All-in-one machine for IV detection of 0BB silicon wafer

Abstract

The utility model discloses an all-in-one machine for IV detection of an 0BB silicon wafer. The all-in-one machine comprises a front-section conveying rail, an IV detection mechanism and an EL detection mechanism, a single-piece conveying rail is arranged on the front-section conveying rail; the IV detection mechanism comprises a first working platform, a first four-station turntable and a first UVW base, the first UVW base is movably connected with a gold wire bar and a silver bar test frame in the vertical direction, an IV gold wire is mounted on the gold wire bar, and an IV silver bar is mounted on the silver bar test frame; the EL detection mechanism comprises a second working platform, a second four-station rotating disc and a second UVW base, a silver bent frame and a copper bar frame are movably connected to the second UVW base in the vertical direction, EL silver bars are installed on the silver bent frame, and EL copper bars are installed on the copper bar frame; the first UVW base and the second UVW base are each provided with a UVW deviation rectifying and aligning assembly. According to the all-in-one machine for IV detection of the 0BB silicon wafer, IV and EL detection is carried out on a single silicon wafer, work is automatically carried out, grid lines on the single silicon wafer are accurately connected, the detection efficiency is improved, the productivity is improved along with the improvement, and the requirements of previous and later production are met through an integrated multifunctional structure.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of silicon wafer production, especially to an all-in-one machine for IV detection of 0BB silicon wafer. BACKGROUND

[0002] After printing, crystalline silicon photovoltaic solar silicon wafer needs to be subjected to IV detection and EL detection, IV detection refers to current-voltage characteristic curve (IV curve) test of photovoltaic module, only the silicon wafer passing detection can enter the next production process equipment, and EL detection mainly detects internal defects such as hidden crack, broken grid, false welding and broken piece. In the existing silicon wafer, the front surface has main grid lines, the main grid lines will shield the surface of solar cell, affect the light absorption of the cell piece, and further affect the power generation efficiency, in the subsequent new type of silicon wafer, the front surface main grid line is cancelled, which leads to difficulty in quality detection during the production process of the silicon wafer, and affects the detection of the yield, therefore, it is necessary to integrate the IV detection and EL detection of 0BB into an all-in-one machine. SUMMARY

[0003] One purpose of the utility model is to provide an all-in-one machine for IV detection of 0BB silicon wafer, OBB silicon wafer with cost reduction and efficiency increase in the use process of the silicon wafer, the IV detection structure for 0BB is adopted to integrate the EL detection structure, realize the electrical performance detection of single silicon wafer, and reduce the appearance of defective products.

[0004] To achieve the purpose, the utility model adopts the following technical scheme:

[0005] An all-in-one machine for IV detection of 0BB silicon wafer, comprising a front section conveying rail, an IV detection mechanism and an EL detection mechanism, the IV detection mechanism is between the front section conveying rail and the EL detection mechanism;

[0006] A single wafer conveying rail is arranged on the front section conveying rail;

[0007] The IV detection mechanism comprises a first working platform, a first four-station turntable and a first UVW base, the first four-station turntable is located in the middle of the first working platform, the first UVW base is located at the front end of the first working platform, a gold wire row and a silver row test frame are movably connected on the first UVW base along the vertical direction, IV gold wires are installed on the gold wire row, and IV silver rows are installed on the silver row test frame;

[0008] The EL detection mechanism comprises a second work platform, a second four-station turntable and a second UVW base, the second four-station turntable is located in the middle of the second work platform, the second UVW base is located at the front end of the second work platform, silver and copper row frames are movably connected to the second UVW base along the vertical direction, an EL silver row is installed on the silver row frame, and an EL copper row is installed on the copper row frame.

[0009] The first UVW base and the second UVW base are both provided with a UVW deviation correction alignment assembly, and the UVW deviation correction alignment assembly comprises two groups of X-axis modules and one group of Y-axis modules.

[0010] As a preferred technical solution, a temporary storage linear module is arranged on the front section conveying rail, and a temporary storage frame is arranged at the driving end of the temporary storage linear module.

