Heat-conducting glue curing and pressing mechanism
By combining the support base and the clamping cover, the PCBA board is clamped by the spring pressure column, which solves the problem of uneven thickness during the curing process of thermally conductive adhesive, improves heat dissipation and bonding strength, and reduces production costs and process complexity.
Patent Information
- Application Number
- CN202422549326.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-22
- Publication Date
- 2025-11-11
- Estimated Expiration
- 2034-10-22
AI Technical Summary
During the curing process of thermally conductive adhesive, the adhesive thickness cannot be guaranteed, resulting in unstable heat dissipation and bonding strength, which increases production costs and process complexity.
The system employs a combination structure of support base and clamping cover, using spring-loaded columns to press the PCBA board firmly, ensuring that the adhesive is spread evenly. It also adapts to different PCBA board models through detachable mounting holes and interchangeable card slots, avoiding the need to set connection holes on the PCBA board.
It improves the uniformity and bonding strength of the adhesive, reduces production costs, increases the product qualification rate and versatility, and reduces additional production process steps.
Smart Images
Figure CN223530772U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of pressing device technology, and in particular to a thermally conductive adhesive curing pressing mechanism. Background Technology
[0002] Currently, automotive headlights commonly use LED light sources. To prevent the LED light source from rapidly degrading due to excessive temperature, a special thermally conductive adhesive is typically applied between the heat sink and the PCBA. This adhesive has both thermal conductivity and adhesive properties. This connection method not only improves the heat dissipation of the light source but also saves on the need to machine connection holes for fixing the PCBA to the heat sink.
[0003] During the curing process of thermally conductive adhesive, the thickness of the adhesive cannot be guaranteed, leading to unstable heat dissipation and bonding strength, ultimately making it difficult to ensure product yield. To ensure the thickness of the thermally conductive adhesive and its even spread, existing technologies typically use connectors (such as rivets or screws) to fix the PCBA to the heatsink, allowing the adhesive to spread before waiting for it to cure. This method requires connecting holes on the PCBA for these connectors, increasing additional manufacturing processes, production line investment, and material costs. Utility Model Content
[0004] In view of this, the present invention provides a thermally conductive adhesive curing and pressing mechanism, which improves the uniformity of adhesive spreading, enhances the heat dissipation effect and bonding strength stability of the product, and increases the pass rate of bonding.
[0005] To achieve the above objectives, this utility model provides the following technical solution:
[0006] A thermally conductive adhesive curing and clamping mechanism, comprising:
[0007] A support base includes a support structure on which a heat sink is placed and the heat sink is fixed to a PCBA board.
[0008] A clamping cover includes a cover body and multiple spring-loaded posts, one end of which is slidably connected to the cover body and the other end is pressed against the PCBA board;
[0009] The clamping cap is engaged with the support base;
[0010] The cover is provided with a plurality of first mounting holes for connecting the spring pressure column, and each spring pressure column can be detachably connected to the corresponding first mounting hole.
[0011] Optionally, the clamping cover further includes a switching slot plate, which is disposed on the surface of the cover away from the support base. The switching slot plate is provided with a plurality of slots, the positions of which correspond one-to-one with the first mounting holes on the cover. One end of the spring pressure column is engaged in the slot.
[0012] Optionally, each of the card slots includes at least two intersecting card slots, and a first through hole is provided at the intersection of different card slots. The spring pressure post passes through the first through hole, and the end of the spring pressure post is engaged in any of the card slots.
[0013] Optionally, the spring-loaded column includes a column body, a spring, a copper sleeve, and a limiting pin. The spring and the copper sleeve are both sleeved on the column body. The limiting pin passes through one end of the column body, and a pressure head is provided at the other end of the column body. The pressure head presses on the PCBA board.
[0014] The outer surface of the copper sleeve is interference-fitted into the first mounting hole of the cover, and the gap between the column and the cavity of the copper sleeve is provided.
[0015] The spring is disposed between the copper sleeve and the pressure head.
[0016] Optionally, the pressure head is disposed at the end of the column via a connecting plate, the size of the connecting plate being larger than the diameter of the column, one end of the spring being limited by the connecting plate, and the other end being limited by a spring limiting plate;
[0017] The spring limiting plate is fixedly connected to the cover, and the column passes through the spring limiting plate;
[0018] The pressure head is either concentric or eccentrically positioned with respect to the column.
