Active temperature controller

Abstract

The utility model provides an active temperature controller. The active temperature controller comprises an upper ceramic plate and a lower ceramic plate which are oppositely arranged; the PN module stack is arranged between the upper ceramic plate and the lower ceramic plate; the TEC electrode is electrically connected with the PN module stack; the at least one temperature control plate and / or temperature sensor ceramic plate is laminated on the upper ceramic plate or the lower ceramic plate; wherein the temperature control plate is one of a heating ceramic plate or a cooling plate. The utility model aims to solve the problems that the existing TEC Peltier heater is easy to damage due to overlarge temperature difference at two ends, the temperature rise and drop speed is slow, and the refrigeration power is low.

Description

Technical Field

[0001] This utility model belongs to the field of thermostats, and in particular relates to an active thermostat. Background Technology

[0002] The TEC (Thermo-Electric Cooler), or Peltier heater, is an innovative electronic device based on the Peltier effect, enabling flexible switching between cooling and heating functions. The Peltier effect describes the temperature difference caused by the passage of electric current at the interface of two different materials; one interface absorbs heat while the other releases heat. The TEC Peltier heater cleverly utilizes this principle, allowing for free switching between heating and cooling modes by adjusting the direction of the current. Its internal structure consists of multiple thermopiles, each carefully crafted with two semiconductor materials, achieving precise temperature control through accurate current regulation.

[0003] TEC Peltier heaters have achieved remarkable success in numerous fields thanks to their unique advantages:

[0004] 1. High-precision temperature control: Achieves precise temperature control of approximately 0.1℃, meeting the requirements for high-precision temperature control.

[0005] 2. Energy saving and environmental protection: High-efficiency power conversion reduces energy loss and is green and environmentally friendly.

[0006] 3. Compact size: Simple structure, no need for complex mechanical parts, small size and easy integration.

[0007] 4. Quiet operation: Designed with no mechanical parts, it operates quietly without disturbing noise.

[0008] In the fields of medicine, chemical engineering, and bioscience, TEC Peltier heaters are widely used in laboratory sample processing, medical equipment insulation, optical component temperature control, and bioreactor temperature control. However, they also face some challenges, such as the need to improve efficiency, relatively short service life, and susceptibility to ambient temperature.

[0009] Regarding the lifespan issue, it is mainly due to the fact that the thermopile material is sensitive to temperature differences. Excessive temperature difference between the two ends will cause high thermal stress, resulting in internal damage.

[0010] In addition, if the temperature difference between the two ends is too large, the effective cooling power will be greatly reduced, resulting in a slower heating and cooling rate. Utility Model Content

[0011] In view of the shortcomings of the prior art described above, the purpose of this utility model is to solve the problem that the TEC Peltier heater is easily damaged due to excessive temperature difference between its two ends, and the problem that the effective cooling power is reduced when the temperature difference between its two ends is too large.

[0012] This application provides an active temperature controller, including:

[0013] The upper and lower ceramic plates are set opposite to each other;

[0014] A PN module stack is positioned between the upper and lower ceramic plates;

[0015] The TEC electrode is electrically connected to the PN module stack;

[0016] At least one temperature control plate and / or temperature sensor ceramic plate are stacked on the upper or lower ceramic plate;

[0017] The temperature control plate is either a heating ceramic plate or a cooling plate.

[0018] Furthermore, the heating ceramic plate is disposed on the upper ceramic plate, and the temperature sensor ceramic plate is disposed on the lower ceramic plate; or the temperature sensor ceramic plate is disposed at the upper end of the upper ceramic plate, and then the heating ceramic plate is disposed on the temperature sensor ceramic plate.

[0019] Furthermore, the PN module stack includes multiple PN pairs spaced apart, and all or part of the PN pairs are electrically connected to at least one set of TEC electrodes; the set of TEC electrodes includes an anode electrode and a cathode electrode.

[0020] Furthermore, each PN pair includes a P-type semiconductor and an N-type semiconductor spaced apart, and a conductive sheet connected between the P-type semiconductor and the N-type semiconductor.

[0021] Furthermore, it includes at least two sets of PN module stacks that can be controlled independently, each PN module stack including a plurality of PN pairs electrically connected to the set of TEC electrodes.

