Refrigerator

Abstract

The utility model provides a refrigerator which comprises an oxygen adjusting module which comprises an electrolyte storage cavity, a first electrode and a second electrode, and the first electrode and the second electrode are located on the two opposite sides of the electrolyte storage cavity respectively. The chamber is communicated with the oxygen adjusting module so as to receive oxygen adjusting gas formed at the first electrode; and the heat dissipation piece is attached to the second electrode and exchanges heat with the second electrode. According to the refrigerator, the heat dissipation piece is arranged on the second electrode of the oxygen adjusting module, and the temperature of the second electrode is reduced through the heat dissipation piece, so that the temperature of the oxygen adjusting module is reduced, and the influence of the oxygen adjusting module on the temperature in the compartment is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of home appliances, in particular to a refrigerator. BACKGROUND

[0002] At present, the refrigerator has higher and higher preservation requirements for high-end food materials, some food materials need to be stored in a low-oxygen or high-oxygen environment, and an oxygen adjusting module is arranged in the refrigerator to adjust the oxygen content in the chamber. However, the oxygen adjusting module generates a large amount of heat during operation, which affects the temperature in the chamber.

[0003] Therefore, it is necessary to provide a refrigerator to solve the above technical problems. SUMMARY

[0004] In order to achieve the above purpose, the utility model provides a refrigerator, which comprises an oxygen adjusting module, an electrolyte storage cavity, a first electrode and a second electrode located on opposite sides of the electrolyte storage cavity respectively, a chamber, a heat dissipation member, and the oxygen adjusting module is communicated with the chamber to receive the oxygen adjusting gas formed at the first electrode.

[0005] As a further improvement of the utility model, the first electrode is located in the chamber.

[0006] As a further improvement of the utility model, it further comprises a communication cavity for communicating the oxygen adjusting module and the chamber, and the first electrode is located in the communication cavity.

[0007] As a further improvement of the utility model, the communication cavity is provided with an opening on the side away from the first electrode, and the communication cavity is communicated with the chamber through the opening.

[0008] As a further improvement of the utility model, the communication cavity is provided with an air inlet pipe and an air outlet pipe which are communicated with the chamber on the side away from the first electrode.

[0009] As a further improvement of the utility model, it further comprises a flow guide member arranged in the chamber and / or the communication cavity, and the flow guide member drives the oxygen adjusting gas in the communication cavity to flow into the chamber.

[0010] As a further improvement of the utility model, it further comprises a cooling member for dissipating heat of the air inlet pipe and / or the air outlet pipe.

[0011] As a further improvement of the utility model, the second electrode is located outside the chamber.

[0012] As a further improvement of the utility model, the second electrode is an anode.

[0013] As a further improvement of this utility model, the heat dissipation component is a heat sink or a semiconductor cooling component.

[0014] The beneficial effects of this utility model are as follows: By setting the heat dissipation component on the second electrode of the oxygen regulation module, the temperature of the second electrode is reduced by the heat dissipation component, thereby reducing the temperature of the oxygen regulation module and thus reducing the impact of the oxygen regulation module on the temperature of the room. Attached Figure Description

[0015] The accompanying drawings, which are included to provide a further understanding of the present invention and constitute a part of this invention, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0016] Figure 1 This is a schematic diagram of the oxygen regulation module of this utility model, which dissipates heat through a heat sink.

[0017] Figure 2 This is a schematic diagram of the oxygen regulation module of this utility model with heat sink.

[0018] Figure 3 This is a schematic diagram of the oxygen regulation module of this utility model, which dissipates heat through a semiconductor cooling component and a cooling fan.

[0019] Figure 4 A schematic diagram of the structure of the oxygen regulation module of this utility model, equipped with a semiconductor cooling component and a heat dissipation fan for heat dissipation;

[0020] Figure 5 A schematic diagram of the structure of the refrigerator of this utility model with the addition of a connecting cavity;

[0021] Figure 6 This utility model Figure 5 The diagram shows the structure of the oxygen regulation module with an added ventilation pipe.

[0022] Figure 7 for Figure 6 The diagram shows the structure of the oxygen regulation module-connecting cavity.

[0023] Figure 8 for Figure 6 The diagram shows the structure of the oxygen control module with added cooling components.

[0024] In the picture:

[0025] 100, Oxygen control module; 101, First electrode; 102, Second electrode; 103, Electrolyte storage chamber; 200, Chamber; 300, Heat sink; 301, Heat sink; 302, Semiconductor cooling component; 400, Connecting chamber; 401, Air outlet pipe; 402, Air inlet pipe; 500, Flow guide; 600, Cooling component. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0027] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0028] In the description of this utility model, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0029] In the description of this utility model, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "linking" should be interpreted broadly. For example, they can refer to mechanical or electrical connections, or internal connections between two components. They can be direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0030] like Figures 1 to 8 As shown, the refrigerator provided by this utility model includes an oxygen regulation module 100, a compartment 200, and a heat dissipation component 300.

[0031] The oxygen regulation module 100 is used to perform electrochemical reactions and prepare oxygen-regulated gas. The chamber 200 is connected to the oxygen regulation module 100 and receives the oxygen-regulated gas prepared by the oxygen regulation module 100. The heat sink 300 is attached to the electrode of the oxygen regulation module 100 to exchange heat with the electrode and transfer the electrode heat to the outside of the chamber 200. The heat sink 300 reduces the electrode temperature, thereby reducing the temperature of the oxygen regulation module 100 and thus reducing the influence of the oxygen regulation module 100 on the temperature inside the chamber 200.

[0032] The oxygen adjusting module 100 comprises an electrolyte storage cavity 103, electrodes in the electrolyte storage cavity 103, the electrodes comprising a first electrode 101 and a second electrode 102. The first electrode 101 and the second electrode 102 are arranged in a spaced manner, and are respectively located on opposite sides of the electrolyte storage cavity 103. The first electrode 101 and the second electrode 102 are respectively connected to an anode and a cathode of a power supply, and oxygen adjusting gas is prepared after the first electrode 101 and the second electrode 102 are powered.

[0033] After being powered, oxygen reaches the surface of the first electrode 101 connected to the cathode of the power supply, and a dissolution reaction occurs on the surface of the first electrode 101 under the action of a direct current electric field, and then a reverse reaction occurs on the second electrode 102 connected to the anode of the power supply to produce pure oxygen. The oxygen adjusting gas prepared by the oxygen adjusting module 100 is introduced into the chamber 200 connected to the oxygen adjusting module 100 to increase or decrease the oxygen content in the chamber 200.

[0034] In this embodiment, the chamber 200 receives oxygen adjusting gas from the first electrode 101 to decrease the oxygen content in the chamber 200. The second electrode 102 is located outside the chamber 200, and the heat dissipation member 300 is attached to the second electrode 102. The temperature of the second electrode 102 is lowered by the heat dissipation member 300, and the temperature of the electrolyte in the electrolyte storage cavity 103 is lowered by the second electrode 102, thereby lowering the temperature of the oxygen adjusting module 100, and further reducing the influence of the oxygen adjusting module 100 on the temperature in the chamber 200.

[0035] Of course, the chamber 200 can also receive oxygen adjusting gas from the second electrode 102 to increase the oxygen content in the chamber 200. At this time, the first electrode 101 is located outside the chamber 200, and the heat dissipation member 300 is attached to the first electrode 101. The temperature of the first electrode 101 is lowered by the heat dissipation member 300, and the temperature of the electrolyte in the electrolyte storage cavity 103 is lowered by the first electrode 101, thereby lowering the temperature of the oxygen adjusting module 100, and further reducing the influence of the oxygen adjusting module 100 on the temperature in the chamber 200.

[0036] The first electrode 101 or the second electrode 102 located outside the chamber 200 is used for heat dissipation, and heat is transferred to the outside of the chamber 200 through the heat dissipation member 300, so that the temperature of the oxygen adjusting module 100 can be effectively lowered, and the influence of the heat generated by the operation of the oxygen adjusting module 100 on the temperature in the chamber 200 can be reduced.

[0037] Referring toFigures 1 to 4 In one embodiment, the first electrode 101 is located in the chamber 200. Oxygen in the chamber 200 participates in the reduction reaction at the location of the first electrode 101, thereby gradually consuming the oxygen in the chamber 200. The oxidation reaction occurs at the second electrode 102 located outside the chamber 200, generating oxygen.