[0019] Optionally, the clamping cover further includes a snap-fit connecting hook, which includes a hook body and a snap hook connected together. The hook body is rotatably connected to a limiting block via a rotating shaft. The limiting block is fixedly connected to the cover body. The snap hook is snapped into the support seat. The hook body is connected to the cover body via a spring plunger.
[0020] Optionally, the bottom of the limiting block is provided with a first limiting structure, which is inserted into the second limiting structure on the support base.
[0021] One of the first limiting structure and the second limiting structure is a limiting pin, and the other is a limiting hole. The end of the limiting pin near the limiting hole is a tapered end.
[0022] Optionally, the support base includes a base plate, on which a support platform is provided. The support platform is provided corresponding to the edge of the radiator, and the edge of the radiator is placed on the support platform.
[0023] Optionally, a positioning pin is provided on the top surface of the support platform, the positioning pin is provided corresponding to the third mounting hole on the heat sink, and the top of the positioning pin is a tapered end;
[0024] The side of the support platform is provided with a snap-fit groove, and the clamping cover snaps into the snap-fit groove.
[0025] Optionally, a limiting platform is provided on the base plate, a positioning copper sleeve is installed on the limiting platform, a limiting hole is provided on the positioning copper sleeve, the limiting hole is correspondingly provided with a limiting pin on the pressing cover, and the limiting pin is inserted into the limiting hole.
[0026] As can be seen from the above technical solution, the thermally conductive adhesive curing and pressing mechanism provided by this utility model, by setting a support base for support and a pressing cover for pressing, allows the heat sink to be supported by the support base during the curing process of the PCBA board after it is bonded to the heat sink with thermally conductive adhesive. The PCBA board is tightly pressed by the spring-loaded column on the pressing cover, ensuring uniform spread of the adhesive, improving the heat dissipation effect and bonding strength stability of the product, ensuring the thickness of the thermally conductive adhesive, and increasing the bonding pass rate. Simultaneously, multiple first mounting holes are provided, and the spring-loaded column can be replaced with different first mounting holes as needed, thereby switching the position of the spring-loaded column and thus changing the pressing position. This allows for compatibility with different models of PCBA boards, improving versatility, reducing the number of pressing mechanisms manufactured for different models, and saving on replacement costs. This thermally conductive adhesive curing and pressing mechanism eliminates the need for connection holes for the bonding process on the PCBA board, avoiding additional production processes, reducing process steps, and lowering production costs. Attached Figure Description
[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0028] Figure 1 A schematic diagram of the assembly structure of the thermally conductive adhesive curing and pressing mechanism provided in this embodiment of the utility model;
[0029] Figure 2 A schematic diagram showing the disassembled structure of the pressing cover and support base of the thermally conductive adhesive curing and pressing mechanism provided in this embodiment of the utility model;
[0030] Figure 3 A schematic diagram of the structure of the clamping cap at one angle provided in an embodiment of this utility model;
[0031] Figure 4 An exploded view of the compression cap provided in an embodiment of this utility model;
[0032] Figure 5 This is a structural schematic diagram of the clamping cap from another angle, provided in an embodiment of the present invention.
[0033] Figure 6 A structural schematic diagram of the clamping cap provided in another embodiment of this utility model;
[0034] Figure 7 A schematic diagram of the structure of the cover provided in an embodiment of this utility model;
[0035] Figure 8 This is a schematic diagram of the structure of the switching slot plate provided in an embodiment of the present utility model;
[0036] Figure 9 A partially enlarged structural diagram of the switching slot plate provided in an embodiment of this utility model;
[0037] Figure 10 This is an exploded structural diagram of a spring-loaded column according to an embodiment of the present invention;
[0038] Figure 11 for Figure 10 A schematic diagram of the assembly structure of the spring-loaded column;
[0039] Figure 12 This is a schematic diagram of the structure of the spring-loaded column provided in another embodiment of the present invention;
[0040] Figure 13 This is a schematic diagram of the structure of the spring limiting plate provided in an embodiment of the present utility model;
[0041] Figure 14 A schematic diagram of the structure of the support base provided in an embodiment of this utility model;
[0042] Figure 15 This is a schematic diagram of the structure after the heat sink and PCBA board are bonded together.
