Exhaust pipe and semiconductor equipment
By installing a second pipe in the exhaust pipe and adjusting its flow area, the problem of exhaust valve blockage was solved, the exhaust effect was improved, and the smooth operation of the semiconductor manufacturing process was ensured.
Patent Information
- Application Number
- CN202520065458.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-10
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2035-01-10
AI Technical Summary
In semiconductor equipment, exhaust valves are easily clogged by volatiles, affecting exhaust efficiency and leading to an unsuitable gas environment in the reaction chamber, which in turn affects the manufacturing process.
Design an exhaust pipe including a first pipe and a second pipe. The second pipe is equipped with an intake regulating device. By adjusting the flow area of the second pipe, the intake volume of the first pipe is adjusted to avoid blockage of the exhaust valve.
The exhaust pipe's exhaust efficiency has been improved, maintaining a suitable gas environment within the reaction chamber and ensuring the smooth operation of the semiconductor manufacturing process.
Smart Images
Figure CN223550052U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor equipment, specifically an exhaust pipe and a semiconductor device. Background Technology
[0002] In semiconductor manufacturing, especially during various chemical reactions in the reaction chamber, a large amount of waste gas and volatiles are generated. If these waste gases and volatiles are not removed in time, they will not only affect the normal progress of the reaction but may also damage the equipment. By venting the waste gases and volatiles from the reaction chamber through exhaust pipes, it is possible to ensure that the gaseous environment inside the reaction chamber is maintained within a suitable range, thereby ensuring the smooth progress of the semiconductor manufacturing process.
[0003] Exhaust pipes typically have an exhaust valve inside, which regulates the amount of exhaust gas. However, some volatile substances released by semiconductor devices can easily adhere to the exhaust valve and cause blockage, affecting the exhaust efficiency of the pipe. Utility Model Content
[0004] To address the aforementioned technical problems, this application provides an exhaust pipe and a semiconductor device.
[0005] In a first aspect, embodiments of this application disclose an exhaust pipe, including a first pipe and a second pipe;
[0006] One end of the first pipeline is connected to the equipment to be vented, and the other end is connected to the vacuum pumping equipment;
[0007] The second pipeline includes an intake regulating device and is connected to the first pipeline; the intake regulating device is used to adjust the flow area of the second pipeline, thereby adjusting the intake volume of the first pipeline.
[0008] In some possible embodiments,
[0009] The first pipeline includes a first air inlet, a first air outlet, and an air inlet hole; the first air inlet and the first air outlet are located at opposite ends of the first pipeline, and the air inlet hole is located on the side of the first pipeline; the first air inlet is used to connect to the equipment to be vented, and the first air outlet is used to connect to the vacuum pumping equipment.
[0010] The second pipeline includes a second air inlet and a second exhaust outlet; the second air inlet and the second exhaust outlet are located at opposite ends of the second pipeline, and the second exhaust outlet is connected to the air inlet.
[0011] In some possible embodiments,
[0012] The intake regulating device includes a first baffle device; the first baffle device is located outside the second pipeline and is adjacent to the second air intake.
[0013] The first baffle device includes a first baffle and a first drive mechanism; the first baffle is connected to the second pipeline, and the first drive mechanism is disposed on the first baffle.
[0014] The first baffle is used to block the second air inlet; the first drive mechanism is used to drive the first baffle to move, thereby adjusting the blocked area of the second air inlet.
[0015] In some possible embodiments,
[0016] The intake regulating device includes a second baffle device;
[0017] The second baffle device includes a second baffle, a rotating shaft, and a second drive mechanism; both the second baffle and the rotating shaft are located inside the second pipeline, and the second baffle is connected to the rotating shaft; at least one end of the rotating shaft extends out of the second pipeline through a positioning hole, and the rotating shaft is rotatably connected to the second pipeline; the second drive mechanism is connected to the end of the rotating shaft that extends out of the second pipeline.
[0018] The second drive mechanism is used to drive the rotating shaft to rotate, thereby adjusting the inclination of the second baffle in the second pipeline.
[0019] In some possible embodiments,
[0020] The intake regulating device includes a third baffle device; the third baffle device is located inside the second pipeline;
[0021] The third baffle device includes a third drive mechanism and at least two third baffles arranged in parallel; each third baffle includes multiple vent holes, and each third baffle is connected to the third drive mechanism.
[0022] The third drive mechanism is used to drive the third baffles to rotate around their respective centers, thereby adjusting the flow area of the second pipeline by adjusting the overlapping area of at least two third baffles.
[0023] In some possible embodiments,
[0024] The intake regulating device includes a fourth baffle device; the fourth baffle device is located inside the second pipeline;
[0025] The fourth baffle device includes a fourth baffle and a fourth drive mechanism; the fourth baffle includes multiple vent holes and multiple adjusting plates, each vent hole and each adjusting plate are in one-to-one correspondence, and the adjusting plates are movably set on the vent holes; the multiple adjusting plates are respectively connected to the fourth drive mechanism;
[0026] The fourth drive mechanism is used to drive the adjustment plate to move, thereby adjusting the flow area of the vent.
[0027] In some possible embodiments,
[0028] The inner diameter of the first pipe is greater than, equal to, or less than the inner diameter of the second pipe.
[0029] In some possible embodiments,
[0030] The second air intake connects to the atmospheric environment or a fan.
[0031] In some possible embodiments,
[0032] A filter screen is installed at the second air intake.
[0033] Secondly, embodiments of this application disclose a semiconductor device, including a process chamber, a vacuum pumping device, and an exhaust pipe of any one of the above.
[0034] One end of the first pipeline is connected to the process chamber, and the other end is connected to the vacuum equipment.
[0035] In some possible embodiments,
[0036] Semiconductor equipment also includes control devices and flow sensors;
[0037] The flow sensor is located in the first pipeline;
[0038] The control device is electrically connected to the flow sensor and the intake regulating device; the control device is used to control the intake regulating device to adjust the flow area of the second pipeline based on the difference between the flow value obtained by the flow sensor and the preset flow value.
[0039] The technical solution provided in this application has the following technical effects:
[0040] The exhaust pipe in this embodiment includes a first pipe and a second pipe. One end of the first pipe is connected to the device to be vented, and the other end is connected to a vacuum device. The second pipe includes an intake regulating device and is connected to the first pipe. The intake regulating device is used to adjust the flow area of the second pipe, thereby adjusting the intake volume of the first pipe. In this embodiment, a second pipe is provided on the side of the first pipe, and the intake volume of the first pipe is adjusted by adjusting the flow area of the second pipe. This avoids the blockage problem caused by the internal exhaust valve of the first pipe and improves the exhaust effect of the exhaust pipe. Attached Figure Description
[0041] To more clearly illustrate the technical solutions and advantages in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0042] Figure 1This is a schematic diagram of an exhaust pipe provided in an embodiment of this application. Figure 1 ;
[0043] Figure 2 This is a schematic diagram of an exhaust pipe provided in an embodiment of this application. Figure 2 ;
[0044] Figure 3 This is a schematic diagram of an exhaust pipe provided in an embodiment of this application. Figure 3 ;
[0045] Figure 4 This is a schematic diagram of an exhaust pipe provided in an embodiment of this application. Figure 4 ;
[0046] Figure 5 This is a schematic diagram of a second pipeline provided in an embodiment of this application. Detailed Implementation
[0047] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0048] It should be noted that the term "an embodiment" or "embodiment" in the specification of the embodiments of this application refers to a specific feature, structure, or characteristic that can be included in at least one implementation of this application. It should be understood that in the specification, claims, and accompanying drawings of the embodiments of this application, the terms "upper," "lower," "top," "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, in the description of this embodiment, unless otherwise stated, "a plurality of" means two or more. Additionally, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, or product that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.
[0049] It should be understood that when a device or component is referred to as being "on," "adjacent to," or "connected to" other devices or components, it may be directly on, adjacent to, or connected to other devices or components, or there may be intervening devices or components. Conversely, when a device or component is referred to as being "directly on," "directly adjacent to," or "directly connected to" other devices or components, there are no intervening devices or components. It should be understood that although the terms first, second, third, etc., may be used to describe various components, areas, layers, and / or parts, these components, areas, layers, and / or parts should not be limited by these terms. These terms are only used to distinguish one component, area, layer, or part from another component, area, layer, or part. Therefore, without departing from the teachings of this application, the first component, area, layer, or part discussed below may be referred to as the second component, area, layer, or part. And the discussion of the second component, area, layer, or part does not imply that the first component, area, layer, or part necessarily exists in this application.
