Aging fixture suitable for SMD (Surface Mount Device) shell

Abstract

The utility model relates to an aging clamp suitable for an SMD shell, and belongs to the field of aging tests. Comprising a radiator, an aging test board, a probe seat, a plurality of probes and a plurality of pressing buckles, the radiator is installed on the aging test board, the probe seat is installed at the bottom end of the radiator, the probes are installed on the probe seat, a plurality of SMD shells are installed on the radiator, the pressing buckles are installed on the radiator, and the pressing buckles are installed on the radiator. And the top end of the SMD shell is crimped with the top end of the SMD shell. According to the utility model, the SMD shells with different sizes can be clamped and fixed, and the aging test can be carried out on the SMD shells.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of burn -in test, especially suitable for SMD shell's burn -in clamp. BACKGROUND

[0002] Burn -in test is a kind of reliability test method of accelerating circuit or component early failure, by the stress higher than normal use condition to circuit or component long time work, to induce potential defect, to accelerate its failure process.The main purpose of burn -in test is to screen out those possible early failure of product under normal use condition, improve the overall reliability of product.For SMD (Surface Mounted Devices) such small size surface mount shell, the conventional burn -in clamp needs to open mould customizing separately, high cost, and the clamp structure is complex, occupies large space, and is inconvenient to use, is not suitable for burn -in test to large quantities of products. UTILITY MODEL CONTENT

[0003] The utility model solves the technical problems that provide a kind of burn -in clamp suitable for SMD shell to solve the above problems.

[0004] The utility model solves the technical problems that provide a kind of burn -in clamp suitable for SMD shell to solve the above problems.

[0005] The utility model has the advantages that multiple different sizes SMD shell are installed on radiator, and are pressed and mounted using press buckle, it is favorable to the clamping and fixing of multiple different sizes SMD shell, and cooperate with probe to carry out burn -in test to SMD shell.

[0006] On the basis of the above technical scheme, the utility model can also be improved as follows.

[0007] Further, the top end side of the radiator is provided with a plurality of clamping grooves, and a plurality of SMD shells are one-to-one correspondingly fitted and installed in the clamping grooves, and the bottom end of the SMD shell is flatly arranged with the bottom surface of the clamping groove.

[0008] The beneficial effects of the above further scheme are that the bottom end of the SMD shell is flatly arranged with the bottom surface of the clamping groove, which is conducive to connecting the output pole of the SMD shell with the clamping groove, and thus the entire radiator serves as the output pole of the SMD shell.

[0009] Further, two cantilevers are arranged on both sides of the clamping groove in one-to-one correspondence, and two first probe seat fastening holes are arranged on the two cantilevers in one-to-one correspondence, the first probe seat fastening hole is a through hole, and the probe seat is arranged at the bottom end of the cantilever.

[0010] The beneficial effect of the above further scheme is that the cantilever is conducive to the installation of the probe seat, and the probe arranged on the probe seat is in abutment with the input pole of the SMD shell.

[0011] Further, the probe seat comprises a probe mounting seat and two fixed flange seats, the two fixed flange seats are arranged at both ends of the probe mounting seat in one-to-one correspondence, and a second probe seat fastening hole is arranged on each of the two fixed flange seats, the second probe seat fastening hole is a through hole coaxially arranged below the first probe seat fastening hole.

[0012] The beneficial effect of the above further scheme is that the fixed flange seat is conducive to spacing the probe mounting seat and the bottom end of the heat sink by a certain distance, thereby providing space for the installation of the probe.

[0013] Further, two probe seat fastening bolts are further included, the probe seat fastening bolts pass through the second probe seat fastening hole and the first probe seat fastening hole and are threadedly connected with the second probe seat fastening hole and the first probe seat fastening hole.

[0014] The beneficial effect of the above further scheme is that the probe seat fastening bolt is conducive to fixing the probe seat at the bottom end of the heat sink.

[0015] Further, a plurality of probe mounting holes are arranged on the probe mounting seat, the probe mounting hole is a through hole, and a plurality of probes pass through the plurality of probe mounting holes in one-to-one correspondence.

[0016] The beneficial effect of the above further scheme is that the probe mounting hole is conducive to hanging the probe on the probe mounting seat.

[0017] Further, the probe comprises a needle sleeve, a probe head, a shoulder, a welding cup and an inner spring, the needle sleeve is sleeved on the probe head, the inner spring is arranged in the needle sleeve and connected with the bottom end of the probe head, the shoulder is arranged on the upper end sidewall of the needle sleeve, the shoulder is arranged above the probe mounting hole and in abutment with the probe mounting seat, and the welding cup is arranged at the bottom end of the needle sleeve.

