Circuit board welding spot quality detection equipment

Abstract

The utility model provides circuit board welding spot quality detection equipment, which relates to the technical field of circuit boards and comprises a bottom plate, a first support plate and a second support plate are distributed and fixedly connected to the top of the bottom plate, a turntable is rotatably connected to one side of the outer wall of the first support plate, and a grip is fixedly connected to one side of the outer wall of the turntable. Micro springs are arranged in the first supporting plates, ejector rods are slidably connected to the interiors of the first supporting plates, and rotating shafts are rotatably connected to the outer walls of the second supporting plates. Through the arrangement of a first supporting plate, a second supporting plate, a circular groove, a connecting rod, a rotating disc, a micro spring, a grip, an ejector rod and a rotating shaft, a first electric push rod and a rubber pad can be driven to rotate, and a circuit board can be clamped between the first electric push rod and the rubber pad during use, so that the circuit board can be driven when being stressed, the circuit board can be turned over, and the use is convenient. And frequent re-clamping and turn-over operation is avoided.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a circuit board solder joint quality inspection device. Background Technology

[0002] A circuit board, also known as a printed circuit board, is a substrate used to connect and support electronic components. It achieves electrical connections between electronic components by etching conductive paths on an insulating material.

[0003] Circuit board solder joint quality inspection equipment is an automated device used to inspect the quality and reliability of solder joints on circuit boards. These devices use a variety of technical means to ensure the integrity and electrical performance of solder joints, thereby improving the quality and reliability of electronic products.

[0004] The existing intelligent cobalt oxide recovery device has the following shortcomings:

[0005] When existing technologies are used to process circuit boards, the process of flipping them for inspection is extremely inconvenient. Due to the lack of a convenient flipping mechanism, the circuit board often needs to be removed from the current clamping device and then placed in another clamping device or the original clamping method needs to be adjusted before the inspection process can be carried out after flipping, resulting in low overall efficiency. Utility Model Content

[0006] This utility model, through the arrangement of a first support plate, a second support plate, a circular groove, a connecting rod, a turntable, a miniature spring, a handle, a top rod, and a rotating shaft, enables the rotation of a first electric push rod and a rubber pad. During use, the circuit board can be clamped between the two, so the circuit board can be driven by the force, allowing the circuit board to be flipped over, thus solving the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: a circuit board solder joint quality inspection device, comprising a base plate, a first support plate and a second support plate fixedly connected to the top of the base plate, a turntable rotatably connected to one side of the outer wall of the first support plate, a handle fixedly connected to one side of the outer wall of the turntable, a miniature spring provided inside the first support plate, a top rod slidably connected inside the first support plate, a rotating shaft rotatably connected to the outer wall of the second support plate, a first electric push rod fixedly installed on the outer wall of both the rotating shaft and the turntable, a rubber pad fixedly connected to the shaft end of the first electric push rod, a second electric push rod fixedly installed on the top of both the first and second support plates, and a movable plate fixedly connected to the shaft end of the second electric push rod.

[0008] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0009] 1. In this utility model, by setting a first support plate, a second support plate, a circular groove, a connecting rod, a turntable, a miniature spring, a handle, a top rod, and a rotating shaft, the first electric push rod and the rubber pad can be driven to rotate. When in use, the circuit board can be clamped between the two, so the circuit board can be driven by the force, allowing the circuit board to be flipped, avoiding the need for frequent re-clamping and flipping operations, and improving the overall efficiency.

[0010] 2. In this utility model, the height of the movable plate and the image processing unit can be adjusted by setting the second electric push rod and the guide rod, which is convenient for subsequent adjustment according to actual needs. Furthermore, the position of the image processing unit can be adjusted by setting the slider and the positioning pin, which is convenient for subsequent use. Attached Figure Description

[0011] Figure 1 This utility model provides a three-dimensional view of the main structure of a circuit board solder joint quality inspection device;

[0012] Figure 2 This utility model provides an enlarged perspective view of the internal interconnection structure of the rotating shaft in a circuit board solder joint quality inspection device;

[0013] Figure 3 This utility model provides an enlarged perspective view of the internal interconnection structure of the first support plate in a circuit board solder joint quality inspection device.

