Domain controller and vehicle
By employing a combination of PCB board, heat pipe and fan in the domain controller, the problems of poor heat dissipation performance and large structural size are solved, achieving efficient heat dissipation and compact structure, and reducing the overall vehicle cost.
Patent Information
- Application Number
- CN202422895250.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-26
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2034-11-26
AI Technical Summary
Existing domain controllers have poor heat dissipation performance and large structural size. Liquid cooling solutions increase the overall vehicle cost and are limited by space, while air cooling solutions cannot meet the chip heat dissipation requirements, which increases the difficulty of heat dissipation optimization.
The PCB board is mounted on the lower shell, the chip is connected to the back of the PCB board, the heat pipe is installed between the PCB board and the upper shell, and the fan is installed on the outside of the upper shell. The combination of heat pipe and fin structure improves heat dissipation efficiency and has a compact structure.
It improves heat dissipation efficiency, reduces structural size and manufacturing cost, avoids the space and cost increases of water cooling solutions, and meets the heat dissipation requirements of the chip.
Smart Images
Figure CN223528385U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to vehicle engineering technical field especially is related to a domain controller and vehicle. BACKGROUND
[0002] With the deepening of the degree of automobile electronization, more and more functions are integrated into electronic control system, which needs the powerful computing resource of chip to support, so the chip heating power on the whole vehicle is bigger and bigger. For this kind of high-power main chip, when air cooling cannot meet, liquid cooling cooling scheme is generally adopted. But for fuel vehicle type, adopting liquid cooling scheme increases the water cooling pipeline and system and increases the cost of the whole vehicle, sometimes the space of the whole vehicle does not support to increase the water cooling system, and pure air cooling scheme cannot meet the chip heat dissipation requirement, thereby increasing the optimization difficulty of domain controller heat dissipation performance. SUMMARY
[0003] The utility model discloses a kind of domain controller and vehicle, to alleviate the technical problem that domain controller heat dissipation performance is poor in prior art, and structure size is big.
[0004] Firstly, the utility model provides a domain controller, comprising: lower shell, PCB board, heat pipe, upper shell and fan;
[0005] The PCB board is installed to the lower shell, and the surface of the PCB board opposite to the lower shell is connected with chip;
[0006] The upper shell is connected with the lower shell, and the upper shell covers the PCB board.
[0007] The heat pipe is installed between the PCB board and the upper shell, and the chip is heat-conducted with the upper shell through the heat pipe.
[0008] The fan is installed to the outside of the upper shell.
[0009] In combination with first aspect, the utility model provides a first possible implementation of first aspect, wherein the upper shell is provided with mounting groove matched with the heat pipe.
[0010] In combination with first aspect, the utility model provides a second possible implementation of first aspect, wherein the mounting groove is filled with epoxy resin, or the heat pipe is welded in the mounting groove.
[0011] In combination with first aspect, the utility model provides a third possible implementation of first aspect, wherein the upper shell is provided with protruding part close to the PCB board and abutting on the heat generating element on the PCB board.
[0012] In combination with the first aspect, the utility model provides a fourth possible implementation of the first aspect, wherein the heat pipe is filled with a heat-conducting glue between the heat pipe and the chip.
[0013] In combination with the first aspect, the utility model provides a fifth possible implementation of the first aspect, wherein the heat pipe has a first condensing section, an evaporating section and a second condensing section, the first condensing section, the evaporating section and the second condensing section are connected in sequence, and the evaporating section is attached to the chip.
[0014] In combination with the fifth possible implementation of the first aspect, the utility model provides a sixth possible implementation of the first aspect, wherein the first condensing section and the second condensing section are arranged in parallel.
[0015] In combination with the first aspect, the utility model provides a seventh possible implementation of the first aspect, wherein the upper shell outer surface is provided with a plurality of fins, and any two adjacent fins form an air duct in fluid communication with the fan.
[0016] In combination with the first aspect, the utility model provides an eighth possible implementation of the first aspect, wherein the lower shell is embedded in the bottom of the upper shell.
[0017] The second aspect provides a vehicle equipped with the domain controller of the first aspect.