[0043] Figure 16 This is a schematic diagram of the structure of the support base after the heat sink is installed in an embodiment of the present utility model;
[0044] Figure 17 A schematic diagram of the structure of the limiting pin placed in a sub-slot of the card slot according to an embodiment of the present utility model;
[0045] Figure 18for Figure 17 A schematic diagram showing the position of the pressure head in the position state of the limit pin;
[0046] Figure 19 for Figure 17 A schematic diagram of the structure in which the limiting pin disengages from the card slot;
[0047] Figure 20 for Figure 19 A schematic diagram showing the limit pin rotating to correspond to another card slot;
[0048] Figure 21 for Figure 20 A diagram showing the insertion of the limiting pin into another card slot;
[0049] Figure 22 for Figure 21 A schematic diagram showing the position of the pressure head in the limit pin position state.
[0050] in:
[0051] 1. Press the cap tightly.
[0052] 101. Switch the card slot plate.
[0053] 1011, Card slot; 10111, Card slot; 10112, First through hole; 1012, Third through hole; 1013, Label; 1014, Sixth through hole.
[0054] 102. Cover body,
[0055] 1021, First mounting hole; 1022, Threaded connection hole; 1023, Fifth through hole; 1024, Seventh through hole.
[0056] 103. Snap-fit connecting hook,
[0057] 1031. Hook,
[0058] 104. Limit block,
[0059] 105. Spring-loaded column,
[0060] 1051. Limit pin; 1052. Copper sleeve; 1053. Spring; 1054. Column; 10541. Second mounting hole; 10542. Pressure head; 10543. Connecting plate.
[0061] 106. Spring limit plate,
[0062] 1061, Second through hole; 1062, Fourth through hole; 1063, Eighth through hole.
[0063] 107. Shaft,
[0064] 108. Limit pin,
[0065] 109. Spring plunger
[0066] 110. Second connecting bolt,
[0067] 2. Support base
[0068] 201. Base plate; 202. Support platform; 203. Positioning copper sleeve; 204. Positioning pin; 205. Snap-fit groove; 206. Limiting platform.
[0069] 3. PCBA board,
[0070] 4. Radiator
[0071] 401, Third mounting hole. Detailed Implementation
[0072] This utility model discloses a thermally conductive adhesive curing and pressing mechanism, which improves the uniformity of adhesive spreading, enhances the heat dissipation effect and bonding strength stability of the product, and increases the pass rate of bonding.
[0073] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0074] Reference Figures 1 to 16 This utility model discloses a thermally conductive adhesive curing and clamping mechanism, comprising a support base 2 and a clamping cover 1 for cooperative use. The support base 2 includes a support structure on which an adhesive PCBA board 3 and a heat sink 4 are placed, and the support structure is used to support the PCBA board 3 and the heat sink 4. The clamping cover 1 includes a cover body 102 and a plurality of spring-loaded pressure posts 105. One end of each spring-loaded pressure post 105 is slidably connected to the cover body 102, and the other end presses against the PCBA board 3, thereby achieving clamping and limiting of the PCBA board 3. For easy connection, the clamping cover 1 is snapped into the support base 2. To ensure the uniformity of the thermally conductive adhesive thickness, a plurality of spring-loaded pressure posts 105 are provided, so that clamping force can be applied to multiple positions of the PCBA board 3, improving the uniformity of the adhesive thickness. The cover body 102 is provided with a plurality of first mounting holes 1021 for connecting the spring-loaded pressure posts 105, and each spring-loaded pressure post 105 is detachably connected to the corresponding first mounting hole 1021.
[0075] The PCBA board 3 has a heat sink 4 bonded to it with thermally conductive adhesive, and the edge of the heat sink 4 is directly supported by the support base 2. Multiple spring pressure posts 105 are detachably connected to the cover 102, so that the number and position of the spring pressure posts 105 can be determined according to the actual structure of the PCBA board 3, avoiding affecting the functional components on the PCBA board 3, thus making it suitable for PCBA boards of different specifications.
