Rapid cooling device for semiconductor processing

Abstract

The utility model relates to a quick cooling device for semiconductor processing, which comprises a cooling frame and a cold air mechanism fixedly mounted at the top of the cooling frame, cooling liquid is injected into a box body through a water inlet valve, the height of the cooling liquid is observed through a transparent plate and does not exceed a scale groove, and two semiconductor chilling plates are started to cool the interior of the box body. The centrifugal fan is started to be a low-power fan along with starting of the centrifugal fan, external air is sucked into the bent air pipe, a protection net is arranged at the air inlet end of the bent air pipe to intercept impurities, the external air enters the bent air pipe and is gradually cooled, and finally cold air enters an air outlet plate through an exhaust pipe; the semiconductor in the cooling frame is cooled, the two air cylinders are started to drive the air outlet plate to rotate, so that the air blowing range is adjusted to be larger, rotation adjustment of the air outlet plate can be achieved through the arrangement of the corrugated pipe, and the cooling frame is located at the top of the box body and has the auxiliary cooling effect on the top of the box body.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing equipment technology, specifically a rapid cooling device for semiconductor processing. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature falls between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, and high-power power conversion, among other fields. For example, diodes are devices made using semiconductors. During semiconductor manufacturing, the semiconductors, after being heated to high temperatures, require annealing and cooling. In current technology, cooling the semiconductor substrate using fans is ineffective, as it cannot effectively transfer cool air across the substrate. Furthermore, the lack of adjustable exhaust angles results in a limited airflow range, further impacting cooling efficiency.

[0003] For example, a semiconductor cooling device disclosed in the authorized patent document with application number CN202122549831.2 includes a housing, an adjustment mechanism inside the housing, a circular guide rail inside the housing, two symmetrical sliders slidably connected to the outer wall of the circular guide rail, and a filter screen fixedly connected to the upper surface of the housing. This invention uses a temperature sensor to detect the surface temperature of the semiconductor and transmits the detection signal to a PLC controller. The PLC controller controls a buzzer to emit different decibel sounds for quick identification by the operator. The operator controls the output shaft of the motor to drive the gear to rotate. Under the force of the external gear ring, the gear moves the fan through the slider and support frame, positioning the fan above the side of the semiconductor with a higher temperature. Multiple fans concentrate heat dissipation and cooling on the side of the semiconductor with a higher temperature, while an exhaust fan accelerates airflow, thereby improving the cooling effect and efficiency of the semiconductor.

[0004] The aforementioned patent has the problem that the cooling effect of the fan on the semiconductor board is not good, and it is impossible to transfer cold air to the semiconductor board for cooling. Therefore, we need to provide a rapid cooling device for semiconductor processing. Utility Model Content

[0005] The purpose of this invention is to provide a rapid cooling device for semiconductor processing. A cooling mechanism is installed on the top of the cooling frame, and the cold air enters the air outlet plate through the exhaust pipe to cool the semiconductor inside the cooling frame. Activating two cylinders can drive the air outlet plate to rotate, thereby adjusting the air blowing range to a larger extent and solving the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a rapid cooling device for semiconductor processing, comprising:

[0007] Cooling frame and cold air mechanism fixedly installed on top of cooling frame;

[0008] The cooling mechanism is used to cool the semiconductors inside the cooling frame. A placement mechanism is installed at the bottom of the inner wall of the cooling frame, which is used to place multiple semiconductors of different types.

[0009] The cooling mechanism includes a box fixedly installed on the top of the cooling frame. Two semiconductor cooling chips are embedded in the top of the box. A curved air duct is fixedly installed on the bottom of the inner wall of the box. The air inlet of the curved air duct passes through one side of the box and extends outward. The air outlet of the curved air duct is connected to an exhaust device. The exhaust device is used to draw the cold air in the curved air duct into the cooling frame.

[0010] Preferably, the exhaust component includes a centrifugal fan connected to the air outlet end of the curved air duct, the bottom of the centrifugal fan is connected to an exhaust pipe, one end of the exhaust pipe penetrates the inner wall of the cooling frame and is connected to an air outlet plate, and one side of the air outlet plate is integrally machined with multiple air outlet holes.

[0011] Preferably, the exhaust pipe is internally connected to a corrugated pipe, which is disposed within the cooling frame. Two cylinders are hinged to the top of the air outlet plate, and one end of each cylinder is fixedly installed on the inner wall of the cooling frame.