[0011] As a preferred technical solution, a clamping plate positioning mechanism is arranged in the middle of the single-piece conveying rail, and the clamping plate positioning mechanism comprises a clamping plate positioning motor, a clamping plate positioning synchronous belt and a clamping plate positioning rotating wheel.

[0012] As a preferred technical solution, a gas blowing and cooling pipe is arranged at the front end of the single-piece conveying rail, and an ion static electricity removing air knife is arranged at the rear end of the single-piece conveying rail.

[0013] As a preferred technical solution, the first four-station turntable and the second four-station turntable both comprise an electrical integrated slip ring, a turntable support frame and a rotating plate, the electrical integrated slip ring is fixed on the turntable support frame, the electrical integrated slip ring drives the rotating plate to rotate, and a suction nozzle is arranged in each of the four stations of the rotating plate.

[0014] As a preferred technical solution, a butt joint conveying rail is arranged at the two sides of the first four-station turntable and the two sides of the second four-station turntable, a walking linear module is arranged at the rear side of the butt joint conveying rail, and a transfer adsorption plate is connected to the driving end of the walking linear module.

[0015] As a preferred technical solution, a first upper linear module and a first lower linear module are arranged on the first UVW base, the first upper linear module is connected to the gold wire row, and the first lower linear module is connected to the silver row test frame, a second upper linear module and a second lower linear module are arranged on the second UVW base, the second upper linear module is connected to the silver row frame, and the second lower linear module is connected to the copper row frame.

[0016] As a preferred technical scheme, the gold wire row is provided with a first circuit board and a tension spring on two sides, two ends of the IV gold wire are connected to the tension spring, a first lead wire is connected between the first circuit board and the tension spring, two ends of the silver row test frame are provided with mounting grooves, the IV silver row is inserted into the mounting grooves, a pressing plate is pressed on the mounting grooves, and a second lead wire is connected to an outer end of the IV silver row.

[0017] As a preferred technical scheme, the EL silver row is fixed on the silver row frame at two ends, a third lead wire is connected to one side of the EL silver row, the EL copper row is fixed on the copper row frame at two ends, a fourth lead wire is connected to one side of the EL copper row, and a plurality of copper needles are distributed on the EL copper row.

[0018] The all-in-one machine for IV detection of 0BB silicon wafers has the advantages that the all-in-one machine for IV detection of 0BB silicon wafers performs IV and EL detection on single silicon wafers, automatically works, realizes accurate connection of gate lines on single silicon wafers through two groups of X-axis modules and one group of Y-axis modules, improves detection efficiency, and increases production capacity. BRIEF DESCRIPTION OF DRAWINGS

[0019] The utility model will be further explained in detail below according to the drawings and examples.

[0020] Figure 1 It is the whole structure schematic diagram of the all-in-one machine for IV detection of 0BB silicon wafers of example described;

[0021] Figure 2 It is the structure schematic diagram of the front section conveying rail of example described;

[0022] Figure 3 It is the structure schematic diagram of the air blowing cooling pipe of example described;

[0023] Figure 4 It is the structure schematic diagram of the clamping plate positioning mechanism of example described;

[0024] Figure 5 It is the structure schematic diagram of the ion static electricity removing air knife of example described;

[0025] Figure 6 It is the structure schematic diagram of the IV detection mechanism of example described;

[0026] Figure 7 It is the structure schematic diagram of the gold wire row of example described;

[0027] Figure 8 It is the structure schematic diagram of the silver row test frame of example described;

[0028] Figure 9 The first structural schematic diagram of the EL detection mechanism described in the embodiment;

[0029] Figure 10 The second structural schematic diagram of the EL detection mechanism described in the embodiment;

[0030] Figure 11 The structural schematic diagram of the silver row frame described in the embodiment;

[0031] Figure 12 The structural schematic diagram of the copper row frame described in the embodiment;

[0032] Figure 13 The structural schematic diagram of the first four-station turntable (or the second four-station turntable) described in the embodiment;

[0033] Figure 14 The structural schematic diagram of the X-axis module (or the Y-axis module) described in the embodiment.