[0018] The beneficial effect of the above further scheme is that the inner spring is conducive to providing cushioning for the adjustment of the probe head in the needle sleeve, the shoulder is conducive to preventing the needle sleeve from falling off the probe mounting hole, and the welding cup is conducive to connecting with the burn-in test board through a welding cable to realize the test on the SMD shell.

[0019] Further, the top end of the heat sink is also provided with a plurality of buckle mounting holes, and a plurality of buckles are installed in the plurality of buckle mounting holes one by one.

[0020] The beneficial effect of the above further scheme is that the buckle mounting hole is beneficial to install the buckle around the clamping groove, and then press the SMD shell tightly after the SMD shell is installed in the clamping groove.

[0021] Further, the buckle comprises a buckle seat, a connecting seat, an adjusting screw and an adjusting spring, the buckle seat is vertically arranged at one end of the connecting seat and is in pressure connection with the top end of the SMD shell, the adjusting spring is sleeved on the adjusting screw, the adjusting screw passes through the connecting seat and is in threaded connection with the buckle mounting hole.

[0022] The beneficial effect of the above further scheme is that the vertical arrangement of the buckle seat is beneficial to exert vertical downward pressure on the SMD shell in the clamping groove, and the adjusting screw and the adjusting spring are beneficial to facilitate the upward lifting of the buckle seat and the connecting seat while locking and fixing the buckle seat and the connecting seat, thereby adjusting the position of the buckle seat and the connecting seat and realizing the pressing and loosening of the SMD shell.

[0023] Further, a plurality of heat sink fastening bolts are further included, the top end of the heat sink is further provided with a plurality of fastening holes, and the plurality of heat sink fastening bolts pass through the plurality of fastening holes one by one and are connected with nuts.

[0024] The beneficial effect of the above further scheme is that the heat sink fastening bolt is beneficial to fix the heat sink on the burn-in test board. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 An overall structure explosion map is provided for the embodiment of the utility model;

[0026] Figure 2 An overall structure top view is provided for the embodiment of the utility model;

[0027] Figure 3 An overall structure side view is provided for the embodiment of the utility model;

[0028] Figure 4 A structure schematic view of the heat sink is provided for the embodiment of the utility model;

[0029] Figure 5 A structure schematic view of the probe seat is provided for the embodiment of the utility model;

[0030] Figure 6 A structure schematic view of the probe is provided for the embodiment of the utility model;

[0031] Figure 7This is a schematic diagram of the buckle structure provided in an embodiment of the present utility model.

[0032] The attached diagram lists the components represented by each number as follows:

[0033] 1. Heat sink; 2. Aged test board; 3. Probe holder; 4. Probe; 5. Clamp; 6. SMD housing; 7. Heat sink fastening bolt; 8. Probe holder fastening bolt; 11. Clamping slot; 12. Cantilever; 13. Clamp mounting hole; 14. Fastening hole; 15. First probe holder fastening hole; 31. Probe mounting seat; 32. Fixed flange seat; 33. Probe mounting hole; 34. Second probe holder fastening hole; 41. Needle sleeve; 42. Probe head; 43. Shoulder; 44. Welding cup; 51. Clamp seat; 52. Connecting seat; 53. Adjusting screw; 54. Adjusting spring. Detailed Implementation

[0034] The principles and features of this utility model are described below. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0035] like Figures 1 to 3 As shown, a aging fixture suitable for SMD housings includes: a heat sink 1, an aging test board 2, a probe holder 3, multiple probes 4, and multiple snap fasteners 5. The heat sink 1 is mounted on the aging test board 2, the probe holder 3 is mounted on the bottom end of the heat sink 1, the probes 4 are mounted on the probe holder 3, multiple SMD housings 6 are mounted on the heat sink 1, and the snap fasteners 5 are mounted on the heat sink 1 and pressed against the top end of the SMD housings 6.

[0036] It should be noted that the multiple probes 4 are divided into three groups according to their required overcurrent capability. Each group consists of probes with large overcurrent capability and probes with small overcurrent capability.

[0037] The beneficial effects of this utility model are: it allows for the installation of various SMD shells of different sizes on the heat sink, and the use of snap fasteners for clamping and fixing of various SMD shells of different sizes, and the use of probes to perform aging tests on the SMD shells.

[0038] Preferred, such as Figure 4 As shown, the top side of the heat sink 1 is provided with a plurality of clamping slots 11, and a plurality of SMD shells 6 are fitted into the plurality of clamping slots 11 in a corresponding manner. The bottom end of the SMD shell 6 is flush with the bottom surface of the clamping slot 11.

[0039] The advantages of adopting the above preferred solution are: the bottom end of the SMD housing is flush with the bottom surface of the mounting slot, which facilitates the connection between the output electrode of the SMD housing and the mounting slot, thereby making the entire heat sink serve as the output electrode of the SMD housing.

