Earphone

Abstract

The utility model provides an earphone, which belongs to the field of loudspeakers and comprises a head beam and earmuffs arranged at the two ends of the head beam, each earmuff comprises an earmuff shell and a loudspeaker arranged in the earmuff shell, an ear pad is further arranged in the direction of contact between the earmuff shell and a human body, and the earphone further comprises a liquid cooling heat dissipation device. The liquid cooling heat dissipation device comprises a heat dissipation shell, and a PCM phase change layer is arranged in the heat dissipation shell. According to the utility model, heat of the ear pad is taken away through the circulating liquid cooling heat dissipation device, so that circulating heat dissipation of the heat-conducting medium is realized; the liquid cooling heat dissipation device fits the shape of the earmuff and extends out of the earmuff, so that the appearance size and the weight are not obviously increased; pure physical liquid cooling heat dissipation does not generate electromagnetic noise and the like to influence the performance of the earphone, and does not form air convection, so that the passive noise reduction capability of the earphone is not influenced.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of earphones. BACKGROUND

[0002] Users wearing earphones, headphones and other over-ear audio devices for long periods of time can experience various types of discomfort. For example, users can experience ear pain caused by ill-fitting ear cups, temple pain caused by ear cups pressing against eyeglasses, general headaches caused by ear cups pressing too tightly against the user's head, etc. Another discomfort that users often complain about is hot ears. For example, gamers often use earphones for long periods of time, which can cause the temperature inside the ear cups and around the ears where the earphone pads press against their heads to increase. As a result, many gamers and other users often complain that their ears become hot, sweaty, itchy, and generally uncomfortable.

[0003] The head-mounted earphone protects the hearing of the ear better than the earphone, wears more comfortably, and the head-mounted earphone atmosphere and space positioning are better than the earphone. The head-mounted earphone has strong sound quality and a sense of immersion. The existing head-mounted earphone is good in sound quality and ear protection, but the heat dissipation effect is not paid attention to. For example, in summer, the ear cups of the head-mounted earphone are long-term covered on the ears, and if there is no good heat dissipation, it can cause a lot of sweating of the ears, which has an adverse effect on the ears of the human body. Therefore, when the head-mounted earphone is designed, a heat dissipation mechanism needs to be considered to solve the problem of overheating inside the ear cups. SUMMARY

[0004] The utility model aims at overcoming the insufficient of prior art, provide a kind of earphone.

[0005] The utility model discloses a kind of earphones, including head beam, ear cup being arranged in the both ends of the head beam, the ear cup includes ear cup shell, speaker being arranged in the ear cup shell, the direction of the ear cup shell and human body contact is also equipped with ear pad, it is characterized by further including liquid cooling heat sink device, the liquid cooling heat sink device includes heat dissipation shell body, PCM phase change layer is equipped in the heat dissipation shell body, the heat dissipation shell body includes the first heat dissipation shell body being arranged in the ear cup shell outer side, first PCM phase change layer is equipped in the first heat dissipation shell body, second heat dissipation shell body is arranged in the ear pad, second PCM phase change layer is equipped in the second heat dissipation shell body.

[0006] As an improvement, the ear pad includes a skin layer that contacts the human body, a cooling gel layer is disposed inside the skin layer, the second heat dissipation shell body is disposed inside the cooling gel layer, and an elastic material layer is disposed inside the second heat dissipation shell body.

[0007] As a further improvement, a circulating micropump is provided on the first heat dissipation housing.

[0008] As a further improvement, a semiconductor cooling chip is provided on the first heat dissipation housing.

[0009] As a further improvement, a miniature fan is provided on the first heat sink housing.

[0010] As a further improvement, several heat dissipation pipes are provided on the outside of the first heat dissipation housing.

[0011] As a further improvement, the head beam is provided with a third heat dissipation shell that communicates with the second heat dissipation shell. The third heat dissipation shell is provided with a third PCM phase change layer. The head beam is also provided with a head beam circulation micro pump, a semiconductor cooling chip, or a micro fan.

[0012] As a further improvement, the earcups are equipped with temperature and humidity sensing elements and a control chip.

