on the bottom surface of the tool body by glue, respectively.
[0012] Further specifically, the tool body is provided with a front end face, a rear end face, a left end face, a right end face, a top face, and a bottom face.
[0013] Further specifically, the left elastic rubber pad, the right elastic rubber pad, the lower first elastic rubber pad, and the lower second elastic rubber pad are cuboid pads.
[0014] Further specifically, the distance between the positions of the four round holes and the four threaded holes on the product to be glued is the same, so that the screws can pass through the round holes and the threaded holes to fix the gluing tool to the base.
[0015] Further specifically, each of the legs comprises an integral column and a horizontal plate, the horizontal plate is fixed to the tool body, and the column is provided with a round hole at the center position.
[0016] Further specifically, the left elastic rubber pad, the right elastic rubber pad, the lower first elastic rubber pad, and the lower second elastic rubber pad are used to compress a certain amount during use, so that the left and right faces and the bottom face of the gluing tool can be in elastic contact with the chips of the product to be glued, ensuring that the gluing tool can reliably press against the chips without damaging the chips.
[0017] Further specifically, the product to be glued, i.e., the inertial measurement unit product, mainly comprises a base, a lower first inertial sensor chip, a left side inertial sensor chip, a front first inertial sensor chip, a front second inertial sensor chip, a right side inertial sensor chip, and a lower second inertial sensor chip.
[0018] The new design scheme has the following improvements compared with the original structure:
[0019] (1) The gluing tool base is increased with four legs, and the hole spacing on the four legs is the same as the spacing of the four M1.6 threaded holes on the product base;
[0020] (2) The left elastic rubber pad and the right elastic rubber pad are added to the left end face and the right end face of the gluing tool base, respectively, and the lower first elastic rubber pad and the lower second elastic rubber pad are added to the bottom face of the gluing tool base. After the gluing tool is installed on the product, the elastic rubber pads will be compressed by a certain amount, and the left and right faces and the bottom face of the gluing tool can be in elastic contact with the chips of the product, ensuring that the gluing tool can reliably press against the chips without damaging the chips.
[0021] By using screws to fix the gluing tool, the problem of movement of the original gluing tool during the gluing process is avoided, and the consistency of the product is improved. At the same time, the addition of elastic rubber pads to the left end face, the right end face, and the bottom face of the tool base can solve the problem of the original gluing tool not being able to tightly contact the chips when the horizontal gap and the chip gap are too large, and can also avoid the problem of the original gluing tool damaging the chips when the horizontal gap and the chip gap are too small or the interference fit is too large.
[0022] The use process of the adhesive tool is as follows:
[0023] 1. First, install the adhesive tool into the product to be adhered, ensure that the round holes on the four legs of the adhesive tool are aligned with the four threaded holes on the product base, and gently push the adhesive tool forward, so that the front of the tool is in close contact with the first and second inertial sensor chips of the product, then place the screws in the round holes on the four legs of the adhesive tool, and tighten them with a screwdriver;
[0024] 2. Apply adhesive between the first and second inertial sensor chips on the front, the left and right inertial sensor chips, and the base;
[0025] 3. After the adhesive solidifies, remove the adhesive tool.
[0026] By adopting the above technical scheme, the utility model has the beneficial effects as follows:
[0027] 1. The adhesive tool is installed on the base by screws, which can tightly fix the adhesive tool and avoid slight movement of the adhesive tool during the adhesive solidification process;
[0028] 2. The adhesive tool is fixed by screws, the operation process is simple, and the consistency of the product assembly process can be ensured;
[0029] 3. The left and right end faces and the bottom face of the adhesive tool base are provided with elastic rubber pads, which can ensure that the tool can effectively contact the chip and avoid damage to the chip. BRIEF DESCRIPTION OF DRAWINGS
[0030] Figure 1 and Figure 2 is a schematic view of the structure of the adhesive tool.
[0031] Figure 3 is a schematic view of the product to be adhered, i.e. an inertial measurement unit product.
[0032] Figure 4 is a schematic view of the leg structure.
[0033] In the diagram, 11-tool body, 12-right elastic rubber pad, 13-lower second elastic rubber pad, 14-lower first elastic rubber pad, 15-left elastic rubber pad, 16-first leg, 17-first round hole, 18-second round hole, 19-second leg, 20-third leg, 21-third round hole, 22-fourth round hole, 23-fourth leg, 24-base, 25-first threaded hole, 26-lower first inertial sensor chip, 27-left inertial sensor chip, 28-second threaded hole, 29-front first inertial sensor chip, 30-front second inertial sensor chip, 31-third threaded hole, 32-right inertial sensor chip, 33-lower second inertial sensor chip, 34-fourth threaded hole. Detailed Implementation
[0034] The present patent will be further explained and described below with reference to the accompanying drawings and embodiments. However, the scope of protection of this patent is not limited to the specific implementation methods.
