Mute floor

By setting buffer grooves on the side of the soundproof floor buffer layer, the splicing problem caused by the expansion of the buffer layer is solved, resulting in a better splicing effect and user experience.

CN223634269UActive Publication Date: 2025-12-05CHANGZHOU BEMATE HOME TECH CO LTD
View PDF 0 Cites 3 Cited by

Patent Information

Application Number
CN202423072289.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-12
Publication Date
2025-12-05
Estimated Expiration
2034-12-12

AI Technical Summary

Technical Problem

Existing soundproof flooring tends to expand to the sides of the floor when the buffer layer is compressed, resulting in seams or unevenness at the joints.

Method used

A buffer groove is provided on the side of the buffer layer, extending to both ends of the side. The opening of the buffer groove faces the outer side of the floor. The width of the buffer groove does not exceed the thickness of the buffer layer to accommodate the expanded portion of the buffer layer and avoid protrusion.

Benefits of technology

It effectively avoids widening of seams and unevenness at the joints of the flooring, improving the installation and performance of the flooring.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223634269U_ABST
    Figure CN223634269U_ABST
Patent Text Reader

Abstract

The utility model discloses a mute floor which comprises a surface treatment layer, a protection layer, a decoration layer, a first carrier, a first buffer layer and a second carrier. The surface treatment layer is arranged on one side of the protection layer, the decoration layer is arranged on the other side of the protection layer, the first carrier is arranged between the decoration layer and the first buffer layer, the first buffer layer is arranged between the first carrier and the second carrier, and the first buffer layer is of a porous structure and / or a net structure. A buffer groove is formed in at least one side face of the first buffer layer and extends to the two ends of the side face. By arranging the floor with the first buffer layer with the porous and / or honeycomb structure, noise is reflected and refracted for multiple times in the porous and / or honeycomb structure, so that sound is attenuated, a sound wave propagation path is prolonged, and the effect of more effectively reducing noise propagation is achieved.
Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The utility model relates to floor technology field especially relates to a mute floor. BACKGROUND

[0002] The existing floor includes wear -resisting layer, decorative layer, carrier and buffer layer etc. component part, these aim at satisfying floor material in strength, wear resistance, decorative effect and comfort etc. requirement. Prior art, increase the mute pad with the effect of collecting sound at the bottom of the floor, reduce the spread of noise, however, through increasing mute pad this way reduces the spread of noise is limited. In order to better mute effect, prior art sets up the floor with the buffer layer with porous and / or honeycomb structure between the first carrier and the second carrier, makes noise in porous or honeycomb structure through multiple reflection and refraction, thereby attenuating sound and prolonging sound wave propagation path, reaches more effective effect of reducing noise spread. However, when using, the upper part of the floor is stressed, the buffer layer expands to the side of the floor under extrusion, and the expansion forms a protruding part, which causes the joint between the two floors to form a joint gap, the joint gap to expand, or the joint between the two floors to be uneven. SUMMARY

[0003] Therefore, a mute floor is provided to solve the technical problems of joint gap, joint gap expansion, or uneven joint between two floors caused by the expansion of the buffer layer to the side of the floor under extrusion.

[0004] The utility model provides a mute floor, which comprises a surface treatment layer, a protective layer, a decorative layer, a first carrier, a first buffer layer, and a second carrier.

[0005] The surface treatment layer is arranged on one side of the protective layer, the decorative layer is arranged on the other side of the protective layer, the first carrier is arranged between the decorative layer and the first buffer layer, the first buffer layer is arranged between the first carrier and the second carrier, and the first buffer layer has a porous structure and / or a mesh structure.

[0006] At least one side surface of the first buffer layer is provided with a buffer groove, and the buffer groove extends to both ends of the side surface.

[0007] Further, the opening of the buffer groove faces outward from the side of the floor.

[0008] Further, the width of the buffer groove is less than or equal to the thickness of the first buffer layer.

[0009] Further, the porous structure includes a closed-cell porous structure, a semi-closed-cell porous structure, and an open-cell porous structure.

