Heating frame

Abstract

The utility model discloses a heating frame which comprises a frame body, a PI heating film and a temperature equalizing sheet. The frame body comprises a base and a frame, the frame is arranged on the periphery of the base, a containing groove is formed between the inner side of the frame and the base, the PI heating film is arranged on the frame, and the temperature equalizing piece is arranged on the PI heating film. When the heating frame is used, the bottom shell is placed in the containing groove, the edge sealing position of the bottom shell abuts against the temperature equalizing piece, then the core material is placed in the groove of the bottom shell, the core material is covered with the barrier film, the whole heating frame is placed in the vacuum cavity to be vacuumized, and after vacuumizing is completed, the PI heating film is heated to seal the barrier film and the bottom shell together in a heat mode. By arranging the temperature equalizing piece, when the PI heating film is heated, heat is transferred to the surface of the temperature equalizing piece, the temperature difference of all positions of the surface of the temperature equalizing piece is small, and therefore the heat sealing effect of the barrier film and the bottom shell is better.

Description

Technical Field

[0001] This utility model relates to the field of heat sealing technology, and in particular to a heating frame. Background Technology

[0002] Vacuum insulation panels are a type of vacuum insulation material. They can effectively prevent heat transfer caused by air convection, thus significantly reducing the thermal conductivity. They are environmentally friendly, efficient, and energy-saving, and are widely used in industries such as building insulation, refrigerators, freezers, and refrigerated containers.

[0003] Current methods for manufacturing vacuum insulation panels involve stamping or vacuum forming a barrier film into a grooved base shell, placing the base shell in a heating frame, then placing the core material along with the absorbent into the groove of the base shell. Another barrier film is then placed on top of the core material, and the entire assembly is placed in a vacuum chamber for evacuation. After evacuation, the heating frame heats up, sealing the barrier film and base shell together to produce the vacuum insulation panel. However, during the heat sealing process, existing heating frames exhibit significant temperature differences across different heating points, resulting in uneven heating and affecting the heat sealing effect of the vacuum insulation panel. Utility Model Content

[0004] Based on the aforementioned problems in the prior art, the purpose of this application is to provide a heating frame that, by setting a temperature equalization plate and a PI heating film, makes the temperature difference between different positions of the heating frame smaller during heating, thereby improving the heat sealing effect.

[0005] The technical solution adopted by this application to solve its technical problem is: a heating frame, including a frame body, a PI heating film and a temperature equalization plate;

[0006] The frame includes a base and a frame. The frame is disposed on the periphery of the base. A receiving groove is formed between the inner side of the frame and the base. The PI heating film is disposed on the frame, and the temperature equalization plate is disposed on the PI heating film.

[0007] Furthermore, the frame includes a frame block and a heat insulation pad, with the bottom of the frame block fixed to the base and the heat insulation pad fixed to the top of the frame block.

[0008] Furthermore, the heat insulation pad is a mica heat insulation pad.

[0009] Furthermore, the frame is set to four, and adjacent frame blocks are connected together by connecting blocks.

[0010] Furthermore, a positioning block is provided on the frame block, and a positioning groove that cooperates with the positioning block is provided on the heat insulation pad.

[0011] Furthermore, a first connecting hole is provided on the positioning block, an extension piece is formed at the bottom of the temperature equalization plate, and a second connecting hole is provided on the extension piece to cooperate with the first connecting hole.

[0012] Furthermore, the PI heating film is provided with a connecting portion, and the extension sheet is provided with a clearance groove for the connecting portion to pass through.

[0013] Furthermore, a shim is provided on the base, and the outer side of the shim is attached to the inner side of the frame.

[0014] Furthermore, the temperature equalization plate is a copper sheet.

[0015] The beneficial effects of this application are as follows: During heat sealing, the bottom shell is placed in the receiving groove so that the sealing edge of the bottom shell abuts against the heat spreader. Then, the core material is placed in the groove of the bottom shell, and the barrier film is placed on the core material. The whole assembly is placed in a vacuum chamber for vacuuming. After vacuuming, the PI heating film is heated to heat seal the barrier film and the bottom shell together. By setting the heat spreader, the heat is transferred to the surface of the heat spreader when the PI heating film is heated. The heat spreader has a better temperature uniformity effect, making the temperature difference between different positions on the surface of the heat spreader smaller, thereby making the heat sealing effect between the barrier film and the bottom shell better. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the heating frame in this application;

[0017] Figure 2 This is an exploded view of the heating frame in this application;

[0018] Figure 3 For this application Figure 2 A magnified view of a portion of the image;

[0019] Figure 4 This is a cross-sectional view of the heating frame in this application;

[0020] Figure 5 For this application Figure 4 A magnified view of a portion of the image.

[0021] Explanation of reference numerals in the attached figures

[0022] Frame 1, base 11, frame 12, frame block 121, positioning block 1211, first connecting hole 12111, heat insulation pad 122, positioning groove 1221, connecting block 123, shim block 13, PI heating film 2, connecting part 21, temperature equalization plate 3, extension plate 31, second connecting hole 311, clearance groove 312, receiving groove 4. Detailed Implementation

[0023] To better explain and facilitate understanding of this utility model, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0024] like Figures 1 to 5 As shown, a heating frame of the present invention includes a frame body 1, a PI heating film 2 and a heat equalizer 3; the frame body 1 includes a base 11 and a frame 12, the frame 12 is disposed on the periphery of the base 11, and a receiving groove 4 is formed between the inner side of the frame 12 and the base 11, the PI heating film 2 is disposed on the frame 12, and the heat equalizer 3 is disposed on the PI heating film 2.

[0025] Thus, in the heating frame of this utility model, during heat sealing, the bottom shell is placed in the receiving groove 4, so that the sealing edge of the bottom shell abuts against the heat equalization plate 3. Then, the core material is placed in the groove of the bottom shell, and the barrier film is placed on the core material. The whole frame is placed in a vacuum chamber for vacuuming. After vacuuming, the PI heating film 2 is heated to heat seal the barrier film and the bottom shell together. By setting the heat equalization plate 3, when the PI heating film 2 is heated, the heat is transferred to the surface of the heat equalization plate 3, so that the temperature difference at various positions on the surface of the heat equalization plate 3 is small, thereby making the heat sealing effect between the barrier film and the bottom shell better.

[0026] Optionally, the frame 12 includes a frame block 121 and a heat insulation pad 122. The bottom of the frame block 121 is fixed to the base 11, and the heat insulation pad 122 is fixed to the top of the frame block 121. That is, the PI heating film 2 is placed on the heat insulation pad 122. By placing the heat insulation pad 122, when the PI heating film 2 is heated, it can block the downward transfer of heat. Specifically, the heat insulation pad 122 is a mica heat insulation pad 122 with good barrier properties.

[0027] Furthermore, four frame blocks 121 are provided, and two adjacent frame blocks 121 are connected together by connecting blocks 123. By providing four frame blocks 121 and four connecting blocks 123, it is convenient to assemble the frame 12. After the four frame blocks 121 and four connecting blocks 123 are connected together, they together with the base 11 form a receiving groove 4 for accommodating the bottom shell.

[0028] In this embodiment, a positioning block 1211 is provided on the frame block 121, and a positioning groove 1221 that cooperates with the positioning block 1211 is provided on the heat insulation pad 122. During installation, the positioning groove 1221 of the heat insulation pad 122 is aligned with the positioning block 1211 of the frame block 121, so that the positioning block 1211 is inserted into the positioning groove 1221. There can be multiple positioning blocks 1211 and positioning grooves 1221, and each positioning groove 1221 cooperates with a positioning block 1211, thereby limiting the heat insulation pad 122 and preventing the heat insulation pad 122 from shaking.