[0022] Furthermore, the heating ceramic plate and / or the temperature sensor ceramic plate are stacked with the upper or lower ceramic plate and fused together to form a non-removable composite ceramic plate; the heating wire of the heating ceramic plate and / or the thermocouple wire of the temperature sensor ceramic plate are serpentinely coiled on their respective ceramic substrates by printing or near-printing. The temperature sensor module can also be an embedded standard RTD or thermocouple temperature sensor module.

[0023] Furthermore, the cooling plate is disposed on the upper ceramic plate, and the heating ceramic plate is disposed on the lower ceramic plate; or the cooling plate is disposed on the upper ceramic plate, and the temperature sensor ceramic plate is disposed on the lower ceramic plate; or the cooling plate and the heating ceramic plate are stacked on the upper ceramic plate, and the temperature sensor ceramic plate is disposed on the lower ceramic plate.

[0024] Furthermore, the cooling plate is cooled by liquid cooling or air cooling, or by phase change material refrigeration (such as refrigerant).

[0025] The improvements in this application bring the following advantages: Traditional TEC solutions, when requiring heating, result in excessive temperature differences between the two sides of the TEC. For example, the upper side, near the cooling plate, has a lower temperature, while the target plate (lower side) needs heating, leading to a large temperature difference. The active temperature controller provided in this application, 1. When used for cooling, an additional cooling plate can be added above the TEC (externally) to cool it down. A temperature sensor and / or heating wire are built into the ceramic plate on the lower side of the TEC for precise temperature control; 2. When used for heating, a heating wire can be built into the ceramic plate on the upper side of the TEC. If the target layer on the lower side needs heating, the upper heating wire can be activated simultaneously to counteract the cooling effect of the cooling plate and reduce the temperature difference between the two sides; 3. Alternatively, a cooling plate can be placed above the TEC, and a heating wire can be installed inside the upper ceramic layer. If the target layer on the lower side needs heating, the upper heating wire can be activated simultaneously to counteract the cooling effect of the cooling plate and reduce the temperature difference between the two sides. 4. Regardless of whether the present invention is used for heating or cooling, heating wires and / or sensors can be built into the upper ceramic plate and / or the lower ceramic plate according to actual needs (such as cost, thickness, etc.) to balance the internal temperature difference and achieve rapid heating and cooling, as well as precise temperature adjustment; 5. The heating wires and / or sensors built into the ceramic plate in the above 4 points can be divided into zones according to actual needs, such as one zone, two zones, etc. Attached Figure Description

[0026] Figure 1a , 1b This is a three-dimensional structural diagram of one embodiment of an active temperature controller according to this application;

[0027] Figure 2a , 2b 2c are three-dimensional structural diagrams of an active temperature controller according to an embodiment of this application;

[0028] Figure 3a , 3b This is an exploded view of the composite ceramic plate according to an embodiment of this application;

[0029] Figure 4a ,4b Figures 4c and 4c are three-dimensional structural diagrams of an active temperature controller according to an embodiment of this application. Detailed Implementation

[0030] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0031] Traditional TEC applications have various limitations: for example, the temperature difference ΔT between the hot plate and cold plate cannot exceed a certain value, such as 80 degrees Celsius (this is just an example). In cooling mode, an additional cold plate or heat sink (with a fan installed if needed) is typically required on the hot plate side of the TEC to help dissipate heat; otherwise, if the temperature on the hot plate side is significantly higher than the cold plate side, the temperature difference ΔT may exceed the safety threshold. However, in heating mode, the hot and cold plates of the TEC are reversed. The installed cold plate or heat sink becomes a heavy thermal mass, which may result in insufficient temperature or slow temperature rise. Even if the desired temperature is reached, the temperature difference ΔT between the hot and cold plates may exceed the safety threshold. All of these limitations restrict the application of this type of TEC to a limited range and significantly shorten its lifespan.

[0032] The active temperature controllers (TECs) described in this application all assume that their underlying layer is in close contact with the target object (that is, the target object whose temperature is controlled by the TEC).

[0033] Example 1

[0034] Figure 1a The diagram shows the TEC divided into two independently controlled areas (areas 1 and 2) based on the traditional method. Figure b shows a perspective view of a. The division into two areas here is merely an example; in practical applications, it can be divided into one to n independent areas as needed. The surrounding soft sealant, etc., are not shown in the accompanying drawings.