[0076] This utility model discloses a thermally conductive adhesive curing and clamping mechanism. By setting a support base 2 for support and a clamping cover 1 for clamping, after the PCBA board 3 is bonded to the heat sink 4 with thermally conductive adhesive, during the adhesive curing process, the heat sink 4 is supported by the support base 2, and the PCBA board 3 is tightly pressed down by the spring-loaded pressure column 105 on the clamping cover 1. This ensures the adhesive is evenly spread, improves the heat dissipation effect and bonding strength stability of the product, maintains the thickness of the thermally conductive adhesive, and increases the bonding pass rate. Simultaneously, multiple first mounting holes 1021 are provided. The spring-loaded pressure column 105 can be replaced with different first mounting holes 1021 as needed, thereby switching the position of the spring-loaded pressure column 105 and thus changing the clamping position. This allows for compatibility with clamping different models of PCBA boards 3, improving versatility, reducing the number of clamping mechanisms manufactured for different models, and saving on replacement costs. This utility model's thermally conductive adhesive curing and clamping mechanism eliminates the need for connection holes for the bonding process on the PCBA board 3, avoiding additional production processes, reducing process steps, and lowering production costs.
[0077] To facilitate changing the clamping angle of the spring-loaded column 105, the clamping cover 1 also includes a switching slot plate 101, which is disposed on the surface of the cover 102 away from the support base 2. Specifically, as shown... Figure 8 and Figure 9 As shown, the switching plate 101 is provided with multiple slots 1011, and the positions of the slots 1011 correspond one-to-one with the first mounting holes 1021 on the cover 102. The first mounting holes 1021 are as follows: Figure 7 As shown, this facilitates the passage of the spring pressure post 105. One end of the spring pressure post 105 is engaged in the slot 1011, which facilitates the assembly and disassembly of the spring pressure post 105 and the switching of the installation position of the spring pressure post 105.
[0078] To facilitate orientation adjustment, each slot 1011 includes at least two intersecting sub-slots 10111. A first through hole 10112 is provided at the intersection of the different sub-slots 10111. A spring pressure post 105 passes through the first through hole 10112, and the end of the spring pressure post 105 is engaged within a sub-slot 10111. In one embodiment, as... Figure 8 and Figure 9As shown, the card slot 1011 includes two intersecting sub-slots 10111, with the intersection of the two sub-slots 10111 located at the center of the sub-slots 10111. The included angle between the two sub-slots 10111 can be an acute angle or a right angle, which can be set by those skilled in the art according to actual needs.
[0079] To ensure that the end of the spring-loaded column 105 can be reliably pressed against the PCBA board 3, the spring-loaded column 105 includes a column body 1054, a spring 1053, a copper sleeve 1052, and a limiting pin 1051, as follows: Figure 10 and Figure 11 As shown, spring 1053 and copper sleeve 1052 are both sleeved on column 1054. The outer surface of copper sleeve 1052 is interference-fitted into the first mounting hole 1021 of cover 102, thereby fixing copper sleeve 1052 into the first mounting hole 1021. A through cavity is provided inside copper sleeve 1052 along the axial direction. Column 1054 passes through the through cavity of copper sleeve 1052. The cavity between column 1054 and copper sleeve 1052 is spaced to facilitate sliding of column 1054 within copper sleeve 1052. Limiting pin 1051 passes through one end of column 1054. A pressure head 10542 is provided at the other end of column 1054, pressing the pressure head 10542 onto PCBA board 3. To facilitate the connection of the limiting pin 1051, a second mounting hole 10541 is provided at one end of the column 1054 near the cover 102. The second mounting hole 10541 is a through hole arranged radially along the column 1054, and the limiting pin 1051 is inserted into the second mounting hole 10541. Figure 10 As shown, the axis of the column 1054 is perpendicular to the axis of the second mounting hole 10541. A spring 1053 is positioned between the copper sleeve 1052 and the pressure head 10542, and the spring 1053 is used to press the pressure head 10542 firmly onto the PCBA board 3. When the spring-loaded column 105 is connected to the switching slot plate 101, the limiting pin 1051 is placed within the slot 10111.