[0014] Figure 4 This utility model provides an enlarged perspective view of the internal interconnection structure of the movable plate in a circuit board solder joint quality inspection device.

[0015] Legend: 1. Base plate; 2. Control panel; 3. First support plate; 4. Second support plate; 5. First electric push rod; 6. Rotary shaft; 7. Rubber pad; 8. Handle; 9. Turntable; 10. Top rod; 11. Connecting rod; 12. Miniature spring; 13. Circular groove; 14. Second electric push rod; 15. Guide rod; 16. Image processing unit; 17. Movable plate; 18. Slider; 19. Positioning pin; 20. Support leg. Detailed Implementation

[0016] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0017] Please see Figures 1-4This utility model provides a technical solution: a circuit board solder joint quality inspection device, including a base plate 1, a first support plate 3 and a second support plate 4 fixedly connected to the top of the base plate 1, a turntable 9 rotatably connected to one side of the outer wall of the first support plate 3, a handle 8 fixedly connected to one side of the outer wall of the turntable 9, a miniature spring 12 provided inside the first support plate 3, a top rod 10 slidably connected inside the first support plate 3, a rotating shaft 6 rotatably connected to the outer wall of the second support plate 4, a first electric push rod 5 fixedly installed on the outer wall of both the rotating shaft 6 and the turntable 9, a rubber pad 7 fixedly connected to the shaft end of the first electric push rod 5, a second electric push rod 14 fixedly installed on the top of both the first support plate 3 and the second support plate 4, and a movable plate 17 fixedly connected to the shaft end of the second electric push rod 14.

[0018] like Figure 1 As shown, the bottom of the base plate 1 is fixedly connected with support legs 20, and the top side of the base plate 1 is fixedly installed with a control panel 2. In actual use, the control panel 2 will be electrically connected to the components to control opening and closing. The support legs 20 can improve the overall stability when in use.

[0019] like Figure 3 As shown, one end of the miniature spring 12 is fixedly connected to the outer surface of the top rod 10, and the other end of the miniature spring 12 is fixedly connected to the inside of the first support plate 3. Both ends of the miniature spring 12 are connected to prevent it from detaching during use.

[0020] like Figure 1 and Figure 3 As shown, the outer wall of the push rod 10 penetrates the interior of the turntable 9, so that the push rod 10 can restrict the turntable 9 and prevent the turntable 9 from rotating.

[0021] like Figure 1 and Figure 3 As shown, the first support plate 3 and the second support plate 4 are provided with circular grooves 13. The inner walls of the circular grooves 13 are slidably connected with connecting rods 11. The end face of the connecting rods 11 is fixedly connected to the outer wall of the first electric push rod 5. Through the circular grooves 13 and connecting rods 11, the stability of the first electric push rod 5, the turntable 9 and the rubber pad 7 during rotation can be improved, so that the flipping operation can be carried out normally.

[0022] like Figure 1 and Figure 4 As shown, a slider 18 is slidably connected to the inner wall of the movable plate 17. An image processing unit 16 is fixedly mounted on the bottom of the slider 18, and a positioning pin 19 is provided through the top of the slider 18. The end face of the positioning pin 19 penetrates the interior of the movable plate 17. Through the slider 18 and the positioning pin 19, the position of the image processing unit 16 can be adjusted according to actual needs. Figure 1 and Figure 4As shown, its image processing unit 16 is composed of a CMOS image sensor and a camera. The combination of the two can capture and analyze images and identify solder joint defects.

[0023] like Figure 1 and Figure 4 As shown, guide rods 15 are fixedly connected to the top of the first support plate 3 and the second support plate 4. The outer wall of the guide rod 15 is slidably connected to the inside of the movable plate 17. The guide rod 15 can improve the stability of the movable plate 17 when it moves up and down.

