Stamping die of water cooling plate
By using an elastic component to connect the lower die and the lower die base in the water-cooled plate stamping die, the problem of lower die base deformation caused by the lack of a buffer mechanism in traditional dies is solved, thereby improving the stability of the die and the quality of the product, and meeting the high-quality requirements of high-end electronic equipment.
Patent Information
- Application Number
- CN202422877525.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2034-11-25
AI Technical Summary
Traditional stamping dies lack a buffer mechanism in water-cooled plate processing, resulting in severe deformation and wear of the lower die base, affecting precision and product quality, and making it difficult to meet the high-quality requirements of high-end electronic equipment.
The lower mold and the lower mold base are connected by elastic components. The impact force is dispersed by the slide groove and helical spring structure to achieve a buffering effect and ensure the stability and accurate positioning of the lower mold.
It effectively reduces deformation and wear of the lower mold base, improves product precision and appearance quality, extends mold life, reduces maintenance costs, and meets the heat dissipation performance requirements of high-end electronic equipment.
Smart Images
Figure CN223543918U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of stamping die technology, specifically to a stamping die for a water-cooled plate. Background Technology
[0002] In modern industrial production, especially in the manufacturing of heat dissipation components for electronic devices, water-cooled plates play a crucial role. As the performance of electronic devices continues to improve and their power density continues to increase, the demand for water-cooled plates (such as...) becomes increasingly higher. Figure 1 As heat dissipation efficiency and quality requirements become increasingly stringent, the processing precision and production efficiency of water-cooled plates have become key factors. As the core tooling for water-cooled plate forming, the technological development of stamping dies has attracted much attention.
[0003] Traditional stamping dies used for processing water-cooled plates often employ a simple, fixed upper and lower die design. The upper and lower die bases respectively support the upper and lower dies, with basic docking and guidance achieved only through guide pillars, ensuring a stable die-closing path during the stamping process. The upper die punch, in conjunction with the lower die's positioning groove, performs the stamping and shaping operation on the water-cooled plate raw material placed within it. The positioning groove is designed to precisely fix the position of the product blank, ensuring accurate stamping positioning.
[0004] However, this conventional structure has many drawbacks. On the one hand, during the stamping process, the punch carries a huge impact force against the product blank and the lower die positioning groove, and the force is transmitted vertically downward along the lower die to the lower die base. Since the lower die is rigidly fixed on the lower die base, the impact force is fully absorbed by the entire lower die base. Long-term repeated impacts can easily lead to deformation and accelerated wear of the lower die base, affecting the overall accuracy of the die, resulting in increased dimensional deviation and poor flatness of the stamped water-cooled plate, and reducing product yield.
[0005] Furthermore, during the stamping process, the lower die lacks a buffer mechanism, and frequent high-intensity impacts can easily cause defects such as indentations and scratches on the product surface, damaging the product's appearance quality and the integrity of its internal microstructure, weakening the heat dissipation performance of the water-cooled plate, shortening the product's service life, and making it difficult to meet the stringent requirements of high-end electronic equipment for high-quality and high-performance water-cooled plates.
[0006] Therefore, it is necessary to propose an improved technical solution to address the above problems. Utility Model Content
[0007] To overcome the shortcomings mentioned above, this utility model aims to provide a technical solution that can solve the above problems.
[0008] A stamping die for a water-cooled plate includes an upper die base and a lower die base that are mated together by guide pillars. The upper die base has an upper die, and the lower die base has a lower die. A punch is provided on the lower end face of the upper die, and a positioning groove for the product is provided on the upper end face of the lower die. The positioning groove corresponds to the punch.
[0009] A sliding groove is provided along the upper end face of the lower mold base. The lower mold is placed in the sliding groove. An elastic component is connected between the bottom end of the lower mold and the inner bottom of the sliding groove. The elastic component allows the lower mold to retract relative to the lower mold base at the sliding groove. The elastic component also allows the positioning groove to be flush with or slightly higher than the end face of the lower mold base.
[0010] The elastic component includes a column and a helical spring attached to the surface of the column in a circumferential manner. The bottom end of the lower mold and the inner bottom of the slide groove are respectively provided with a first groove that elastically abuts against the upper end of the helical spring and a second groove that elastically abuts against the lower end of the helical spring. A third groove that slides against the column is also formed in the first groove. There is an active space between the third groove and the column for the lower mold to retract.
[0011] The lower mold has anti-detachment limiting parts extending on both sides that abut against the inner side of the slide groove.
[0012] As a further embodiment of this utility model: the third slot extends along the longitudinal direction of the first slot so that the third slot and the first slot are interconnected and form an inverted T-shaped structure.
[0013] As a further embodiment of this utility model: the inner walls of the lower mold base on both sides of the slide groove extend inward to form a limiting wall, and the bottom ends of the lower mold extend outward to form the anti-detachment limiting part. In the initial state of the mold, the anti-detachment limiting part is tightly abutted against the lower end of the limiting wall under the support force of the elastic component.
[0014] As a further embodiment of this utility model: a limiting plate is fixedly provided on the inner bottom of the slide groove. The limiting plate is located within the active stroke range of the lower mold, and the limiting plate plays a limiting role on the lower mold. The active stroke range of the lower mold relative to the limiting plate constitutes the maximum active stroke range of the lower mold.
[0015] As a further embodiment of this utility model: the travel range of the movable space for the lower mold to retract between the third slot and the column is greater than the travel range of the lower mold relative to the limiting plate.
[0016] As a further embodiment of this utility model: the lower die is provided with a first waste discharge channel corresponding to the punch, and the limiting plate and the lower die base are jointly provided to form a second waste discharge channel corresponding to the first waste discharge channel;
[0017] The diameter of the second waste discharge channel is larger than that of the first waste discharge channel.
[0018] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0019] 1) Through elastic components, the strong impact force of stamping is effectively dispersed and absorbed, greatly reducing the rigid impact burden on the lower die holder, avoiding problems such as deformation and wear of the lower die holder caused by long-term repeated impacts, maintaining the long-term stable dimensional accuracy and structural integrity of the die, reducing the frequency of die maintenance and replacement costs, significantly extending the overall service life of stamping dies, ensuring the continuous and stable operation of the production line, and reducing the overall operation and maintenance costs of equipment;
[0020] 2) The buffer mechanism avoids the impact force of the punch directly and harshly acting on the product and the lower die, significantly reducing surface defects such as indentations and scratches, and ensuring that the water-cooled plate has a flat and beautiful appearance; the precise and stable positioning and buffering operation ensure the stamping dimensional accuracy of the product, making the water-cooled plate uniform in thickness and standardized in shape, which meets the design requirements of the heat dissipation structure, maintains its stable and reliable heat dissipation performance, improves the overall quality of the product, meets the high-quality requirements of high-end electronic equipment for water-cooled plates, reduces the defect rate, and improves market competitiveness;
[0021] 3) The lower mold and the lower mold base are connected by a sliding groove and elastic components, which makes the height of the lower mold easy to adjust. To meet the production needs of water-cooled plates of different specifications, if it is necessary to adjust the positioning height of the lower mold, the operator does not need to disassemble the main structure of the mold. The adjustment can be achieved by simply adjusting the elastic components or changing the relative position of the lower mold in the sliding groove. The operation is simple and quick.
[0022] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0024] Figure 1 This is a schematic diagram of the water-cooled plate structure;
[0025] Figure 2 This is a schematic diagram of the structure of this utility model;
[0026] Figure 3 This is a cross-sectional structural schematic diagram of this utility model from one perspective;
[0027] Figure 4 yes Figure 3 Enlarged structural diagram at point A;
[0028] Figure 5This is a cross-sectional structural schematic diagram from another perspective of this utility model.
[0029] The reference numerals and names in the figure are as follows:
[0030] 1. Upper mold base; 2. Lower mold base; 3. Upper mold; 4. Lower mold; 5. Punch; 6. Positioning groove; 7. Slide groove; 8. Elastic component; 9. Column; 10. Helical spring; 11. First slot; 12. Second slot; 13. Third slot; 14. Anti-detachment limiting part; 15. Limiting wall; 16. Limiting plate; 17. First waste discharge channel; 18. Second waste discharge channel. Detailed Implementation
[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0032] Please see Figure 1-5 In this embodiment of the present invention, a stamping die for a water-cooled plate includes an upper die base 1 and a lower die base 2 that are mated together by guide pillars. The upper die base 1 has an upper die 3, and the lower die base 2 has a lower die 4. A punch 5 is provided on the lower end face of the upper die 3, and a positioning groove 6 that acts on the product is provided on the upper end face of the lower die 4. The positioning groove 6 corresponds to the punch 5.
[0033] A groove 7 is provided along the upper end face of the lower mold base 2. The lower mold 4 is placed in the groove 7. An elastic component 8 is connected between the bottom end of the lower mold 4 and the inner bottom of the groove 7. The elastic component 8 allows the lower mold 4 to retract relative to the lower mold base 2 at the groove 7. The elastic component 8 also allows the positioning groove 6 to be flush with or slightly higher than the end face of the lower mold base 2.
[0034] The elastic component 8 includes a column 9 and a helical spring 10 attached to the surface of the column 9 in a circumferential manner. The bottom end of the lower mold 4 and the inner bottom of the slide groove 7 are respectively provided with a first groove 11 that elastically abuts against the upper end of the helical spring 10 and a second groove 12 that elastically abuts against the lower end of the helical spring 10. A third groove 13 that slides against the column 9 is also formed in the first groove 11. The third groove 13 and the column 9 have an active space for the lower mold 4 to retract.
[0035] The lower mold 4 extends on both sides to form anti-detachment limiting parts 14 that abut against the inner side of the slide groove 7.
[0036] In this utility model's technical solution, the core design of the water-cooled plate stamping die lies in the elastic connection structure between the lower die 4 and the lower die base 2. Specifically, a groove 7 opened along the upper end face of the lower die base 2 accommodates the lower die 4. The bottom end of the lower die 4 and the inner bottom of the groove 7 are connected by an elastic component 8. The elastic component 8 consists of a column 9 and a spiral spring 10 surrounding its surface. The first groove 11 at the bottom end of the lower die 4 and the second groove 12 at the inner bottom of the groove 7 elastically abut against the upper and lower ends of the spiral spring 10, respectively. Furthermore, the first groove 11 also contains a third groove 13 that slides with the column 9. The lower die 4 is provided with a space for retraction, and the third slot 13 slides with the column 9. While providing the lower die 4 with vertical space, it ensures the stability and guidance of its movement. During the stamping process, when the punch 5 of the upper die 3 acts on the product in the positioning slot 6 of the lower die 4 with impact force, the impact force drives the lower die 4 to compress the elastic component 8 (the helical spring 10 is compressed) along the slide 7. Through the deformation of the spring, part of the impact force is converted into elastic potential energy and stored to achieve a buffering effect, avoiding the impact force from being directly and rigidly transmitted to the lower die base 2 and causing damage.
[0037] The positioning groove 6 of the lower die 4 is used to accurately position the water-cooled plate product to be stamped, ensuring that the punch 5 corresponds precisely to the stamping part of the product, and ensuring the accuracy of the stamping shape and size. At the same time, relying on the certain degree of freedom of movement provided by the elastic component 8, the lower die 4 can keep the positioning groove 6 flush with or slightly higher than the end face of the lower die base 2 in the initial state to facilitate product placement and positioning, and can also appropriately retract inward to buffer when the stamping force is applied. The anti-detachment limiting parts 14 extending on both sides of the lower die 4 abut against the inner side of the slide 7, restricting the displacement of the lower die 4 in the horizontal direction, ensuring that it can only perform buffering movements along the slide 7 in the vertical direction, maintaining the stable positioning and orderly buffering action of the lower die 4 throughout the stamping process, ensuring the orderly progress of the entire stamping process, and can also abut against the inner wall of the slide 7 in the vertical direction (like the cooperation between a T-slot and a T-shape), so that the lower die 4 is always precisely connected with the slide 7.
[0038] In summary, the elastic component 8 effectively disperses and absorbs the powerful impact force during stamping, greatly reducing the rigid impact burden on the lower die holder 2. This avoids problems such as deformation and wear of the lower die holder 2 caused by long-term repeated impacts, maintaining the long-term stable dimensional accuracy and structural integrity of the die, reducing the frequency of die maintenance and replacement costs, significantly extending the overall service life of the stamping die, ensuring continuous and stable operation of the production line, and reducing the overall equipment operation and maintenance costs. The buffering mechanism prevents the impact force of the punch 5 from directly and harshly acting on the product and the lower die 4, significantly reducing surface defects such as indentations and scratches on the product, ensuring a smooth and aesthetically pleasing appearance of the water-cooled plate. Precise and stable positioning and buffering... The coordinated operation ensures the stamping dimensional accuracy of the product, making the water-cooled plate uniform in thickness and standardized in shape, meeting the design requirements of the heat dissipation structure, maintaining its stable and reliable heat dissipation performance, improving the overall quality of the product, meeting the high-quality requirements of high-end electronic equipment for water-cooled plates, reducing the defect rate, and improving market competitiveness. The lower die 4 and the lower die base 2 are connected by a sliding groove 7 and an elastic component 8, which gives the lower die 4 convenient height adjustment. For the production needs of water-cooled plates of different specifications, if it is necessary to adjust the positioning height of the lower die 4, the operator does not need to disassemble the main structure of the mold. It can be achieved simply by fine-tuning the elastic component 8 or changing the relative position of the lower die 4 in the sliding groove 7, which is simple and quick to operate.
[0039] In this embodiment of the present invention, the third slot 13 extends along the longitudinal direction of the first slot 11 so that the third slot 13 and the first slot 11 are interconnected and form an inverted T-shaped structure.
[0040] The third slot 13 extends longitudinally along the first slot 11 and connects to form an inverted T-shaped structure. The inverted T-shaped structure strengthens the connection stability between the bottom end of the lower die 4 and the elastic component 8. The first slot 11 supports the upper end of the helical spring 10 and undertakes the main elastic support and buffering force bearing tasks. The third slot 13 connects and works in concert to build a closer mechanical connection between the column 9 and the lower die 4. The lower end of the column 9 can be fixed in the second slot 12. During the stamping process, the lower die 4 can linearly retract along the sliding direction of the third slot 13 and the column 9, making the force transmission direction clearer and more concentrated. This ensures that the impact force is transmitted to the helical spring 10 in the expected, vertically downward direction. As a result, the helical spring 10 can stably convert part of the impact force into elastic potential energy for buffering according to the designed elastic performance, avoiding force dispersion or oblique transmission that could lead to abnormal mold stress. This ensures that the entire buffering process proceeds along a reasonable and controllable path.
[0041] In this embodiment of the present invention, the inner walls of the lower mold base 2 on both sides of the slide groove 7 extend inward to form a limiting wall 15, and the bottom ends of the lower mold 4 extend outward to form the anti-detachment limiting part 14. In the initial state of the mold, the anti-detachment limiting part 14 is tightly abutted against the lower end of the limiting wall 15 under the supporting force of the elastic component 8.
[0042] In the longitudinal (vertical) direction of the mold, the limiting wall 15 of the lower mold base 2 and the anti-detachment limiting part 14 of the lower mold 4 form a key limiting structure. When the mold is in the initial state, the lower mold 4 is supported by the elastic component 8, so that the anti-detachment limiting part 14 abuts against the lower end of the limiting wall 15. This structural design provides a clear initial position for the lower mold 4 in the longitudinal direction. The elastic force of the elastic component 8 supports the lower mold 4 upward, while the abutment between the anti-detachment limiting part 14 and the limiting wall 15 restricts the position of the lower mold 4 from below, ensuring that the positioning groove 6 of the lower mold 4 can be accurately at the appropriate height at the beginning so as to accurately correspond with the punch 5 of the upper mold 3.
[0043] In this embodiment of the utility model, a limiting plate 16 is fixedly provided on the inner bottom of the slide groove 7. The limiting plate 16 is located within the active stroke range of the lower mold 4, and the limiting plate plays a limiting role on the lower mold 4. The active stroke range of the lower mold 4 relative to the limiting plate 16 constitutes the maximum active stroke range of the lower mold 4.
[0044] A limiting plate 16 is fixed to the bottom of the groove 7 of the mold, which is within the range of the lower die 4's travel. This precisely defines the maximum displacement range of the lower die 4 in the vertical direction. After the stamping operation starts, the upper die 3 punch 5 applies force, and the lower die 4, buffered by the elastic component 8 between itself and the lower die base 2, moves downward along the groove 7 inward. The degree of inward movement is dynamically adjusted within the allowable deformation range of the elastic component 8 according to the magnitude of the impact force. When the impact force continues to increase, causing the lower die 4 to approach the preset maximum travel, the limiting plate 16 begins to function. On the one hand, it rigidly blocks the lower die 4 from moving further downward in the spatial dimension, strictly controls the range of motion of the lower die 4, effectively prevents the elastic component 8 from becoming unstable or damaged due to excessive compression, and eliminates adverse conditions such as collision and friction between the lower die 4 and surrounding components due to overtravel. On the other hand, in terms of mechanical support, it provides rigid support force to the lower die 4 at the end of the stroke, and works in synergy with the resistance of the elastic component 8 to stabilize the posture of the lower die 4, ensuring that the lower die 4 maintains the relative positional accuracy between its positioning groove 6 and the punch 5 when subjected to the impact of the punch 5.
[0045] In this embodiment of the present invention, the travel range of the movable space for the lower mold 4 to retract between the third slot 13 and the column 9 is greater than the travel range of the lower mold 4 relative to the limiting plate 16.