[0010] Further, the porous structure material is one or more of a polyolefin foam, expanded polystyrene, expanded polypropylene, expanded rubber, expanded ethylene vinyl acetate, expanded ethylene, expanded polyethylene, ethylene-vinyl acetate copolymer, radiation cross-linked polyethylene, polypropylene, compressible natural material, polystyrene.

[0011] Further, the net structure includes a honeycomb structure and a net accumulation structure.

[0012] Further, the net structure material is one or more of an ethylene-vinyl acetate copolymer, radiation cross-linked polyethylene, foamed polypropylene, foamed polystyrene.

[0013] Further, the first carrier is one or more of a high-density fiberboard layer, a wood-plastic composite material layer, a polyvinyl chloride resin layer, a high-end vinyl material layer, a terephthalate glycol layer, a polypropylene resin layer, or a polyethylene terephthalate-1,4-cyclohexane dimethanol layer.

[0014] Further, the first carrier includes at least one reinforcing layer, and the reinforcing layer is located inside the first carrier.

[0015] Further, the reinforcing layer includes a net or a mesh.

[0016] Further, the net or the mesh includes glass fiber, jute, and / or cotton.

[0017] Further, a second buffer layer is further included, and the second buffer layer is arranged on a side of the second carrier away from the first buffer layer.

[0018] The utility model has the advantages of:

[0019] The utility model discloses a buffer groove is arranged on at least one side of the buffer layer, and the buffer groove extends to both ends of the side, and when in use, the upper part of the floor is stressed, the buffer groove expands to the side of the floor under extrusion, and the buffer groove can accommodate the convex part formed by the expansion of the buffer layer, or the buffer layer expands but does not form the convexity to the side of the floor, so that the joint gap, the expansion of the joint gap, or the unevenness of the joint of the two floors is avoided. The silent floor has better mounting and use effect. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to the structure shown in the drawings without creative labor.

[0021] Figure 1Fig. 1 is a schematic diagram of the overall structure of a soundproof floor in an embodiment;

[0022] Figure 2 Fig. 2 is a schematic diagram of the overall structure of a soundproof floor in another embodiment;

[0023] Figure 3 Fig. 3 is a schematic diagram of the cross section of a first buffer layer porous structure in an embodiment;

[0024] Figure 4 Fig. 4 is a schematic diagram of the cross section of a first buffer layer reticular structure in an embodiment;

[0025] Figure 5 Fig. 5 is a schematic diagram of the structure of a first carrier in an embodiment;

[0026] Figure 6 Fig. 6 is a schematic diagram of the structure of a first carrier in another embodiment;

[0027] Figure 7 Fig. 7 is a perspective view of a soundproof floor in an embodiment with a first buffer groove on one side;

[0028] Figure 8 Fig. 8 is a cross-sectional view of a soundproof floor in an embodiment with a first buffer groove on one side;

[0029] Figure 9 Fig. 9 is an assembly schematic diagram of a soundproof floor in an embodiment with a first buffer groove on one side;

[0030] Figure 10 Fig. 10 is a perspective view of a soundproof floor in another embodiment with a second buffer groove on an end face;

[0031] Figure 11 Fig. 11 is a cross-sectional view of a soundproof floor in another embodiment with a second buffer groove on an end face;

[0032] Figure 12 Fig. 12 is an assembly schematic diagram of a soundproof floor in another embodiment with a second buffer groove on an end face.

[0033] Fig. 1 is a schematic diagram of the overall structure of a soundproof floor in an embodiment;

[0034] The realization, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts fall within the scope of the present application.

[0036] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications also change accordingly.

[0037] In addition, the description of "first", "second" and the like in the present application is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include at least one of the features. In addition, "and / or" in the full text includes three schemes, for example, A and / or B includes A technical solution, B technical solution, and A and B simultaneously meet the technical solution; in addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor within the scope of protection required by the present application.

[0038] Reference Figure 1 , Figure 3 and Figure 4 , embodiment one provides a silent floor, from top to bottom including surface treatment layer 10, protective layer 11, decorative layer 12, first carrier 13, first buffer layer 14 and second carrier 15, surface treatment layer 10 is arranged on one side of protective layer 11, decorative layer 12 is arranged on the other side of protective layer 11, first carrier 13 is arranged between decorative layer 12 and first buffer layer 14, first buffer 14 is arranged between first carrier 13 and second carrier 15, and the first buffer layer 14 is a porous and / or reticular structure.

[0039] The first buffer layer 14 with porous and / or reticular structure provided in the present application can make the noise reflect and refract in the porous or honeycomb structure for many times, thereby attenuating the sound and prolonging the sound wave propagation path, achieving the effect of effectively reducing noise propagation. At the same time, the first buffer layer 14 with porous and / or reticular structure has compressibility, which can also alleviate the impact effect of the contact between the layers of the floor and the floor and the ground, thereby reducing the effect of noise propagation.

[0040] Specifically, the porous structure includes a closed-cell porous structure, a semi-closed-cell porous structure, and an open-cell porous structure; the net structure includes a honeycomb structure and a net accumulation structure. The material of the porous structure is one or more of polyolefin foam, expanded polystyrene, expanded polypropylene, expanded rubber, expanded ethylene vinyl acetate, expanded ethylene, expanded polyethylene, ethylene-vinyl acetate copolymer (EVA), irradiation cross-linked polyethylene (IXPE), polypropylene (PP), compressible natural material, foamed polystyrene (XPS); the material of the net structure is one or more of ethylene-vinyl acetate copolymer (EVA), irradiation cross-linked polyethylene (IXPE), foamed polypropylene (XPP), and foamed polystyrene (XPS). Understandably, the porous structure and the net structure can make the noise reflect and refract multiple times, attenuate the sound and prolong the sound wave propagation path, thereby reducing the propagation of noise.

[0041] Reference Figure 2 In another embodiment, the silent floor further comprises a second buffer layer 16 on the basis of embodiment one, the second buffer layer 16 being arranged on the side of the second carrier 15 away from the first buffer layer 14. The second buffer layer provides the floor with sound attenuation effect, absorbing and reducing the energy of sound wave propagation during the use of the floor.

[0042] Specifically, the second buffer layer 16 is a sound-absorbing layer made of at least one polymer material or non-woven fiber, such as but not limited to polyurethane, which can further optimize the acoustic properties of the floor. The second buffer layer 16 can be composed of a foamed layer of ethylene-vinyl acetate copolymer (EVA), irradiation cross-linked polyethylene (IXPE), foamed polypropylene (XPP), and / or foamed polystyrene (XPS); the second buffer layer 16 can also be made of non-woven fiber, such as polyethylene terephthalate (PET). The second buffer layer 16 can also be a compressible natural material, such as felt, cotton, wool, mycelium, hemp, cork, and / or the like. Cork is composed of many small holes or cells inside, which are called "air chambers", and this structure of cork makes it have good temperature, sound and vibration insulation performance, which can effectively isolate external noise and vibration. The optional density range of the second buffer layer 16 is 65 kg / m 3 ~ 300 kg / m 3 , especially 80 kg / m 3 ~ 150 kg / m 3 . Understandably, the floor includes at least one adhesive layer on the bottom surface of the second carrier 15, or when the second buffer layer 16 is used, at least one adhesive layer on the second buffer layer 16, which can be a conductive adhesive layer or a conductive glue layer.

[0043] In other embodiments, the first cushioning layer 14 can be selected from the group of closed cell flexible foam, compressible foam, flexible polymer, elastomer, compressible natural material and / or combinations of any of the above. Optionally, the first cushioning layer 14 comprises at least 50% of closed cell flexible foam and / or compressible foam; optionally, the first cushioning layer 14 comprises at least 80% of closed cell flexible foam material. The first cushioning layer 14 can be a compressible foam of closed cell porous structure, which enables sufficient compressible behavior while being strong enough to support the load applied by the surface treatment top layer. The first cushioning layer 14 can also be a compressible foam of semi-closed cell porous structure or open cell porous structure. It is appreciated that open cell porous structure or semi-closed cell porous structure has the advantage of improved sound absorption. Optionally, the first cushioning layer 14 is a foamed layer, in which case the foam pore size and open cell rate of the foamed material of the first cushioning layer 14 can be controlled by the foaming reaction, in particular by adjusting the amount of foaming catalyst, to achieve open cell, semi-open cell and closed cell. Optionally, the first cushioning layer 14 can also be a substantially solid non-foamed layer, in which case the best results are obtained using a material selected from the group of flexible polymers and elastomers, such as rubber, latex, acrylic elastomeric epoxy, cis-polyisoprene (natural rubber, NR), cis-polybutadiene (butadiene rubber, BR), nitrile rubber (NBR), styrene butadiene rubber (SBR), rubber, latex and / or ethylene propylene monomer (EPM). When the first cushioning layer 14 comprises a compressible natural material, the material can be selected from the group of, for example, felt, cotton, wool, mycelium, hemp, cork and / or the like. Cork is composed of many small holes or cells inside, which are called "air chambers", and this structure of cork provides it with good temperature, sound and vibration insulation properties, effectively isolating external noise and vibrations. These examples are non-limiting and any similar foam material having equivalent material properties can be applied. The thickness of the first cushioning layer 14 is typically in the range of 0.8 mm to 4 mm, in particular in the range of 0.8 mm to 2 mm. In further embodiments, the first cushioning layer 14 has a thickness in the range of 0.75 mm to 1.25 mm in uncompressed state.

[0044] With reference to Figure 5 In the present embodiment, the first carrier 13 comprises at least one reinforcing layer 132, which is located inside the first carrier 13, the thickness of the reinforcing layer 132 being less than the thickness of the first carrier, preferably less than half the thickness of the first carrier. With reference to Figure 6In another embodiment, the first carrier 13 comprises at least two reinforcing layers 132, one of which is located near the upper surface of the first carrier 13, at a distance of less than one-half of the thickness of the first carrier 13 from the upper surface of the first carrier 13, and the other of which is located near the lower surface of the first carrier 13, at a distance of less than one-half of the thickness of the first carrier 13 from the lower surface of the first carrier 13. By adding reinforcing layers 132 within the first carrier 13, the overall strength of the first carrier is increased, the dimensional stability of the first carrier at high temperatures is increased, and shrinkage is reduced.

[0045] Specifically, the first carrier 13 is one or more of a high-density fiberboard layer, a wood-plastic composite material layer, a polyvinyl chloride resin layer, a high-end vinyl material layer (LVT base layer), a terephthalate layer (PET base layer), a polypropylene resin layer (PP base layer), or a polyethylene terephthalate-1, 4-cyclohexane dimethanol layer (PETG base layer).

[0046] Specifically, the first carrier 13 is one or more of a high-density fiberboard layer, a wood-plastic composite material layer, a polyvinyl chloride resin layer, a high-end vinyl material layer (LVT base layer), a terephthalate layer (PET base layer), a polypropylene resin layer (PP base layer), or a polyethylene terephthalate-1, 4-cyclohexane dimethanol layer (PETG base layer).

[0047] Specifically, the first carrier 13 is one or more of a high-density fiberboard layer, a wood-plastic composite material layer, a polyvinyl chloride resin layer, a high-end vinyl material layer (LVT base layer), a terephthalate layer (PET base layer), a polypropylene resin layer (PP base layer), or a polyethylene terephthalate-1, 4-cyclohexane dimethanol layer (PETG base layer).

[0048] In the present embodiment, the surface treatment layer 10 is a surface layer having surface properties such as antibacterial, anti-slip, water-resistant, scratch-resistant, and anti-aging functions. For example, the surface treatment layer 10 is a layer of ultraviolet light-cured paint (UV) or a layer of paint. In addition, the surface treatment layer 10 has a relief.

[0049] In the present embodiment, the protective layer 11 is a wear or scratch resistant layer, which can comprise one or more transparent layers of thermoplastic or thermoset resin, non-limiting examples of thermoplastic or thermoset materials that can be used are polyvinyl chloride (PVC), polystyrene (PS), polyethylene (PE), polyurethane (PU), acrylonitrile butadiene styrene (ABS), polypropylene (PP), polyethylene terephthalate (PET), phenol resin and / or melamine resin or formaldehyde resin, fillers such as aluminum trioxide, metal color powder, etc. can also be used; the wear layer can also be in liquid or paste form made of thermoset resin such as but not limited to phenol resin and / or melamine resin or formaldehyde resin; in addition, the wear layer can also comprise or consist essentially of a carrier layer impregnated with a scratch resistant thermoset resin inherent to the carrier layer such as paper or lignocellulose. The advantage of the latter embodiment (consisting essentially of the above-mentioned scratch resistant thermoset resin inherent to the carrier layer) is that the urea-formaldehyde also acts as a relatively scratch resistant layer. Typically, the thickness of the wear layer structure is in the range of 0.1 mm to 2.0 mm.

[0050] In particular, the second carrier 15 is a high-density fiberboard (HDF) layer, a wood plastic composite (WPC) layer, a polyvinyl chloride resin layer, a high-end vinyl tile (LVT) layer, a polyethylene terephthalate (PET) layer, a polypropylene resin (PP) layer or a polyethylene terephthalate-1,4-cyclohexane dimethanol (PETG) layer. The presence of the second carrier 15 can further contribute to the acoustic performance of the floor, providing better strength and stability.

[0051] In the present embodiment, the first cushioning layer 14 has a Shore A hardness of 80 to 100, the first carrier 13 has an elastic modulus in the range of 100 Mpa to 500 MPa, and the second carrier 15 has an elastic modulus in the range of 2000 Mpa to 7000 MPa. In another alternative embodiment, the first carrier 13 has an elastic modulus in the range of 100 Mpa to 300 MPa. Relative to prior art silent floors, the first cushioning layer is too soft and the first carrier is a SPC substrate which is too hard, the present first cushioning layer is harder and has better elasticity, and the first carrier is a high-end vinyl tile (LVT) layer which is softer and more deformable relative to the SPC substrate. In this case, the degree of deformation of the first carrier and the first cushioning layer when a person steps on them is greater, and the resilience of the first cushioning layer and the first carrier as a whole when the foot is removed is best, and the silent effect is better.

[0052] The polyvinyl chloride resin layer includes a foamed chloroethylene base layer or a rigid polyvinyl chloride base layer, etc., the second carrier 15 has an elastic modulus in the range of 2000 MPa to 3000 MPa when the foamed chloroethylene base layer, and the second carrier 15 has an elastic modulus in the range of 3000 MPa to 7000 MPa when the rigid polyvinyl chloride base layer.

[0053] In particular, the decorative layer can be composed of multiple impregnated layers, which can be made of one or a combination of several of wood cellulose, wood veneer, thermoplastic layers, stone veneer, and veneer layers. The veneer is preferably wood veneer, cork veneer, bamboo veneer, etc.; the veneer can also be made of other materials, such as ceramic tiles or porcelain, real stone veneer, rubber veneer, decorative plastic or vinyl, linoleum, and laminated decorative thermoplastic materials in the form of foil or film, which can be polypropylene (PP), polyethylene terephthalate (PET), polyvinyl chloride (PVC), etc. The design of the decorative layer can be selected from a design database, which includes digitally processed designs, traditional patterns, picture or image files, custom digital artwork, random image patterns, abstract art, wood grain images, ceramic or concrete style images, or user-defined patterns. The decorative layer can be printed or copied with a laser printer, inkjet printer, or any other digital printing technology including conventional printing methods, which can also use various types of ink to meet the design requirements of the decorative layer. Preferably, the ink used in the printing method includes but is not limited to waterproof, lightfast, acid-free, metallic, glossy, shiny, or deep black, etc. At the same time, the decorative layer can also be a substantially transparent coating, so as to achieve better visual effects. The decorative layer can also have a pattern, which can be prepared by digital printing, inkjet printing, rotogravure printing machine, electronic spool (ELS) rotogravure printing machine, automatic plastic printing machine, offset printing, flexographic printing, or rotogravure printing machine, etc. The thickness of the decorative layer is in the range of 0.05 mm and 0.10 mm, for example, 0.07 mm.

[0054] Another embodiment of the present application refers to Figures 7 to 9, provide a kind of mute floor, at least one side of first buffer layer 14 is provided with buffer groove (17,18), buffer groove (17,18) extends to the both ends of side, the notch of buffer groove (17,18) is towards the outside of floor side, the width of the widest part of buffer groove is less than or equal to the thickness of first buffer 14 layer.When in use, the upper part of floor is stressed, first buffer layer expands to the side of floor when being extruded, by being provided with buffer groove in first buffer layer 14, the protruding part formed by the expansion of first buffer layer 14 can be accommodated, first buffer layer 14 expands but does not form protrusion to the side of floor, avoid the joint of two floors to form joint, joint expands or the joint of two floors is uneven.This mute floor has better installation and use effect.Specifically, the mute floor includes surface treatment layer 10 from top to bottom, protective layer 11, decorative layer 12, first carrier 13, first buffer layer 14 and second carrier 15, surface treatment layer 10 is arranged on one side of protective layer 11, decorative layer 12 is arranged on the other side of protective layer 11, first carrier 13 is arranged between decorative layer 12 and first buffer layer 14, first buffer 14 layer is arranged between first carrier 13 and second carrier 15, and the first buffer layer 14 is porous and / or reticular structure;At least one side of mute floor is provided with first buffer groove 17, first buffer groove 17 is opened in first buffer layer 14, and first buffer groove 17 extends to the both ends of mute floor and penetrates. Figures 10 to 11 , another alternative embodiment at least one end surface of the mute floor is provided with second buffer groove 18, second buffer groove 18 is opened in first buffer layer 14, and second buffer groove 18 extends to the both sides of mute floor and penetrates.Specifically, the two sides of mute floor are respectively provided with first buffer groove 17, and the two ends are respectively provided with second buffer groove 18, and the cross-sectional shape of first buffer groove 17 and second buffer groove 18 is semicircular shape, which can also be other circular arc shape or triangular shape.The notch width of first buffer groove 17 and second buffer groove 18 is less than or equal to the thickness of first buffer layer 14.It should be noted that first buffer groove 17 extends to the both ends of mute floor and penetrates, and second buffer groove 18 extends to the both sides of mute floor and penetrates as a preferred embodiment, under the premise of meeting the aforementioned installation and use effect, first buffer groove 17 and second buffer groove 18 do not need to penetrate completely, first buffer groove 17 and second buffer groove 18 have enough length, and the small thickness groove wall at both ends of first buffer groove 17 and second buffer groove 18 does not affect the technical effect of the application, and also falls within the protection scope of the application.

[0055] Example 1

[0056] The surface treatment layer 10 is made of UV-cured paint, the protective layer 11 is made of polyvinyl chloride material, the decorative layer 12 is made of polyvinyl chloride material, the first carrier 13 is made of high-end vinyl flooring (LVT), the first cushion layer 14 is made of IXPP, closed-cell flexible foam, the second carrier 15 is made of rigid polyvinyl chloride substrate layer, the second cushion layer 16 is made of IXPE, and the first carrier 13 includes a reinforcing layer 132 made of glass fiber, and the glass fiber of the reinforcing layer 132 is located inside the first carrier.

[0057] Example 2

[0058] The surface treatment layer 10 is made of UV-cured paint, the protective layer 11 is made of polyvinyl chloride material, the decorative layer 12 is made of polyvinyl chloride material, the first carrier 13 is made of high-end vinyl flooring (LVT), the first cushion layer 14 is made of IXPP, closed-cell flexible foam, the second carrier 15 is made of rigid polyvinyl chloride substrate layer, the second cushion layer 16 is made of IXPE, and the first carrier 13 includes a reinforcing layer 132 made of glass fiber, and the glass fiber of the reinforcing layer 132 is located inside the first carrier.

[0059] Example 3

[0060] The surface treatment layer 10 is made of UV-cured paint, the protective layer 11 is made of polyvinyl chloride material, the decorative layer 12 is made of polyvinyl chloride material, the first carrier 13 is made of high-end vinyl flooring (LVT), the first cushion layer 14 is made of IXPP, closed-cell flexible foam, the second carrier 15 is made of rigid polyvinyl chloride substrate layer, the second cushion layer 16 is made of IXPE, and the first carrier 13 includes a reinforcing layer 132 made of glass fiber, and the glass fiber of the reinforcing layer 132 is located inside the first carrier.

[0061] Example 4

[0062] The surface treatment layer 10 is made of UV-cured paint, the protective layer 11 is made of polyvinyl chloride material, the decorative layer 12 is made of polyvinyl chloride material, the first carrier 13 is made of high-end vinyl flooring (LVT), the first cushion layer 14 is made of IXPP, closed-cell flexible foam, the second carrier 15 is made of rigid polyvinyl chloride substrate layer, the second cushion layer 16 is made of IXPE, and the first carrier 13 includes a reinforcing layer 132 made of glass fiber, and the glass fiber of the reinforcing layer 132 is located inside the first carrier.

[0063] Comparative Example 1

[0064] The surface treatment layer 10 is made of UV-cured paint, the protective layer 11 is made of polyvinyl chloride material, the decorative layer 12 is made of polyvinyl chloride material, the first carrier 13 is made of high-end vinyl flooring (LVT), the first cushioning layer 14 is made of IXPP, closed-cell flexible foam, the second carrier 15 is made of rigid polyvinyl chloride substrate layer, the second cushioning layer 16 is made of IXPE, and the first carrier 13 does not contain a reinforcing layer 132.

[0065] Comparative Example 2

[0066] The surface treatment layer 10 is made of UV-cured paint, the protective layer 11 is made of polyvinyl chloride material, the decorative layer 12 is made of polyvinyl chloride material, the first carrier 13 is made of high-end vinyl flooring (LVT), the first cushioning layer 14 is made of IXPP, closed-cell flexible foam, the second carrier 15 is made of rigid polyvinyl chloride substrate layer, the second cushioning layer 16 is made of IXPE, and the first carrier 13 does not contain a reinforcing layer 132.

[0067] Comparative Example 3

[0068] The surface treatment layer 10 is made of UV-cured paint, the protective layer 11 is made of polyvinyl chloride material, the decorative layer 12 is made of polyvinyl chloride material, the first carrier 13 is made of high-end vinyl flooring (LVT), the first cushioning layer 14 is made of IXPP, closed-cell flexible foam, the second carrier 15 is made of rigid polyvinyl chloride substrate layer, the second cushioning layer 16 is made of IXPE, and the first carrier 13 does not contain a reinforcing layer 132.

[0069] Comparative Example 4

[0070] The surface treatment layer 10 is made of UV-cured paint, the protective layer 11 is made of polyvinyl chloride material, the decorative layer 12 is made of polyvinyl chloride material, the first carrier 13 is made of high-end vinyl flooring (LVT), the first cushioning layer 14 is made of IXPP, closed-cell flexible foam, the second carrier 15 is made of rigid polyvinyl chloride substrate layer, the second cushioning layer 16 is made of IXPE, and the first carrier 13 does not contain a reinforcing layer 132.

[0071] Comparative Example 5

[0072] The surface treatment layer 10 is made of UV-cured paint, the protective layer 11 is made of polyvinyl chloride material, the decorative layer 12 is made of polyvinyl chloride material, the first carrier 13 is made of high-end vinyl flooring (LVT), the first cushioning layer 14 is made of IXPP, closed-cell flexible foam, the second carrier 15 is made of rigid polyvinyl chloride substrate layer, the second cushioning layer 16 is made of IXPE, and the first carrier 13 does not contain a reinforcing layer 132.

[0073] Comparative Example 6

[0074] The surface treatment layer 10 adopts ultraviolet light curing paint, the protection layer 11 adopts polyvinyl chloride material, the decorative layer 12 adopts polyvinyl chloride material, high-end ethylene base plate (LVT), the first buffer layer 14 adopts IXPP, closed cell flexible foam, the second carrier 15 adopts foamed polyvinyl chloride base layer, the second buffer layer 16 adopts IXPE, and the glass fiber of the reinforcing layer 132 is located above the first carrier.