[0024] The usage and working principle of this device are as follows: After placing the entire unit in the designated location, connect the external power supply to ensure normal operation of subsequent work. Place the circuit board between the two rubber pads 7. Activate the first electric push rod 5 via the control panel 2 to move the two rubber pads 7 horizontally and bring them closer together. When they are in the appropriate position, the circuit board is fixed. Then, activate the second electric push rod 14 via the control panel 2 to extend and retract, causing the movable plate 17 and image processing unit 16 to move up and down to the appropriate height. Adjust the position of the image processing unit 16 using the slider 18 and positioning pin 19. (The following is a separate section and not part of the instructions.) The image processing unit 16 captures and analyzes images, identifies solder joint defects, outputs detection results, and marks defect locations. The detection structure can be viewed on the display screen on the control panel 2. If it is necessary to flip the circuit board, the user presses the push rod 10 to disengage it from the turntable 9, and then rotates the turntable 9 through the handle 8. The connecting rod 11 slides in the circular groove 13 under force, and the turntable 9 can drive the corresponding first electric push rod 5 and rubber pad 7. Then the circuit board can be driven by the first electric push rod 5 and rubber pad 7 corresponding to the rotating shaft 6. After the flipping is completed, the elastic force of the micro spring 12 is used to make the push rod 10 forcefully and stably inserted into the turntable 9 to achieve its restriction.

[0025] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A circuit board solder joint quality inspection device, comprising a base plate (1), characterized in that: The top of the base plate (1) is fixedly connected to a first support plate (3) and a second support plate (4). A turntable (9) is rotatably connected to one side of the outer wall of the first support plate (3). A handle (8) is fixedly connected to one side of the outer wall of the turntable (9). A miniature spring (12) is provided inside the first support plate (3). A top rod (10) is slidably connected inside the first support plate (3). A rotating shaft (6) is rotatably connected to the outer wall of the second support plate (4). A first electric push rod (5) is fixedly installed on the outer wall of both the rotating shaft (6) and the turntable (9). A rubber pad (7) is fixedly connected to the shaft end of the first electric push rod (5). A second electric push rod (14) is fixedly installed on the top of both the first support plate (3) and the second support plate (4). A movable plate (17) is fixedly connected to the shaft end of the second electric push rod (14).

2. The circuit board solder joint quality inspection equipment according to claim 1, characterized in that: The bottom of the base plate (1) is fixedly connected to a support leg (20), and a control panel (2) is fixedly installed on one side of the top of the base plate (1).

3. The circuit board solder joint quality inspection equipment according to claim 1, characterized in that: One end of the miniature spring (12) is fixedly connected to the outer surface of the top rod (10), and the other end of the miniature spring (12) is fixedly connected to the interior of the first support plate (3).

4. The circuit board solder joint quality inspection equipment according to claim 1, characterized in that: The outer wall of the top rod (10) penetrates the interior of the turntable (9).

5. The circuit board solder joint quality inspection equipment according to claim 1, characterized in that: The first support plate (3) and the second support plate (4) are provided with circular grooves (13), and the inner walls of the circular grooves (13) are slidably connected with connecting rods (11), and the end face of the connecting rods (11) is fixedly connected to the outer wall of the first electric push rod (5).

6. The circuit board solder joint quality inspection equipment according to claim 1, characterized in that: The inner wall of the movable plate (17) is slidably connected to a slider (18), and an image processing unit (16) is fixedly installed at the bottom of the slider (18). A positioning pin (19) is provided through the top of the slider (18), and the end face of the positioning pin (19) penetrates the interior of the movable plate (17).

7. The circuit board solder joint quality inspection equipment according to claim 1, characterized in that: The top of the first support plate (3) and the second support plate (4) are both fixedly connected with guide rods (15), and the outer wall of the guide rods (15) is slidably connected to the inside of the movable plate (17).

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