[0035] First Embodiment
[0036] As attached Figure 1 , Figure 2 and Figure 4 As shown, the present invention discloses an adhesive fixture structure for a micromechanical inertial measurement unit, comprising a fixture base, a right elastic rubber pad 12, a lower second elastic rubber pad 13, a lower first elastic rubber pad 14, and a left elastic rubber pad 15. All four elastic rubber pads are rectangular parallelepipeds. The fixture base includes a fixture body 11 and four legs.
[0037] The fixture body 11 is a cuboid, with its length dimension greater than its height dimension and its height dimension greater than its width dimension; there are four legs, which are respectively set at the four corners of the fixture body 11. Each leg is an integral L-shaped structure, including a column and a crossbeam; the cross plate is fixed to the fixture body 11, and a round hole is set at the center of each column. The positions of the four round holes correspond to the four threaded holes on the product to be glued.
[0038] The left elastic rubber pad 12 and the right elastic rubber pad 15 are respectively glued to the left end face and the right end face of the tooling body 11, and the lower first elastic rubber pad 14 and the lower second elastic rubber pad 13 are respectively glued to the bottom surface of the tooling body 11.
[0039] As attached Figure 3 As shown, the inertial measurement assembly for the product to be bonded mainly includes a base 24, a lower first inertial sensor chip 26, a left-side inertial sensor chip 27, a front first inertial sensor chip 29, a front second inertial sensor chip 30, a right-side inertial sensor chip 32, and a lower second inertial sensor chip 33. The base 24 has four M1.6 threaded holes, designated as the first to fourth threaded holes.
[0040] The use process of the adhesive tool is as follows:
[0041] 1. First, install the adhesive tool into the product to be glued, ensure that the round holes on the four legs of the adhesive tool are aligned with the four threaded holes on the product base, and gently push the adhesive tool forward, so that the front of the tool is in close contact with the front of the product, and then place the M1.6 screws in the round holes on the four legs of the adhesive tool, and tighten them with a screwdriver.
[0042] 2. Apply 3M glue between the front first inertia sensor chip 29, the front second inertia sensor chip 30, the left inertia sensor chip 27, the right inertia sensor chip 32, and the base 24.
[0043] 3. After the glue is cured, remove the adhesive tool.
Claims
1. A micro-mechanical inertial measurement unit adhesive tooling, i.e. adhesive tooling, for processing an adhesive product to be used, characterized by: The tooling base body includes a tooling body and a supporting leg, the tooling body is a cuboid, the length dimension is greater than the height dimension, and the height dimension is greater than the width dimension; the supporting leg is four, which are respectively arranged at the four corners of the tooling body, and each supporting leg is an integral L-shaped structure, including a column and a crossbeam. A circular hole is arranged at the center position of the column of each supporting leg structure, and the positions of the four circular holes correspond to the four threaded holes on the product to be glued. The left elastic rubber pad and the right elastic rubber pad are fixed on the left end face and the right end face of the tooling body by glue, and the lower first elastic rubber pad and the lower second elastic rubber pad are fixed on the bottom surface of the tooling body by glue. The left elastic rubber pad, the right elastic rubber pad, the lower first elastic rubber pad and the lower second elastic rubber pad are cuboid pads.
2. The micromechanical inertial measurement unit bonding tooling of claim 1, wherein: The distances between the four circular holes and the four threaded holes on the product to be glued are the same, so that the screws can pass through the circular holes and the threaded holes to fix the gluing tool to the base.
3. The micromechanical inertial measurement unit bonding tooling of claim 1, wherein: Each supporting leg includes an integral column and a crossbeam, the crossbeam is fixed with the tooling body, and a circular hole is arranged at the center position of the column.
4. The adhesive bonding tooling for a micromachined inertial measurement unit of claim 1, wherein: The product to be glued, that is, the inertial measurement unit product, includes a base, a lower first inertial sensor chip, a left side inertial sensor chip, a front first inertial sensor chip, a front second inertial sensor chip, a right side inertial sensor chip and a lower second inertial sensor chip.
5. The adhesive bonding tooling for a micromachined inertial measurement unit of claim 1, wherein: When the micro-mechanical inertial measurement unit gluing tool is used, the left elastic rubber pad, the right elastic rubber pad, the lower first elastic rubber pad and the lower second elastic rubber pad will be compressed by a certain amount, the left and right faces and the bottom surface of the micro-mechanical inertial measurement unit gluing tool can be in elastic contact with the chips of the product to be glued through the four elastic rubber pads, so as to ensure that the gluing tool can reliably press against the chips and will not damage the chips.
6. The micromechanical inertial measurement unit adhesive bonding tooling of claim 1, wherein: