Gallium arsenide polished wafer sample thickness measuring tool

Abstract

The utility model discloses a gallium arsenide polished section sample thickness measuring tool, and particularly relates to the technical field of thickness measurement, the gallium arsenide polished section sample thickness measuring tool comprises a supporting table, and the top of the supporting table is provided with a detection assembly used for measuring the thickness of a gallium arsenide polished section sample; the detection assembly comprises a top plate arranged at the top of the supporting table, a groove is formed in the top of the top plate, and an embedded plate is arranged in the groove. According to the utility model, the counterweight plate is lifted to be separated from the measuring table, so that a gallium arsenide polished section sample can be conveniently placed on the measuring table, and then the counterweight plate freely falls to be in contact with the gallium arsenide polished section sample and is supported by the gallium arsenide polished section sample to rise; and the supporting column moving along with the connecting column and the counterweight plate can drive the beacon to move along the graduated scale, so that the effect of measuring the thickness of the gallium arsenide polished wafer sample can be realized, the overall structure is simple, the operation is convenient, the measuring efficiency can be effectively improved, and the use cost and the maintenance cost can be effectively reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to thickness measurement technical field more specifically, it is a kind of gallium arsenide polished wafer sample thickness measurement tool. BACKGROUND

[0002] Gallium arsenide polished wafer sample is an important material for manufacturing high-performance electronic devices, and is an important semiconductor material, with zinc blende lattice structure, belongs to the compound of Ⅲ-Ⅴ group, mainly used for manufacturing integrated circuit substrate, infrared detector and gamma photon detector etc., gallium arsenide polished wafer sample is a kind of material with important application value and technical advantage.Its high resistivity, wide band gap width etc.

[0003] Gallium arsenide polished processing needs to measure the thickness of polished wafer sample after polishing to ensure the quality of pass, as shown in the prior art of announcement number CN213301042U, although, the prior art is by sample horizontal placement from front to rear by fixed wheel and movable wheel contact point sliding, fixed wheel and movable wheel occur rolling and movable wheel is extruded by sample and thus moves up to push measurement assembly whole up, limit rod fixed on measurement assembly upper surface moves up to drive connecting block to move up and thus make conversion rod left end move up, cause conversion rod right end right move to make rack plate move right and thus make first wheel clockwise rotate to drive second gear counterclockwise rotate, since the diameter of first gear is greater than the diameter of second gear, second gear rotation makes rotating shaft rotate to drive pointer deflection, that is, the thickness measurement value of polished wafer can be amplified.But, the technical scheme needs to measure the direction by the meshing transmission of rack plate, first gear and second gear, and the structure is relatively complex, and also increases the cost and maintenance cost. UTILITY MODEL CONTENTS

[0004] In order to overcome the above-mentioned defects of the prior art, the utility model provides a gallium arsenide polished wafer sample thickness measurement tool, which separates the counterweight plate from the measuring table by lifting, which can facilitate the placement of the gallium arsenide polished wafer sample on the measuring table, and then the counterweight plate freely falls and contacts the gallium arsenide polished wafer sample for thickness measurement. The structure is simple and easy to operate, which can effectively improve the measurement efficiency and reduce the use cost and maintenance cost, to solve the problems in the above background technology.

[0005] To achieve the above object, the utility model provides the following technical scheme: a gallium arsenide polished wafer sample thickness measurement tool, comprising a support table, the support table top is equipped with the detection assembly for measuring the thickness of gallium arsenide polished wafer sample;

[0006] The detection assembly comprises a top plate arranged on the top of the support table, a recess is formed in the top of the top plate, a panel is arranged in the recess, a connecting column is arranged on the bottom of the panel, the bottom end of the connecting column extends to the bottom of the top plate and a counterweight plate is arranged on the bottom end of the connecting column, a measuring table for placing a gallium arsenide polished sample is arranged on the bottom of the counterweight plate, and the measuring table is arranged on the top of the support table.

[0007] A support column is arranged on one side of the bottom end of the connecting column, and a pointing mark is arranged on the end of the support column away from the connecting column, a scale is arranged on the rear side of the pointing mark, and a support seat for connecting the support table is arranged on the bottom of the scale.

[0008] In a preferred embodiment, the counterweight plate is provided with a fixing plate on both sides, and a fixing column is arranged on the bottom of both ends of the fixing plate, the bottom end of the fixing column is fixed to the top of the support table, and the top end of the fixing column penetrates the fixing plate and is fixed to the bottom of the top plate.

[0009] In a preferred embodiment, a protective cylinder is arranged on the top of the top plate, and the protective cylinder is arranged above and below the recess.

[0010] In a preferred embodiment, a handle for lifting the connecting column is arranged on the side of the bottom end of the connecting column away from the support column.

[0011] In a preferred embodiment, a functional box for storing is arranged on the front side of the support table.

[0012] In a preferred embodiment, a plurality of supporting legs are arranged on the bottom of the support table, and the supporting legs are evenly distributed.

[0013] The technical effects and advantages of the present application are as follows:

[0014] The counterweight plate and the measuring table are separated by lifting, which facilitates the placement of the gallium arsenide polished sample on the measuring table, and then the counterweight plate freely falls and contacts the gallium arsenide polished sample, and is supported and lifted by the gallium arsenide polished sample, the support column moving together with the connecting column and the counterweight plate can drive the pointing mark to move along the scale, thereby achieving the effect of measuring the thickness of the gallium arsenide polished sample, and the overall structure is simple, convenient to operate, and can effectively improve the measurement efficiency and reduce the use and maintenance costs. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 The overall structure of the present application is shown in the figure;

[0016] Figure 2 The top plate side view of the present application is shown in the figure;

[0017] Figure 3 The top plate side view of the present application is shown in the figure; Figure 2Enlarged view of part A;

[0018] Figure 4 The schematic view of the counterweight plate after adjustment of the utility model;

[0019] Figure 5 The recess top view of the utility model.

[0020] The figure signs are: 1, support table; 2, top plate; 3, recess; 4, panel; 5, connecting column; 6, counterweight plate; 7, measuring table; 8, support column; 9, pointing mark; 10, scale; 11, support seat; 12, fixed plate; 13, fixed column; 14, protection cylinder; 15, handle; 16, function box; 17, supporting leg. DETAILED DESCRIPTION

[0021] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skill in the art without creative labor belong to the protection scope of the utility model.

[0022] Referring to the drawings in the description Figures 1-5 The utility model provides a kind of gallium arsenide polished piece sample thickness measurement tool, including support table 1, the support table 1 top is equipped with the detection assembly for measuring gallium arsenide polished piece sample thickness;

[0023] As Figures 1-4 Indicated, the detection assembly includes top plate 2 being equipped in support table 1 top, recess 3 is opened in the top plate 2 top, the recess 3 inside is equipped with panel 4, connecting column 5 is installed in the panel 4 bottom, and connecting column 5 bottom end extends to top plate 2 bottom and is installed with counterweight plate 6, the counterweight plate 6 bottom is equipped with the measuring table 7 for placing gallium arsenide polished sample, and the measuring table 7 is installed in support table 1 top;Connecting column 5 bottom end one side is installed with support column 8, and support column 8 is installed with pointing mark 9 in the end away from connecting column 5, the pointing mark 9 rear side is equipped with scale 10, and scale 10 bottom is installed with support seat 11 for connecting support table 1, and because connecting column 5 bottom end is installed with handle 15 for lifting connecting column 5 in the side away from support column 8, so that staff operates handle 15 to drive connecting column 5 and counterweight plate 6 to move up, so it can improve the convenience of staff operating counterweight plate 6.

[0024] The staff operates the handle 15 to drive the counterweight plate 6 on the connecting column 5 to move upwards, so that the gallium arsenide polished wafer sample can be placed on the measuring table 7, and then the counterweight plate 6 freely falls and contacts the gallium arsenide polished wafer sample; the gallium arsenide polished wafer sample blocks the upward displacement of the counterweight plate 6; the support column 8 moving together with the connecting column 5 and the counterweight plate 6 can drive the pointer 9 to move along the scale 10; the displacement distance of the pointer 9 is equivalent to the thickness of the gallium arsenide polished wafer sample; thus, the thickness of the gallium arsenide polished wafer sample can be measured; the whole structure is simple, convenient to operate, can effectively improve the measuring efficiency and reduce the use cost and maintenance cost.