[0018] The embodiment of the utility model brings following beneficial effects: adopt the PCB board to install in the lower shell, and the surface of the PCB board is connected with the chip in the direction of away from the lower shell, the upper shell is connected with the lower shell, and the upper shell covers the PCB board, the heat pipe is installed between the PCB board and the upper shell, and the chip is heat-conducted with the upper shell through the heat pipe, and the fan is installed outside the upper shell, which not only improves the heat dissipation efficiency, but also has more compact structure and smaller occupied space.
[0019] In order to make the above-mentioned purpose, features and advantages of the utility model more obvious and easy to understand, the following preferred embodiments are described in detail below, and the accompanying drawings are described as follows. DRAWINGS
[0020] In order to more clearly illustrate the technical scheme in the specific embodiment or the related technical scheme of the utility model, the following will briefly introduce the drawings needed to be used in the specific embodiment or the related technical description, and obviously, the drawings in the following description are some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained without creative labor under the premise of the drawings.
[0021] Figure 1 The explosion diagram of the domain controller provided by the embodiment of the utility model is shown in the following figure:
[0022] Figure 2 A schematic view of an upper shell of a domain controller provided by the embodiment of the present utility model;
[0023] Figure 3 A schematic view of a domain controller provided by the embodiment of the present utility model.
[0024] Icon: 100 - lower shell; 200 - PCB board; 300 - heat pipe; 301 - first condensing section; 302 - evaporating section; 303 - second condensing section; 400 - upper shell; 401 - mounting groove; 402 - protruding part; 403 - fin; 500 - fan; 600 - chip. DETAILED DESCRIPTION
[0025] The technical solutions of the present utility model will be described clearly and completely below in combination with the drawings. Obviously, the described embodiments are only some of the embodiments of the present utility model, not all the embodiments. Based on the embodiments in the present utility model, all the other embodiments obtained by the ordinary skilled in the art without making creative efforts fall within the scope of protection of the present utility model.
[0026] In the description of the present utility model, it needs to be explained that the orientations or position relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like are the orientations or position relationships shown in the drawings, which are only for the convenience of describing the present utility model and simplifying the description, and are not intended to indicate or imply that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance. The physical quantities in the formulas, such as no separate marking, should be understood as the basic quantities of the International System of Units, or the derived quantities derived from the basic quantities by multiplication, division, differentiation or integration, etc.
[0027] In the description of the present utility model, it needs to be explained that, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For the ordinary skilled in the art, the specific meaning of the above terms in the present utility model can be understood according to the specific circumstances.
[0028] As Figure 1As shown, the domain controller provided by the embodiment of the utility model, including: lower shell 100, PCB board 200, heat pipe 300, upper shell 400 and fan 500, PCB board 200 is installed in lower shell 100, and the surface of PCB board 200 is connected with chip 600 back to lower shell 100, upper shell 400 is connected with lower shell 100, and upper shell 400 covers PCB board 200, heat pipe 300 is installed between PCB board 200 and upper shell 400, and makes chip 600 heat conduction with upper shell 400 through heat pipe 300, fan 500 is installed outside upper shell 400.
[0029] Specifically, lower shell 100 and upper shell 400 can be processed by die casting, chip 600 can be cooled by heat pipe 300, the heat of heat pipe 300 can be transmitted to upper shell 400, and the upper shell 400 is air-cooled by fan 500, so as to accelerate heat dissipation. The domain controller recorded in the embodiment has the advantages of high heat dissipation efficiency and compact structure, and compared with the water cooling scheme, not only the structure size is smaller, but also the manufacturing cost is lower.
[0030] As shown in Figure 1 and Figure 2 In the embodiment of the utility model, upper shell 400 is provided with mounting groove 401 matched with heat pipe 300. Among them, mounting groove 401 can be formed once during the die casting process of upper shell 400, without secondary processing.
[0031] In the optional embodiment, the depth of mounting groove 401 is 2mm-3mm, heat pipe 300 is configured as a flat structure, and heat pipe 300 is embedded in mounting groove 401 and protrudes compared with the inner wall surface of upper shell 400, so that heat pipe 300 abuts chip 600.