[0035] like Figure 1a and Figure 1bAs shown, the PN module stack 3 inside the TEC is divided into two groups: region 1 on the left and region 2 on the right. Each group of PN module stack 3 consists of multiple PN31 pairs. Both groups of PN module stack 3 are connected to an independent set of TEC electrodes 4, each with its own independent TEC electrodes 4 for independent control of power and current direction. In this way, the power of the two regions can be controlled separately, or even the heating and cooling conditions, such as heating one region while cooling the other. Heating one region while cooling another is necessary in some situations, such as when a constant temperature needs to be maintained on the target surface, but the power of different regions of the target object or the external conditions change over time. In such cases, the TEC needs to "dynamically adjust" to maintain this temperature, requiring rapid power adjustments, or even heating or cooling, to stabilize the temperature of the contact surface between the TEC and the target object at a certain value, unaffected by external influences on the TEC. Correspondingly, the heating ceramic plate 5 and / or the temperature sensor ceramic plate 6 also have at least two independently controllable zones to follow the TEC's independent control. The heating ceramic plate 5 and / or the temperature sensor ceramic plate 6 can also be controlled independently without partitioning, or can be partitioned differently from the TEC.

[0036] Notice, Figure 1a and Figure 1b This is merely an example of a design concept. In actual use, it can be modified according to actual needs. For example, the number of partitions can be one or more, not limited to two; the location of the partitions, the size and shape of the partitions are not limited to rectangles, and the area and shape of each partition can also be different; the location and shape of the external power supply pins can also be changed. Figure 1a The positions of regions 1 and 2 on the ceramic plate in section b are deliberately marked with lines, but this is only for ease of understanding. In actual use, it is not necessary to deliberately mark them on the appearance.

[0037] Example 2

[0038] Figure 2 illustrates application examples of three TECs combined with heating ceramic plate 5 and / or temperature sensor ceramic plate 6: Figure 2a - An additional heating layer was added to the upper ceramic plate 1; Figure 2b -A heating layer was added to the upper ceramic plate 1, and a temperature sensor layer was added to the lower ceramic plate 2; Figure 2c - An additional heating layer and a temperature sensor layer were added to the upper ceramic plate 1.

[0039] Figure 2aIn sections b and c, the heating ceramic plate 5 and the temperature sensor ceramic plate 6 are also divided into two corresponding areas. Similarly, the TEC electrodes 4 of the heating ceramic plate 5 and the temperature sensor ceramic plate 6 are divided into two groups, allowing for independent control. However, in practical applications, the partitioning and number of heating ceramic plates 5 and / or temperature sensor ceramic plates 6 may not correspond to the TEC partitioning. For example, the heating area can be a single, continuous area, but the temperature sensors can be divided into areas and numbers corresponding to the locations and numbers of TECs. This can be adjusted according to the specific circumstances.

[0040] Figure 2a The vertical positions of the heating ceramic plate 5 and temperature sensor ceramic plate 6 in sections b and c, relative to the original ceramic layer substrate, are merely illustrative examples to explain the concept. In practice, these positions can be modified. For instance, the order of the upper ceramic plate 1 could be: upper ceramic plate 1 --> heating ceramic plate 5, bringing the heating ceramic plate 5 closer to the TEC's PN module stack 3. Similarly, the order of the lower ceramic plate 2 could be: lower ceramic plate 2 --> temperature sensor ceramic plate 6, bringing the temperature sensor closer to the target object requiring temperature control, facilitating more accurate temperature feedback to the controller for PID temperature control calculations. Furthermore, the heating ceramic plate 5 could be moved from the upper ceramic plate 1 to the lower ceramic plate 2, or heating ceramic plates 5 could be added to both the upper and lower layers, and / or temperature sensor ceramic plate 6 layers could be added to both.

[0041] The temperature sensor ceramic plate 6 here can have multiple uses: for example, if it is placed on the upper ceramic plate 1 and close to the heating ceramic plate 5, it can be used for temperature feedback to regulate the switching of the heater inside the heating ceramic plate 5, determining when to turn on the power or power of the heater circuit; or if it is placed on the lower layer and close to the target object at the bottom that needs temperature control, it can be used to monitor the temperature of the target object and feed it back to the temperature controller of the TEC to dynamically adjust the heating or cooling power and current direction of the TEC.