[0050] To make the objectives, technical solutions, and advantages disclosed in the embodiments of this application clearer, the embodiments of this application will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the embodiments of this application and are not intended to limit the embodiments of this application.
[0051] Connecting the device to be vented to the exhaust pipe allows the exhaust gas in the device to be discharged, preventing it from affecting the normal operation of the device. The exhaust pipe typically contains an exhaust valve, which can be adjusted to control the exhaust gas emission rate and flow rate within a reasonable range.
[0052] During semiconductor fabrication using semiconductor equipment, various chemical reactions in the reaction chamber generate a large amount of waste gas and volatiles. In particular, the photolithography process using photoresist in the photolithography region of the semiconductor equipment produces a significant amount of volatiles during the heating and bonding of the photoresist. If these waste gases and volatiles are not removed promptly, they can not only affect the normal progress of the reaction but also potentially damage the equipment. Exhausting these waste gases and volatiles from the reaction chamber through an exhaust pipe connected to the semiconductor equipment ensures that the gaseous environment within the reaction chamber remains within a suitable range, thereby guaranteeing the smooth operation of the semiconductor manufacturing process. However, the volatiles released from the semiconductor equipment can easily adhere to the exhaust valve in the exhaust pipe, causing blockages and affecting the exhaust efficiency.
[0053] To address the aforementioned problems, this application provides a newly designed exhaust pipe. This exhaust pipe connects to a branch exhaust pipe on the side of the original exhaust pipe, and an intake regulating device, similar to an exhaust valve, is installed in the branch exhaust pipe. By adjusting the intake device, the flow area of the branch exhaust pipe can be adjusted, thereby regulating the emission speed and flow rate of exhaust gas from the semiconductor device by the original exhaust pipe.
[0054] Figure 1 This is a schematic diagram of an exhaust pipe provided in an embodiment of this application. Figure 1 ,like Figure 1 As shown, the exhaust pipe includes a first pipe 1 and a second pipe 2. One end of the first pipe 1 (as shown) Figure 1 The intake end 11 shown is connected to the device to be exhausted, and the other end (such as...) Figure 1 The exhaust end 12 shown is connected to a vacuum pump. The second pipeline 2 includes an intake regulating device 21 and is connected to the first pipeline 1. The intake regulating device 21 is used to adjust the flow area of the second pipeline 2, thereby adjusting the intake volume of the first pipeline 1.
[0055] In this embodiment, a second pipe 2 is provided on the side of the first pipe 1, and the air intake of the first pipe 1 is adjusted by adjusting the flow area of the second pipe 2, which avoids the blockage problem caused by the exhaust valve inside the first pipe 1 and improves the exhaust effect of the exhaust pipe.
[0056] Figure 2 This is a schematic diagram of an exhaust pipe provided in an embodiment of this application. Figure 2 ,like Figure 2 As shown, the first pipeline 1 includes a first air inlet, a first exhaust outlet, and an air inlet hole 13. The first air inlet is located at the air inlet end 11 of the first pipeline 1, the first exhaust outlet is located at the exhaust end 12 of the first pipeline 1, and the air inlet hole 13 is located on the side of the first pipeline 1. The first air inlet is used to connect to the equipment to be vented, and the first exhaust outlet is used to connect to the vacuum pumping equipment. The second pipeline 2 includes a second air inlet 22 and a second exhaust outlet 23. The second air inlet 22 and the second exhaust outlet 23 are located at opposite ends of the second pipeline 2, and the second exhaust outlet 23 is connected to the air inlet hole 13. The air intake regulating device 21 is used to adjust the flow area of the second pipeline 2, thereby adjusting the air intake volume of the first pipeline 1.
[0057] In this embodiment of the application, when using the exhaust pipe to discharge gas from the semiconductor device, the first air inlet is connected to the device to be vented in the semiconductor device, and the first exhaust outlet is connected to a vacuum pumping device. The exhaust gas from the semiconductor device enters the first pipeline 1 through the first air inlet and is drawn into the vacuum pumping device.