[0046] In the mold structure, the travel range of the movable space between the third slot 13 and the column 9 is greater than the travel range of the lower mold 4 relative to the limiting plate 16. This is a key design to prevent rigid collisions. When stamping begins, the lower mold 4 is impacted and retracts. It will first move along the preset direction under the action of the elastic component 8. Since there is a sufficiently large travel space between the third slot 13 and the column 9, it can be ensured that the third slot 13 of the lower mold 4 will not rigidly abut against the column 9 in the vertical direction during the entire retraction process of the lower mold 4. This is based on the precise design of the movement trajectory of the lower mold 4 and the spatial relationship between each component, so that the lower mold 4 can freely retract within the normal stamping buffer range without being obstructed by the column 9. This design works closely with the buffering characteristics of the elastic component 8. The elastic component 8 will undergo elastic deformation when subjected to impact force, thereby guiding the retraction movement of the lower mold 4. The sufficient travel space ensures that the movement of the lower mold 4 conforms to the deformation law of the elastic component 8, avoiding unreasonable collisions between components due to insufficient space, maintaining the smooth movement of the lower mold 4 and the normal working state of each component.
[0047] In this embodiment of the utility model, the lower mold 4 is provided with a first waste discharge channel 17 corresponding to the punch 5, and the limiting plate 16 and the lower mold base 2 are jointly provided to form a second waste discharge channel 18 corresponding to the first waste discharge channel 17.
[0048] The diameter of the second waste discharge channel 18 is larger than the diameter of the first waste discharge channel 17.
[0049] The design ensures a reasonable discharge path for waste material as soon as it is generated. The diameter of the second waste discharge channel 18 is larger than that of the first waste discharge channel 17. This is to facilitate the smooth transfer and timely discharge of waste material from the mold.
[0050] Understandably, the first waste discharge channel 17 and the second waste discharge channel 18 are misaligned with the elastic component 8.
[0051] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention.
Claims
1. A stamping die for a water-cooled plate, characterized in that, It includes an upper mold base and a lower mold base that are mated together by guide posts. The upper mold base has an upper mold, and the lower mold base has a lower mold. A punch is provided on the lower end face of the upper mold, and a positioning groove for the product is provided on the upper end face of the lower mold. The positioning groove corresponds to the punch. A sliding groove is provided along the upper end face of the lower mold base. The lower mold is placed in the sliding groove. An elastic component is connected between the bottom end of the lower mold and the inner bottom of the sliding groove. The elastic component allows the lower mold to retract relative to the lower mold base at the sliding groove. The elastic component also allows the positioning groove to be flush with or slightly higher than the end face of the lower mold base. The elastic component includes a column and a helical spring attached to the surface of the column in a circumferential manner. The bottom end of the lower mold and the inner bottom of the slide groove are respectively provided with a first groove that elastically abuts against the upper end of the helical spring and a second groove that elastically abuts against the lower end of the helical spring. A third groove that slides against the column is also formed in the first groove. There is an active space between the third groove and the column for the lower mold to retract. The lower mold has anti-detachment limiting parts extending on both sides that abut against the inner side of the slide groove.
2. The stamping die for a water-cooled plate according to claim 1, characterized in that, The third slot extends along the longitudinal direction of the first slot so that the third slot and the first slot are interconnected and form an inverted T-shaped structure.
3. The stamping die for a water-cooled plate according to claim 1, characterized in that, The lower mold base extends inward on both sides of the inner wall of the slide groove to form a limiting wall, and the bottom end of the lower mold extends outward on both sides to form the anti-detachment limiting part. In the initial state of the mold, the anti-detachment limiting part is tightly abutted against the lower end of the limiting wall under the support force of the elastic component.
4. The stamping die for a water-cooled plate according to claim 1, characterized in that, A limiting plate is fixed to the inner bottom of the chute. The limiting plate is located within the active stroke range of the lower mold and plays a limiting role on the lower mold. The active stroke range of the lower mold relative to the limiting plate constitutes the maximum active stroke range of the lower mold.
5. The stamping die for a water-cooled plate according to claim 4, characterized in that, The travel range of the movable space between the third slot and the column for the lower mold to retract is greater than the travel range of the lower mold relative to the limiting plate.
6. The stamping die for a water-cooled plate according to claim 4, characterized in that, The lower die is provided with a first waste discharge channel corresponding to the punch, and the limiting plate and the lower die base are jointly provided to form a second waste discharge channel corresponding to the first waste discharge channel; The diameter of the second waste discharge channel is larger than that of the first waste discharge channel.