[0080] To facilitate limiting the two ends of the spring 1053, the pressure head 10542 is disposed at the end of the column 1054 via a connecting plate 10543. The connecting plate 10543 is larger than the diameter of the column 1054, meaning the outer contour of the side of the connecting plate 10543 is larger than the outer contour of the connecting end of the column 1054. Figure 11 or Figure 12As shown, this results in the end area of the connecting plate 10543 being larger than the end area of the column 1054, and creates a portion between the end face of the connecting plate 10543 and the end face of the column 1054 that limits the spring 1053. Specifically, one end of the spring 1053 is limited by the connecting plate 10543, and the other end is limited by the spring limiting plate 106. It can be understood that the spring limiting plate 106 is provided with a second through hole 1061 for the column 1054 to pass through, such as... Figure 13 As shown. The spring limiting plate 106 is fixedly connected to the cover 102 and the switching slot plate 101 by a first connecting bolt. To facilitate the passage of the first connecting bolt, the switching slot plate 101 is provided with a third through hole 1012, the spring limiting plate 106 is provided with a fourth through hole 1062, and the cover 102 is provided with a fifth through hole 1023. The third through hole 1012, the fourth through hole 1062, and the fifth through hole 1023 are correspondingly provided. The switching slot plate 101 is also provided with a label 1013, which can be marked with the name and number of the upper mold tooling as needed. The switching slot plate 101 is also provided with a sixth through hole 1014, the cover 102 is provided with a seventh through hole 1024, and the spring limiting plate 106 is provided with an eighth through hole 1063. The sixth through hole 1014, the seventh through hole 1024, and the eighth through hole 1063 are correspondingly provided. By providing the sixth through hole 1014, the seventh through hole 1024 and the eighth through hole 1063, it is easy for the robot arm to pick up and press the cover 1.
[0081] The pressure head 10542 is either concentric or eccentric with the column 1054, such as... Figure 11 As shown, the pressure head 10542 and the column 1054 are eccentrically positioned, as follows: Figure 12 As shown, the pressure head 10542 and the column 1054 are concentrically arranged. The pressing part of the pressure head 10542 is made of 40Cr, tempered to 40~45HRC. By setting two types of pressure heads 10542, it is easy to change the position of the pressing point to accommodate more products.
[0082] To facilitate engagement with the support base 2, in one embodiment, the clamping cover 1 further includes a snap-fit connecting hook 103. The snap-fit connecting hook 103 includes a hook body and a snap hook 1031 connected together, such as... Figure 5 As shown, the hook 1031 is engaged with the support base 2. The hook body is rotatably connected to the limiting block 104 via a rotating shaft 107. The limiting block 104 is fixedly connected to the bottom surface of the cover 102 via a second connecting bolt 110. By rotating the hook body, it is easy for the hook body to engage with the support base 2. To ensure reliable engagement of the hook 103, the hook body is connected to the cover 102 via a spring plunger 109. Figure 5As shown, the hook 1031 and the spring plunger 109 are respectively located on both sides of the rotating shaft 107. One end of the spring plunger 109 is fixedly connected to the hook body, and the other end is connected to the threaded connection hole 1022 on the side of the cover 102. The end of the spring plunger 109 is threaded into the threaded connection hole 1022. By changing the length of the threaded connection, the thrust of the spring plunger 109 on the hook 103 is changed, thereby preventing the hook 1031 from falling off the support 2. Specifically, there are two hooks 103, which are located on two opposite sides of the cover 102. To ensure the reliability of the engagement, each hook 103 has two hooks 1031, which are spaced at a predetermined distance to form a guide gap. The limiting block 104 is installed in the guide gap to prevent the hook body from moving axially along the rotating shaft 107.
[0083] To ensure proper alignment between the pressure cap 1 and the support base 2 during assembly, a first limiting structure is provided at the bottom of the limiting block 104. This first limiting structure is inserted into a corresponding second limiting structure on the support base 2. One of the first and second limiting structures is a limiting pin, and the other is a limiting hole. The end of the limiting pin near the limiting hole is tapered, facilitating insertion into the limiting hole. In one specific embodiment, the first limiting structure is a limiting pin 108, and the second limiting structure is a limiting hole. The limiting pin 108 is inserted into the limiting hole, thereby ensuring the alignment accuracy of the assembly position between the pressure cap 1 and the support base 2.