[0029] Furthermore, such as Figure 3As shown, the positioning block 1211 is provided with a first connecting hole 12111, and the bottom of the heat spreader 3 forms an extension piece 31. The extension piece 31 is provided with a second connecting hole 311 that mates with the first connecting hole 12111. During installation, after the heat insulation pad 122 is placed on the frame block 121, the PI heating film 2 is placed on the heat insulation pad 122, and then the heat spreader 3 is placed on the PI heating film 2, so that the second connecting hole 311 is aligned with the first connecting hole 12111. Finally, a fastener is used to connect the second connecting hole 311 and the first connecting hole 12111, thereby locking the heat spreader 3 onto the frame block 121 and firmly fixing the heat spreader 3 to the frame 12. At the same time, by providing the extension piece 31, the PI heating film 2 is limited in position.

[0030] Furthermore, the PI heating film 2 is provided with a connecting portion 21, and the extension sheet 31 is provided with a relief groove 312 for the connecting portion 21 to pass through. The PI heating film 2 is mainly composed of a polyimide film and a metal conductive heating element. The polyimide film, as an external insulator, not only has excellent insulation and temperature resistance properties, but also effectively protects the internal metal heating element, preventing it from oxidizing or being damaged in high-temperature environments. The metal conductive heating element is the key component for converting electrical energy into heat energy, generating heat through the action of electric current. By providing the connecting portion 21, it is easy to conduct electricity through the PI heating film 2, enabling the PI heating film 2 to achieve a heating effect.

[0031] Some bottom shells have deeper grooves, while others have shallower grooves. To accommodate different bottom shells, a shim block 13 is provided on the base 11. The outer side of the shim block 13 fits into the inner side of the frame 12. During use, the shim block 13 of different thicknesses can be replaced according to the different groove depths of the bottom shells, so that the bottom of the bottom shell fits perfectly on the shim block 13 and the sealing edge of the bottom shell fits perfectly on the temperature equalizer 3.

[0032] In this embodiment, the temperature equalization plate 3 is a copper sheet, which has a good temperature equalization effect. Preferably, the copper sheet is 0.5mm thick. Testing showed that without the copper sheet, the temperature difference between each measuring point was approximately ±12℃. With the copper sheet, the temperature difference between each measuring point was approximately ±5℃. Therefore, by using the copper sheet, the heating frame achieves better temperature equalization, thus improving the heat sealing effect between the barrier film and the bottom shell.

[0033] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent modifications made based on the content of this utility model specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A heating frame, characterized in that: Includes the frame, PI heating film, and temperature distribution plate; The frame includes a base and a frame. The frame is disposed on the periphery of the base. A receiving groove is formed between the inner side of the frame and the base. The PI heating film is disposed on the frame, and the temperature equalization plate is disposed on the PI heating film.

2. The heating frame as described in claim 1, characterized in that: The frame includes a frame block and a heat insulation pad. The bottom of the frame block is fixed to the base, and the heat insulation pad is fixed to the top of the frame block.

3. The heating frame as described in claim 2, characterized in that: The heat insulation pad is a mica heat insulation pad.

4. The heating frame as described in claim 2, characterized in that: The frame is set to four, and adjacent frames are connected together by connecting blocks.

5. The heating frame as described in claim 2, characterized in that: The frame is provided with a positioning block, and the heat insulation pad is provided with a positioning groove that cooperates with the positioning block.

6. The heating frame as described in claim 5, characterized in that: The positioning block is provided with a first connecting hole, and the bottom of the temperature equalization plate is formed with an extension plate, and the extension plate is provided with a second connecting hole that cooperates with the first connecting hole.

7. The heating frame as described in claim 6, characterized in that: The PI heating film is provided with a connecting part, and the extension sheet is provided with a clearance groove for the connecting part to pass through.

8. The heating frame as described in claim 1, characterized in that: A shim is provided on the base, and the outer side of the shim is attached to the inner side of the frame.

9. The heating frame as described in claim 1, characterized in that: The temperature equalization plate is a copper sheet.

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