High-temperature thermal debonding easy-to-rework adhesive tape

By introducing a combination of pyrolytic adhesive layer and high-tack adhesive layer into the tape, the tape is made easy to separate and re-bond by heating to reduce its tackiness. This solves the problems of traditional tapes being difficult to disassemble and rework, and improves the rework efficiency and safety of electronic products.

CN223535016UActive Publication Date: 2025-11-11HENGSHAN JIACHENG NEW MATERIAL
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Patent Information

Application Number
CN202323607644.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-28
Publication Date
2025-11-11
Estimated Expiration
2033-12-28

AI Technical Summary

Technical Problem

Traditional high-adhesion foam tapes are difficult to remove and rework. Solvent soaking during rework can corrode components and endanger health. Existing reworkable tapes require complete peeling, which increases the difficulty.

Method used

The structure consists of an upper release film, a pyrolytic adhesive layer, a substrate layer, a high-tack layer, and a lower release film arranged sequentially from top to bottom. The pyrolytic adhesive layer is a heat-resistant acrylic pressure-sensitive adhesive that reduces tack, while the high-tack layer is a high-temperature resistant, high-tack acrylic pressure-sensitive adhesive. Heating reduces the tack of the pyrolytic adhesive layer, making it easier to peel off, while the high-tack layer maintains its tack, making it easy to re-bond.

Benefits of technology

This technology enables easy separation and repeated bonding of the tape, improves the rework efficiency of electronic products, avoids the tediousness of overall peeling and the risk of solvent corrosion, and ensures bonding reliability.

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Abstract

The utility model relates to the technical field of adhesive tapes, in particular to a high-temperature pyrolytic adhesive tape easy to rework, which comprises an upper release film, a pyrolytic adhesive layer, a base material layer, a high adhesive layer and a lower release film which are sequentially arranged from top to bottom, and the high-viscosity adhesive layer is made of a high-temperature-resistant high-viscosity acrylic pressure-sensitive adhesive. After the adhesive tape is applied to an electronic product, the whole adhesive tape does not need to be stripped from the product during reworking, and the reworking efficiency of the product can be improved.
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Description

Technical Field

[0001] This utility model relates to the field of adhesive tape technology, and in particular to a high-temperature pyrolytic adhesive tape that is easy to rework. Background Technology

[0002] Traditional high-adhesion foam tape used in electronic products is typically applied to fix the screen to the mid-frame, achieving waterproofing and shock absorption, but it is not easy to remove. If it is forcibly removed, the tape cohesion will be damaged, making rework difficult. If solvent soaking is used for rework, it can easily corrode the components and endanger human health.

[0003] Chinese patent CN108384471 A discloses a reworkable adhesive tape, which mainly includes a first release liner layer, a first heat-resistant adhesive layer, a substrate layer, a second heat-resistant adhesive layer, and a second release liner layer. The heat-resistant adhesives in the first and second layers are identical, both reducing adhesion upon heating, thus making it easy to peel off. However, since both sides peel off from the product, rework requires re-applying the entire tape, increasing the difficulty of rework. Utility Model Content

[0004] The purpose of this invention is to provide a high-temperature pyrolytic adhesive tape that is easy to rework, so that the entire tape does not need to be peeled off the product during rework, thereby improving the efficiency of product rework.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a high-temperature pyrolytic adhesive tape that is easy to rework, comprising an upper release film, a pyrolytic adhesive layer, a substrate layer, a high-tack adhesive layer, and a lower release film arranged sequentially from top to bottom. The pyrolytic adhesive layer is made of a pyrolytic acrylic pressure-sensitive adhesive whose viscosity decreases when heated, and the high-tack adhesive layer is made of a high-temperature resistant, high-tack acrylic pressure-sensitive adhesive.

[0006] Preferably, the thickness of the pyrolytic adhesive layer is 40-80 μm, and the Tg point is -40°C.

[0007] More preferably, the thickness of the high-adhesion layer is 40-80 μm, and the Tg point is -20°C.

[0008] More preferably, the substrate layer is made of PE foam, PP, acrylic foam, or PU material; the thickness of the substrate layer is 0.05-1.8 mm.

[0009] More preferably, both the upper release film and the lower release film are PET release films or double-sided release paper.

[0010] Compared with existing technologies, this invention, when applied to electronic products, can reduce the tackiness of the pyrolytic adhesive layer in the tape by heating, making it easier to peel off and separate the product structure for rework. Since the high-tack adhesive layer does not reduce tackiness and can still adhere to the separated product structure, when the product needs to be reassembled after repair, the separated products can be directly bonded together, avoiding the tedious process of the entire tape separating from the product and having to re-attach both sides, thus improving the efficiency of product rework. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the overall structure in an embodiment of the present utility model.

[0012] In the picture:

[0013] 1—Upper release film; 2—Pyrolytic adhesive layer; 3—Substrate layer

[0014] 4 - High-adhesion layer; 5 - Lower release film. Detailed Implementation

[0015] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to embodiments and accompanying drawings. The content mentioned in the embodiments is not intended to limit the present invention.