[0034] Figures 1 to 14 In the embodiment, the first working platform 201 is provided with the first four-station turntable 202, the first UVW base 203, the gold row 204, the silver row test frame 205, the IV gold row 206, the IV silver row 207, the X-axis module 208, the electrical integrated slip ring 209, the turntable support frame 210, the rotating plate 211, the suction nozzle 212, the docking conveying track 213, the walking linear module 214, the transfer adsorption plate 215, the first upper linear module 216, the first lower linear module 217, the first circuit board 218, the tension spring 219, the first wire 220, the pressing plate 221, the second wire 222, the motor mounting seat 223, the module motor 224, the adjusting screw 225, the adjusting sliding table 226, and the connecting bearing 227.

[0035] 1. The first conveying track; 101. The single-piece conveying track; 102. The temporary storage linear module; 103. The temporary storage frame; 104. The clamping plate positioning mechanism; 105. The clamping plate positioning motor; 106. The clamping plate positioning synchronous belt; 107. The clamping plate positioning rotating wheel; 108. The clamping plate positioning wheel; 109. The clamping plate positioning support; 110. The air cooling pipe; 111. The ion static electricity removing air knife;

[0036] 2. The IV detection mechanism; 201. The first working platform; 202. The first four-station turntable; 203. The first UVW base; 204. The gold row; 205. The silver row test frame; 206. The IV gold row; 207. The IV silver row; 208. The X-axis module; 209. The electrical integrated slip ring; 210. The turntable support frame; 211. The rotating plate; 212. The suction nozzle; 213. The docking conveying track; 214. The walking linear module; 215. The transfer adsorption plate; 216. The first upper linear module; 217. The first lower linear module; 218. The first circuit board; 219. The tension spring; 220. The first wire; 221. The pressing plate; 222. The second wire; 223. The motor mounting seat; 224. The module motor; 225. The adjusting screw; 226. The adjusting sliding table; 227. The connecting bearing;

[0037] 3. The EL detection mechanism; 301. The second working platform; 302. The second UVW base; 303. The silver row frame; 304. The copper row frame; 305. The EL silver row; 306. The EL copper row; 307. The third wire; 308. The fourth wire; 309. The copper needle; 310. The second four-station turntable. DETAILED DESCRIPTION

[0038] The technical scheme of the utility model is further illustrated below in combination with the drawings and by specific embodiments.

[0039] As Figures 1 to 14 shown, in the embodiment, an all-in-one machine for IV detection of 0BB silicon wafer includes a front conveying rail 1, an IV detection mechanism 2 and an EL detection mechanism 3, the IV detection mechanism 2 is between the front conveying rail 1 and the EL detection mechanism 3; the front conveying rail 1 is provided with a single wafer conveying rail 101; the IV detection mechanism 2 includes a first working platform 201, a first four-station turntable 202 and a first UVW base 203, the first four-station turntable 202 is located in the middle of the first working platform 201, the first UVW base 203 is located at the front end of the two sides of the first working platform 201, the first UVW base 203 is movably connected with a gold wire row 204 and a silver row test rack 205 along the vertical direction, the gold wire row 204 is installed with an IV gold wire 206, and the silver row test rack 205 is installed with an IV silver row 207; the EL detection mechanism 3 includes a second working platform 301, a second four-station turntable 310 and a second UVW base 302, the second four-station turntable 310 is located in the middle of the second working platform 301, the second UVW base 302 is located at the front end of the two sides of the second working platform 301, the second UVW base 302 is movably connected with a silver row rack 303 and a copper row rack 304 along the vertical direction, the silver row rack 303 is installed with an EL silver row 305, and the copper row rack 304 is installed with an EL copper row 306; the first UVW base 203 and the second UVW base 302 are both installed with a UVW deviation correction alignment assembly, and the UVW deviation correction alignment assembly includes two groups of X-axis modules 208 and a group of Y-axis modules.