[0013] Due to the adoption of the above technical solution, the advantages of this utility model compared with the prior art are:

[0014] First: This new invention removes heat from the ear pads through the circulating liquid cooling heat dissipation device, thereby achieving circulating heat dissipation of the heat-conducting medium;

[0015] Second: The liquid cooling heat dissipation device extends out of the earcup in accordance with its shape, without causing a significant increase in appearance size and weight;

[0016] Third: The liquid cooling heat dissipation device of this invention has a compact and simple structure, which enables the headphones to have an "inside to outside" circulating heat dissipation system, which conducts the heat generated inside the earcups to the outside of the earcups, effectively relieving the stuffiness of wearing headphones for a long time.

[0017] Fourth: Purely physical liquid cooling does not generate electromagnetic noise or other factors that could affect headphone performance, nor does it create air convection, thus not affecting the headphone's passive noise cancellation capability.

[0018] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0019] Appendix Figure 1 This is a schematic diagram of the present invention;

[0020] Appendix Figure 2 This is a schematic diagram of the cross-sectional structure of the earmuff described in Embodiment 1 of this utility model;

[0021] Appendix Figure 3 This is a schematic diagram of the cross-sectional structure of the earmuff described in Embodiment 2 of this utility model;

[0022] AppendixFigure 4 is the cross section structure schematic view of the earmuff of the embodiment three of the utility model;

[0023] attached Figure 5 is the cross section structure schematic view of the earmuff of the embodiment four of the utility model;

[0024] attached Figure 6 is attached Figure 5 the top view. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0026] In the description of the utility model, it is understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like is the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model.

[0027] In the utility model, unless otherwise explicitly specified and limited, the terms "mounting", "setting", "connecting", "fixing", "threading" and the like should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrated; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, or internal communication of two elements or interaction relationship of two elements, unless otherwise explicitly limited, the above-mentioned terms in the utility model can be understood according to the specific meaning of the above-mentioned terms in the utility model by those skilled in the art according to the specific situation.

[0028] In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or more features. In the description of the utility model, the meaning of "multiple" is two or more, unless otherwise explicitly specified and limited.

[0029] Embodiment one: as attachedFigure 1 -attach Figure 6 As shown in the figure, an earphone comprises a head beam 1, ear covers 2 arranged at both ends of the head beam 1, the ear covers 2 comprising ear cover shells 21, loudspeakers 22 arranged in the ear cover shells 21, and ear pads 23 arranged at the side of the ear cover shells 21 in contact with the human body, and further comprising a liquid cooling heat dissipation device 3, the liquid cooling heat dissipation device 3 comprising a heat dissipation shell 31, the heat dissipation shell 31 comprising a PCM phase change layer, the heat dissipation shell 31 comprising a first heat dissipation shell 311 arranged outside the ear cover shell 21, the first heat dissipation shell 311 comprising a first PCM phase change layer 313, a second heat dissipation shell 312 arranged in the ear pad 23, the second heat dissipation shell 312 comprising a second PCM phase change layer 314, and a circulating micro-pump 315 arranged on the first heat dissipation shell 311.

[0030] The ear pad 23 comprises a surface skin layer 231 in contact with the human body, the surface skin layer 231 comprising a cooling gel layer 232 arranged inside, the cooling gel layer 232 comprising the second heat dissipation shell 312 arranged inside, the second heat dissipation shell 312 comprising an elastic material layer 233 arranged inside, the elastic material layer 233 being zero-pressure sponge or the like.

[0031] The first PCM phase change layer 313 and the second PCM phase change layer 314 are PCM phase change materials, the PCM phase change materials being liquid cooling materials, the circulating micro-pump 315 continuously taking away the heat of the cooling gel layer, so as to ensure that the cooling gel layer is always kept at a suitable lower temperature, thereby achieving heat dissipation.

[0032] The liquid cooling heat dissipation device 3 further comprises a third heat dissipation shell 32 arranged on the head beam 1 and in communication with the second heat dissipation shell 312, the third heat dissipation shell 32 comprising a third PCM phase change layer (not shown in the figure), and the head beam 1 further comprising a head beam circulating micro-pump 33, and of course, a semiconductor refrigeration chip or a micro-fan can also be added on the basis of the head beam circulating micro-pump 33.