[0012] Preferably, a plurality of mounting seats are fixedly installed on the surface of the curved duct, and the bottom of each of the mounting seats is fixedly installed on the bottom of the housing by bolts, and heat dissipation plates are installed on the heating surfaces of the two semiconductor cooling chips.

[0013] Preferably, the placement mechanism includes a platform fixedly installed at the bottom of the inner wall of the cooling frame. The top of the platform is provided with several sliding grooves, and two sliding seats are slidably installed inside each of the several sliding grooves. An abutment block is slidably installed on one side of each sliding seat, and an elastic element for the abutment block to rebound is provided inside the sliding seat.

[0014] Preferably, the abutment block includes a groove formed in the sliding seat, a spring is engaged inside the groove, one end of the spring is engaged with the surface of the abutment block, and a toggle plate is fixedly installed on the top of the abutment block, with one side of the toggle plate penetrating through the surface of the sliding seat and extending therefrom.

[0015] Preferably, the front of the housing is embedded with a transparent plate, the top of the housing is connected to a water inlet valve, one side of the housing is connected to a drain valve, the surface of the housing is provided with a scale groove, and the air inlet end of the curved air duct is equipped with a protective net.

[0016] Preferably, each of the sliding seats has a protrusion fixedly installed on its top, and the platform has a ventilated plate embedded inside, and the cooling frame has two fans embedded in its bottom.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] This invention features a cooling mechanism installed on the top of the cooling frame. Cool air enters the air outlet plate through the exhaust pipe to cool the semiconductor inside the cooling frame. Activating two cylinders can drive the air outlet plate to rotate, thereby adjusting the airflow range to be larger. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0020] Figure 2 This is a partial three-dimensional structural view of the present invention;

[0021] Figure 3 This is a three-dimensional sectional view of the box body of this utility model;

[0022] Figure 4 This is a perspective view of the exhaust component of this utility model;

[0023] Figure 5 This is a perspective view of the platform of this utility model;

[0024] Figure 6 This is a perspective view of the elastic element of this utility model.

[0025] In the diagram: 1. Cooling frame; 2. Air conditioning mechanism; 21. Housing; 22. Semiconductor cooling chip; 23. Curved duct; 20. Exhaust component; 201. Centrifugal fan; 202. Exhaust pipe; 203. Air outlet plate; 3. Placement mechanism; 31. Platform; 32. Slide groove; 33. Sliding seat; 34. Contact block; 30. Elastic component; 301. Groove; 302. Spring; 303. Actuating plate; 4. Corrugated pipe; 5. Cylinder; 6. Mounting base; 7. Heat sink; 8. Transparent plate; 9. Water inlet valve; 10. Drain valve; 11. Scale groove; 12. Protrusion; 13. Ventilation plate; 14. Fan. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Please see Figure 1-6 This utility model provides a technical solution: a rapid cooling device for semiconductor processing, comprising:

[0028] Cooling frame 1 and cooling air mechanism 2 fixedly installed on top of cooling frame 1;

[0029] The cooling mechanism 2 is used to cool the semiconductors inside the cooling frame 1. The bottom of the inner wall of the cooling frame 1 is equipped with a placement mechanism 3, which is used to place multiple semiconductors of different types.

[0030] The cooling mechanism 2 includes a box 21 fixedly installed on the top of the cooling frame 1. Two semiconductor cooling chips 22 are embedded in the top of the box 21. A curved air duct 23 is fixedly installed on the bottom of the inner wall of the box 21. The air inlet end of the curved air duct 23 passes through one side of the box 21 and extends outward. The air outlet end of the curved air duct 23 is connected to an exhaust component 20. The exhaust component 20 is used to draw cold air from the curved air duct 23 into the cooling frame 1.

[0031] The exhaust component 20 includes a centrifugal fan 201 connected to the air outlet end of the curved air duct 23. The bottom of the centrifugal fan 201 is connected to an exhaust pipe 202. One end of the exhaust pipe 202 penetrates the inner wall of the cooling frame 1 and is connected to an air outlet plate 203. Multiple air outlet holes are integrally machined on one side of the air outlet plate 203.

[0032] In this embodiment, coolant is injected into the housing 21 through the water inlet valve 9. The coolant level is observed through the transparent plate 8 and must not exceed the scale groove 11. Two semiconductor cooling chips 22 are activated to cool the housing 21. As the coolant temperature decreases, the air inside the curved air duct 23 becomes colder. With the activation of the centrifugal fan 201 (a low-power fan), external air is drawn into the curved air duct 23. A protective net is installed at the air inlet end of the curved air duct 23 to intercept debris. The external air gradually cools as it enters the curved air duct 23. Finally, the cold air enters the air outlet plate 203 through the exhaust pipe 202 to cool the semiconductor in the cooling frame 1. Two cylinders 5 are activated. These two cylinders 5 are synchronous cylinders and can drive the air outlet plate 203 to rotate, thereby adjusting the airflow range to a larger extent. The rotation adjustment of the air outlet plate 203 can be achieved through the corrugated pipe 4. The cooling frame 1 is located at the top of the housing 21 and has an auxiliary cooling effect on the top of the housing 21.