[0040] More specifically, the X-axis module 208 and the Y-axis module both include a motor mounting seat 223, a module motor 224, an adjusting screw rod 225 and an adjusting sliding table 226, the module motor 224 is fixed on the motor mounting seat 223, the driving end of the module motor 224 is in transmission connection with the adjusting screw rod 225, the adjusting screw rod 225 is in threaded connection with the adjusting nut of the adjusting sliding table 226, the adjusting sliding table 226 slides along the length direction of the adjusting screw rod 225, the adjusting sliding table 226 is provided with a connecting bearing 227, the connecting bearing 227 slides on the adjusting sliding table 226, the moving direction of the connecting bearing 227 is perpendicular to the moving direction of the adjusting sliding table 226, the edge of the UVW base is locked in the connecting bearing 227, and the two groups of X-axis modules 208 and the group of Y-axis modules jointly control the T-axis steering of the UVW base on one side, in the UVW alignment, the two groups of X-axis modules 208 and the group of Y-axis modules realize the X-axis translation, Y-axis translation and T-axis rotation of the gold wire row 204, the silver row test rack 205, the silver row rack 303 and the copper row rack 304 in the above structure, and the alignment requirements are met.

[0041] The UVW deviation correction alignment assembly is a high-precision moving structure, which is specially designed for high-precision alignment equipment, and is also commonly referred to as an XXY platform. As a kind of three-axis parallel motion mechanism, the UVW deviation correction alignment assembly can realize rotation movement with any point in a plane as the center and translation in any direction (three-axis movement of X, Y and theta in the plane) by controlling the parallel movement of three linear moving structures. The UVW deviation correction alignment assembly can realize high-precision alignment function in cooperation with a vision module, and can be applied to the silicon wafer printing industry.

[0042] More specifically, the implementation process of the UVW deviation correction alignment assembly includes determining the conversion matrix from the camera coordinate system to the UVW platform coordinate system through a vision calibration method, and obtaining the x, y and theta offset between the marker template position and the marker to be corrected through the vision module based on the coordinate value of the origin coordinate system of the UVW deviation correction alignment assembly. Then, according to the formula, the initial coordinates of the three axes are input, the rotation center is set as (0, 0), the theta offset is input, the new coordinate values of the UVW three-axis and the new coordinates of the object to be corrected are obtained, and the corresponding feed amount of the three motors is obtained. This series of operations disassembles the movement process into translation and rotation parts, respectively calculates the motor feed amount, so as to realize accurate automatic positioning, and the alignment accuracy can reach microns.

[0043] The single silicon wafer enters the front conveying rail 1 and is transported by the single conveying rail 101. The single silicon wafer is first adsorbed to the front by the first four-station turntable 202, the gold wire row 204 and the silver row test rack 205 are respectively close to the single silicon wafer, the IV gold wire 206 and the IV silver row 207 are connected to the auxiliary gate of 0BB to form a path, and then the electrical performance detection is carried out. Then, the single silicon wafer after IV detection is adsorbed to the front by the second four-station turntable 310, the silver row rack 303 and the copper row rack 304 are respectively close to the single silicon wafer, the EL silver row 305 and the EL copper row 306 are connected to the silicon wafer to form the detection of internal defects such as hidden cracks, broken gates and virtual welding, and finally the single silicon wafer is output. Moreover, the alignment between the detection mechanism and the silicon wafer on the IV detection mechanism 2 and the EL detection mechanism 3 relies on the UVW deviation correction alignment assembly, and the movement on the X-axis, the Y-axis and the T-axis is realized through two groups of X-axis modules 208 and one group of Y-axis modules.

[0044] The front conveying rail 1 is provided with a temporary storage linear module 102, and the driving end of the temporary storage linear module 102 is provided with a temporary storage frame 103. The temporary storage frame 103 moves transversely at the side of the single conveying rail 101, and moves transversely at the side of the front conveying rail 1. When the temporary storage linear module 102 on one side is full, the other side starts to be placed, and the full side can be manually unloaded.

[0045] The middle part of the single wafer conveying track 101 is provided with a clamping plate positioning mechanism 104, which comprises a clamping plate positioning motor 105, a clamping plate positioning synchronous belt 106 and a clamping plate positioning rotating wheel 107. The driving end of the clamping plate positioning motor 105 is connected with a clamping plate positioning wheel 108. The clamping plate positioning synchronous belt 106 is in transmission connection with the clamping plate positioning wheel 108. The clamping plate positioning synchronous belt 106 is installed with a clamping plate positioning support 109. The clamping plate positioning rotating wheel 107 rotates at the upper end of the clamping plate positioning support 109. The clamping plate positioning motor 105 drives the movement of the clamping plate positioning synchronous belt 106 by controlling the rotation of the clamping plate positioning wheel 108, so as to make the clamping plate positioning support 109 close to the middle part of the single wafer conveying track 101, and adjust the position of the single wafer.