[0058] In this embodiment, the second air inlet 22 is connected to the atmospheric environment. By adjusting the air intake regulating device 21, air from the atmospheric environment can pass through the second air inlet 22, the air intake regulating device 21, and the second exhaust port 23 in the second pipeline 2 to reach the first pipeline 1 and be drawn into the vacuum pumping device.
[0059] In some possible embodiments, the second air inlet 22 is connected to a fan. Adjusting the power of the fan can change the air intake volume of the second air inlet 22.
[0060] In this embodiment, waste gas from the semiconductor device can be discharged into a vacuum pump via the first pipe 1, and atmospheric gas can be transported to the vacuum pump via the second pipe 2. Since both gases need to be transported to the vacuum pump via the first pipe 1, a change in the intake volume of one gas will cause a change in the intake volume of the other gas. Therefore, to change the intake volume of the semiconductor device reaching the vacuum pump via the first pipe 1, this can be achieved by changing the intake volume of atmospheric gas entering the first pipe 1 via the second pipe 2. To change the intake volume of atmospheric gas entering the first pipe 1 via the second pipe 2, the flow area of the second pipe 2 can be changed using the intake regulating device 21.
[0061] Figure 3 This is a schematic diagram of an exhaust pipe provided in an embodiment of this application. Figure 3 ,like Figure 3 As shown, a filter screen 24 is installed at the second air inlet 22. The filter screen 24 can filter the gas entering the second pipeline 2 from the external environment, preventing large-volume substances from the outside from entering the second pipeline 2 and clogging the air intake regulating device 21.
[0062] Figure 4 This is a schematic diagram of an exhaust pipe provided in an embodiment of this application. Figure 4 ,like Figure 4 As shown, the intake regulating device 21 in the exhaust pipe includes a first baffle device 211. The first baffle device 211 is located outside the second pipe 2 and is adjacent to the second air intake 22. By partially or completely blocking the second air intake 22, the flow area of the second pipe 2 can be changed.
[0063] In some possible embodiments, the first baffle device 211 includes a first baffle and a first driving mechanism. The first baffle is connected to the second pipe 2, and the first baffle can partially or completely block the second air inlet 22 by moving its position. The first driving mechanism is disposed on the first baffle and can drive the first baffle to move its position. By driving the first baffle to move by the first driving mechanism, the blocked area of the second air inlet 22 can be adjusted, thereby changing the flow area of the second pipe 2.
[0064] In some possible embodiments, when the second air inlet 22 is completely blocked, the amount of air entering the vacuum equipment from the semiconductor device via the first conduit 1 is not affected by the second conduit 2. As the blocked area of the second air inlet 22 gradually decreases, the amount of air entering the vacuum equipment from the semiconductor device via the first conduit 1 is gradually affected by the second conduit 2 and gradually decreases.
[0065] Optionally, the first drive mechanism is a micro motor.
[0066] Figure 5 This is a schematic diagram of a second pipeline provided in an embodiment of this application, as shown below. Figure 5As shown, the intake regulating device 21 includes a second baffle device 212. The second baffle device 212 includes a second baffle 2121, a rotating shaft 2122, and a second drive mechanism 2123. Both the second baffle 2121 and the rotating shaft 2122 are located inside the second pipe 2, with the second baffle 2121 connected to the rotating shaft 2122. At least one end of the rotating shaft 2122 extends out of the second pipe 2 through a positioning hole, and the rotating shaft 2122 is rotatably connected to the second pipe 2. The second drive mechanism 2123 is connected to the end of the rotating shaft 2122 that extends out of the second pipe 2. By driving the rotating shaft 2122 to rotate through the second drive mechanism 2123, the second baffle 2121 can be rotated in the second pipe 2, thereby adjusting the inclination of the second baffle 2121 in the second pipe 2. By changing the inclination of the second baffle 2121 in the second pipe 2, the flow area of the second pipe 2 can be changed.
[0067] In some possible embodiments, the second baffle 2121 is circular. The diameter of the second baffle 2121 is slightly smaller than the inner diameter of the second pipe 2 so that the second baffle 2121 can rotate smoothly inside the second pipe 2.