[0033] The adjustable sliding seat 33 slides within the slide groove 32 to accommodate different types of semiconductors. The top protrusion 12 of the sliding seat 33 has a small contact area with the semiconductor, and the top of the protrusion 12 is arc-shaped to protect the semiconductor. By pressing the toggle plate 303, the sliding seat 33 moves and drives the abutment block 34 into the sliding seat 33, allowing the sliding seat 33 to move. The spring 302 is used to push the abutment block 34 out, so that the abutment block 34 fits against the inner wall of the slide groove 32, limiting the sliding seat 33.

[0034] The exhaust pipe 202 is internally connected to a corrugated pipe 4, which is located inside the cooling frame 1. The top of the air outlet plate 203 is hinged to two cylinders 5, one end of each cylinder 5 is fixedly installed on the inner wall of the cooling frame 1.

[0035] Specifically, the bellows 4 enables the rotation adjustment of the air outlet 203. The two cylinders 5 are synchronized cylinders, which can drive the air outlet 203 to rotate, thereby adjusting the air blowing range to a larger extent.

[0036] Several mounting seats 6 are fixedly installed on the surface of the curved air duct 23. The bottom of the mounting seats 6 is fixedly installed on the bottom of the box 21 by bolts, and heat dissipation plates 7 are installed on the heating surface of the top of the two semiconductor cooling chips 22.

[0037] Furthermore, several mounting bases 6 are provided to securely install the curved air duct 23 inside the housing 21, and a heat sink 7 is provided to cool the heating surface on the top of the semiconductor cooling chip 22.

[0038] The placement mechanism 3 includes a platform 31 fixedly installed at the bottom of the inner wall of the cooling frame 1. The top of the platform 31 is provided with several sliding grooves 32. Two sliding seats 33 are slidably installed inside each of the several sliding grooves 32. A contact block 34 is slidably installed on one side of the sliding seat 33. An elastic element 30 for the contact block 34 to rebound is provided inside the sliding seat 33.

[0039] It should be noted that the adjustable sliding seat 33 slides within the slide groove 32 to accommodate different types of semiconductors for support. The top protrusion 12 of the sliding seat 33 has a small contact area with the semiconductor, and the top of the protrusion 12 is arc-shaped to protect the semiconductor. By pressing the toggle plate 303, it slides within the groove 301. The movement of the toggle plate 303 causes the abutment block 34 to retract into the sliding seat 33, thus allowing the sliding seat 33 to move.

[0040] The abutment block 34 includes a groove 301 formed in the sliding seat 33. A spring 302 is engaged inside the groove 301. One end of the spring 302 is engaged on the surface of the abutment block 34. A toggle plate 303 is fixedly installed on the top of the abutment block 34. One side of the toggle plate 303 penetrates the surface of the sliding seat 33 and extends outward.

[0041] The spring 302 is used to push the abutment block 34 outward, so that the abutment block 34 fits against the inner wall of the slide groove 32, thereby limiting the sliding seat 33.

[0042] The front of the box 21 is inlaid with a transparent plate 8, the top of the box 21 is connected to a water inlet valve 9, the side of the box 21 is connected to a drain valve 10, and the surface of the box 21 is provided with a scale groove 11, and the air inlet end of the curved air duct 23 is equipped with a protective net.

[0043] It is worth noting that coolant is injected into the housing 21 through the water inlet valve 9, and the coolant level is observed through the transparent plate 8. It must not exceed the scale groove 11. The two semiconductor cooling chips 22 are activated to cool the inside of the housing 21. As the coolant temperature decreases, the air inside the curved air duct 23 becomes colder.

[0044] Several sliding seats 33 are fixedly installed with protrusions 12 on their tops, and the interior of the platform 31 is embedded with a ventilated plate 13. The bottom of the cooling frame 1 is embedded with two fans 14.

[0045] Specifically, two fans 14 are placed close to the semiconductor to dissipate heat radiating from the semiconductor surface.