[0042] in addition, Figure 2a In sections b and c, the upper ceramic plate 1 or the lower ceramic plate 2 can be integrated with the heating ceramic plate 5 and / or the temperature sensor ceramic plate 6 into a single ceramic plate. For example... Figure 2b The upper composite ceramic plate is formed by fusing the heating ceramic plate 5 and the upper ceramic plate 1 into an inseparable whole, rather than two separate pieces; similarly, the lower composite ceramic plate is formed by fusing the lower ceramic plate 2 and the temperature sensor ceramic plate 6 into an inseparable whole. For ease of understanding, the schematic diagram shows a multi-layered structure. However, the total thickness of the fused multi-layered composite ceramic plate can still be made very thin, or consistent with the thickness of a traditional TEC ceramic plate.

[0043] Example 3

[0044] Figure 3 illustrates an exploded view of the structure of a composite ceramic plate with a heater ceramic plate and a temperature sensor ceramic plate mounted on a ceramic plate substrate. Figure 3a - It adds six ceramic plates: a heater ceramic plate and a temperature sensor ceramic plate. Figure 3b - This simply adds six ceramic plates, either a heater ceramic plate or a temperature sensor ceramic plate. The order of the multi-layer composite ceramic plates and the internal circuit layout shown here are merely conceptual diagrams for illustrative purposes; in actual applications, they can be modified according to specific needs.

[0045] As shown in the figure Figure 3a As shown in Figure b, this embodiment uses either high-temperature co-fired ceramics (HTCC) or low-temperature co-fired ceramics (LTCC) methods to produce multilayer composite ceramic plates. These plates are equipped with built-in heaters and / or temperature sensors. The fine wires (heating wire 51 or thermocouple wire 61) for the heaters and temperature sensors are printed on the ceramic plate or disposed on the ceramic substrate using a similar printing method. The ceramic plates are then extruded and co-fired with the base ceramic plate (including the upper ceramic plate 1 or the lower ceramic plate 2) to obtain a bonded (fused) non-removable single ceramic plate with a thickness approaching 1 mm. This ceramic plate is then combined with a PN module stack 3 in a matrix sandwich configuration. The gaps between the PN module stack 3 and the upper and lower ceramic plates are then sealed with adhesive to obtain the product of this application. The temperature sensor can be made using (but is not limited to) a thermal couple, or printed metal wires (the metal material is customized according to the production process, usage environment and accuracy, such as but not limited to platinum or manganese alloys with other metals) to make an RTD (temperature sensor) (as shown in Figure 3), or a standard temperature sensor component can be embedded.

[0046] Figure 3a The serpentine layout of the heater and / or temperature sensor resistance wires shown in Figure b is merely an example. In practice, the layout can be flexibly adjusted according to actual needs, and may even be divided into two layers of resistance wires connected in series (if high resistance is required) to form a three-dimensional circuit layout.

[0047] If this product is used for dynamic temperature control, an additional temperature control circuit board is required to receive the signal from the temperature sensor ceramic plate 6 as the input signal for temperature control. After calculation (e.g., PID calculation), the output signal controls the magnitude and direction of the current in the TEC PN module stack 3 and the heating ceramic plate 5. If the product has more than one area (e.g.) Figure 2a If we consider the two regions (b and c), then we need to make a one-to-one correspondence between the temperature sensor, PID calculation, TEC, and the electrodes of the heating ceramic plate 5 according to the region positions.

[0048] Example 4

[0049] Figure 4 provides an example. Figure 4a b-TEC with coolant-cooled cold plate 7, and Figure 4c -TEC and fan-cooled heat sink plate 7. Figure 4a It uses a simple TEC ceramic plate. Figure 4b and Figure 4c The TEC used has heating ceramic plate 5 and temperature sensor ceramic plate 6 installed separately. The three examples here, including the positions of heating ceramic plate 5 and temperature sensor ceramic plate 6 on the TEC, are for illustrative purposes only, and the actual application is not limited to these three types.

[0050] Figure 4a This shows how a TEC (thermal control circuit) divided into two zones (ceramic plate 5 without heating and ceramic plate 6 without temperature sensor) is assembled with a cold plate 7 to cool the TEC. If the temperature of the target object needs to be dynamically adjusted, an additional temperature sensor (e.g., mounted on the target object) is required as the PID temperature feedback signal for the temperature control circuit board.