[0040] Preferred, such as Figure 4 As shown, two cantilever arms 12 are provided on both sides of the clamping groove 11, and two first probe seat fastening holes 15 are provided on the two cantilever arms 12. The first probe seat fastening holes 15 are through holes, and the probe seat 3 is located at the bottom end of the cantilever arm 12.

[0041] The advantages of adopting the above preferred solution are: the cantilever facilitates the installation of the probe holder and makes the probe set on the probe holder abut against the input pole of the SMD housing.

[0042] Preferred, such as Figure 5 As shown, the probe holder 3 includes a probe mounting base 31 and two fixed flange seats 32. The two fixed flange seats 32 are respectively arranged at both ends of the probe mounting base 31. Each of the two fixed flange seats 32 is provided with a second probe holder fastening hole 34. The second probe holder fastening hole 34 is a through hole coaxially arranged below the first probe holder fastening hole 15.

[0043] The advantages of adopting the above preferred solution are: the fixed flange seat helps to separate the probe mounting base and the bottom of the heat sink by a certain distance, thereby providing space for the probe installation.

[0044] Preferred, such as Figure 1 As shown, it also includes two probe seat fastening bolts 8, which pass through the second probe seat fastening hole 34 and the first probe seat fastening hole 15, and are threadedly connected to the second probe seat fastening hole 34 and the first probe seat fastening hole 15.

[0045] The advantage of adopting the above preferred solution is that the probe holder fastening bolts help to fix the probe holder to the bottom of the heat sink.

[0046] Preferred, such as Figure 5 As shown, the probe mounting base 31 is provided with a plurality of probe mounting holes 33, which are through holes, and the plurality of probes 4 pass through the plurality of probe mounting holes 33 one by one.

[0047] The advantage of adopting the above preferred solution is that the probe mounting hole facilitates hanging the probe on the probe mounting base.

[0048] Preferred, such as Figure 6As shown, the probe 4 comprises: a needle sleeve 41, a probe head 42, a shoulder 43, a welding cup 44 and an inner spring, the needle sleeve 41 is sleeved on the probe head 42, the inner spring is arranged in the needle sleeve 41 and connected with the bottom end of the probe head 42, the shoulder 43 is arranged on the upper end side wall of the needle sleeve 41, the shoulder 43 is arranged above the probe mounting hole 33 and abuts against the probe mounting seat 31, and the welding cup 44 is arranged at the bottom end of the needle sleeve 41.

[0049] It should be noted that in the technical scheme of the utility model, as shown in Figure 1 and Figure 2 As shown, the heat sink 1 is fixed on the aging test board 2, and the hole is not completely covered after the heat sink 1 is fixed on the aging test board 2, the welding cup 44 is connected with the top surface of the aging test board 2 through the welding cable, and therefore the welding cable can pass through the hole on the aging test board 2.

[0050] The beneficial effects of the above preferred scheme are that the inner spring is conducive to the adjustment of the probe head in the needle sleeve, the shoulder is conducive to preventing the needle sleeve from falling off from the probe mounting hole, and the welding cup is conducive to connecting with the aging test board through the welding cable to realize the test on the SMD shell.

[0051] Preferably, as shown in Figure 4 As shown, the top end of the heat sink 1 is further provided with a plurality of press buckle mounting holes 13, and a plurality of press buckles 5 are installed in the plurality of press buckle mounting holes 13 one by one.

[0052] The beneficial effects of the above preferred scheme are that the press buckle mounting hole is conducive to installing the press buckle around the clamping groove, and then the SMD shell is pressed tightly after being adaptively installed in the clamping groove.

[0053] Preferably, as shown in Figure 7 As shown, the press buckle 5 comprises: a press buckle seat 51, a connecting seat 52, an adjusting screw 53 and an adjusting spring 54; the press buckle seat 51 is vertically arranged at one end of the connecting seat 52 and is in pressure connection with the top end of the SMD shell 6, the adjusting spring 54 is sleeved on the adjusting screw 53, and the adjusting screw 53 passes through the connecting seat 52 and is in threaded connection with the press buckle mounting hole 13.

[0054] The beneficial effects of the above preferred scheme are that the vertical arrangement of the press buckle seat is conducive to exerting vertical downward pressure on the SMD shell in the clamping groove, the adjusting screw and the adjusting spring are conducive to locking and fixing the press buckle seat and the connecting seat while facilitating the upward lifting of the press buckle seat and the connecting seat, thereby adjusting the position of the press buckle seat and the connecting seat and realizing the pressing and loosening of the SMD shell.

[0055] Preferably, as shown in Figure 1As shown, the heat sink 1 is further provided with a plurality of fastening holes 14 at the top end thereof, and a plurality of heat sink fastening bolts 7 are correspondingly arranged through the fastening holes 14 and connected with nuts.