[0084] Furthermore, refer to Figure 14 The support base 2 includes a base plate 201, on which a support platform 202 is provided. The support platform 202 is the support structure. The support platform 202 is correspondingly positioned to the edge of the heat sink 4, with the edge of the heat sink 4 resting on the top surface of the support platform 202. The PCBA board 3 is located on the surface of the heat sink 4 away from the support platform 202, and the heat sink fins of the heat sink 4 are placed within the cavity enclosed by the support platform 202. To facilitate the positioning of the heat sink 4, a positioning pin 204 is provided on the top surface of the support platform 202. The positioning pin 204 is correspondingly positioned to the third mounting hole 401 on the heat sink 4. The third mounting hole 401 is a hole for mounting the heat sink 4. Figure 15 and Figure 16 As shown. To facilitate the insertion of the positioning pin 204 into the third mounting hole 401, the top of the positioning pin 204 is tapered. To facilitate the engagement of the connecting hook 103 with the support base 2, the side of the support platform 202 is provided with a snap-fit groove 205, as shown. Figure 14 As shown, the snap hook 1031 of the snap-fit connector 103 snaps into the snap-fit groove 205.
[0085] The base plate 201 is provided with a limiting platform 206, and a positioning copper sleeve 203 is installed on the limiting platform 206. The positioning copper sleeve 203 is provided with a limiting hole, and the limiting hole is correspondingly provided with a limiting pin 108, which is inserted into the limiting hole.
[0086] The specific steps for switching the pressure point position of the spring pressure column 105 are as follows: In the initial state, such as Figure 17 As shown, the limiting pin 1051 of the spring pressure column 105 is placed in a sub-slot 10111 of the slot 1011. In this state, the position of the pressure head 10542 of the spring pressure column 105 is as follows: Figure 18 As shown. Pull up the limiting pin 1051 of the spring pressure column 105, causing the limiting pin 1051 to disengage from the switching slot plate 101, as shown. Figure 19 As shown. Rotate the limiting pin 1051 so that the limiting pin 1051 corresponds to another sub-slot 10111 of the aforementioned slot 1011, as shown. Figure 20 As shown. Releasing the limit pin 1051, the limit pin 1051 returns to the corresponding slot 10111 on the switching slot plate 101 under the action of the spring 1053, as... Figure 21 As shown. In this state, the position of the pressure head 10542 of the spring pressure column 105 is as follows. Figure 22 As shown, this completes the switching of the pressure point position.
[0087] The operation process of this utility model's thermally conductive adhesive curing and pressing mechanism is as follows: The robotic arm places the product to be cured and pressed onto the support platform 202 of the support base 2, and the positioning pin 204 ensures the accurate positioning of the product. The robotic arm picks up the pressing cover 1, confirms that the spring pressure column 105 is switched to the correct pressing position, and installs the pressing cover 1 vertically onto the support base 2. The limiting pin 108 is inserted into the limiting hole of the positioning copper sleeve 203, and then the connecting hook 103 is engaged in the locking groove 205. The spring pressure column 105 is compressed, and the reaction force acts on the product to be cured. The spring 1053 is compressed to generate the rated pressure and maintains the pressure. Then, the entire curing and pressing mechanism is placed in the heating oven, and the thermally conductive adhesive is cured by heat. The curing and pressing mechanism is removed from the heating oven, the pressing cover 1 is removed, the robotic arm removes the cured product, and then the above steps are repeated.
[0088] The thermally conductive adhesive curing and clamping mechanism of this invention ensures that during the curing process of the PCBA board 3 and the heat sink 4 connected by thermally conductive adhesive, the PCBA board 3 is tightly pressed by the curing and clamping mechanism, guaranteeing the uniform spread of the adhesive. This curing and clamping mechanism also has multiple switchable clamping positions, allowing for selection of which position to activate or deactivate as needed. It is compatible with various sizes of PCBA boards 3, greatly improving versatility, reducing the number of curing fixtures required, saving on changeover costs, improving product heat dissipation and bonding strength stability, reducing product scrap rates, and significantly lowering production costs.
[0089] In the description of this solution, it should be understood that the terms "upper", "lower", "vertical", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this solution.
[0090] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this solution, "multiple" means two or more, unless otherwise explicitly specified.
[0091] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.
[0092] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A thermally conductive adhesive curing and pressing mechanism, characterized in that, include: The support base (2) includes a support structure on which a heat sink (4) is placed and the heat sink (4) is fixed on a PCBA board (3); The clamping cover (1) includes a cover body (102) and a plurality of spring pressure columns (105), one end of the spring pressure column (105) is slidably connected to the cover body (102), and the other end is pressed on the PCBA board (3); The clamping cap (1) is engaged with the support base (2); The cover (102) is provided with a plurality of first mounting holes (1021) for connecting the spring pressure column (105), and each spring pressure column (105) is detachably connected to the corresponding first mounting hole (1021).