[0025] In order to prevent the counterweight plate 6 from deviating during displacement, the counterweight plate 6 needs to be positioned and guided, as shown in Figure 1 , 2 and 4, the counterweight plate 6 is provided with a fixed plate 12 on both sides, and the fixed plate 12 is provided with a fixed column 13 at the bottom of the front and rear ends; the bottom end of the fixed column 13 is fixed to the top of the support table 1; the top end of the fixed column 13 penetrates through the fixed plate 12 and is fixed to the bottom of the top plate 2; through the cooperation of the fixed column 13 and the fixed plate 12, the counterweight plate 6 can be positioned in multiple directions, so as to ensure the stability of the counterweight plate 6 during displacement and prevent the counterweight plate 6 from deviating during displacement, thereby improving the accuracy of measuring the thickness of the gallium arsenide polished wafer sample.

[0026] In use, in order to prevent dust and other impurities from accumulating in the groove 3, the groove 3 needs to be protected, as shown in Figure 1 , 2 and 4, the top plate 2 is provided with a protection cylinder 14 on the top, and the protection cylinder 14 corresponds to the position of the groove 3 in up and down directions; the protection cylinder 14 blocks dust and impurities, preventing dust and other impurities from accumulating in the groove 3; in this way, the accumulation of dust can be avoided, which causes the panel 4 to not be completely fitted with the groove 3; when the panel 4 cannot be completely fitted with the groove 3, the pointer 9 will not be at the initial position of the scale line, which will affect the measuring accuracy; the utility model can avoid the above problems.

[0027] In order to facilitate the taking of measuring tools, as shown in Figure 1 and 4 , the support table 1 is provided with a functional box 16 for storing on the front side; the tools needed during measurement are stored in the functional box 16, so as to facilitate the taking of the tools by the staff and avoid the disorderly placement of the tools affecting the measuring efficiency.

[0028] In order to ensure the stability and support strength of the support table 1, the support table 1 needs to be supported and fixed, as shown in Figure 1 and 4As shown, the bottom of the support table 1 is provided with a plurality of supporting legs 17, which are evenly distributed between the supporting legs 17, and the support table 1 is supported by the supporting legs 17, so that the stability of the support table 1 can be ensured, and the supporting strength of the support table 1 is improved.

[0029] Finally: the above only for the preferred embodiments of the present application and not for limiting the present application, any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A gallium arsenide polished wafer sample thickness measurement tool comprising a support table (1) characterised in that: The support table (1) top is equipped with a detection assembly for measuring the thickness of the gallium arsenide polished sample; The detection assembly includes a top plate (2) arranged on the top of the support table (1), a recess (3) is formed on the top of the top plate (2), and a panel (4) is arranged in the recess (3); the bottom of the panel (4) is provided with a connecting column (5), the bottom end of the connecting column (5) extends to the bottom of the top plate (2) and is provided with a counterweight plate (6), the bottom of the counterweight plate (6) is provided with a measuring table (7) for placing the gallium arsenide polished sample, and the measuring table (7) is arranged on the top of the support table (1); The bottom end of the connecting column (5) is provided with a support column (8) on one side, and the end of the support column (8) away from the connecting column (5) is provided with a pointing mark (9), the rear side of the pointing mark (9) is provided with a scale (10), and the bottom of the scale (10) is provided with a support seat (11) for connecting the support table (1).

2. A GaAs polished wafer sample thickness measurement fixture as defined in claim 1, wherein: The counterweight plate (6) is provided with a fixed plate (12) on both sides, and the fixed plate (12) is provided with a fixed column (13) on the bottom of the front and rear ends, the bottom end of the fixed column (13) is fixed with the top of the support table (1), and the top end of the fixed column (13) penetrates through the fixed plate (12) and is fixed with the bottom of the top plate (2).

3. A GaAs polished wafer sample thickness measurement fixture as defined in claim 1, wherein: The top plate (2) is provided with a protective cylinder (14) on the top, and the protective cylinder (14) is opposite to the position of the recess (3) in up and down direction.

4. A GaAs polished wafer sample thickness measurement fixture as defined in claim 1, wherein: The bottom end of the connecting column (5) is provided with a handle (15) on the side away from the support column (8) for lifting the connecting column (5).

5. A GaAs polished wafer sample thickness measurement fixture as defined in claim 1, wherein: The front side of the support table (1) is provided with a functional box (16) for storing.

6. A GaAs polished wafer sample thickness measurement fixture as defined in claim 1, wherein: The bottom of the support table (1) is provided with a plurality of supporting legs (17) which are evenly distributed.

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