[0056] The heat sink fastening bolt is beneficial to fixing the heat sink on the burn-in test board.

[0057] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0058] In addition, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0059] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication or interaction relationship of two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0060] In the present application, unless otherwise specifically defined and limited, the first feature "on" or "under" the second feature can be direct contact between the first and second features, or indirect contact between the first and second features through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0061] In the description of the present specification, the description referring to the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. Furthermore, the person skilled in the art can combine and combine the different embodiments or examples described in the present specification and the features of the different embodiments or examples, without contradiction.

[0062] Although the embodiments of the present application have been shown and described above, it is understood that the above-described embodiments are exemplary and are not to be construed as limiting the present application, and the person skilled in the art can make changes, modifications, replacements and variations to the above-described embodiments within the scope of the present application.

Claims

1. Burn-in fixture suitable for SMD housings, characterized in that, It includes: The heat sink (1), the burn-in test board (2), the probe seat (3), a plurality of probes (4) and a plurality of pressure buckles (5), the heat sink (1) is installed on the burn-in test board (2), the probe seat (3) is installed at the bottom end of the heat sink (1), the probe (4) is installed on the probe seat (3), a plurality of SMD shells (6) are installed on the heat sink (1), and the pressure buckle (5) is installed on the heat sink (1) and is pressure welded with the top end of the SMD shell (6).

2. Burn-in fixture for SMD housings according to claim 1, characterized in that The top side of the heat sink (1) is provided with a plurality of clamping grooves (11), and a plurality of SMD shells (6) are correspondingly and adaptively installed in the plurality of clamping grooves (11), and the bottom end of the SMD shell (6) is flush with the bottom surface of the clamping groove (11).

3. Burn-in fixture for SMD housings according to claim 2, characterized in that Both sides of the clamping groove (11) are correspondingly provided with two cantilevers (12), and two first probe seat fastening holes (15) are correspondingly provided on the two cantilevers (12), the first probe seat fastening hole (15) is a through hole, and the probe seat (3) is arranged at the bottom end of the cantilever (12).

4. Burn-in fixture for SMD housings according to claim 3, characterized in that The probe seat (3) includes a probe mounting seat (31) and two fixed flange seats (32), the two fixed flange seats (32) are correspondingly arranged at both ends of the probe mounting seat (31), and the two fixed flange seats (32) are both provided with a second probe seat fastening hole (34), and the second probe seat fastening hole (34) is a through hole coaxially arranged below the first probe seat fastening hole (15).

5. Burn-in fixture for SMD housings according to claim 4, characterized in that It also includes two probe seat fastening bolts (8), the probe seat fastening bolt (8) passes through the second probe seat fastening hole (34) and the first probe seat fastening hole (15), and is threadedly connected with the second probe seat fastening hole (34) and the first probe seat fastening hole (15).

6. Burn-in fixture for SMD housings according to claim 4, characterized in that A plurality of probe mounting holes (33) are arranged on the probe mounting seat (31), the probe mounting hole (33) is a through hole, and a plurality of probes (4) pass through a plurality of probe mounting holes (33) one by one.

7. Burn-in fixture for SMD housings according to claim 6, characterized in that The probe (4) includes: a needle sleeve (41), a probe head (42), a shoulder (43), a welding cup (44) and an inner spring, the needle sleeve (41) is sleeved on the probe head (42), the inner spring is arranged in the needle sleeve (41) and connected with the bottom end of the probe head (42), the shoulder (43) is arranged on the upper end side wall of the needle sleeve (41), the shoulder (43) is arranged above the probe mounting hole (33) and abuts with the probe mounting seat (31), and the welding cup (44) is arranged at the bottom end of the needle sleeve (41).

8. Burn-in fixture for SMD housings according to claim 1, characterized in that The top end of the heat sink (1) is also provided with a plurality of pressure buckle mounting holes (13), and a plurality of pressure buckles (5) are correspondingly installed in the plurality of pressure buckle mounting holes (13).

9. Burn-in fixture for SMD housings according to claim 8, characterized in that The press buckle (5) comprises a press buckle base (51), a connecting base (52), an adjusting screw (53) and an adjusting spring (54); the press buckle base (51) is vertically arranged at one end of the connecting base (52) and is press-connected with the top end of the SMD shell (6), the adjusting spring (54) is sleeved on the adjusting screw (53), the adjusting screw (53) passes through the connecting base (52) and is threadedly connected with the press buckle mounting hole (13).

10. Burn-in fixture for SMD housings according to claim 1, characterized in that A plurality of radiator fastening bolts (7) are further included, the top end of the radiator (1) is further provided with a plurality of fastening holes (14), and the plurality of radiator fastening bolts (7) pass through the plurality of fastening holes (14) one by one and are connected with nuts.

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