Prime-coat-free high-heat-dissipation portable potting inductor

Abstract

The utility model discloses a prime-coat-free high-heat-dissipation portable potting inductor which comprises a shell, an inductor structure, a first heat dissipation layer, a second heat dissipation layer and a third heat dissipation layer. The shell is internally provided with a containing cavity, and the containing cavity is internally provided with the inductor structure; the self-adhesion encapsulation structure is arranged between the inductor structure and the shell; and the multiple heat dissipation plates are installed at the bottom of the shell at intervals, and an air channel is formed between every two adjacent heat dissipation plates. In the production process, the encapsulating material with viscosity is directly poured to form the self-adhesive encapsulating structure, the self-adhesive encapsulating structure has viscosity, and it is ensured that strong cohesive force exists between the self-adhesive encapsulating structure and the shell, so that the stability of the self-adhesive encapsulating structure is ensured, a primer does not need to be brushed, the production efficiency is high, and the production cost is low. The two adjacent heat dissipation plates and the bottom of the shell define the air channel, cold air rapidly takes away heat on the shell when passing through the air channel, stable work of the shell is maintained, and the situation that the temperature of an internal inductor structure area is too high due to insufficient heat dissipation capacity of the shell is avoided.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of potting inductors, in particular to a high-heat-dissipation potting inductor without primer. BACKGROUND

[0002] A potting inductor is an inductor formed by filling a potting material around or inside an inductor structure, aiming to improve the performance and stability of the inductor and protect the internal components from the external environment.

[0003] The existing potting inductor needs to be brushed with a primer during production to ensure good adhesion between the potting material and the shell. However, with the rapid development of photovoltaic, 5G communication technology, automotive electronics and other fields, the demand for potting inductors has also increased, and the influence of brushing primer on production efficiency has become more and more significant. Moreover, the primer has an effective time, and needs to be rebrushed beyond the effective time, which is high in production cost.

[0004] Therefore, it is an urgent technical problem to provide a high-heat-dissipation potting inductor without primer to improve production efficiency and reduce production cost. SUMMARY

[0005] The application provides a high-heat-dissipation potting inductor without primer, which aims to solve the problem of the influence of brushing primer on production efficiency in the prior art, and the problem of high production cost due to the existence of effective time of primer and the need for rebrushing beyond the effective time.

[0006] To achieve the above-mentioned purpose, the application provides a high-heat-dissipation potting inductor without primer, which comprises: a shell, a containing cavity is arranged in the shell, and an inductor structure is installed in the containing cavity; a self-adhesive potting structure is arranged between the inductor structure and the shell; a plurality of heat dissipation plates are installed at the bottom of the shell in intervals, and an air duct is formed between two adjacent heat dissipation plates.

[0007] In some embodiments, the angle between the air duct and the horizontal line is X, and the angle X is greater than 90° and less than 180°.

[0008] In some embodiments, a plurality of containing cavities are arranged in the shell, and two adjacent containing cavities are separated by a partition plate, and the partition plate comprises a horizontal partition plate and a vertical partition plate.

[0009] In some embodiments, the application further comprises:

[0010] At least two hook slots are arranged on the side surface of the shell in intervals.

[0011] In some embodiments, the application further comprises:

[0012] A grounding hole is arranged on the side surface of the shell.

[0013] In some embodiments, further comprising:

[0014] The handle connecting hole is arranged on the side of the shell, and an internal thread is arranged in the handle connecting hole.

[0015] In some embodiments, further comprising:

[0016] The positioning pin is arranged on the upper end of the shell.

[0017] In some embodiments, further comprising:

[0018] The plurality of connecting holes are arranged at intervals on the upper end of the shell.

[0019] The technical scheme of the present application provides a high-heat-dissipation portable encapsulated inductor without primer coating, comprising: a shell, a self-adhesive encapsulation structure, and a plurality of heat dissipation plates. The shell is provided with a receiving cavity, and the receiving cavity is provided with an inductor structure. The self-adhesive encapsulation structure is arranged between the inductor structure and the shell. The plurality of heat dissipation plates are arranged at intervals on the bottom of the shell, and the adjacent two heat dissipation plates form an air duct. In the production process, the self-adhesive encapsulation structure is formed by directly pouring the adhesive encapsulation material. The self-adhesive encapsulation structure has adhesion, ensuring that the self-adhesive encapsulation structure and the shell have strong adhesion, thereby ensuring the stability of the self-adhesive encapsulation structure. The primer coating is not needed, the production efficiency is high, and the production cost is low. The adjacent two heat dissipation plates and the bottom of the shell form an air duct. When the cold air passes through the air duct, it quickly takes away the heat on the shell, maintains the stability of the shell, and avoids the insufficient heat dissipation capacity of the shell, which leads to the high temperature of the internal inductor structure area. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0021] Figure 1 It is a three-dimensional structure schematic diagram of the high-heat-dissipation portable encapsulated inductor without primer coating according to an embodiment of the present application.

[0022] Figure 2 It is a three-dimensional structure schematic diagram of the high-heat-dissipation portable encapsulated inductor without primer coating according to an embodiment of the present application. Figure 1 It is a local enlarged view of part A in the figure.

[0023] Figure 3 It is a local enlarged view of part B in the figure. Figure 1 It is a local enlarged view of part B in the figure.

[0024] Figure 4Figure 8 is a bottom view of the high-heat-dissipation portable potting inductor without primer coating according to an embodiment of the present application;

[0025] Figure 5 For Figure 4 Figure 9 is a partial enlarged view of the middle C part;

[0026] Figure 6 Figure 10 is a top view of the high-heat-dissipation portable potting inductor without primer coating according to an embodiment of the present application. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0028] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications also change accordingly.

[0029] It should also be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or can have a middle element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or can have a middle element.

[0030] In addition, the description of "first", "second", etc. in the present application is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" can explicitly or implicitly include at least one of the features. In addition, the technical solutions of various embodiments can be combined with each other, but it must be based on the fact that a person skilled in the art can realize it, and when the combination of technical solutions contradicts each other or cannot be realized, it should be considered that the combination of technical solutions does not exist and is not within the scope of protection claimed by the present application.

[0031] Referring to Figure 1 and Figure 4 It is proposed that the high-heat-dissipation portable potting inductor without primer coating according to an embodiment of the present application includes: a shell 1, a containing cavity 2 is arranged in the shell 1, and an inductor structure is installed in the containing cavity 2; a self-adhesive potting structure is arranged between the inductor structure and the shell 1; a plurality of heat dissipation plates 4 are installed at the bottom of the shell 1 at intervals, and an air duct is formed between the two adjacent heat dissipation plates 4.

[0032] Wherein, the shell 1 is the structure basis of the high heat dissipation portable potting inductor without primer, the inductor structure, the self-adhesive potting structure and the heat dissipation plate 4 are all installed on the shell 1. The inductor structure at least includes a coil, and the coil has an outgoing structure which extends out of the accommodating cavity 2 for powering the coil. The inductor structure can also include a magnetic core which is partially arranged in the coil. The self-adhesive potting structure is obtained by condensing a potting material in the accommodating cavity 2 where the inductor structure is installed, for protecting the inductor structure from the external environment, preventing the inductor structure from being affected by the external environment, one end of the accommodating cavity 2 is open for pouring the potting material, the potting material carries adhesion, so that the formed self-adhesive potting structure and the shell 1 have adhesion, ensuring that the self-adhesive potting structure will not come out of the accommodating cavity 2. Preferably, the heat dissipation plate 4 is integrally formed with the shell 1, of course, the heat dissipation plate 4 can also be connected to the bottom end of the shell 1 by welding or other connection methods, and multiple heat dissipation plates 4 form a wind-cooled heat dissipation structure, cold air flows through the air duct between the heat dissipation plates 4, taking away the heat in the heat dissipation plates 4 and the bottom of the shell 1, thereby quickly cooling the shell 1.

[0033] Specifically, in the production process, the self-adhesive potting structure is formed by directly pouring the adhesive potting material, the self-adhesive potting structure itself has adhesion, ensuring that the self-adhesive potting structure and the shell 1 have strong adhesion, thereby ensuring the stability of the self-adhesive potting structure, without the need for brushing primer, high production efficiency and low production cost. The two adjacent heat dissipation plates 4 and the bottom of the shell 1 form an air duct, and cold air quickly takes away the heat on the shell 1 when passing through the air duct, maintaining the stable operation of the shell 1, avoiding insufficient heat dissipation of the shell 1, and causing the temperature in the internal inductor structure area to be too high.

[0034] Wherein, the shell 1 is made of ADC12 material. It has high flowability and castability, suitable for the production of various aluminum alloy die castings. And it has excellent mechanical properties and corrosion resistance, which is conducive to the high heat dissipation portable potting inductor without primer to adapt to various harsh environmental conditions.

[0035] Wherein, the self-adhesive potting structure is formed by mixing and filling the potting material with the curing agent, the potting material is formed by mixing the potting raw material and the adhesive silicone resin in a certain proportion, the potting raw material is room temperature vulcanized silicone rubber or organic silicon gel, after the potting material is configured, the potting material is subjected to high temperature negative pressure water removal process, to remove the excess water in the adhesive silicone resin, to prevent the curing effect of the potting glue from being affected by the water, causing the glue to not dry, poisoning, cracking and other phenomena. After the high temperature negative pressure water removal process, the finished potting material can be obtained, the finished potting material is mixed with the curing agent 1:1 during the glue pouring process, and the self-adhesive potting structure is formed after curing, the self-adhesive potting structure will play a bonding role on the surface layer of the inductor structure and the surface layer of the shell 1, the glue adheres to the inductor structure and the shell 1, replacing the role of the primer.

[0036] In detail, during the potting process, the potting material is prepared and then a vacuum operation is performed. The vacuum pressure is 95 kPa min and the vacuum holding time is 90 s min. After potting, the inductor is baked in a tunnel oven at 80°C for 0.5 h. This results in a high-heat-dissipation, portable potted inductor without a primer. The resulting inductor has no cracks, delamination from the outer shell, poisoning, or other abnormalities.

[0037] See Figure 4 , Figure 5 As shown, in some embodiments, the angle between the air duct and the horizontal line 9 is X, which is greater than 90° and less than 180°. That is, all the heat sinks 4 are inclined and parallel to each other. The inclined arrangement of the heat sinks 4 helps to extend the air duct, thereby improving air cooling efficiency and further ensuring that the casing 1 can maintain a normal operating temperature without localized overheating. Preferably, the angle X is 120°, which increases the air duct by approximately 5 times, better matching the overall air duct design and resulting in superior heat dissipation.

[0038] In this embodiment, the heat sink 4 has an arc-shaped protrusion on its side facing the air duct, which increases the contact area between the heat sink 4 and the cold air. Furthermore, the transition between the arc-shaped protrusion and the heat sink 4 is relatively smooth, without significantly obstructing the cold air or causing it to lose too much kinetic energy, thus maximizing heat dissipation efficiency. Moreover, the arc-shaped protrusion produces almost no volume increase, which is beneficial for the compact structural design of the primerless, high-heat-dissipation, convenient potted inductor.

[0039] See Figure 1 and Figure 6 As shown, in some embodiments, the housing 1 has multiple accommodating cavities 2, and adjacent accommodating cavities 2 are separated by partitions, including horizontal partitions 10 and vertical partitions 11. Multiple inductor structures can be installed inside the housing 1 to meet the performance requirements of electrical components, with one inductor structure installed in each accommodating cavity 2. The partitions help to fix the specific positions of the multiple inductor structures inside the housing 1, ensuring that the inductor structures are effectively protected after potting.

[0040] In this embodiment, multiple accommodating cavities 2 are divided inside the housing 1 by horizontal partition 10 and vertical partition 11, and the different accommodating cavities 2 can be of different sizes to accommodate different types of inductors, thus fully meeting the performance requirements of electrical components.

[0041] See Figure 1 , Figure 2As shown, in some embodiments, further comprising: at least two hook slots 5, the at least two hook slots 5 are arranged at the side of the shell 1. Since the shell 1 is made of ADC12 material, after the assembly of the high-heat-dissipation portable potted inductor without primer, its weight can reach 13 kg, which is not convenient for assembly. The hook slots 5 are arranged at the side of the shell 1, and the mechanical hook type installation is adopted during assembly, which reduces the inconvenience of employees to pick up and facilitates the customer to install the whole machine. The hook slots 5 are provided with two, which are used to maintain the stability of the high-heat-dissipation portable potted inductor without primer during hoisting, so as to avoid damage caused by falling.