[0033] The ear cover 2 comprises a temperature and humidity sensing element and a control chip (not shown in the figure), the control chip performing starting control of the earphone heat dissipation unit according to the temperature and humidity detected by the temperature and humidity sensing element.

[0034] Embodiment two: the structure is the same as that of embodiment one, except that a semiconductor refrigeration chip 316 is arranged on the first heat dissipation shell 311. The semiconductor refrigeration chip 316 is fixed to a matching ear cover metal shell (as a heat sink of the semiconductor refrigeration chip), and in order to further ensure heat conduction, a heat-conducting silicone grease, a heat-conducting carbon fiber gasket or the like is coated between the two.

[0035] Embodiment three: the structure is same with embodiment one, the difference is that the first heat dissipation shell 311 is provided with a micro fan 317, the liquid cooling heat dissipation device 3 is blown by the micro fan 317, the air flow rate in the region is accelerated, and the heat dissipation efficiency and effect are significantly improved.

[0036] Embodiment four: the structure is same with embodiment one, the difference is that the first heat dissipation shell 311 is provided with a plurality of heat dissipation pipes 318 outside; the heat dissipation pipe 318 is a plurality of groups of heat dissipation pipes of high-thermal-conductivity metal material, the heat dissipation area of the liquid cooling material is increased, and the heat dissipation effect is significantly improved; of course, the embodiment can also be combined with embodiment two and embodiment three to form a new embodiment, which will not be repeated here.

[0037] The liquid cooling heat dissipation device 3 is circulated in the pipe distributed throughout the earphone shell under the action of the circulating micropump, the heat of the cool gel layer is taken away, and is radiated to the air, so that the heat dissipation and cooling of the area in the ear cover 2 are realized, on the basis of the cool gel layer (high specific heat material), the PCM phase change material is used as the liquid cooling material, the micropump continuously takes away the heat of the cool gel, and the cool gel is always kept at a suitable low temperature, so that the heat dissipation is realized, and the hot and humid situation when the headphone is worn for a long time is effectively relieved; and the pure physical liquid cooling heat dissipation does not generate electromagnetic noise and other influences on the performance of the earphone, and air convection is not formed, so as to not affect the passive noise reduction capability of the earphone.

[0038] The suitable selection of PCM phase change material and the addition of microcapsule technology disperse the PCM phase change material into spherical small particles, and encapsulate a layer of stable shell material on the surface, finally form phase change microcapsules, and well solve the problems and difficulties of liquid material loss, corrosion, volume change rate and the like in application.

[0039] The above only describes the preferred embodiments of the present application, and does not limit the present application, and any modification, equivalent replacement and improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A headphone comprising a headband, earcups disposed at both ends of the headband, the earcups comprising an earcup housing, a speaker disposed within the earcup housing, and an earpad disposed in a direction in which the earcup housing contacts a human body, characterized in that: The liquid cooling heat dissipation device comprises a heat dissipation shell, and a PCM phase change layer is arranged in the heat dissipation shell.

2. A headphone according to claim 1, characterized in that: The ear pad comprises a surface skin layer in contact with a human body, a cooling gel layer is arranged in the inner side of the surface skin layer, the second heat dissipation shell is arranged in the inner side of the cooling gel layer, and an elastic material layer is arranged in the inner side of the second heat dissipation shell.

3. The earphone of claim 1, wherein: A circulating micro-pump is arranged on the first heat dissipation shell.

4. The earphone of claim 1, wherein: A semiconductor refrigeration chip is arranged on the first heat dissipation shell.

5. The earphone of claim 1, wherein: A micro-fan is arranged on the first heat dissipation shell.

6. The earphone according to any one of claims 1 to 5, characterized in that: A plurality of heat dissipation pipelines are arranged on the outer side of the first heat dissipation shell.

7. A headphone according to claim 6, characterised in that: A third heat dissipation shell in communication with the second heat dissipation shell is arranged on the head beam, a third PCM phase change layer is arranged in the third heat dissipation shell, and a head beam circulating micro-pump or a semiconductor refrigeration chip or a micro-fan is further arranged on the head beam.

8. A headphone according to claim 7, characterized in that: A temperature and humidity sensing element and a control chip are arranged in the ear cover.

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