Protective film for uncovering

Abstract

The utility model discloses a protective film for uncovering, which belongs to the technical field of protective films and comprises a release layer, a PI (polyimide) substrate layer, a thermosetting adhesive layer, a PET (polyethylene terephthalate) composite film layer and a release layer which are sequentially stacked from top to bottom. Compared with the prior art, the utility model has the following beneficial effects: a five-layer structure is adopted, PI is used as a base material, the outer layer of the base material is coated with the release layer, the middle layer is the thermosetting adhesive layer, and the lower surface is the PET composite film layer of which the outer layer is coated with the release layer, so that the uncovering position is flexible and changeable, the uncovering can be opened at any position of the PI surface or the PET surface, and the product selection of a user is facilitated; necessary conditions are provided for PCB / FPC automatic lamination production; in addition, the thermosetting adhesive layer is used for replacing the original acrylic adhesive layer, so that the product quality is more stable, the production modes are diversified, and the capacity of adapting to various external environments is stronger.

Description

Technical Field

[0001] This utility model belongs to the field of protective film technology, specifically relating to a protective film for opening PCB / FPC covers. Background Technology

[0002] With the increasing demands for high-quality manufacturing processes, the requirements for the bonding precision and opening position of protective films used in PCB / FPC cap opening are becoming increasingly stringent. Currently used cap opening protective films consist of a PI substrate coated with acrylic adhesive and then laminated with a PET release film. During product use, the opening position can only be on a fixed PET side. Current PCB / FPC manufacturing processes and the production processes for cap opening protective films cannot meet the requirements for high-precision automated bonding manually. Existing bonding processes mainly rely on fixed tooling fixtures for manual bonding, which cannot guarantee bonding precision and high-efficiency production. Furthermore, it is impossible to quantify the results of manual bonding, placing significant pressure on product quality and production capacity. To ensure high-quality and high-efficiency production, introducing high-precision automated bonding methods is both necessary and urgent.

[0003] The existing PCB / FPC board opening and protective film bonding method has the following main shortcomings: (1) High cost: The product opening position is fixed and can only be on the PET surface. It can only be bonded by manpower, resulting in low quality and efficiency, which leads to high cost; (2) Insufficient precision: Manual bonding will result in a deformation of ±0.15mm between the protective film and the PCB / FPC, which cannot guarantee precision; (3) Inability to quantify bonding effect: Due to manual bonding, the bonding effect cannot be quantified digitally. It can only be inspected visually and cannot promote the improvement of bonding process through digitalization. Utility Model Content

[0004] The purpose of this utility model embodiment is to provide a protective film for opening lids, which can solve at least one technical problem involved in the background art.

[0005] To solve the above-mentioned technical problems, this utility model is implemented as follows:

[0006] This utility model provides a protective film for opening lids, comprising a release layer, a PI substrate layer, a thermosetting adhesive layer, a PET composite film layer and a release layer stacked sequentially from top to bottom.

[0007] Optionally, the thickness of the release layer is 1-2 μm.

[0008] Optionally, the release layer is coated on both the PI substrate layer and the PET composite film layer.

[0009] Optionally, the thickness of the PI substrate layer is 12-60 μm.

[0010] Optionally, the thickness of the thermosetting adhesive layer is 6-40 μm.

[0011] Optionally, the thickness of the PET composite film layer is 25-75 μm.

[0012] Optionally, the release layer is a silicone-free release layer.

[0013] Compared with the prior art, this utility model has the following advantages:

[0014] Employing a 5-layer structure with PI as the substrate, an outer release layer, a middle thermosetting adhesive layer, and a bottom PET composite film layer with an outer release layer, this design allows for flexible opening positions, allowing the cover to be opened at any location on either the PI or PET side, facilitating product selection for users. It also provides the necessary conditions for automated PCB / FPC bonding production. Furthermore, replacing the original acrylic adhesive layer with a thermosetting adhesive layer results in more stable product quality, diversified production methods, and greater adaptability to various external environments. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0016] Figure 1 This is a cross-sectional structural diagram of the protective film for opening the lid provided by this utility model. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0018] The terms "first," "second," etc., used in the specification and claims of this utility model are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of this utility model can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, the first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0019] Please see Figure 1 As shown, this utility model embodiment provides a protective film for opening the lid, including a release layer 1, a PI substrate layer 2, a thermosetting adhesive layer 3, a PET composite film layer 4, and a release layer 5 stacked sequentially from top to bottom.

[0020] The release layer 1 has a thickness of 1-2 μm. Specifically, the release layer 1 is a silicon-free release layer.

[0021] The release layer 1 is coated on the PI substrate layer 2 and the PET composite film layer 4 respectively.

[0022] The thickness of the PI substrate layer 2 is 12-60 μm.

[0023] The thickness of the thermosetting adhesive layer 3 is 6-40 μm.

[0024] The thickness of the PET composite film layer 4 is 25-75 μm.

[0025] The protective film for opening the lid provided by this utility model adopts a 5-layer structure, with PI as the substrate, a release layer coated on the outer layer of the substrate, a thermosetting adhesive layer in the middle, and a PET composite film layer coated with a release layer on the bottom. Therefore, it realizes flexible and variable opening position, and can be opened at any position on the PI side or PET side, which is convenient for users to select products; it brings the necessary conditions for automated bonding production of PCB / FPC; in addition, the use of thermosetting adhesive layer instead of the original acrylic adhesive layer makes the product quality more stable, the production method more diversified, and the ability to adapt to various external environments stronger.

[0026] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0027] Furthermore, it should be noted that the scope of the methods and systems in the embodiments of this utility model is not limited to performing functions in the order shown or discussed. It may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0028] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of the present invention.

Claims

1. A protective film for opening lids, characterized in that, It includes a release layer, a PI substrate layer, a thermosetting adhesive layer, a PET composite film layer, and the release layer stacked from top to bottom.

2. The protective film for opening the lid according to claim 1, characterized in that, The thickness of the release layer is 1-2 μm.

3. The protective film for opening the lid according to claim 1 or 2, characterized in that, The release layer is coated on the PI substrate layer and the PET composite film layer respectively.

4. The protective film for opening the lid according to claim 1, characterized in that, The thickness of the PI substrate layer is 12-60 μm.

5. The protective film for opening the lid according to claim 1, characterized in that, The thickness of the thermosetting adhesive layer is 6-40 μm.

6. The protective film for opening the lid according to claim 1, characterized in that, The thickness of the PET composite film is 25-75 μm.

7. The protective film for opening the lid according to claim 1, characterized in that, The release layer is a silicon-free release layer.

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