[0068] In some possible embodiments, for ease of description, it is assumed that the second pipe 2 is a pipe with a uniform inner diameter and no bends from the second air inlet 22 to the second exhaust outlet 23. When the second baffle 2121 rotates to a position parallel to the second air inlet 22, the flow area of the second pipe 2 reaches its minimum. At this time, the amount of air entering the vacuum equipment from the semiconductor device via the first pipe 1 is minimally affected by the second pipe 2. Furthermore, by reducing the gap between the second baffle 2121 and the second pipe 2, the influence of the second pipe 2 on the exhaust gas emitted by the semiconductor device can be further reduced. As the second baffle 2121 gradually rotates from a position parallel to the second air inlet 22 to a position perpendicular to the second air inlet 22, the flow area of the second pipe 2 gradually increases, and the influence of the second pipe 2 on the amount of air entering the vacuum equipment from the semiconductor device via the first pipe 1 gradually increases and then gradually decreases.
[0069] Optionally, the second drive mechanism 2123 is a micro motor.
[0070] In some possible embodiments, the intake regulating device 21 includes a third baffle device. The third baffle device is located inside the second pipe 2. The third baffle device includes a third drive mechanism and at least two third baffles arranged side by side. All the third baffles are arranged closely adjacent to each other, and each third baffle is connected to the third drive mechanism. Each third baffle includes multiple vent holes. The third baffles are driven by the third drive mechanism to rotate around their respective centers. When the rotation speeds of at least two third baffles are different, the overlapping area of the multiple third baffles will change. When the overlapping area of the multiple third baffles changes, the number and venting area of the vent holes connecting the second intake port 22 and the second exhaust port 23 will change, resulting in a change in the flow area of the second pipe 2.
[0071] In some possible embodiments, the third baffle device includes two third baffles arranged side by side. The third drive mechanism includes two drive structures. Each drive structure is connected to one third baffle, and each drive structure controls the rotation of the third baffle it is connected to.
[0072] Optionally, the third drive mechanism is a micro motor.
[0073] In some possible embodiments, the intake regulating device 21 includes a fourth baffle device. The fourth baffle device is located inside the second pipe 2. The fourth baffle device includes a fourth baffle and a fourth driving mechanism. The fourth baffle includes multiple vent holes and multiple adjusting plates, with each vent hole corresponding to one adjusting plate, and the adjusting plate being movably disposed on the vent hole. The multiple adjusting plates are respectively connected to the fourth driving mechanism. By driving the adjusting plates to move through the fourth driving mechanism, the blocked area of the vent holes can be adjusted, thereby adjusting the flow area of the vent holes and the second pipe 2.
[0074] Optionally, the fourth drive mechanism is a micro motor.
[0075] In this embodiment of the application, since the inner diameter of the second pipe 2 directly determines the maximum flow area that the second pipe 2 can achieve, when the inner diameter of the second pipe 2 changes, the degree to which the intake volume of the semiconductor device through the first pipe 1 into the vacuum equipment is affected by the second pipe 2 will also change.
[0076] In some possible embodiments, the inner diameter of the first conduit 1 is greater than, equal to or less than the inner diameter of the second conduit 2.
[0077] This application also provides a semiconductor device. The semiconductor device includes a process chamber, a vacuum pumping device, and the aforementioned exhaust pipe. The inlet 11 of the first pipe 1 in the exhaust pipe is connected to the process chamber, and the exhaust end 12 of the first pipe 1 in the exhaust pipe is connected to the vacuum pumping device.
[0078] In some possible embodiments, the semiconductor device further includes a control device and a flow sensor. The flow sensor is located in the first conduit 1 and measures the amount of air released from the process chamber into the exhaust pipe. The control device is electrically connected to the flow sensor and the air intake regulating device 21. Based on the difference between the flow rate value obtained by the flow sensor and a preset flow rate value, the control device can control the air intake regulating device 21 to adjust the flow area of the second conduit 2, thereby regulating the air intake of the first conduit 1.
[0079] It should be noted that the order of the embodiments described above is merely for descriptive purposes and does not represent the superiority or inferiority of the embodiments. Furthermore, specific embodiments have been described above. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps described in the claims can be performed in a different order than that shown in the embodiments and still achieve the desired result. Additionally, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.
[0080] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the device embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions of the method embodiments.
[0081] Those skilled in the art will understand that all or part of the steps of the above embodiments can be implemented by hardware or by a program instructing related hardware. The program can be stored in a computer-readable storage medium, such as a read-only memory, a disk, or an optical disk.