[0051] Figure 4b It showed a Figure 4a Based on this, an additional heating ceramic plate 5 is added to the upper ceramic plate 1, and a temperature sensor ceramic plate 6 is added to the lower ceramic plate 2. This is used to determine how to use the heating ceramic plate 5 to resist the low temperature and thermal mass of the cold plate on the upper part of the product during the stage when the target object requires heating. The temperature sensor ceramic plate 6 is used to record the temperature near the target object, which is used as the temperature feedback signal for the PID calculation of the temperature control circuit board.

[0052] Figure 4c It showed a Figure 4b Based on this, the cold plate 7 is replaced with a heat sink 14, and a fan (fixed speed or dynamically variable speed) is installed for cooling. The cooling methods listed in this application, such as cold plates or heat sinks, are only examples. In actual use, there are many other methods, such as heat pipes, heat sinks, phase change materials, refrigerants, etc.

[0053] Note that if the heating ceramic plate 5 is located on the upper ceramic plate 1 (e.g., Figure 2a(Considering the three scenarios in b and c), the purpose of the heating ceramic plate 5 is to prevent the heat sink or cold plate above the product from becoming too cold when the target object directly below the product needs to be heated to a relatively high temperature, thus preventing excessive temperature difference between the top and bottom surfaces of the product and damaging the TEC. Therefore, the external temperature control circuit board needs to perform additional special handling on the current of the heating ceramic plate 5: a. During the rapid heating phase of the target object, the heating ceramic plate 5 needs to be heated; b. During the rapid cooling phase of the target object, the heating ceramic plate 5 needs to be switched off; c. After the temperature approaches the required set temperature, it needs to be dynamically switched on (e.g., turned on when TEC heating is needed, otherwise turned off), or the heating ceramic plate 5 needs to be kept on at low power to minimize the high current heating power of the TEC.

[0054] The above description is merely a preferred embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. An active temperature controller, characterized in that, include: The upper and lower ceramic plates are set opposite to each other; A PN module stack is positioned between the upper and lower ceramic plates; The TEC electrode is electrically connected to the PN module stack; At least one temperature control plate and / or temperature sensor ceramic plate are stacked on the upper or lower ceramic plate; The temperature control plate is either a heating ceramic plate or a cooling plate.

2. The active temperature controller according to claim 1, characterized in that, The heating ceramic plate is disposed on the upper ceramic plate, and the temperature sensor ceramic plate is disposed on the lower ceramic plate; or the temperature sensor ceramic plate is disposed at the upper end of the upper ceramic plate, and then the heating ceramic plate is disposed on the temperature sensor ceramic plate.

3. The active temperature controller according to claim 1, characterized in that, The PN module stack includes multiple PN pairs spaced apart, and all or some of the PN pairs are electrically connected to at least one set of TEC electrodes; one set of TEC electrodes includes an anode electrode and a cathode electrode.

4. An active temperature controller according to claim 3, characterized in that, Each PN pair includes a P-type semiconductor and an N-type semiconductor spaced apart, and a conductive sheet connecting the P-type semiconductor and the N-type semiconductor.

5. An active temperature controller according to claim 3, characterized in that, It includes at least two sets of PN module stacks that can be controlled independently, and each set of PN module stacks includes a plurality of PN pairs that are electrically connected to the set of TEC electrodes.

6. An active temperature controller according to any one of claims 1-5, characterized in that, The heating ceramic plate and / or temperature sensor ceramic plate are stacked with the upper or lower ceramic plate and fused together to form a non-removable composite ceramic plate; the heating wire of the heating ceramic plate and / or the thermocouple wire of the temperature sensor ceramic plate are serpentinely coiled on their respective ceramic substrates by printing or near-printing, or the temperature sensor module is embedded within them.

7. An active temperature controller according to any one of claims 1-5, characterized in that, The cooling plate is disposed on the upper ceramic plate, and the heating ceramic plate is disposed on the lower ceramic plate; or the cooling plate is disposed on the upper ceramic plate, and the temperature sensor ceramic plate is disposed on the lower ceramic plate; or the cooling plate and the heating ceramic plate are stacked on the upper ceramic plate, and the temperature sensor ceramic plate is disposed on the lower ceramic plate.

8. An active temperature controller according to claim 7, characterized in that, The cooling plate is cooled by liquid cooling, air cooling, or phase change material refrigeration.

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