[0046] The front end of the single wafer conveying track 101 is provided with a blowing cooling pipe 110, and the rear end of the single wafer conveying track 101 is provided with an ion static electricity removing air knife 111. The blowing cooling pipe 110 performs cooling treatment, and the ion static electricity removing air knife 111 is responsible for removing static electricity.

[0047] The first four-station turntable 202 and the second four-station turntable 310 each comprise an electrical integrated slip ring 209, a turntable support frame 210 and a rotating plate 211. The electrical integrated slip ring 209 is fixed on the turntable support frame 210, and drives the rotating plate 211 to rotate. The four stations of the rotating plate 211 are each installed with a suction nozzle 212. The single wafer is transferred to the detection station from the front, and the electrical integrated slip ring 209 provides power to make the rotating plate 211 rotate. The suction nozzles 212 on the four stations can effectively fix the position of the single wafer, and facilitate the alignment of the detection mechanism.

[0048] The two sides of the first four-station turntable 202 and the two sides of the second four-station turntable 310 are each installed with a butt joint conveying track 213. The rear side of the butt joint conveying track 213 is provided with a walking linear module 214. The driving end of the walking linear module 214 is connected with a transfer adsorption plate 215. The single wafer is moved in parallel by the butt joint conveying track 213. The walking linear module 214 controls the single wafer of the front and rear structures to be transferred to the rotating plate 211 for adsorption.

[0049] The first UVW base 203 is provided with a first upper linear module 216 and a first lower linear module 217, the first upper linear module 216 is connected with the gold wire row 204, the first lower linear module 217 is connected with the silver row test rack 205, the second UVW base 302 is provided with a second upper linear module and a second lower linear module, the second upper linear module is connected with the silver row rack 303, the second lower linear module is connected with the copper row rack 304, the first upper linear module 216, the first lower linear module 217, the second upper linear module and the second lower linear module are all controlled by a motor control screw rod, and drive a nut to control the up-down movement of the gold wire row 204, the silver row test rack 205, the silver row rack 303 and the copper row rack 304.

[0050] The first line board 218 and the tension spring 219 are arranged on the two sides of the gold wire row 204, the two ends of the IV gold wire 206 are connected with the tension spring 219, the first lead wire 220 is connected between the first line board 218 and the tension spring 219, the two ends of the silver row test rack 205 are provided with mounting grooves, the IV silver row 207 is inserted into the mounting grooves, the pressing plate 221 is pressed on the mounting grooves, the outer end of the IV silver row 207 is connected with the second lead wire 222, the tension spring 219 ensures the tension of the IV gold wire 206, the middle part of the IV silver row is upwardly arc-shaped and protruded, which is more convenient for contacting the auxiliary grid, and the electric signal is connected through the first lead wire 220 and the second lead wire 222.

[0051] The two ends of the EL silver row 305 are fixed on the silver row rack 303, one side of the EL silver row 305 is connected with the third lead wire 307, the two ends of the EL copper row 306 are fixed on the copper row rack 304, one side of the EL copper row 306 is connected with the fourth lead wire 308, a plurality of copper needles 309 are distributed on the EL copper row 306, the copper needles 309 contact the lower end of the 0BB silicon wafer under the action of the EL copper row 306, and the EL silver row 305 is connected with the upper end of the 0BB silicon wafer, so that the EL detection of the 0BB silicon wafer is realized.

[0052] It should be noted that the above specific embodiments only serve as the preferred embodiments of the present application and the applied technical principles, and any changes or replacements easily thought by any person skilled in the art within the technical range disclosed by the present application should be covered in the protection range of the present application.