[0032] Further, mounting groove 401 is filled with epoxy resin, or heat pipe 300 is welded in mounting groove 401, so as to ensure smooth heat transfer between heat pipe 300 and upper shell 400.
[0033] In addition, upper shell 400 is provided with protruding part 402 protruding towards PCB board 200 and abutting on the heat generating element on PCB board 200. Heat pipe 300 can be flush with protruding part 402, and chip 600 as a high-heat heat generating element can be cooled by heat pipe 300, and the remaining low-heat heat generating elements can be directly contacted with protruding part 402 to achieve heat dissipation.
[0034] Further, heat pipe 300 and chip 600 are filled with heat-conducting glue, so as to avoid the gap between heat pipe 300 and chip 600, which leads to low heat transfer efficiency, and the gap is filled with heat-conducting glue, so as to improve the heat transfer efficiency.
[0035] In an optional embodiment, the heat pipe 300 has a first condensing section 301, an evaporating section 302 and a second condensing section 303, which are connected in sequence, and the evaporating section 302 is attached to the chip 600.
[0036] Further, the first condensing section 301 and the second condensing section 303 are arranged in parallel, and the first condensing section 301, the evaporating section 302 and the second condensing section 303 form a U-shaped structure, which can increase the temperature difference between the evaporating section 302 and the condensing section in a limited space, thereby improving the heat transfer efficiency of the heat pipe.
[0037] As shown in Figure 1 The outer surface of the upper shell 400 is provided with a plurality of fins 403, and any two adjacent fins 403 form an air duct in fluid communication with the fan 500, and the heat dissipation area is increased by the plurality of fins 403, thereby improving the heat dissipation efficiency.
[0038] As shown in Figure 3 The lower shell 100 is embedded in the bottom of the upper shell 400, and the lower shell 100 and the upper shell 400 can be connected by buckling or can be fixed by glue sealing, and the lower shell 100 is embedded in the bottom of the upper shell 400, which can make the structure more compact.
[0039] The vehicle provided by the embodiment of the present application is equipped with the domain controller described in the above embodiment, and has the technical advantages of the domain controller, which will not be described here.
[0040] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the above embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. A domain controller, characterized by, The application relates to a heat dissipation device for a chip. The heat dissipation device comprises a lower shell (100), a PCB board (200), a heat pipe (300), an upper shell (400) and a fan (500). The PCB board (200) is installed on the lower shell (100), and a chip (600) is connected to the surface of the PCB board (200) which is away from the lower shell (100). The upper shell (400) is connected to the lower shell (100), and the upper shell (400) covers the PCB board (200). The heat pipe (300) is installed between the PCB board (200) and the upper shell (400), and the chip (600) is in heat conduction with the upper shell (400) through the heat pipe (300). The fan (500) is installed outside the upper shell (400).
2. The domain controller of claim 1, wherein, The upper shell (400) is provided with a mounting groove (401) which is matched with the heat pipe (300).
3. The domain controller of claim 2, wherein, The mounting groove (401) is filled with epoxy resin, or the heat pipe (300) is welded in the mounting groove (401).
4. The domain controller of claim 1, wherein, The upper shell (400) is provided with a protruding part (402) which protrudes towards the PCB board (200) and abuts against the heat-generating element on the PCB board (200).
5. The domain controller of claim 1, wherein, Thermal conductive glue is filled between the heat pipe (300) and the chip (600).
6. The domain controller of claim 1, wherein, The heat pipe (300) has a first condensing section (301), an evaporating section (302) and a second condensing section (303), the first condensing section (301), the evaporating section (302) and the second condensing section (303) are connected in sequence, and the evaporating section (302) is attached to the chip (600).
7. The domain controller of claim 6, wherein, The first condensing section (301) and the second condensing section (303) are arranged in parallel.
8. The domain controller of claim 1, wherein, The outer surface of the upper shell (400) is provided with a plurality of fins (403), and any two adjacent fins (403) form an air duct which is in fluid communication with the fan (500).
9. The domain controller of claim 1, wherein, The lower shell (100) is embedded in the bottom of the upper shell (400).
10. A vehicle characterized by comprising: The vehicle is provided with the domain controller according to any one of claims 1-9.