[0046] This device injects coolant into the housing 21 through the water inlet valve 9. The coolant level is observed through the transparent plate 8 and must not exceed the scale groove 11. Two semiconductor cooling chips 22 are activated to cool the inside of the housing 21. As the coolant temperature decreases, the air inside the curved air duct 23 becomes colder. With the activation of the centrifugal fan 201 (a low-power fan), external air is drawn into the curved air duct 23. A protective net is installed at the air inlet end of the curved air duct 23 to intercept debris. The external air gradually cools as it enters the curved air duct 23. Finally, the cold air enters the air outlet plate 203 through the exhaust pipe 202, cooling the semiconductor in the cooling frame 1. Two cylinders 5 are activated. These two cylinders 5 are synchronous cylinders, which can drive the air outlet plate 203 to rotate, thereby adjusting the airflow range to a larger extent. The rotation adjustment of the air outlet plate 203 is achieved through the corrugated pipe 4. The cooling frame 1 is located at the top of the housing 21, providing auxiliary cooling to the top of the housing 21.

[0047] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A rapid cooling device for semiconductor processing, characterized in that, include: Cooling frame (1) and cooling mechanism (2) fixedly installed on top of cooling frame (1); The cooling mechanism (2) is used to cool the semiconductors in the cooling frame (1). A placement mechanism (3) is installed at the bottom of the inner wall of the cooling frame (1). The placement mechanism (3) is used to place multiple semiconductors of different types. The cooling mechanism (2) includes a box (21) fixedly installed on the top of the cooling frame (1). Two semiconductor cooling chips (22) are embedded in the top of the box (21). A curved air duct (23) is fixedly installed on the bottom of the inner wall of the box (21). The air inlet of the curved air duct (23) passes through one side of the box (21) and extends therein. The air outlet of the curved air duct (23) is connected to an exhaust device (20). The exhaust device (20) is used to draw cold air from the curved air duct (23) into the cooling frame (1).

2. The rapid cooling device for semiconductor processing according to claim 1, characterized in that: The exhaust component (20) includes a centrifugal fan (201) connected to the air outlet of the curved air duct (23). The bottom of the centrifugal fan (201) is connected to an exhaust pipe (202). One end of the exhaust pipe (202) penetrates the inner wall of the cooling frame (1) and is connected to an air outlet plate (203). One side of the air outlet plate (203) is integrally machined with multiple air outlet holes.

3. The rapid cooling device for semiconductor processing according to claim 2, characterized in that: The exhaust pipe (202) is internally connected to a corrugated pipe (4), which is located inside the cooling frame (1). The top of the air outlet plate (203) is hinged to two cylinders (5), one end of each cylinder (5) is fixedly installed on the inner wall of the cooling frame (1).

4. The rapid cooling device for semiconductor processing according to claim 1, characterized in that: The curved duct (23) is fixedly mounted with several mounting seats (6), and the bottom of the mounting seats (6) is fixedly mounted inside the box (21) by bolts. The heating surfaces of the two semiconductor cooling chips (22) are all equipped with heat sinks (7).

5. The rapid cooling device for semiconductor processing according to claim 1, characterized in that: The placement mechanism (3) includes a platform (31) fixedly installed on the bottom of the inner wall of the cooling frame (1). The top of the platform (31) is provided with several sliding grooves (32). Two sliding seats (33) are slidably installed inside each of the several sliding grooves (32). A contact block (34) is slidably installed on one side of the sliding seat (33). An elastic element (30) for the contact block (34) to rebound is provided inside the sliding seat (33).

6. The rapid cooling device for semiconductor processing according to claim 5, characterized in that: The abutment block (34) includes a groove (301) formed in the sliding seat (33), a spring (302) is engaged inside the groove (301), one end of the spring (302) is engaged on the surface of the abutment block (34), and a toggle plate (303) is fixedly installed on the top of the abutment block (34), with one side of the toggle plate (303) penetrating through the surface of the sliding seat (33) and extending therefrom.

7. The rapid cooling device for semiconductor processing according to claim 1, characterized in that: The front of the box (21) is inlaid with a transparent plate (8), the top of the box (21) is connected to a water inlet valve (9), one side of the box (21) is connected to a drain valve (10), and the surface of the box (21) is provided with a scale groove (11), and the air inlet end of the curved air duct (23) is equipped with a protective net.

8. The rapid cooling device for semiconductor processing according to claim 6, characterized in that: Each of the sliding seats (33) has a protrusion (12) fixedly installed on its top, and the platform (31) has a ventilated plate (13) embedded inside, and the cooling frame (1) has two fans (14) embedded in its bottom.

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