[0042] Referring to Figure 1 As shown, in some embodiments, further comprising: a grounding hole 3, the grounding hole 3 is arranged at the side of the shell 1. The grounding hole 3 is grounded, and preferably, a grounding mark is arranged at the position of the side of the shell 1 near the grounding hole 3, so as to clearly show the position of the grounding hole 3.

[0043] Referring to Figure 1 , Figure 2 As shown, in some embodiments, further comprising: a handle connecting hole 76, the handle connecting hole 76 is arranged at the side of the shell 1, and the handle connecting hole 76 is internally provided with internal threads. The handle connecting hole 76 is used to connect the handle. As described in the foregoing, the high-heat-dissipation portable potted inductor without primer has a relatively large weight. When the customer lacks mechanical hook equipment, the handle can be installed on the handle connecting hole 76, so that the customer can install the high-heat-dissipation portable potted inductor without primer through the handle later.

[0044] Referring to Figure 1 and Figure 3 As shown, in some embodiments, further comprising: a positioning pin 8, the upper end of the shell 1 is provided with the positioning pin 8. The positioning pin 8 can be used for preliminary positioning during the assembly of the high-heat-dissipation portable potted inductor without primer. After the preliminary positioning is completed, the high-heat-dissipation portable potted inductor without primer can be installed through fasteners.

[0045] Referring to Figure 1 and Figure 3 As shown, in some embodiments, further comprising: a plurality of connecting holes 7, the plurality of connecting holes 7 are arranged at the upper end of the shell 1. The connecting holes 7 are used to connect fasteners. The high-heat-dissipation portable potted inductor without primer is assembled to the whole machine through the fasteners and the connecting holes 7. The fasteners can be bolts, screws, etc.

[0046] The above only describes some or preferred embodiments of the present application, neither the text nor the drawings can limit the scope of protection of the present application, any equivalent structural transformation using the content of the present application specification and drawings, or direct / indirect application in other related technical fields is included in the scope of protection of the present application.

Claims

1. A high heat dissipation portable potted inductor without primer coating, characterized in that, Include: The shell (1) is provided with a containing cavity (2) in the shell (1), and an inductance structure is installed in the containing cavity (2); Self-adhesive potting structure, the inductance structure and the shell (1) are provided with the self-adhesive potting structure; Multiple heat dissipation plates (4), multiple heat dissipation plates (4) are installed at the bottom of the shell (1), and the air duct is formed between two adjacent heat dissipation plates (4).

2. The high heat sink portable potted inductor without primer coating according to claim 1, wherein, The angle between the air duct and the horizontal line (9) is X, the angle X is greater than 90° and less than 180°.

3. The high heat sink portable potted inductor without primer coating according to claim 1, characterized in that, The shell (1) is provided with multiple containing cavities (2), and two adjacent containing cavities (2) are separated by a partition, the partition includes a horizontal partition (10) and a vertical partition (11).

4. The high heat sink portable potted inductor without primer coating according to claim 1, wherein, Also include: At least two hook slots (5), at least two hook slots (5) are arranged on the side of the shell (1).

5. The no base coat high heat dissipation portable potted inductor as claimed in claim 1, wherein, Also include: Grounding hole (3), the grounding hole (3) is arranged on the side of the shell (1).

6. The no base coat high heat dissipation portable potted inductor as claimed in claim 1, wherein, Also include: Handle connecting hole (7) (6), the handle connecting hole (7) (6) is arranged on the side of the shell (1), and the handle connecting hole (7) (6) is provided with internal threads.

7. The high heat sink portable potted inductor without primer according to claim 4, wherein, Also include: Positioning pin (8), the upper end of the shell (1) is provided with a positioning pin (8).

8. The no base coat high heat dissipation portable potted inductor as claimed in claim 1, wherein, Also include: Multiple connecting holes (7), multiple connecting holes (7) are arranged at the upper end of the shell (1).

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