[0038] During the electrochemical reaction in the oxygen regulating module 100, the temperature of the electrolyte in the electrolyte storage cavity 103 gradually rises, thereby increasing the temperature of the entire oxygen regulating module 100. Thus, heat is transferred from the first electrode 101 to the chamber 200, causing the temperature of the chamber 200 to rise. By providing the heat dissipation member 300 at the second electrode 102, heat from the electrolyte in the electrolyte storage cavity 103 is transferred from the second electrode 102 to the outside of the chamber 200 through the heat dissipation member 300, thereby effectively reducing the temperature of the oxygen regulating module 100 and preventing large fluctuations in the temperature of the chamber 200 during oxygen regulation.

[0039] Referring to Figure 1 and Figure 2 , the heat dissipation member 300 is a heat sink 301 that is attached to the second electrode 102. The second electrode 102 transfers heat to the heat sink 301, which can increase the heat exchange area between the second electrode 102 and the air outside the chamber 200, thereby accelerating the reduction of the temperature of the oxygen regulating module 100 and reducing the impact of the oxygen regulating module 100 on the temperature of the chamber 200.

[0040] The heat sink 301 can also be combined with a heat dissipation fan to accelerate air flow at the heat sink 301, thereby further improving the heat dissipation efficiency of the heat sink 301.

[0041] In this embodiment, the connection method of the heat sink 301 and the second electrode 102 is not specifically limited, and they can be directly connected or indirectly connected, as long as the second electrode 102 can transfer heat to the heat sink 301.

[0042] Referring to Figure 3 and Figure 4 , the heat dissipation member 300 is a semiconductor cooling member 302 combined with a heat dissipation fan. The semiconductor cooling member 302 includes a cold end and a hot end, the cold end of the semiconductor cooling member 302 is in contact with the second electrode 102, and the hot end of the semiconductor cooling member 302 is provided with a heat dissipation fan. The semiconductor cooling member 302 transfers cold energy to the second electrode 102 through the cold end to cool the second electrode 102, thereby reducing the temperature of the oxygen regulating module 100.

[0043] Referring to Figure 5 In another embodiment, the oxygen regulating module further comprises a communicating cavity 400 for communicating the oxygen regulating module 100 and the chamber 200, and the first electrode 101 is located in the communicating cavity 400.

[0044] The communicating cavity 400 is provided with an opening on the side away from the first electrode 101, and the communicating cavity 400 communicates with the chamber 200 through the opening. Air flows between the chamber 200 and the communicating cavity 400, and oxygen in the air in the communicating cavity 400 participates in the reduction reaction at the position of the first electrode 101, thereby gradually consuming the oxygen in the chamber 200 and the communicating cavity 400. The oxidation reaction occurs at the second electrode 102 located outside the chamber 200 to generate oxygen.

[0045] As in the previous embodiment, during the electrochemical reaction of the oxygen regulating module 100, the temperature of the electrolyte in the electrolyte storage cavity 103 gradually rises, thereby raising the temperature of the entire oxygen regulating module 100. By providing the heat dissipation member 300 at the second electrode 102, the temperature of the oxygen regulating module 100 is effectively reduced, preventing large fluctuations in the temperature in the chamber 200 during oxygen regulation. The heat dissipation member 300 can be selected from the heat dissipation fin 301 or the semiconductor cooling member 302 in combination with a cooling fan.

[0046] In this embodiment, the communicating cavity 400 can also be cooled. It can be understood that, since the first electrode 101 is located in the communicating cavity 400, part of the heat of the electrolyte is transferred from the first electrode 101 to the communicating cavity 400. By cooling the communicating cavity 400, the temperature of the oxygen regulating gas in the communicating cavity 400 is reduced, preventing the oxygen regulating gas from flowing into the chamber 200 and affecting the temperature in the chamber 200. The communicating cavity 400 can also be cooled by the heat dissipation member 300.

[0047] Referring to Figure 6 and Figure 8 On the basis of the embodiment shown in Figure 5 The communicating cavity 400 comprises an air inlet pipe 401 and an air outlet pipe 402 for communicating with the chamber 200. Air in the chamber 200 flows into the communicating cavity 400 from the air inlet pipe 401, and oxygen in the air flowing into the communicating cavity 400 participates in the reduction reaction at the position of the first electrode 101, thereby reducing the oxygen content in the communicating cavity 400. The low-oxygen air in the communicating cavity 400 flows into the chamber 200 from the air outlet pipe 402, thereby reducing the oxygen content in the chamber 200.