[0016] It's important to note beforehand that thermally tacky acrylic pressure-sensitive adhesives experience a decrease in tackiness upon heating, but this tackiness typically recovers when cooled to normal temperatures. This material exhibits a temporary flow during heating, making it easier to peel off. Once cooled, the acrylic pressure-sensitive adhesive re-cures and regains its original tackiness.

[0017] like Figure 1 As shown, a high-temperature pyrolytic adhesive tape that is easy to rework includes, from top to bottom, an upper release film 1, a pyrolytic adhesive layer 2, a substrate layer 3, a high-tack adhesive layer 4, and a lower release film 5. The pyrolytic adhesive layer 2 is made of a pyrolytic acrylic pressure-sensitive adhesive whose tack decreases upon heating, with a thickness of 40-80 μm and a Tg point of -40°C. The high-tack adhesive layer 4 is made of a high-temperature resistant, high-tack acrylic pressure-sensitive adhesive, with a thickness of 40-80 μm and a Tg point of -20°C.

[0018] In the above structure, the substrate layer 3 is made of PE foam, PP, acrylic foam, or PU material; the thickness of the substrate layer 3 is 0.05-1.8mm. The upper release film 1 and the lower release film 5 are both PET release films or double-sided release paper.

[0019] To further illustrate the characteristics of each adhesive layer, in this embodiment, the pyrolytic adhesive layer 2 is made of common hot-melt acrylic adhesive, and the high-tack adhesive layer 4 is made of n-butyl acrylate. The pyrolytic adhesive layer 2 and the high-tack adhesive layer 4 were individually subjected to peel force tests at different temperature environments. The peel force of the tape was measured after being held at a given temperature for 5 minutes, and the test data was obtained using Peel Testing 90°. The test results are shown in Table 1 below (peel force unit: N / in, temperature unit: °C).

[0020] Table 1. Results of adhesive peel strength test

[0021]

[0022] The test results above show that the peel strength of the pyrolytic adhesive layer 2 is ≥25 N / in at room temperature. Maintaining it at 50℃ for 5 minutes will reduce the peel strength to about 13 N / in, and maintaining it at 70℃ for 5 minutes will reduce the peel strength to about 4 N / in. In actual testing, the adhesiveness will automatically recover when the temperature returns to normal. The peel strength of the high-adhesion layer after maintaining it at 70℃ for 5 minutes is >20 N / in, and the data in the table shows that its peel strength does not decrease rapidly with the increase of temperature.

[0023] In addition, the pyrolytic adhesive layer 2 and the high-adhesion adhesive layer 4 were tested in a high-temperature environment of 80℃, and both were able to achieve a high-temperature retention force of ≥24h without displacement, that is, there will be no loosening, falling off or slipping.

[0024] The high-temperature pyrolytic adhesive tape provided in the above embodiments, when applied to electronic products, can reduce the tackiness of the pyrolytic adhesive layer in the tape by heating, making it easy to peel off and separate the product structure for rework. Since the high-tack adhesive layer 4 does not reduce the tackiness, it can still adhere to the separated product structure. Therefore, when the product needs to be reassembled after repair, the separated products can be directly bonded together, avoiding the tedious process of the entire tape separating from the product and having to re-paste both sides. It even eliminates the need for additional adhesive, improving the product rework efficiency and ensuring the reliability and repeatability of the bonding.

[0025] To facilitate understanding by those skilled in the art of the improvements of this utility model compared to the prior art, some of the accompanying drawings and descriptions of this utility model have been simplified. The above embodiments are preferred implementations of this utility model. In addition, this utility model can be implemented in other ways. Any obvious substitutions without departing from the concept of this technical solution are within the protection scope of this utility model.

Claims

1. A high-temperature pyrolytic adhesive tape that is easy to rework, characterized in that: The material comprises, from top to bottom, an upper release film (1), a pyrolytic adhesive layer (2), a substrate layer (3), a high-adhesion layer (4), and a lower release film (5). The pyrolytic adhesive layer (2) is made of a pyrolytic acrylic pressure-sensitive adhesive whose viscosity decreases when heated. The high-adhesion layer (4) is made of a high-viscosity acrylic pressure-sensitive adhesive that is resistant to high temperatures. Both the upper release film (1) and the lower release film (5) are double-sided release papers. The thickness of the pyrolytic adhesive layer (2) is 40-80 μm, and the Tg point is -40°C.

2. The high-temperature pyrolytic adhesive tape for easy rework according to claim 1, characterized in that: The thickness of the high-viscosity adhesive layer (4) is 40-80 μm, and the Tg point is -20 °C.

3. The high-temperature pyrolytic adhesive tape for easy rework according to claim 1, characterized in that: The substrate layer (3) is made of PE foam material, PP material, acrylic foam material or PU material; the thickness of the substrate layer (3) is 0.05-1.8mm.

Citation Information

Patent Citations

  • Reworkable adhesive tape and preparation method thereof

    CN108384471A