Slicing machine
By incorporating detection and cleaning mechanisms into the slicer, the problem of wire breakage caused by cutting line misalignment was solved, resulting in a more efficient production process.
Patent Information
- Application Number
- CN202422762062.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-12
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2034-11-12
AI Technical Summary
In existing slicing machines, the cutting wire is prone to jumping out of the guide wheel groove, causing vibration and wire breakage, which affects production efficiency and cost.
The slicer is equipped with a detection mechanism and a cleaning mechanism. The moving component drives the sensor to move along the guide wheel axis to detect the position of the cutting line. After detection, the sensor is cleaned by spraying liquid to ensure accurate detection and reduce the probability of line breakage.
By adjusting the cutting line position and cleaning the sensors in a timely manner, the probability of cutting line breakage was reduced, production efficiency was improved, and downtime was reduced.
Smart Images
Figure CN223545489U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of cutting device technology, and more specifically, to a slicer. Background Technology
[0002] Solar cell silicon wafers are made by cutting silicon blocks or rods using a multi-wire dicing machine. Multi-wire dicing technology involves first winding dicing wires around the guide grooves of a guide roller, thus restricting the horizontal movement of the dicing wires and keeping their cutting position constant. Multiple dicing wires are wound in circles to form a wire mesh. The silicon rod is mounted on a worktable, which feeds towards the dicing wires at a set feed speed. Simultaneously, the high-speed movement of the dicing wires cuts the silicon rod into silicon wafers.
[0003] As cutting wires become thinner and thinner, the guide wheel groove spacing and depth become increasingly smaller. During the cutting process, acceleration / deceleration and foreign objects can easily cause the cutting wire to jump out of the guide wheel groove. Furthermore, due to the elasticity of the cutting wire as a chord during the forward / reverse switching process, the cutting wire vibrates. As the vibration amplitude increases, the probability of the cutting wire jumping out of the guide wheel groove also increases. Cutting wires that jump out of the guide wheel groove will rub against the cutting wires in adjacent guide wheel grooves, leading to wire breakage. After a wire breakage, the machine needs to be stopped for splicing or rewiring, significantly impacting production efficiency and increasing production costs.
[0004] Therefore, there is a need for a slicing machine that can detect the position of the cutting line, so that the operator can adjust the position of the cutting line in time when the cutting line jumps out of the guide wheel groove based on the detection results, thereby reducing the probability of the cutting line breaking and improving production efficiency. Utility Model Content
[0005] In view of the above-mentioned shortcomings, this application provides a slicing machine to partially improve the problem of detecting the position of the cutting line on the guide roller in the related art.
[0006] This application is implemented as follows:
[0007] This application provides an example of a slicer, including a frame, a cutting mechanism, a detection mechanism, and a cleaning mechanism. The cutting mechanism includes guide wheels disposed on the frame for winding cutting wire; the detection mechanism includes a moving component disposed on the frame and a sensor disposed on the moving component; the moving component can selectively drive the sensor to move along the axial direction of the guide wheels, so that the sensor can detect the position of the cutting wire in different axial regions on the guide wheels; the cleaning mechanism is disposed on the frame, and the moving component can selectively drive the sensor to the cleaning mechanism, whereby the cleaning mechanism sprays liquid to rinse the sensor.
[0008] In the above implementation process, a detection mechanism is set up inside the slicer. The moving component in the detection mechanism can drive the sensor to move along the axial direction of the guide wheel, so that the sensor can gradually detect the position of the cutting line in different axial areas on the guide wheel. This allows the operator to correct any deviations in the cutting line position based on the detection results, thereby reducing the probability of the cutting line breaking due to long-term deviation. It also reduces the downtime of the slicer for wiring, changing lines, or rewiring, thus improving the production efficiency of the slicer.
[0009] During the operation of the slicing machine, a large amount of splashed silica sludge, coolant, and other contaminants in the cutting chamber can easily adhere to the sensor, leading to reduced sensor detection accuracy or even failure to detect. Therefore, the slicing machine provided in this application example is also equipped with a cleaning mechanism. Before the next detection is performed after the previous detection by the sensor, the moving component can move the sensor to the cleaning mechanism. The cleaning mechanism can spray liquid to rinse the sensor, removing the silica sludge or coolant and other contaminants adhering to the sensor, enabling the sensor to accurately detect the position of the cutting line in different axial areas on the guide roller.
[0010] In one alternative embodiment, the guide wheel has a winding section for winding the cutting wire at its axial center; the end of the moving component extends axially beyond the winding section, and the cleaning mechanism is disposed opposite to the end of the moving component so that when the moving component drives the sensor to move axially beyond the winding section, the cleaning mechanism sprays liquid to rinse the detection end.
[0011] In the above implementation, the end of the moving component extends beyond the winding section of the guide wheel used to wind the cutting wire, and the cleaning mechanism is positioned opposite the end of the moving component. Therefore, the moving component can drive the sensor to move linearly along the axial direction of the guide wheel to the cleaning mechanism for cleaning. The linear movement of the moving component between the guide wheel and the cleaning mechanism improves movement efficiency and simplifies the movement method. Furthermore, by positioning the cleaning mechanism opposite the end of the moving component, the sensor needs to move beyond the winding section of the guide wheel before it can be sprayed with liquid. This prevents waste liquid or residue from falling onto the cutting wire of the winding section of the guide wheel during the cleaning mechanism's liquid rinsing, thus improving the cleanliness and efficiency of the cutting wire.
[0012] In one alternative embodiment, the cleaning mechanism includes a spray plate having a plurality of spaced-apart spray nozzles and an inlet communicating with each spray nozzle; the spray plate is connected to a frame and opposite to the end of a moving component, with the spray nozzles facing the detection end of a sensor; the inlet is provided with a connector for connecting to an infusion tube.
[0013] In the above implementation process, a spray plate is set at the position opposite to the end of the frame and the moving component that extends beyond the guide wheel winding section, so that the spray plate is opposite to the detection end of the sensor. When the sensor moves to the opposite side of the spray plate, the spraying liquid delivered by the inlet pipe can flow into the spray plate from the inlet and spray out from multiple spray nozzles of the spray plate toward the detection end of the sensor to rinse the detection end of the sensor and remove dirt such as silica mud and coolant adhering to the detection end of the sensor.
[0014] In one alternative embodiment, the cleaning mechanism further includes a scraper connected to the frame, and the moving component can optionally drive the sensor to move axially to the scraper, so that the scraper contacts the detection end to clean the detection end.
[0015] In the above implementation process, the cleaning mechanism is also equipped with a scraper. When the sensor needs to be cleaned, the moving component can move the sensor to the scraper. The scraper can remove dirt or water vapor from the sensor detection end, further improving the cleaning quality of the sensor.
[0016] In one alternative implementation, the scraper is positioned axially on the side of the spray plate facing the winding section.
[0017] In the above implementation process, a scraper is positioned at the end of the spray plate facing the winding section. The moving component drives the sensor to move axially along the guide wheel, gradually detecting the cutting line position at the winding section of the guide wheel. As the sensor continues to move axially towards the cleaning mechanism, it first moves to the scraper and contacts it. As the sensor continues to move, the scraper gradually removes dirt from the sensor's detection end surface, pre-cleaning the detection end. Then, driven by the moving component, the sensor continues to move and separates from the scraper, moving to the spray plate located at the rear of the scraper. The spray plate sprays liquid to rinse the sensor's detection end. After rinsing, the moving component drives the sensor towards the winding section of the guide wheel. After the spray plate rinses the sensor's detection end, water vapor forms at the sensor's detection end, which can affect the sensor's detection accuracy. During the movement from the spray plate towards the winding section, the sensor contacts the scraper again, which removes the water vapor from the sensor's detection end, further improving the sensor's cleaning quality and detection accuracy.
[0018] In one alternative embodiment, the scraper end facing the sensor is provided with a first inclined surface and a second inclined surface that are connected to each other. The first inclined surface and the second inclined surface are arranged opposite to each other, with the first inclined surface facing the winding section and the second inclined surface facing the spray plate.
[0019] In the above implementation process, the scraping end of the scraper is set as a first inclined surface and a second inclined surface facing away from each other. When the moving component drives the sensor from the winding section of the guide wheel towards the spray plate of the cleaning mechanism, the detection end of the sensor will first contact the first inclined surface of the scraper, using the first inclined surface to pre-clean the dirt on the detection end. After the spray plate has finished spraying and rinsing the detection end of the sensor, the moving component will drive the sensor from the spray plate towards the winding section of the guide wheel. During the movement, the detection end of the sensor will contact the second inclined surface of the scraper, using the second inclined surface to scrape away the water vapor on the detection end.
[0020] Since the first and second inclined surfaces are set opposite to each other, and the dirt on the sensor detection end surface is usually a thin layer or a few droplets, the dirt during the pre-cleaning of the first inclined surface will flow along the first inclined surface and be discharged from the first inclined surface. The dirt scraped off by the first inclined surface will not flow to the second inclined surface, and will basically not cause contamination of the second inclined surface. Therefore, when the second inclined surface scrapes off the water vapor, it will basically not cause secondary contamination of the sensor detection end.
[0021] In one alternative embodiment, the cleaning mechanism further includes a mounting plate on which both the spray plate and the scraper are mounted, and the mounting plate is connected to the frame.
[0022] In the above implementation process, both the spray plate and the scraper are mounted on the mounting plate, and the connection between the mounting plate and the frame can be used to fix the spray plate and the scraper.
[0023] In one alternative embodiment, a liquid receiving plate is provided below the mounting plate corresponding to the spray plate and the scraper.
[0024] In the above implementation process, a liquid receiving plate is provided below the mounting plate corresponding to the spray plate and the scraper. The liquid receiving plate can absorb the dirt generated by the spray plate and the scraper during cleaning.
[0025] In one alternative embodiment, the cleaning mechanism further includes a fastener and a relief spring passing through the fastener, the scraper is provided with a connecting hole, the fastener passes through the connecting hole and is fixed to the mounting plate, and the scraper abuts against the relief spring.
[0026] In the above implementation process, the scraper is inserted through the fastener, and a stress relief spring is fitted at the fastener. The stress relief spring abuts against the scraper, which can adjust the contact friction between the scraper and the sensor detection end, thereby improving the cleaning effect of the scraper on the sensor detection end.
[0027] In one alternative embodiment, the detection mechanism includes two sets of corresponding moving components and sensors, with the two moving components located on opposite sides of the guide wheel radially. The slicer also includes two sets of cleaning mechanisms, which spray liquid to rinse the two sensors in a corresponding manner.
[0028] In the above implementation process, a set of moving components and sensors are set on both sides of the guide wheel in the radial direction, which can detect both guide wheels. The two sets of cleaning mechanisms are respectively opposite to the detection ends of the two sensors, which can spray liquid to rinse the two sensors respectively, thereby further improving the detection accuracy. Attached Figure Description
[0029] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.
[0030] Figure 1 A front view of the slicer provided as an example in this application;
[0031] Figure 2 A side view of the slicer provided as an example in this application;
[0032] Figure 3 A floor plan of the cleaning facility provided as an example in this application;
[0033] Figure 4 This is a schematic diagram of the first structure of the scraper provided as an example in this application.
[0034] Icons: 1-Slicer; 10-Frame; 20-Cutting mechanism; 21-Guide wheel; 211-Winding section; 22-Cutting line; 30-Detection mechanism; 31-Moving component; 32-Sensor; 321-Detection end; 40-Cleaning mechanism; 41-Spray plate; 411-Spray nozzle; 42-Scraper; 421-First inclined plane; 422-Second inclined plane; 43-Mounting plate; 44-Drawing plate; 45-Fastener; 46-Relief spring; D1-Axial axis. Detailed Implementation
[0035] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.
[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification and the foregoing description of the drawings are intended to cover non-exclusive inclusion.
[0037] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.
[0038] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0039] In the description of the embodiments of this application, the technical terms "middle", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "bottom", "inner" and other indications of the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.
[0040] Solar cell silicon wafers are produced by cutting silicon blocks or rods using a slicing machine 1. (See also...) Figure 1 and Figure 2 The slicing machine 1 first winds the cutting wire 22 around the guide wheel groove (not shown in the figure) of the guide wheel 21, thereby restricting the movement of the cutting wire 22 along the axial direction D1 of the guide wheel 21 and keeping its cutting position constant. Multiple cutting wires are wound in circles to form a wire mesh. The silicon rod is mounted on the worktable, and the worktable feeds towards the cutting wire at a set feed speed. At the same time, the cutting wire 22 moves at high speed to cut the silicon rod into silicon wafers.
[0041] During operation, the cutting wire 22 may jump out of the guide wheel groove. The cutting wire 22 that jumps out of the guide wheel groove may rub against the cutting wire 22 in the adjacent guide wheel groove, which may cause the cutting wire 22 to break. After the wire breaks, the machine needs to be stopped for splicing or rewiring, which will greatly affect production efficiency and increase production costs.
[0042] Therefore, this application further improves the slicer 1, thereby mitigating the problem of reduced production efficiency caused by wire breakage due to positional misalignment of the cutting line 22. To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.
[0043] Please continue reading. Figure 1 and Figure 2 This application provides a slicer 1, which includes a frame 10, a cutting mechanism 20, a detection mechanism 30, and a cleaning mechanism 40.
[0044] Please continue reading for more details. Figure 1 and Figure 2 The cutting mechanism 20 includes a guide wheel 21 disposed on the frame 10, which is used to wind the cutting wire 22.
[0045] Please continue reading for more details. Figure 1 and Figure 2 The detection mechanism 30 includes a moving component 31 mounted on the frame 10 and a sensor 32 mounted on the moving component 31. The moving component 31 can selectively drive the sensor 32 to move along the axial direction D1 of the guide wheel 21, so that the sensor 32 can detect the position of the cutting line 22 in different axial regions on the guide wheel 21.
[0046] Please continue reading for more details. Figure 1 and Figure 2 The cleaning mechanism 40 is mounted on the frame 10. The moving component 31 can selectively move the sensor 32 to the cleaning mechanism 40, and the cleaning mechanism 40 sprays liquid to rinse the sensor 32.
[0047] When slicing using the slicer 1 provided in this application, the workpiece to be cut is brought close to the high-speed cutting line 22 at the guide wheel 21 at a given speed. The moving component 31 drives the sensor 32 to move along the axial direction D1 of the guide wheel 21, and the sensor 32 detects the position of the cutting line 22 in different areas along the axial direction D1 of the guide wheel 21. The operator can take appropriate actions based on the detection results of the sensor 32. For example, when the sensor 32 detects a shift in the position of the cutting line 22 at a certain location, the operator can adjust the position of the cutting line 22 in a timely manner, thereby reducing the probability of wire breakage due to the shift in the position of the cutting line 22.
[0048] During the cutting process by the cutting mechanism 20, coolant needs to be sprayed onto the cutting line 22 and the workpiece such as the silicon rod. Silica sludge and coolant generated during the cutting process may splash onto the sensor 32. If the detection end 321 of the sensor 32 is blocked by coolant or silica sludge, it will affect the detection accuracy of the sensor 32.
[0049] Therefore, the slicer 1 provided in this application example is also provided with a cleaning mechanism 40. After the sensor 32 detects the position of the cutting line 22 at the guide wheel 21, the moving component 31 can drive the sensor 32 to the cleaning mechanism 40. The cleaning mechanism 40 can spray liquid to rinse the detection end 321 of the sensor 32, thereby improving the detection quality of the sensor 32.
[0050] The frame 10 is used to support the cutting mechanism 20, the detection mechanism 30, and the cleaning mechanism 40. In some possible embodiments, the frame 10 is provided with a cutting chamber, in which the cutting mechanism 20, the detection mechanism 30, and the cleaning mechanism 40 can be placed to improve the stability of the working environment of the cutting mechanism 20 during cutting, and to prevent the probability of impurities such as edge material, silica mud, or coolant generated during the cutting process from splashing out of the cutting chamber, thereby improving the cleanliness and safety of the slicer 1.
[0051] Furthermore, in order to facilitate the operator's maintenance of the cutting mechanism 20, detection mechanism 30 and cleaning mechanism 40 of the cutting chamber, in one possible embodiment, a window can be provided on the side wall of the cutting chamber, and a corresponding door panel can be installed at the window.
[0052] The cutting mechanism 20 includes a guide wheel 21 and a cutting line 22 wound around the guide wheel 21 to cut the workpiece.
[0053] For example, please continue reading Figure 2 The cutting mechanism 20 includes three guide wheels 21, which are spaced apart in an inverted triangle arrangement. For example, two guide wheels 21 are arranged horizontally parallel to each other, and a third guide wheel 21 is arranged horizontally below the two guide wheels 21. The two ends of each guide wheel 21 are rotatably connected to the side wall of the cutting chamber of the frame 10. Multiple guide wheel grooves are spaced apart along the axial direction D1 of each guide wheel 21, with the grooves of the three guide wheels corresponding one-to-one. The cutting wire 22 is wound around the guide wheel grooves.
[0054] Furthermore, the guide wheel groove is located in the middle of the guide wheel 21 along axis D1. That is, the middle of the guide wheel 21 along axis D1 has a winding section 211, and the two ends of the winding section 211 are connecting sections, which are rotatably connected to the side wall of the cutting chamber.
[0055] Furthermore, the cutting mechanism 20 may also be equipped with a wire feeding assembly (not shown in the figure). The wire feeding assembly is located below one side of the guide wheel 21 and is used to guide the cutting wire 22 to wind around the guide wheel groove of the guide wheel 21. The wire feeding assembly typically has two feeding rollers, which are located on both sides of the guide wheel 21 in the radial direction. When cutting the workpiece, the first feeding roller feeds the wire, and the second feeding roller retracts the wire, causing the cutting wire 22 on the guide wheel 21 to move in the first direction; then, the second feeding roller feeds the wire, and the first feeding roller retracts the wire, causing the cutting wire 22 on the guide wheel 21 to move in the opposite direction of the first direction. The reciprocating motion of the cutting wire 22 can be achieved by the feeding and retracting of the first and second feeding rollers, thereby realizing the cutting of the workpiece.
[0056] The moving component 31 in the detection mechanism 30 drives the sensor 32 to move along the axial direction D1 of the guide wheel 21, so as to gradually detect the position of the cutting line 22 in different areas of the axial direction D1 of the guide wheel 21.
[0057] For example, the moving component 31 is disposed on the side above the guide wheel 21 opposite to the workpiece.
[0058] This application does not limit the specific movement mode of the moving component 31. In some possible embodiments, the moving component 31 can be a lead screw and nut moving component or a guide rail and pulley component.
[0059] Sensor 32 can detect the position of the cutting line 22 on the guide wheel 21 in real time. In some possible embodiments, sensor 32 includes a camera and a processor connected to the camera signal, with the detection end 321 of sensor 32 being the camera lens. The camera captures an image of the cutting line 22 on the guide wheel 21 and sends it to the processor. The processor performs image recognition processing to determine whether the cutting line 22 is located within the guide wheel groove and the number of cutting lines within the groove. When the processor detects an abnormality in the cutting line within the guide wheel groove, it issues a warning signal so that the operator can handle the abnormality accordingly. The warning signal can be an alarm sound or a flashing indicator light. Furthermore, the processor of sensor 32 can be connected to the controller of cutting mechanism 20. When the processor detects an abnormality in the cutting line 22 within the guide wheel groove, it sends a signal to the controller of cutting mechanism 20, which then controls cutting mechanism 20 to stop operating.
[0060] Furthermore, in some possible embodiments, please continue to refer to... Figure 2 Two sets of corresponding moving components 31 and sensors 32 can be set in the slicer 1. The two sets of moving components 31 are respectively set above the two guide wheels 21 on the side away from the workpiece.
[0061] The cleaning mechanism 40 is mounted on the frame 10, and the moving component 31 can selectively move the sensor 32 to the cleaning mechanism 40.
[0062] For example, the cleaning mechanism 40 is positioned on the side of the guide wheel 21 at a certain position on the moving path of the moving component 31, so that the cleaning mechanism 40 is opposite to the detection end 321 of the sensor 32 connected to the moving component 31. When the sensor 32 moves along the moving path to the position opposite to the cleaning mechanism 40, the cleaning mechanism 40 can spray liquid to rinse the detection end 321 of the sensor 32.
[0063] For example, the moving component 31 can be a linear moving component, and the moving direction of the linear moving component is consistent with the axial direction D1 of the guide wheel 21. The cleaning mechanism 40 can be disposed on the side of the linear moving component facing the guide wheel 21.
[0064] Since the workpiece is fed gradually downwards from above the guide wheel 21 via the worktable, if the cleaning mechanism 40 is positioned above the winding section 211 of the guide wheel 21 on the side of the linear motion assembly facing the workpiece's cutting area, the cleaning mechanism 40 may be splashed with a large amount of silica sludge or cold cutting fluid, increasing the cleaning difficulty. Furthermore, the proximity of the cleaning mechanism 40 to the cutting area, where the sensor 32 is cleaned, also increases the cleaning difficulty. To further improve cleaning efficiency, in some possible embodiments, the cleaning mechanism 40 can be positioned opposite the end of the linear motion assembly located outside the winding section 211 of the guide wheel 21.
[0065] The cleaning mechanism 40 is located away from the cutting area above the winding section 211, which not only improves the cleanliness of the cleaning mechanism 40 itself, but also cleans the sensor 32 at the end away from the winding section 211, so as to prevent dirt or cleaning fluid generated after cleaning from falling down onto the cutting line 22 of the winding section 211.
[0066] Furthermore, this application does not limit how the cleaning mechanism 40 sprays liquid to rinse the detection end 321 of the sensor 32. In some possible embodiments, a spray plate 41 may be provided at a position opposite to the end of the linear motion component on the frame 10.
[0067] The spray plate 41 has a plurality of spaced spray nozzles 411 and a liquid inlet (not shown in the figure) communicating with each spray nozzle 411. The spray nozzles 411 face the detection end 321.
[0068] Furthermore, a connector (not shown in the figure) can be provided at the liquid inlet of the spray plate 41 for connecting to the infusion tube.
[0069] After the spray plate 41 sprays liquid to rinse the detection end 321 of the sensor 32, a certain amount of water vapor will form at the detection end 321 of the sensor 32. The water vapor adhering to the detection end 321 will affect the detection accuracy of the sensor 32.
[0070] Furthermore, in order to improve the detection accuracy of sensor 32, in some possible embodiments, cleaning mechanism 40 may also be provided with scraper 42, which scrapes away the detection end 321 to improve detection accuracy.
[0071] For example, the scraper 42 can be positioned on the frame 10 at the end corresponding to the end of the linear motion component, and the scraper 42 is located on the side of the spray plate 41 away from the winding section 211 of the guide wheel 21.
[0072] After the moving component 31 moves the sensor 32 to the spray plate 41 for spray rinsing, the spray plate 41 stops spraying. The moving component 31 can continue to move the sensor 32 to the scraper 42 on one side of the spray plate 41, so that the spray end 321 of the sensor 32 contacts the scraper 42 and gradually removes the water vapor from the detection end 321 as the sensor 32 continues to move. After the scraper 42 removes the water vapor, the moving component 31 moves the sensor 32 from the scraper 42 toward the winding section 211 of the guide wheel 21.
[0073] Alternatively, in other embodiments, the scraper 42 may be positioned on the side of the spray plate 41 facing the winding section 211 of the guide wheel 21.
[0074] When the moving component 31 moves the sensor 32 from the winding section 211 towards the cleaning mechanism 40, the detection end 321 of the sensor 32 first contacts the scraper 42, which scrapes away dirt from the detection end 321 for pre-cleaning. Then, the sensor 32 moves from the scraper 42 to the spray plate 41 for spray cleaning. After spray cleaning, the moving component 31 moves the sensor 32 from the spray plate 41 towards the winding section 211 of the guide wheel 21. During this movement, the detection end 321 of the sensor 32 contacts the scraper 42 again, which scrapes away moisture from the detection end 321.
[0075] For example, the material of the scraper 42 can be selected from hydrophobic resin materials. The dirt scraped off by the scraper 42 during pre-cleaning can slide down from the scraper 42 and basically will not adhere to the scraper 42. This can reduce the probability of secondary pollution to the detection end 321 when the scraper 42 scrapes off water vapor.
[0076] To further reduce the likelihood of secondary contamination of the detection end 321 when the pre-cleaned scraper 42 removes moisture, in some possible embodiments, please refer to... Figure 4 The scraping end of the scraper 42 facing the detection end 321 can be set as two opposite inclined surfaces, namely the first inclined surface 421 facing the winding section 211 and the second inclined surface 422 facing the spray plate 41.
[0077] When the moving component 31 moves the sensor 32 from the winding section 211 of the guide wheel 21 towards the spray plate 41 of the cleaning mechanism 40, the detection end 321 of the sensor 32 will first contact the first inclined surface 421 of the scraper 42, using the first inclined surface 421 to pre-clean the dirt on the detection end 321. After pre-cleaning, it continues to move to the spray plate 41 for spray rinsing. After the spray plate 41 has finished spraying and rinsing the detection end 321 of the sensor 32, the moving component 31 will move the sensor 32 from the spray plate 41 towards the winding section 211 of the guide wheel 21. During the movement, the detection end 321 of the sensor 32 will contact the second inclined surface 422 of the scraper 42, using the second inclined surface 422 to scrape away the water vapor on the detection end 321.
[0078] Since the first inclined surface 421 and the second inclined surface 422 are arranged opposite to each other, and the dirt on the surface of the sensor 32 detection end 321 is usually a thin layer or a few droplets, the dirt during the pre-cleaning of the first inclined surface 421 will fall off the first inclined surface 421 and be discharged from the first inclined surface 421. The dirt scraped off by the first inclined surface 421 will not flow to the second inclined surface 422, and will basically not cause contamination of the second inclined surface 422. Therefore, when the second inclined surface 422 scrapes off the water vapor, it will basically not cause re-contamination of the sensor 32 detection end 321.
[0079] For example, such as Figure 4 As shown, the end of the scraper 42 facing away from the first inclined surface 421 and the second inclined surface 422 can be set into a rectangle; or, as shown... Figure 3 As shown, the end of the scraper 42 that is away from the first inclined surface 421 and the second inclined surface 422 can be set into an arc shape.
[0080] Furthermore, in some possible embodiments, the spray plate 41 and the scraper 42 can be mounted on the mounting plate 43, and the mounting plate 43 can be used to fix the spray plate 41 and the scraper 42 to the frame 10.
[0081] Furthermore, a liquid receiving plate 44 can be provided below the mounting plate 43 corresponding to the spray plate 41 and the scraper 42.
[0082] Furthermore, the cleaning mechanism 40 also includes a fastener 45 and a relief spring 46 passing through the fastener 45. The scraper 42 is provided with a connecting hole, through which the fastener 45 is fixed to the mounting plate 43, and the fastener 45 abuts against the relief spring 46. The relief spring 46 enables the scraper 42 to be elastically connected to the mounting plate 43 and can adjust the friction between the scraper 42 and the detection end 321 when scraping material.
[0083] Furthermore, the fastener 45 can be arranged laterally along the axial direction D1, and the scraper 42 with a first inclined surface 421 and a second inclined surface 422 passes through the fastener 45, and the fastener 45 is fitted with a stress relief spring. The connecting hole of the scraper 42 is an inclined hole.
[0084] When the moving component 31 brings the sensor 32 into contact with the first inclined surface 421, the sensor 32 exerts a certain pushing force on the first inclined surface 421. Since the scraper 42 abuts against the unloading spring 46, and the connecting hole at the scraper 42 is an angled hole, under the action of the pushing force, the scraper 42 can tilt at a certain angle towards the side away from the first inclined surface 421, causing the middle part of the first inclined surface 421 to contact the detection end 321, thus scraping away dirt. Dirt will not cross the end of the first inclined surface 421 and adhere to the second inclined surface 422, further reducing contamination of the second inclined surface 422.