Claims

1. An all-in-one machine for IV detection of 0BB silicon wafer, characterized in that, The front section conveying track, the IV detection mechanism and the EL detection mechanism are included, the IV detection mechanism is between the front section conveying track and the EL detection mechanism; A single-piece conveying track is arranged on the front section conveying track; The IV detection mechanism includes a first working platform, a first four-station turntable and a first UVW base, the first four-station turntable is located in the middle of the first working platform, the first UVW base is located at the front end of the first working platform, a gold wire row and a silver row test rack are movably connected to the first UVW base along the vertical direction, IV gold wires are installed on the gold wire row, and IV silver rows are installed on the silver row test rack. The EL detection mechanism includes a second working platform, a second four-station turntable and a second UVW base, the second four-station turntable is located in the middle of the second working platform, the second UVW base is located at the front end of the second working platform, a silver row rack and a copper row rack are movably connected to the second UVW base along the vertical direction, EL silver rows are installed on the silver row rack, and EL copper rows are installed on the copper row rack. UVW deviation correction alignment assemblies are installed on the first UVW base and the second UVW base, and the UVW deviation correction alignment assembly includes two groups of X-axis modules and a group of Y-axis modules.

2. The IV detector for 0BB silicon wafer according to claim 1, wherein, A temporary storage linear module is arranged on the front section conveying track, and a temporary storage frame is arranged at the driving end of the temporary storage linear module.

3. The IV detector for 0BB silicon wafer according to claim 1, wherein, A clamping plate positioning mechanism is arranged in the middle of the single-piece conveying track, the clamping plate positioning mechanism includes a clamping plate positioning motor, a clamping plate positioning synchronous belt and a clamping plate positioning rotating wheel, a clamping plate positioning wheel is connected to the driving end of the clamping plate positioning motor, the clamping plate positioning synchronous belt is in transmission connection with the clamping plate positioning rotating wheel, a clamping plate positioning support is installed on the clamping plate positioning synchronous belt, and the clamping plate positioning rotating wheel rotates at the upper end of the clamping plate positioning support.

4. The IV detector for 0BB silicon wafer according to claim 1, wherein, A blowing and cooling pipe is arranged at the front end of the single-piece conveying track, and an ion static electricity removing air knife is arranged at the rear end of the single-piece conveying track.

5. The IV detector for 0BB silicon wafer according to claim 1, wherein, The first four-station turntable and the second four-station turntable each include an electrical integrated slip ring, a turntable support frame and a rotating plate, the electrical integrated slip ring is fixed on the turntable support frame, the electrical integrated slip ring drives the rotating plate to rotate, and a suction nozzle is installed in each of the four stations of the rotating plate.

6. The IV detector for 0BB silicon wafer according to claim 1, wherein, A butt joint conveying track is installed on the two sides of the first four-station turntable and the two sides of the second four-station turntable, a walking linear module is arranged at the rear side of the butt joint conveying track, and a transfer adsorption plate is connected to the driving end of the walking linear module.

7. The IV detector for 0BB silicon wafer according to claim 1, wherein, A first upper linear module and a first lower linear module are arranged on the first UVW base, the first upper linear module is connected with the gold wire row, the first lower linear module is connected with the silver row test rack, a second upper linear module and a second lower linear module are arranged on the second UVW base, the second upper linear module is connected with the silver row rack, and the second lower linear module is connected with the copper row rack.

8. The IV detector for 0BB silicon wafer according to claim 1, wherein, The gold wire row is provided with first circuit boards and tension springs on both sides, the IV gold wire is connected to the tension springs at both ends, first conductive wires are connected between the first circuit boards and the tension springs, the silver row test frame is provided with mounting grooves at both ends, the IV silver row is inserted into the mounting grooves, pressing plates are pressed on the mounting grooves, and second conductive wires are connected to outer ends of the IV silver row.

9. The IV detector for 0BB silicon wafer according to claim 1, wherein, The EL silver row is fixed at both ends on the silver row frame, a third conductive wire is connected to one side of the EL silver row, the EL copper row is fixed at both ends on the copper row frame, a fourth conductive wire is connected to one side of the EL copper row, and a plurality of copper needles are distributed on the EL copper row.

Images