[0048] The flow guide 500 is arranged in the communicating cavity 400 and faces the air outlet pipe 402 to guide the oxygen-regulating gas in the communicating cavity 400 to the chamber 200. The flow guide 500 accelerates the air flow between the chamber 200 and the communicating cavity 400, thereby accelerating the regulation of the oxygen content in the chamber 200.

[0049] In the embodiment, the flow guide 500 is arranged in the communicating cavity 400 and faces the air outlet pipe 402 to guide the oxygen-regulating gas in the communicating cavity 400 to the chamber 200. The flow guide 500 is a flow guide fan.

[0050] With reference to Figure 8 In some embodiments, the refrigerator further comprises a cooling member 600 for cooling the air inlet pipe 401 and / or the air outlet pipe 402. The cooling member 600 cools the air inlet pipe 401 and / or the air outlet pipe 402, thereby reducing the temperature of the air in the air inlet pipe 401 and / or the air outlet pipe 402, and further reducing the influence of the air circulation between the chamber 200 and the communicating cavity 400 on the temperature in the chamber 200. The cooling member 600 can be arranged as the heat dissipation member 300, or a fan can be used to cool the air inlet pipe 401 and / or the air outlet pipe 402.

[0051] In summary, the heat dissipation member 300 is arranged on the second electrode of the oxygen-regulating module 100, the temperature of the second electrode is reduced by the heat dissipation member 300, thereby reducing the temperature of the oxygen-regulating module 100, and further reducing the influence of the oxygen-regulating module 100 on the temperature in the chamber 200.

[0052] It should be understood that although the present specification is described in terms of embodiments, each embodiment does not necessarily contain only one independent technical solution, and the description of the specification is only for the sake of clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0053] The above series of detailed descriptions are only specific descriptions of feasible embodiments of the present application, and are not intended to limit the scope of protection of the present application. Any equivalent embodiments or modifications made without departing from the spirit of the present application should be included in the scope of protection of the present application.

Claims

1. A refrigerator characterized by comprising: The application relates to an oxygen regulating module and an oxygen regulating device. The oxygen regulating module (100) comprises an electrolyte storage cavity (103) and a first electrode (101) and a second electrode (102) located at opposite sides of the electrolyte storage cavity (103) respectively. The chamber (200) is connected with the oxygen regulating module (100) to receive oxygen regulating gas formed at the first electrode (101). The heat dissipation member (300) is attached to the second electrode (102) and exchanges heat with the second electrode (102).

2. The refrigerator according to claim 1, characterized in that: The first electrode (101) is located in the chamber (200).

3. The refrigerator according to claim 1, characterized in that: The oxygen regulating module (100) and the chamber (200) are connected through a communication cavity (400), and the first electrode (101) is located in the communication cavity (400).

4. The refrigerator according to claim 3, characterized in that: An opening is arranged on the side of the communication cavity (400) away from the first electrode (101), and the communication cavity (400) is connected with the chamber (200) through the opening.

5. The refrigerator according to claim 3, characterized in that: An air inlet pipe (401) and an air outlet pipe (402) are arranged on the side of the communication cavity (400) away from the first electrode (101) and connected with the chamber (200).

6. The refrigerator according to claim 4 or 5, characterized in that: A flow guide member (500) is arranged in the chamber (200) and / or the communication cavity (400), and the flow guide member (500) drives the oxygen regulating gas in the communication cavity (400) to flow into the chamber (200).

7. The refrigerator according to claim 5, characterized in that: A cooling member (600) is arranged to dissipate heat of the air inlet pipe (401) and / or the air outlet pipe (402).

8. The refrigerator according to claim 1, characterized in that: The second electrode (102) is located outside the chamber (200).

9. The refrigerator according to claim 1, characterized in that: The second electrode (102) is an anode.

10. The refrigerator according to claim 1, characterized in that: The heat dissipation member (300) is a heat dissipation fin (301) or a semiconductor cooling member (302).

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