[0075] The floor in examples 1, 2, 3, 4 and the floor in comparative examples 1-6 are baked in an oven at a temperature of 80 DEG C for 6h, and comparative analysis is carried out, and the results are shown in table 1:

[0076] Table 1 heat resistance test results

[0077]

[0078] It can be known from the above table 1 that compared with the floor made by comparative examples 1-6, the floor made by examples 1-4 has obviously better heat resistance, better dimensional stability at high temperature (smaller warping) and lower shrinkage because of the setting of the extremely strong layer in the first carrier.

[0079] The above are only preferred embodiments of the present application, and do not limit the patent range of the present application, and any equivalent structural transformation made by the present application specification and drawings, or direct / indirect application in other related technical fields under the utility model concept of the present application are included in the patent protection range of the present application.

Claims

1. A silent floor, characterized in that The surface treatment layer, the protective layer, the decorative layer, the first carrier, the first buffer layer, and the second carrier are included. The surface treatment layer is arranged on one side of the protective layer, the decorative layer is arranged on the other side of the protective layer, the first carrier is arranged between the decorative layer and the first buffer layer, the first buffer layer is arranged between the first carrier and the second carrier, and the first buffer layer is a porous structure and / or a network structure. At least one side of the first buffer layer is provided with a buffer groove, and the buffer groove extends to both ends of the side.

2. The silent floor according to claim 1, characterized in that The notch of the buffer groove faces the outside of the floor side.

3. The silent floor according to claim 1, characterized in that The width of the buffer groove is less than or equal to the thickness of the first buffer layer.

4. The silent floor according to claim 1, characterized in that The porous structure includes a closed-cell porous structure, a semi-closed-cell porous structure, and an open-cell porous structure.

5. The silent floor according to claim 4, characterized in that The porous structure material is one or more of polyolefin foam, expanded polystyrene, expanded polypropylene, expanded rubber, expanded ethylene vinyl acetate, expanded ethylene, expanded polyethylene, ethylene-vinyl acetate copolymer, irradiation cross-linked polyethylene, polypropylene, compressible natural material, and polystyrene.

6. The silent floor according to claim 1, characterized in that The network structure includes a honeycomb structure and a network accumulation structure.

7. The silent floor according to claim 6, characterized in that The network structure material is one or more of ethylene-vinyl acetate copolymer, irradiation cross-linked polyethylene, foamed polypropylene, and foamed polystyrene.

8. The silent floor according to claim 1, characterized in that The first carrier is one or more of a high-density fiberboard layer, a wood-plastic composite material layer, a polyvinyl chloride resin layer, a high-end vinyl material layer, a polyethylene terephthalate layer, a polypropylene resin layer, or a polyethylene terephthalate-1,4-cyclohexane dimethanol layer.

9. The silent floor according to claim 1, wherein The first carrier includes at least one reinforcing layer inside the first carrier.

10. The silent floor according to claim 9, characterized in that The reinforcing layer includes a net or a mesh.

11. The silent floor according to claim 10, characterized in that The net or mesh includes glass fibers, jute, and / or cotton.

12. The silent floor according to claim 1, characterized in that A second buffer layer is also included, which is arranged on the side of the second carrier away from the first buffer layer.

13. The silent floor according to claim 1, characterized in that The first buffer layer has a Shore A hardness of 80 to 100, the first carrier has an elastic modulus in the range of 100 MPa to 500 MPa, and the second carrier has an elastic modulus in the range of 2000 MPa to 7000 MPa.

14. The silent floor according to claim 13, characterized in that The first carrier has an elastic modulus in the range of 100 MPa to 300 MPa, and the second carrier has an elastic modulus in the range of 2000 MPa to 3000 MPa when the second carrier is a foamed chloroethylene base material layer.

Citation Information

Cited By

  • Silent wood composite floor and preparation method thereof

    CN121473538A

  • Silent wood composite floor and preparation method thereof

    CN121473538B

  • Stone composite wallboard and preparation method thereof

    CN121700939A