[0085] When the moving component 31 drives the sensor 32 to contact the second inclined surface 422, the sensor 32 will exert a certain thrust on the second inclined surface 422. Since the scraper 42 abuts against the unloading spring 46, and the connecting hole at the scraper 42 is an oblique hole, under the action of the thrust, the scraper 42 can tilt at a certain angle toward the side away from the second inclined surface 422, so that the middle part of the second inclined surface 422 contacts the detection end 321 and scrapes off the water vapor.
[0086] Furthermore, a gap is provided between the first inclined surface 421 and the second inclined surface 422.
[0087] Furthermore, the slicer 1 is equipped with two sets of cleaning mechanisms 40, which are used to spray liquid to rinse the detection ends 321 of the two sensors 32 in a one-to-one correspondence.
[0088] For example, two sets of cleaning mechanisms 40 are positioned above the two guide wheels 21 on the side away from the workpiece, respectively opposite to the detection ends 321 of the two sensors 32.
[0089] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A slicer, characterized in that, include: frame; A cutting mechanism, the cutting mechanism including guide wheels disposed on the frame, the guide wheels being used to wind cutting wire; The detection mechanism includes a movable component disposed on the frame and a sensor disposed on the movable component; the movable component can selectively drive the sensor to move along the axial direction of the guide wheel, so that the sensor can detect the position of the cutting line in different axial regions on the guide wheel; A cleaning mechanism is provided on the frame. The movable component can selectively move the sensor to the cleaning mechanism, and the cleaning mechanism sprays liquid to rinse the sensor.
2. The slicer according to claim 1, characterized in that, The guide wheel has a winding section for winding the cutting line at its center along the axial direction; the end of the moving component extends beyond the winding section along the axial direction, and the cleaning mechanism is disposed opposite to the end of the moving component, so that when the moving component drives the sensor to move beyond the winding section along the axial direction, the cleaning mechanism sprays liquid to rinse the detection end of the sensor.
3. The slicer according to claim 2, characterized in that, The cleaning mechanism includes a spray plate with a plurality of spaced-apart spray nozzles and an inlet communicating with each spray nozzle; the spray plate is connected to the frame and opposite to the end of the moving component, and the spray nozzles face the detection end of the sensor; the inlet is provided with a connector for connecting to an infusion tube.
4. The slicer according to claim 3, characterized in that, The cleaning mechanism also includes a scraper connected to the frame. The moving component can selectively drive the sensor to move along the axial direction to the scraper, so that the scraper contacts the detection end to clean the detection end.
5. The slicer according to claim 4, characterized in that, Along the axial direction, the scraper is located on the side of the spray plate facing the winding section.
6. The slicer according to claim 5, characterized in that, The scraper has a first inclined surface and a second inclined surface connected to each other at the scraping end facing the sensor. The first inclined surface and the second inclined surface are arranged opposite to each other, with the first inclined surface facing the winding section and the second inclined surface facing the spray plate.
7. The slicer according to claim 4, characterized in that, The cleaning mechanism also includes a mounting plate, on which the spray plate and the scraper are mounted, and the mounting plate is connected to the frame.
8. The slicer according to claim 7, characterized in that, The mounting plate is provided with a liquid receiving plate below the spray plate and the scraper.
9. The slicer according to claim 7, characterized in that, The cleaning mechanism also includes fasteners and a relief spring passing through the fasteners. The scraper is provided with a connecting hole, the fastener passes through the connecting hole and is fixed to the mounting plate, and the scraper abuts against the relief spring.
10. The slicer according to any one of claims 1-9, characterized in that, The detection mechanism includes two sets of corresponding moving components and sensors, with the two moving components located on opposite sides of the guide wheel in the radial direction. The slicer also includes two sets of cleaning mechanisms, which spray liquid to rinse the two sensors in a one-to-one correspondence.