[0082] The above description is only a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. An exhaust pipe, characterized in that, Including the first pipeline and the second pipeline; One end of the first pipeline is connected to the device to be vented, and the other end is connected to the vacuum pumping device; The second pipeline includes an intake regulating device and is connected to the first pipeline; The intake regulating device is used to adjust the flow area of the second pipeline, thereby adjusting the intake volume of the first pipeline.
2. The exhaust pipe according to claim 1, characterized in that, The first pipeline includes a first air inlet, a first air outlet, and an air inlet hole; the first air inlet and the first air outlet are respectively located at both ends of the first pipeline, and the air inlet hole is located on the side of the first pipeline; the first air inlet is used to connect to the device to be vented, and the first air outlet is used to connect to the vacuum pumping device. The second pipeline includes a second air inlet and a second exhaust outlet; the second air inlet and the second exhaust outlet are located at opposite ends of the second pipeline, and the second exhaust outlet is connected to the air inlet.
3. The exhaust pipe according to claim 2, characterized in that, The air intake regulating device includes a first baffle device; the first baffle device is located outside the second pipeline and is adjacent to the second air intake. The first baffle device includes a first baffle and a first driving mechanism; the first baffle is connected to the second pipeline, and the first driving mechanism is disposed on the first baffle; The first baffle is used to block the second air inlet; the first driving mechanism is used to drive the first baffle to move, thereby adjusting the blocked area of the second air inlet.
4. The exhaust pipe according to claim 2, characterized in that, The air intake regulating device includes a second baffle device; The second baffle device includes a second baffle, a rotating shaft, and a second drive mechanism; both the second baffle and the rotating shaft are located inside the second pipeline, and the second baffle is connected to the rotating shaft; at least one end of the rotating shaft extends out of the second pipeline through a positioning hole, and the rotating shaft is rotatably connected to the second pipeline; the second drive mechanism is connected to the end of the rotating shaft that extends out of the second pipeline. The second drive mechanism is used to drive the rotating shaft to rotate, thereby adjusting the inclination of the second baffle in the second pipeline.
5. The exhaust pipe according to claim 2, characterized in that, The intake regulating device includes a third baffle device; the third baffle device is located inside the second pipeline; The third baffle device includes a third drive mechanism and at least two third baffles arranged in parallel; each third baffle includes multiple vent holes, and each third baffle is connected to the third drive mechanism. The third driving mechanism is used to drive the third baffles to rotate around their respective centers, thereby adjusting the flow area of the second pipeline by adjusting the overlapping area of the at least two third baffles.
6. The exhaust pipe according to claim 2, characterized in that, The intake regulating device includes a fourth baffle device; the fourth baffle device is located inside the second pipeline; The fourth baffle device includes a fourth baffle and a fourth drive mechanism; the fourth baffle includes multiple vent holes and multiple adjusting plates, each vent hole and each adjusting plate are in one-to-one correspondence, and the adjusting plate is movably disposed on the vent hole; the multiple adjusting plates are respectively connected to the fourth drive mechanism. The fourth driving mechanism is used to drive the adjusting plate to move, thereby adjusting the flow area of the vent.
7. The exhaust pipe according to any one of claims 1 to 6, characterized in that, The inner diameter of the first pipeline is greater than, equal to, or less than the inner diameter of the second pipeline.
8. The exhaust pipe according to any one of claims 2 to 6, characterized in that, The second air inlet is connected to the atmospheric environment or a fan.
9. The exhaust pipe according to any one of claims 2 to 6, characterized in that, A filter screen is installed at the second air inlet.
10. A semiconductor device, characterized in that, Includes a process chamber, a vacuum pumping device, and an exhaust pipe as described in any one of claims 1 to 9; One end of the first pipeline is connected to the process chamber, and the other end is connected to the vacuum pumping equipment.
11. The semiconductor device according to claim 10, characterized in that, It also includes control devices and flow sensors; The flow sensor is located in the first pipeline; The control device is electrically connected to the flow sensor and the air intake regulating device; The control device is used to control the intake regulating device to adjust the flow area of the second pipeline based on the difference between the flow value obtained by the flow sensor and the preset flow value.