2. The thermally conductive adhesive curing and pressing mechanism according to claim 1, characterized in that, The pressing cover (1) also includes a switching slot plate (101). The switching slot plate (101) is disposed on the surface of the cover body (102) away from the support base (2). The switching slot plate (101) is provided with a plurality of slots (1011). The positions of the slots (1011) correspond one-to-one with the first mounting holes (1021) on the cover body (102). One end of the spring pressure column (105) is engaged in the slot (1011).
3. The thermally conductive adhesive curing and pressing mechanism according to claim 2, characterized in that, Each of the card slots (1011) includes at least two intersecting card slots (10111), and a first through hole (10112) is provided at the intersection of different card slots (10111). The spring pressure post (105) passes through the first through hole (10112), and the end of the spring pressure post (105) is engaged in any of the card slots (10111).
4. The thermally conductive adhesive curing and pressing mechanism according to claim 2 or 3, characterized in that, The spring-loaded column (105) includes a column body (1054), a spring (1053), a copper sleeve (1052), and a limiting pin (1051). The spring (1053) and the copper sleeve (1052) are both sleeved on the column body (1054). The limiting pin (1051) passes through one end of the column body (1054). The other end of the column body (1054) is provided with a pressure head (10542), which presses on the PCBA board (3). The outer surface of the copper sleeve (1052) is interference-fitted into the first mounting hole (1021) of the cover (102), and the cavity between the column (1054) and the copper sleeve (1052) is provided with a gap. The spring (1053) is disposed between the copper sleeve (1052) and the pressure head (10542).
5. The thermally conductive adhesive curing and pressing mechanism according to claim 4, characterized in that, The pressure head (10542) is disposed at the end of the column (1054) via a connecting plate (10543). The size of the connecting plate (10543) is larger than the diameter of the column (1054). One end of the spring (1053) is limited by the connecting plate (10543), and the other end is limited by the spring limiting plate (106). The spring limiting plate (106) is fixedly connected to the cover (102), and the column (1054) passes through the spring limiting plate (106). The pressure head (10542) is arranged concentrically or eccentrically with the column (1054).
6. The thermally conductive adhesive curing and pressing mechanism according to claim 1, characterized in that, The pressing cover (1) also includes a snap-fit connecting hook (103), which includes a hook body and a snap hook (1031) connected together. The hook body is rotatably connected to the limiting block (104) via a rotating shaft (107). The limiting block (104) is fixedly connected to the cover body (102). The snap hook (1031) is snapped with the support seat (2). The hook body is connected to the cover body (102) via a spring plunger (109).
7. The thermally conductive adhesive curing and pressing mechanism according to claim 6, characterized in that, The bottom of the limiting block (104) is provided with a first limiting structure, which is inserted into the second limiting structure on the support base (2). One of the first limiting structure and the second limiting structure is a limiting pin, and the other is a limiting hole. The end of the limiting pin near the limiting hole is a tapered end.
8. The thermally conductive adhesive curing and pressing mechanism according to claim 1, characterized in that, The support base (2) includes a base plate (201), on which a support platform (202) is provided. The support platform (202) is provided corresponding to the edge of the radiator (4), and the edge of the radiator (4) is placed on the support platform (202).
9. The thermally conductive adhesive curing and pressing mechanism according to claim 8, characterized in that, The top surface of the support platform (202) is provided with a positioning pin (204), which is corresponding to the third mounting hole (401) on the radiator (4). The top of the positioning pin (204) is a tapered end. The side of the support platform (202) is provided with a snap-fit groove (205), and the clamping cover (1) is snapped into the snap-fit groove (205).
10. The thermally conductive adhesive curing and pressing mechanism according to claim 8, characterized in that, A limiting platform (206) is provided on the base plate (201), and a positioning copper sleeve (203) is installed on the limiting platform (206). A limiting hole is provided on the positioning copper sleeve (203), and the limiting hole is correspondingly provided with a limiting pin (108) on the pressing cover (1). The limiting pin (108) is inserted into the limiting hole.